Name: 374324B60023G
Brand: Boyd Laconia, LLC
SKU: HS522-ND
Price: 678.7 JPY
Availability: InStock

Image shown is a representation only. Exact specifications should be obtained from the product data sheet.

374324B60023G
DigiKey Part Number	HS522-ND
Manufacturer	Boyd Laconia, LLC
Manufacturer Product Number	374324B60023G
Description	BGA HEAT SINK
Manufacturer Standard Lead Time	14 Weeks
Customer Reference
Detailed Description	Heat Sink BGA, FPGA Aluminum 1.5W @ 50°C Board Level
Datasheet	Datasheet

Product Attributes

Filter Similar Products

Show Empty Attributes

Category Fans, Blowers, Thermal Management Thermal Heat Sinks	Length 1.063" (27.00mm)
Mfr Boyd Laconia, LLC	Width 1.063" (27.00mm)
Series 37432	Fin Height 0.394" (10.00mm)
Packaging Bulk	Power Dissipation @ Temperature Rise 1.5W @ 50°C
Part Status Active	Thermal Resistance @ Forced Air Flow 6.00°C/W @ 500 LFM
Type Board Level	Thermal Resistance @ Natural 30.60°C/W
Package Cooled BGA, FPGA	Material Aluminum
Attachment Method Solder Anchor	Material Finish Black Anodized
Shape Square, Pin Fins	Base Product Number 374324

Report Product Information Error

Documents & Media

Environmental & Export Classifications

Additional Resources

In-Stock: 1,983

Check for Additional Incoming Stock

Non-Cancelable/Non-Returnable

Quantity

All prices are in JPY

Bulk

Manufacturers Standard Package

Unit Price without JCT:	¥617.00000
Unit Price with JCT:	¥678.70000

374324B60023G