HSB01-080808
Image shown is a representation only. Exact specifications should be obtained from the product data sheet.

HSB01-080808

DigiKey Part Number
2223-HSB01-080808-ND
Manufacturer
Same Sky (Formerly CUI Devices)
Manufacturer Product Number
HSB01-080808
Description
HEAT SINK, BGA, 8.5 X 8.5 X 8 MM
Manufacturer Standard Lead Time
16 Weeks
Customer Reference
Detailed Description
Heat Sink BGA Aluminum Alloy 1.9W @ 75°C Top Mount
Datasheet
 Datasheet
Product Attributes
Type
Description
Select All
Category
Mfr
Same Sky (Formerly CUI Devices)
Series
HSB
Packaging
Box
Part Status
Active
Type
Top Mount
Package Cooled
BGA
Attachment Method
Adhesive (Not Included)
Shape
Square, Pin Fins
Length
0.335" (8.50mm)
Width
0.335" (8.50mm)
Diameter
-
Fin Height
0.315" (8.00mm)
Power Dissipation @ Temperature Rise
1.9W @ 75°C
Thermal Resistance @ Forced Air Flow
16.00°C/W @ 200 LFM
Thermal Resistance @ Natural
39.10°C/W
Material
Aluminum Alloy
Material Finish
Black Anodized
In-Stock: 1,658
Can ship immediately
Quantity
All prices are in JPY
Box
QuantityUnit PriceExt Price
1¥113.00000¥113
10¥100.60000¥1,006
25¥95.84000¥2,396
50¥92.38000¥4,619
100¥89.05000¥8,905
250¥84.81600¥21,204
500¥81.75000¥40,875
3,672¥73.52614¥269,988
7,344¥70.85975¥520,394
Manufacturers Standard Package
Unit Price without JCT:¥113.00000
Unit Price with JCT:¥124.30000
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