MaxiGrip Board Rework

maxiGRIP™ and Board Rework Costs

Advanced Thermal Solutions Inc

This tutorial discusses use of the latest technology to attach heat sinks to BGA devices that minimizes potential damage to either the component or the PCB itself during the rework process.

Related Parts

画像メーカー品番商品概要取り付け方法形状入手可能な数量価格詳細を表示
HEAT SINK 27MM X 27MM X 12.5MMATS-52270G-C1-R0HEAT SINK 27MM X 27MM X 12.5MM熱伝導テープ、接着剤（含む）正方形、角度付きフィン100 - 即時$11.55詳細を表示
HEAT SINK 25MM X 25MM X 14.5MMATS-51250K-C1-R0HEAT SINK 25MM X 25MM X 14.5MMクリップ、熱材料正方形、角度付きフィン0 - 即時$12.50詳細を表示
HEAT SINK 33MM X 33MM X 7.5MMATS-52330B-C1-R0HEAT SINK 33MM X 33MM X 7.5MM熱伝導テープ、接着剤（含む）正方形、角度付きフィン187 - 即時$10.26詳細を表示
HEAT SINK 27MM X 27MM X 14.5MMATS-53270K-C1-R0HEAT SINK 27MM X 27MM X 14.5MMクリップ、熱材料正方形、フィン615 - 即時$12.49詳細を表示
HEAT SINK 25MM X 25MM X 12.5MMATS-50250G-C1-R0HEAT SINK 25MM X 25MM X 12.5MMクリップ、熱材料正方形、角度付きフィン975 - 即時$15.30詳細を表示
HEAT SINK 23MM X 23MM X 12.5MMATS-50230G-C1-R0HEAT SINK 23MM X 23MM X 12.5MMクリップ、熱材料正方形、角度付きフィン65 - 即時$15.11詳細を表示
HEAT SINK 19MM X 19MM X 12.5MMATS-50190G-C1-R0HEAT SINK 19MM X 19MM X 12.5MMクリップ、熱材料正方形、角度付きフィン32 - 即時$14.87詳細を表示
HEAT SINK 21MM X 21MM X 12.5MMATS-50210G-C1-R0HEAT SINK 21MM X 21MM X 12.5MMクリップ、熱材料正方形、角度付きフィン100 - 即時$14.97詳細を表示
HEAT SINK 19MM X 19MM X 9MMATS-56001-C1-R0HEAT SINK 19MM X 19MM X 9MM熱伝導テープ、接着剤（含む）正方形、角度付きフィン1918 - 即時$7.80詳細を表示
PTM Published on: 2011-10-13

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ATS Explains - Thermal Interface Material
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Related Product Highlight

ヒートシンクアタッチメントソリューション Advanced Thermal Solutionsのヒートシンクアタッチメントは、ほとんどすべてのヒートシンクをPCBに機械的に取り付けるための複数のオプションをエンジニアに提供します。
maxiFLOW™ with maxiGRIP™ Heatsinks ATS BGA cooling solutions with maxiGRIP attachment come preassembled with phase change thermal interface materials for easy installation/removal.

Related Articles and Blogs

Feasibility Study of an LED-Based Lighting System Using Analytical Modeling A study of the heat loads for an outdoor LED-based lighting system using analytical modeling to determine the feasibility of the design with solar heat load.
Device Thermal Coupling on a PCB A look at how components on a printed circuit board thermally couple and the design considerations that help minimize heat dissipation problems.
Air Flow Measurement in Electronic Systems An analysis of circuit board air flow measurement techniques and the considerations required to obtain an accurate reading in this complex environment.

Related Product Training Modules

Introduction to Heat Sinks This module will review the use of heat sinks, including how a heat sink works, the factors that impact heat sink thermal performance, common heat sink materials, and thermal interface materials.
maxiGRIP™ Flip-Chip Overview of the maxiGRIP Flip-Chip and review of importance of selecting the correct TIM.
Phase Change - Pressure Increase maxiGRIP™ ATS maxiGRIP and superGRIP are ideal solutions when used with phase change TIM for increased thermal and mechanical performance.