Solder preforms, wire, and ribbon are manufactured and packaged to minimize oxidation. Since no container offers complete isolation from oxygen in ambient air, solder will slowly oxidize, which may result in a reduction in wetting.

The alloys in this book are the result of decades of listening to our customers and finding solutions that enable cutting-edge technologies

Metal Thermal Interface Materials (TIMs) aid in the transfer of heat between surfaces and minimize the thermal resistance at each device connection.

For high-power devices, the performance of interconnect materials within the packaging is critical to achieve efficiency and longevity.

The automotive industry, emerging electric vehicles, and wafer-level packages with smaller pitch sizes demand higher reliability of solder joints, namely, the elongated lifetime and/or the survival of more aggressive service conditions, than the mainstream SAC305.

The theoretical volume of solder paste can be calculated for each board using the Greely Formula and a simple volume calculation.

Durafuse® LT serves as a high-reliability solution to several different application challenges employing a vast array of reflow processes to achieve different results.

Indium metal is extracted primarily from indium-bearing zinc or tin ores and purified to various grades utilizing state-of-the-art statistical process-controlled refining technologies.

Indium flux and solder compatibility application note.

Reducing the energy consumed by the reflow oven has a direct impact on reduced CO2 emissions. In addition to quantifying the energy consumed, there is a growing emphasis on the Life Cycle Assessment (LCA) of a product.

A manufacturer can choose either a rosin-containing or a non-rosin-containing flux based on the solvent used, the ratio of flux to solvent, and the current cleaning process, to name a few.

One of the biggest challenges facing the electronics industry today is voiding in the solder joints that connect bottom terminated components to PCBs.

Indium Corporationは、面実装業界の厳しい品質要求を上回る棒はんだを製造し、より安定した信頼性の高い性能を提供しています。

Indium Corporationのソリッドはんだ線は、ASTM B-32、J-STD-006、JIS-Z-3282の厳しい品質基準を満たすように製造されています。

CW-807は、Indium Corporationのすべての無洗浄はんだペースト、ウェーブフラックス、および一般的な軟質はんだ合金と互換性があります。

Indiumの棒はんだチップは、小さなポットを充填したり、新しいはんだポットではんだの溶融を早めたりするために使用される電子グレードの棒はんだの小片です。

IndiumのIndium6.6HF水溶性はんだペーストは、卓越したリフロープロセスウィンドウを備え、SnPbおよびPbフリーの組み立てプロセスに対応します。

IndiumのCW-219高活性、高性能、無洗浄コアードワイヤは、高度に酸化された表面のロボットはんだ付けおよび手はんだ付けに最適です。

Indiumの技術により開発されたフラックスペンは、各々10mlのフラックスを含んでおり、非常に優れた漏れ制御とディスペンス能力を備えています。

IndiumのCW-818コアードワイアは、耐熱性と低スパッタ特性を備えており、優れた外観のアセンブリをもたらします。