Adhesives, Epoxies, Greases, Pastes

Showing

of 643

Mfr Part #	Quantity Available	Price	Series	Package	Product Status	Type	Size / Dimension	Usable Temperature Range	Color	Thermal Conductivity	Features	Shelf Life	Storage/Refrigeration Temperature
TC1-10G HEAT SINK COMPOUND - HIGH DENSIT Chip Quik Inc.	237 In Stock	1 : ¥1,365.00000 Bulk	-	Bulk	Active	Silicone Compound	10 gram Syringe	-40°F ~ 302°F (-40°C ~ 150°C)	White	0.67W/m-K	-	60 Months	37°F ~ 77°F (3°C ~ 25°C)
250G THERMALCOTE GREASE TUBE 2OZ Boyd Laconia, LLC	497 In Stock	1 : ¥2,200.00000 Bulk	Thermalcote™	Bulk	Active	Silicone Compound	2 oz Tube	-40°F ~ 399°F (-40°C ~ 204°C)	White	0.76W/m-K	-	Indefinite (Unopened)	-
TG-N909-30 NON-SILICONE THERMAL GREASE 30G t-Global Technology	198 In Stock	1 : ¥2,261.00000 Bulk	TG-N909	Bulk	Active	Non-Silicone Grease	30 gram Container	-40°F ~ 392°F (-40°C ~ 200°C)	Gray	9.00W/m-K	Low Outgassing (ASTM E595)	18 Months	77°F (25°C) or Below
CW7270 HEAT SINK GREASE SILICONE FREE Chemtronics	416 In Stock	1 : ¥2,442.00000 Bulk	CircuitWorks®	Bulk	Active	Non-Silicone Grease	7 gram Syringe	-99.4°F ~ 392°F (-73°C ~ 200°C)	White	0.71W/m-K	-	60 Months	-
CW7250 HEAT SINK GREASE BORON NITRIDE Chemtronics	258 In Stock	1 : ¥3,426.00000 Bulk	CircuitWorks®	Bulk	Active	Non-Silicone Grease	3.4 gram Syringe	-99.4°F ~ 392°F (-73°C ~ 200°C)	White	1.85W/m-K	-	60 Months	-
GF1000-00-15-50CC GF1000 50CC DUAL CARTRIDGE Bergquist	224 In Stock	1 : ¥3,879.00000 Box	Gap Filler 1000	Box	Active	Liquid Gap Filler, 2 Part	50cc Cartridge	-76°F ~ 347°F (-60°C ~ 175°C)	Gray	1.00W/m-K	-	6 Months	77°F (25°C)
9460TC-3ML THERMALLY CONDUCTIVE 1-PART EPOX MG Chemicals	147 In Stock	1 : ¥3,910.00000 Bulk	9460TC	Bulk	Active	Epoxy Adhesive	3 ml Syringe	-85°F ~ 302°F (-65°C ~ 150°C)	White	0.80W/m-K	-	14 Months	50°F ~ 86°F (10°C ~ 30°C)
CT40-5 SILICONE GREASE 5 0Z TUBE Chemtronics	427 In Stock	1 : ¥5,249.00000 Bulk	CircuitWorks®	Bulk	Active	Silicone Compound	5 oz Tube	5°F ~ 392°F (-15°C ~ 200°C)	White	0.63W/m-K	-	60 Months	-
8329TCS-6ML ADHESIVE - THERMAL CONDUCTIVE EP MG Chemicals	140 In Stock	1 : ¥5,373.00000 Bulk	8329TCS	Bulk	Active	Epoxy, 2 Part	6 ml Syringe	-40°F ~ 302°F (-40°C ~ 150°C)	Gray	1.40W/m-K	Low Outgassing (ASTM E595)	36 Months	50°F ~ 86°F (10°C ~ 30°C)
1978-DP SILICONE FREE HEAT SINK COMP. Techspray	310 In Stock	1 : ¥5,696.00000 Bulk	-	Bulk	Active	Non-Silicone Compound	4 oz Tube	-	Gray	-	-	60 Months	Ambient Temperature
TC3-10G HEAT SINK THERMAL COMPOUND Chip Quik Inc.	398 In Stock	1 : ¥5,789.00000 Bulk	CHIPQUIK®	Bulk	Active	Silicone Compound	5cc Syringe	-40°F ~ 302°F (-40°C ~ 150°C)	Gray	8.50W/m-K	-	24 Months	37°F ~ 77°F (3°C ~ 25°C)
65-00-GEL75-0010 THERM-A-GAP GEL 75 7.5 W/M-K DIS Parker Chomerics	109 In Stock	1 : ¥7,266.00000 Bottle	THERM-A-GAP™ GEL 75	Bottle	Active	Silicone Gel	10cc Syringe	-67°F ~ 392°F (-55°C ~ 200°C)	White	7.50W/m-K	Low Outgassing (ASTM E595)	18 Months	50°F ~ 90°F (10°C ~ 32.22°C)
8329TFS-25ML SLOW CURE THERM COND ADH FLOW MG Chemicals	44 In Stock	1 : ¥7,632.00000 Bulk	8329TFS	Bulk	Active	Epoxy, 2 Part	25 ml Syringe	-40°F ~ 302°F (-40°C ~ 150°C)	Black	1.20W/m-K	-	36 Months	50°F ~ 86°F (10°C ~ 30°C)
TG-N8000-30 NON-SILICONE PUTTY 30G POT YELLO t-Global Technology	94 In Stock	1 : ¥7,658.00000 Bulk	TG-N8000	Bulk	Active	Non-Silicone Putty	30 gram Jar	-40°C ~ 125°C	Yellow	8.00W/m-K	-	12 Months	-
GF3500S35-07-60-50CC LIQUID GAP FILLER THERMAL CONDU Bergquist	316 In Stock	1 : ¥8,041.00000 Bulk	Gap Filler 3500S35	Bulk	Active	Liquid Gap Filler, 2 Part	50cc Cartridge	-76°F ~ 392°F (-60°C ~ 200°C)	Blue	3.60W/m-K	-	5 Months	77°F (25°C)
GF3500S35-00-60-50CC GF3500S35 50CC DUAL CARTRIDGE Bergquist	174 In Stock	1 : ¥8,232.00000 Box	Gap Filler 3500S35	Box	Active	Liquid Gap Filler, 2 Part	50cc Cartridge	-76°F ~ 392°F (-60°C ~ 200°C)	Blue	3.60W/m-K	-	5 Months	77°F (25°C)
TC4-20G HEAT SINK THERMAL COMPOUND - DEE Chip Quik Inc.	44 In Stock	1 : ¥8,445.00000 Bulk	CHIPQUIK®	Bulk	Active	Thermal Compound, Liquid Metal	20 gram Syringe	-40°F ~ 302°F (-40°C ~ 150°C)	Silver	79.00 W/m-K	-	60 Months	68°F ~ 77°F (20°C ~ 25°C)
65-02-GEL75-0030 THERM-A-GAP GEL 75 7.5 W/M-K DIS Parker Chomerics	449 In Stock	1 : ¥9,719.00000 Bottle	THERM-A-GAP™ GEL 75	Bottle	Active	Silicone Gel	30cc Syringe	-67°F ~ 392°F (-55°C ~ 200°C)	White	7.50W/m-K	Low Outgassing (ASTM E595)	18 Months	50°F ~ 90°F (10°C ~ 32.22°C)
CW7100 CONDUCTIVE SILVER GREASE SYRINGE Chemtronics	394 In Stock	1 : ¥10,377.00000 Bulk	CircuitWorks®	Bulk	Active	Silicone Grease	6.5 gram Syringe	-70°F ~ 485°F (-57°C ~ 252°C)	Silver	5.60W/m-K	-	120 Months	-
8329TFS-50ML SLOW CURE THERM COND ADH FLOW MG Chemicals	92 In Stock	1 : ¥10,885.00000 Bulk	8329TFS	Bulk	Active	Epoxy, 2 Part	45 ml Cartridge	-40°F ~ 302°F (-40°C ~ 150°C)	Black	1.20W/m-K	-	36 Months	50°F ~ 86°F (10°C ~ 30°C)
8329TCS-50ML EPOXY MG Chemicals	169 In Stock	1 : ¥11,321.00000 Bulk	8329TCS	Bulk	Active	Epoxy, 2 Part	50 ml Jar	-40°F ~ 302°F (-40°C ~ 150°C)	Gray	1.40W/m-K	Low Outgassing (ASTM E595)	36 Months	50°F ~ 86°F (10°C ~ 30°C)
1978-1 SILICONE FREE HEAT SINK Techspray	235 In Stock	1 : ¥12,462.00000 Bulk	-	Bulk	Active	Non-Silicone Compound	1 lb Can	-	Gray	-	-	60 Months	Ambient Temperature
8349TFM-45ML EPOXY 2PART 45ML JAR MG Chemicals	135 In Stock	1 : ¥13,408.00000 Box	-	Box	Active	Epoxy, 2 Part	45 ml Jar	-85°F ~ 248°F (-65°C ~ 120°C)	White	0.90W/m-K	-	36 Months	61°F ~ 81°F (16°C ~ 27°C)
A17170-02 TPUTTY 508 Laird Technologies - Thermal Materials	49 In Stock	1 : ¥15,791.00000 Box	Tputty™ 508	Box	Active	Silicone Compound	180cc Cartridge	-40°F ~ 302°F (-40°C ~ 150°C)	Green	3.70W/m-K	Low Outgassing (ASTM E595)	6 Months	-
A17262-01 TFLEX CR607 CARTRIDGE 50CC,EFD S Laird Technologies - Thermal Materials	32 In Stock	1 : ¥17,885.00000 Box	Tflex™ CR607	Box	Active	Silicone Gap Filler	50cc Cartridge	-67°F ~ 392°F (-55°C ~ 200°C)	White, Blue	6.40W/m-K	-	6 Months	-

Showing

of 643

Products in this family are fluids, gels, or semi-solids used primarily to aid the heat transfer between objects such as a transistor and a heatsink or a printed circuit board assembly and a device enclosure. A variety of materials are included, some of which provide additional functions such as adhesive bonding, mechanical cushioning and shock absorption, or environmental sealing.