Product Training Library

This presentation will discuss the features, technology, and products for the Trion FPGA family.

This presentation will give an overview of Laird Thermal Systems' Thermoelectric Cooler Assemblies and Temperature Controller product lines.

Vishay's VOR112x hybrid solid state relay allows fast switching times with a wide operating ambient temperature range.

This PTM defines what a Thermal Dielectric Pad is, what are the major product selection criteria, and a ranking based on the level of performance.

KEMET's pyroelectric infrared sensors are able to detect the natural infrared signature produced by humans without using lenses.

This presentation will introduce TT Electronics' OP207CL low-profile, infrared emitter from the Optek Technology brand.

This presentation will discuss the features, applications, and the open loop ASIC of LEM’s HOYS and HOYL open-loop current transducer families.

ROHM's supervisor IC chip is designed for the automotive market where AEC-Q100 and ASIL qualifications are required.

This module will review the key features, ratings, characteristics and enhancements of four series of 1 and 2 W unregulated SIP products.

This presentation will introduce ECS Incorporated's MultiVolt™ Oscillator products.

LEM's ASIC with on-board second-order Sigma-Delta modulator provides a digital output to open-loop transducers.

KEMET offers an extended portfolio of common mode, differential mode, and dual mode chokes, as well as input and output capacitors for power supplies.

This presentation will explain what separates industrial-grade DRAM modules from commercial-grade modules.

Schaffner's FN9255 and FN9255E IEC inlet filters offer high attenuation, front and rear mount options, and seven current ratings.

ECS's AEC-Q200 qualified products are ideal for automotive, industrial, medical, and municipality applications.

An introduction to Amphenol RF's 2.2-5 series of RF connectors, a well as their features, applications, and specifications.

This presentation will introduce LEM's LDSR leakage current measurement for safety.

This presentation will explain how to test a thermal interface material from Parker Chomerics.

This presentation will define what Thermal Gap Pads are, what the major product performance criteria used to make the material selection are, and rank the performance of each.

TRINAMIC's TMC2300 low voltage stepper motor driver combines StealthChop2™ and StallGuard4™ to create a ground-breaking solution for portable devices.

RECOM's DC/DC gate driver converters offer asymmetric dual outputs ideal for IGBT drivers in many applications.

This presentation will cover information pertaining to this DC-DC converter, explaining the function, features and line up of what is currently available from the company.

An introduction to Amphenol Industrial Operations' SurLok Plus™ compression lug system.

Littelfuse offers a broad array of solutions for AC and DC types of electric vehicle charging stations.

An overview of RECOM's low to medium power medical grade AC/DC and DC/DC converters.

NXP's eiQ™ machine learning software environment enables customers to convert and optimize trained machine learning models for deployment on NXP silicon.

This presentation will introduce the base technology and features of Susumu’s high-frequency attenuators, the ATS series.

This presentation will introduce the range of mini-breakers, explain their construction, and review their applications and advantages. It will also explain the part numbering system and talk about how to select the most suitable part.

This presentation will provide an introduction to Analog Devices LTC33xx family of synchronous buck regulators.

The objective of the training is to discuss where data access ports can be used, where they are located and the features and benefits of the Panduit Data Access Ports

This presentation will introduce the features and benefits, part number structure and application examples for the FN3287/FN3288 series.

This presentation will provide users with the features, applications, the product line-up, and a comparison between the standard lens and the Low Profile Lens for PIR sensors.

This presentation will provide an overview of the Thermoelectric Cooler and the Thermal Wizard tool from Laird Thermal Systems.

This presentation will introduce the Electronically Commutated (EC) fans from Orion Fans.

This presentation will review the challenges in reaching the performance needed for a good industrial network and show an existing solution that can be implemented with very little effort.

This presentation will provide an overview of the available tools and products associated with the IntraVUE® solution from Panduit.

Overview of Molex's easy-on FD19 series FFC and FPC connectors.

This presentation will discuss how to maintain impedance in split core ferrites for Low-Frequency applications.

This presentation will provide an overview of the dev kit, which is a two-mic far field voice interface solution optimised for smart TVs, set-top box and smart home devices. It will introduce the key features and benefits and provide a guide on how to get started.

This presentation will introduce Molex's OptoConnect LGX and 144-Port Enclosures.

This presentation will introduce ROHM's low IQ DC/DC converters for wearables and battery powered devices.

This presentation provides information about printing solutions for industrial users.

An overview of the flux-cored solder wire products available from Kester Solder.

A tutorial on how to utilize features and benefits of the WX series soldering stations.

The presentation will introduce engineers, designers and customers to MEAN WELL’s XLG LED driver family features and why they are a suitable power solution for LED lighting applications.

This presentation will give an overview of the product specifications, features and benefits and the target markets and applications for the V-Flip Connectors.

This presentation will provide an overview of the features of this interconnect system, and offer solutions to overcome different challenges.

This presentation will give an overview of some of the challenges high-power applications face and how Triton Grounding Jumpers can help overcome them.

This presentation will discuss how to prevent performance loss due to reverse rotation.

Bourns' SRP series power inductors are designed for high current applications and low radiation in a compact size.

Cornell Dubilier's EDC/EDS coin cell supercapacitors combine cost effectiveness with a very high level of performance.

This presentation will introduce RECOM's RACxx-K series of AC/DC converter modules.

This presentation will give an overview of the product specifications, features and benefits and the target markets and applications for PicoBlade Connectors.

This presentation will discuss why to choose the TMC2209, how to get started, features, and applications for the TMC2209 stepper motor driver.

This presentation will review the operation, performance and use cases for serial flash interfaces while concentrating on Serial Peripheral Interface or SPI.

Würth's WE-FLEX and WE-FLEX HV transformers are built with six independent and identical windings, allowing the customer to configure up to 1,000 different transformers.

This presentation will introduce the THL 15WI series of DC/DC converters from TRACO Power.

This presentation will introduce the Ultra-Low-Profile (ULP) Series of Electrolytic Capacitors.

Overview of the features and functions of Test Products International's 183A Digital Multi-Meter.

This presentation will introduce the standard Lithium Iron Phosphate batteries.

This presentation will discuss the features and advantages, product specifications and provide an overview of the product with its target markets and applications.

This presentation will introduce Molex's SlimStack 0.635mm Pitch Board-to-Board Connector system.

This presentation will introduce Molex’s Mini-Lock 2.50mm Pitch Wire-to-Board and Wire-to-Wire Connector System

This presentation will discuss four requirements for determining the customers needs when starting an IoT design and how Molex’s expertise as a connected home resource can offer solutions suitable for the IoT marketplace.

The presentation will provide an overview of the LGA50D non-isolated DC/DC converter from Artesyn Embedded Technologies.

This presentation will provide an overview of the LTC3376 from Analog Devices.

Molex's CLIK-Mate 1.50 wire-to-board connectors offer both dual- and single-row configurations, as well as SMT and through-hole styles.

This presentation will provide an overview of Molex's Spot-On products and their target markets and applications

This presentation will provide an overview of Mini-SPOX 2.50mm product and its target markets and applications.

Molex Pico-SPOX wire-to-board connectors offer both tin-and gold-plating versions, have a friction lock for better mating retention, and are available in vertical and right-angle types.

This presentation will introduce the EN2650QI high-efficiency 12V bus converter and review its features and benefits.

This presentation will introduce the ATX or Explosion Proof Boxes from Bud Industries.

This presentation will provide an overview of the products from Viking Technology that support the defense, aerospace, and security markets.

This presentation will introduce the Performance Series XLR Cables from IO Audio Technologies

This presentation will give an overview of the product specifications, features and advantages and the target markets and applications for the Pico-Lock Connector System.

This presentation will give an overview of the challenges and solutions, features and benefits and the target markets and applications for the iGrid 2.00 Wire-To-Board Connector System.

This presentation will give an overview of the product specifications, features and benefits and the target markets and applications for the CP-6.5 Connector System.

This PTM will give an overview of what the Milli-Grid 2.00 mm pitch connector system has to offer.

This presentation will introduce the Micro-Latch 2.00 mm Pitch, Wire-to-Board Connector System from Molex.

This presentation will go over ECS' offering of inductor products.

Khadas' Tone Board is a high-res sound card (also known as a digital-to-analog converter) that outputs two channels via RCA connectors at 2 volts root-mean-squared.

This presentation will cover the features and specifications for the NGC Series of Compact Limit Switches offered by Honeywell.

This presentation will illustrate how a smart thermostat can be used in an IoT Control Unit.

ZEUS' LiFePO4 battery cells are a safer alternative to Li-ion batteries and have less chance of thermal runaway.

This presentation will introduce Renesas' Quick Solution with Analog Enhancement using the RL78 family.

Bourns' GMOV™ component combines the technology of an MOV and GDT with FLAT® technology to resolve premature MOV degradation and failure.

NXP's i.MX 7ULP applications processor brings MCU-level power consumption to the application's processor space.

This presentation will provide an overview of Amphenol Advanced Sensors' air filter monitor products.

This presentation will give an outline of the background and needs of the Smart Embedded Vision products.

This PTM gives an overview of SV’s LiteTouch Solderless PCB connector product line and discusses the key features and benefits of these connectors.

Phoenix Contact's FINEPITCH board-to-board connectors offer a wide range of connection configurations.

Digi's free XCTU software offers many valuable tools for configuring, testing, customizing, and managing Digi XBee® product.

This presentation will provide an overview of the RJ magnetic modular jacks, go over the features and benefits and various aspects of the offering.

This presentation will introduce the high-power, 3-phase Gate Driver TMC6200 for PMSM servo or BLDC motors.

Diodes' wide variety of low dropout regulators spans a large variety of input voltages, load currents, and package types.

Radiocrafts' RIIoT™ long range start network can run on low power with only a few weeks of development.

This module will provide an overview of Harwin’s RfI Shield Clips and Can products, explain the advantages, and cover the features and benefits.

This presentation will do a deep-dive into network mapping, a method for visualizing a network and manipulating the connectivity between devices.

This presentation will give an overview of the Contrinex Inductive and Photoelectric Sensors.

This presentation will provide an explanation of the challenges facing designers who create designs with faster data rates. In addition, it will cover the advantages of Mirror Mezz Connectors and list the appropriate applications for these devices.