ulTIMiFlux Thermal Interface Material
Updated: 2025-11-03
Wakefield Thermal's ulTIMiFlux line of thermal interface materials offer high performance, low cost, configurability, and custom sizes for your thermal system needs.
Brazed High-Performance Liquid Cold Plate
Publish Date: 2023-10-18
Wakefield Thermal’s 300 mm x 240 mm x 34.5 mm 0.007°C/kW high-performance cold plates are used in power/inverters, medical, aerospace and defense, and more.
452E Ejector Series
Publish Date: 2023-05-05
Wakefield's 452E ejectors are a ready-to-go insertion and extraction solution for embedded computing heat frames.
DC Axial Fans
Publish Date: 2020-11-25
Wakefield Thermal's line of DC axial fans used on fan heat sinks which are commonly used to support BGAs, VGAs, and CPU coolers or as chassis fans.
HSF Series Heat Sink/Fan Combinations
Publish Date: 2020-03-03
Wakefield Thermal’s HSF series heat sink/fan combinations are designed for airflow applications in telecom, data centers, networking, cloud computing, and more.
COB and SMB LED Heat Sinks
Publish Date: 2019-11-05
Wakefield Thermal's COB and SMB LED heat sinks feature a compact size and a fan attachment, making them suitable for active and passive cooling.
SKV Series Copper and Aluminum Skived Fin Heat Sinks
Publish Date: 2019-10-30
Wakefield Thermal's Skived Fin heat sink is an alternative to extruded heat sinks when looking for a fin density that cannot be achieved by extrusion technology.
SCGB/SCGBK Series Standard Ground Bars and Kits
Publish Date: 2019-10-30
Wakefield Thermal's SCGB/SCGBK series of standard off the shelf grounding busbar and kits for various applications.
Alves U-Joint Series
Publish Date: 2019-08-09
Wakefield Thermal's Alves U-Joint Series split block design provides a positive lubrication reservoir for long life and low wear.
960 Series Plastic Push-Pin Heat Sinks
Publish Date: 2019-07-18
Wakefield Thermal’s 960 series push-pin heat sinks have plastic push-pins that engage with a hole in one application's PCB design.
RAPID CPU Coolers
Publish Date: 2019-05-30
Wakefield Thermal's RAPID CPU coolers are devices designed to draw heat away from the system’s CPU and other components in an enclosure.
ulTIMiFlux™ High-Performance Thermal Cured Dispensable Gel
Publish Date: 2019-04-23
Wakefield Thermal's ulTIMiFlux™ fully cured dispensable gels require no mixing or curing, providing superior design flexibility.
TEC Series Peltier Thermoelectric Coolers
Publish Date: 2019-04-02
Wakefield Thermal’s Peltier thermoelectric coolers can meet the requirement of higher current and large cooling needs.
Recirculating Liquid Chillers
Publish Date: 2019-02-14
Wakefield Thermal’s HPLC-RM series is a refrigerant-free temperature control device mountable in a 19-inch rack.
High-Performance Recirculating Liquid Chillers
Publish Date: 2018-06-14
Wakefield Thermal's high performance HPLC series compact liquid chiller has both air cooled and water-cooled options available.
HiBay LED Heat Sink
Publish Date: 2018-02-28
Wakefield Thermal's HiBay LED heat sink series is available in varying lengths for warehousing, industrial settings, residential, and sporting arena environments.
Vapor Chambers
Publish Date: 2017-10-25
Wakefield Thermal’s vapor chambers can provide extended life and reliability for components and applied products.
Wave Series™ Heat Sink
Publish Date: 2017-10-18
Wakefield Thermal’s Wave Series heat sink series are a superior choice for cooling BGA.
ulTIMiFlux™ Dielectric Phase-Change Thermal Material
Updated: 2018-08-23
Wakefield Thermal's ulTIMiFlux high performance dielectric phase-change material which utilizes a substrate to act as a thermally conductive carrier in order to deliver you uniform thickness coating of phase-change compound on both sides.
omniKlip-Series Heat Sinks and Clips
Publish Date: 2016-10-14
The Wakefield Thermal omniKlip heat sink series is a configurable and patented (pat. pending), high-performance, low-cost and compact solution for TO-220, TO-247, and TO-264 or similar packages.

