TG-NSP-60 Series Gap Filler

T-Global TG-NSP-60 is an ultra-high performance, non-silicone, dispensable gap filler. This unique formulation, which is a one-part fully cured system, confers the benefits of exceptional thermal transfer without the many issues associated with silicone products.

This product is suitable for volume manufacturing and can be accurately and reproducibly dispensed for the ultimate ease of manufacturing.  It can be used to fill gaps from 0.25 mm to approximately 8 mm, which allows it to be used in numerous applications and to greatly simplify the bill of materials.  Additionally, TG-NSP-60 series gap filler is 100% silicone-free and can therefore be used in critical applications, such as automotive electronics, consumer devices, and sensitive military applications.