Name: HF115AC-0.0055-AC-58
Brand: Bergquist
SKU: BER168-ND
Price: 77 JPY
Availability: InStock

Image shown is a representation only. Exact specifications should be obtained from the product data sheet.

HF115AC-0.0055-AC-58
DigiKey Part Number	BER168-ND
Manufacturer	Bergquist
Manufacturer Product Number	HF115AC-0.0055-AC-58
Description	THERM PAD 19.05MMX12.7MM W/ADH
Manufacturer Standard Lead Time	10 Weeks
Customer Reference
Detailed Description	Thermal Pad Gray 19.05mm x 12.70mm Rectangular Adhesive - One Side
Datasheet	Datasheet

Product Attributes

Type	Description	Select All
Category	Fans, Blowers, Thermal Management Thermal Pads, Sheets, Bridges
Manufacturer	Bergquist
Series	Hi-Flow® 115-AC
Packaging	Bulk
Part Status	Active
Usage	TO-220
Type	Pad, Sheet
Shape	Rectangular
Outline	19.05mm x 12.70mm
Thickness	0.0055" (0.140mm)
Material	Phase Change Compound
Adhesive	Adhesive - One Side
Backing, Carrier	Fiberglass
Color	Gray
Thermal Resistivity	0.35°C/W
Thermal Conductivity	0.8W/m-K
Shelf Life	12 Months
Shelf Life Start	Date of Manufacture
Storage/Refrigeration Temperature	-
Base Product Number	HF115AC

Product Questions and Answers

See what engineers are asking, ask your own questions, or help out a member of the DigiKey engineering community

In-Stock: 3,770

Check for Additional Incoming Stock

Quantity

All prices are in JPY

Bulk