HSB28-606022
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HSB28-606022

DigiKey Part Number
2223-HSB28-606022-ND
Manufacturer
Same Sky (Formerly CUI Devices)
Manufacturer Product Number
HSB28-606022
Description
HEAT SINK, BGA, 60 X 60 X 22 MM,
Manufacturer Standard Lead Time
24 Weeks
Customer Reference
Detailed Description
Heat Sink BGA Aluminum Alloy 15.83W @ 75°C Top Mount
Datasheet
 Datasheet
EDA/CAD Models
HSB28-606022 Models
Product Attributes
Type
Description
Select All
Category
Mfr
Same Sky (Formerly CUI Devices)
Series
HSB
Packaging
Box
Part Status
Active
Type
Top Mount
Package Cooled
BGA
Attachment Method
Push Pin
Shape
Square, Pin Fins
Length
2.362" (60.00mm)
Width
2.362" (60.00mm)
Diameter
-
Fin Height
0.866" (22.00mm)
Power Dissipation @ Temperature Rise
15.83W @ 75°C
Thermal Resistance @ Forced Air Flow
1.40°C/W @ 200 LFM
Thermal Resistance @ Natural
4.74°C/W
Material
Aluminum Alloy
Material Finish
Black Anodized
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In-Stock: 4
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Quantity
All prices are in JPY
Box
QuantityUnit PriceExt Price
1¥1,129.00000¥1,129
10¥935.10000¥9,351
28¥850.71429¥23,820
56¥796.14286¥44,584
112¥744.03571¥83,332
252¥736.83730¥185,683
Manufacturers Standard Package
Unit Price without JCT:¥1,129.00000
Unit Price with JCT:¥1,241.90000
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