MaxiGrip Board Rework

maxiGRIP™ and Board Rework Costs

Advanced Thermal Solutions Inc

This tutorial discusses use of the latest technology to attach heat sinks to BGA devices that minimizes potential damage to either the component or the PCB itself during the rework process.

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Related Parts

ImageManufacturer Part NumberDescriptionPart StatusTypeAvailable QuantityView Details
HEAT SINK 27MM X 27MM X 12.5MMATS-52270G-C1-R0HEAT SINK 27MM X 27MM X 12.5MMActiveTop Mount316 - ImmediateView Details
HEAT SINK 25MM X 25MM X 14.5MMATS-51250K-C1-R0HEAT SINK 25MM X 25MM X 14.5MMActiveTop Mount193 - ImmediateView Details
HEAT SINK 33MM X 33MM X 7.5MMATS-52330B-C1-R0HEAT SINK 33MM X 33MM X 7.5MMActiveTop Mount203 - ImmediateView Details
HEAT SINK 27MM X 27MM X 14.5MMATS-53270K-C1-R0HEAT SINK 27MM X 27MM X 14.5MMActiveTop Mount48 - ImmediateView Details
HEAT SINK 25MM X 25MM X 12.5MMATS-50250G-C1-R0HEAT SINK 25MM X 25MM X 12.5MMActiveTop Mount929 - ImmediateView Details
HEAT SINK 23MM X 23MM X 12.5MMATS-50230G-C1-R0HEAT SINK 23MM X 23MM X 12.5MMActiveTop Mount133 - ImmediateView Details
HEAT SINK 19MM X 19MM X 12.5MMATS-50190G-C1-R0HEAT SINK 19MM X 19MM X 12.5MMActiveTop Mount149 - ImmediateView Details
HEAT SINK 21MM X 21MM X 12.5MMATS-50210G-C1-R0HEAT SINK 21MM X 21MM X 12.5MMActiveTop Mount85 - ImmediateView Details
HEAT SINK 19MM X 19MM X 9MMATS-56001-C3-R0HEAT SINK 19MM X 19MM X 9MMActiveTop Mount95 - ImmediateView Details
PTM Published on: 2011-10-13