HF115AC-0.0055-AC-90
Image shown is a representation only. Exact specifications should be obtained from the product data sheet.

HF115AC-0.0055-AC-90

DigiKey Part Number
BER169-ND
Manufacturer
Manufacturer Product Number
HF115AC-0.0055-AC-90
Description
THERM PAD 21.84MMX18.79MM W/ADH
Manufacturer Standard Lead Time
10 Weeks
Customer Reference
Detailed Description
Thermal Pad Gray 21.84mm x 18.79mm Rectangular Adhesive - One Side
Datasheet
 Datasheet
Product Attributes
Type
Description
Select All
Category
Manufacturer
Bergquist
Series
Packaging
Bulk
Part Status
Active
Usage
TO-218, TO-220, TO-247
Type
Pad, Sheet
Shape
Rectangular
Outline
21.84mm x 18.79mm
Thickness
0.0055" (0.140mm)
Material
Phase Change Compound
Adhesive
Adhesive - One Side
Backing, Carrier
Fiberglass
Color
Gray
Thermal Resistivity
0.35°C/W
Thermal Conductivity
0.8W/m-K
Shelf Life
12 Months
Shelf Life Start
Date of Manufacture
Storage/Refrigeration Temperature
-
Base Product Number
Product Questions and Answers

See what engineers are asking, ask your own questions, or help out a member of the DigiKey engineering community

In-Stock: 4,664
Check for Additional Incoming Stock
All prices are in JPY
Bulk
QuantityUnit PriceExt Price
1¥173.00000¥173
10¥153.80000¥1,538
25¥146.52000¥3,663
50¥141.24000¥7,062
100¥136.15000¥13,615
300¥128.43667¥38,531
500¥124.99800¥62,499
1,000¥120.47700¥120,477
5,000¥110.58160¥552,908
Manufacturers Standard Package
Unit Price without JCT:¥173.00000
Unit Price with JCT:¥190.30000