- Henkel’s BERGQUIST® brand thermal management materials include a broad range of solutions for reliability-enhancing heat dissipation within modern electronic devices. The company’s BERGQUIST GAP PAD® gap filling thermal interface materials (TIMs) are soft, compliant, pre-cut pads that reduce assembly stress while providing excellent thermal conductivity. Liquid BERGQUIST Gap Filler TIMs, which can be automatically dispensed, are ideal for applications where complex dimensions are the norm and/or high throughput is required. The expansive thermal solutions portfolio also includes SIL PAD® thermally conductive insulators, BOND PLY® thermal adhesives, HI FLOW® phase change materials and TCLAD® Insulated Metal Substrates (IMS®).


Liquid Gap Fillers

Image of Bergquists Liquid Gap Fillers

Henkel / Bergquist’s GAP FILLER materials are two-component, thermally conductive, form-in-place elastomers that provide virtually zero stress on components. Learn More

Thermal Gap Pads

Image of Henkel/Bergquist's Thermal Gap Pads

Henkel / Bergquist’s extensive GAP PAD family provides an effective thermal interface between heat sinks and electronic devices, improving an assembly’s thermal performance and reliability. Learn More

Thermal Sil-Pads

Image of Bergquists Thermal Sil-Pads

Henkel / Bergquist’s line of SIL-PAD materials offer excellent thermal performance, are more durable than mica, create less mess than grease and are highly cost efficient. Learn More

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Newest Products すべてを閲覧 (8)

Gap Pad® TGP 6000ULM

BergquistのGap Pad® TGP 6000ULMシリコーンベースの非導電性Gap Padは、高度にコンフォーマブルで、さまざまな地形で優れたカバレッジを提供します。 詳細はこちら

Gap Pad® TGP 7000ULM

BergquistのGap Pad®TGP 7000ULMの柔らかなギャップ充填材の定格は7.0W/mKで、低いアセンブリ応力を必要とする高性能アプリケーション向けに配合されています。 詳細はこちら

ギャップパッドHC 5.0

ソフトなコンプライアンスギャップ充填材である BergquistのギャップパッドHC 5.0は、5.0W/m-Kの熱伝導性を備え、非常に低い圧縮応力で傑出した熱性能を提供します。 詳細はこちら

Sil-Pad® 900S

Sil-Pad® 900S絶縁材は、電源などのアプリケーション向けに、0.61°Cインチ2/W(@50psi)の熱インピーダンスを特長とます。 詳細はこちら

Q-Pad® 3

Q-Pad® 3ガラス強化グリース置き換え熱インターフェースは、はんだ付けや洗浄を行う前にインストールすることができます。 詳細はこちら

Gap Pad® 1500

Gap Pad® 1500非強化ギャップ充填材料は、1.5W/m-Kの熱伝導性およびコンフォーマブルで、低硬度を特徴とします。 詳細はこちら

Recent PTMs すべてを閲覧 (5)

Gap Pad EMI 1 公開日:2015-11-16

Explore potential markets and applications for the Bergquist Gap Pad EMI 1.0 product.

Duration: 15 minutes
Thermal Interface Material (TIM), Gap Pad® VO Ultra Soft 公開日:2014-02-18

Gap Pad VO offers a thermally conductive, electrically isolating material with a wide array of secondary benefits.

Duration: 5 minutes
Thermal Interface materials (TIM) Gap Pad Key Product Characteristics 公開日:2013-11-04

Thermal interface materials (TIM) Gap Pad characteristics including thermal, electrical, and mechanical.

Duration: 15 minutes
Thermal Interface Materials (TIM) Gap Pad 公開日:2013-07-24

An electrically isolating material which provides protection between heat sinks and high voltage devices.

Duration: 5 minutes

Featured Videos すべてを閲覧 (1)

Liquid Dispensed TIM

This animation demonstrates how to combine your Thermal Clad® IMS with Bergquist Liquid Dispensed TIM for an optimal thermal solution.