Phase Change Materials for the Electronics Industry
PCM materials can be used for some of the most demanding of thermal applications.
H48 Product Range
The H48-2 series of thermally conductive gap fillers covers the thermal conductivity range from 1.8-6 W/m.k and is available for a variety of applications.
Flexible Black Epoxy Potting Compounds
TG-LH-FBPE-80 is a compound that can be used to increase lifetime, value and reduce operating costs for electronic devices.
TG-NSP35 Non-Silicone Putty Materials
TG-NSP35 is perfect for circuit boards where there are multiple component heights that need to be connected to a heat-sink.
L37-3S Ultra-soft Gap Filler for LCD
Designed for applications where an ultra-soft material is needed due to tolerance issues or delicate components.
H48-6A Silicone Based Gap Filter
The H48-6A high performance silicone gap filler is specifically designed for military applications.