Broadcom

ASCKCx00 Surface-Mount LEDs

Broadcom's surface-mount LEDs utilize AllnGaP and InGaN chips in a small form factor

Image of Broadcom ASCKCx00 Surface-Mount LEDsBroadcom's ASCKCx00 surface-mount LEDs in a 1608 package utilize AllnGaP and InGaN chips in a small form factor DFN-2 package. The LEDs are designed with high-reliability performance to work under various environmental conditions. The small form factor package enables flexibility in product designs. The LEDs are ideal for a wide range of applications.

The LEDs are packed in tape-and-reel to facilitate easy pick-and-place assembly. Every reel is shipped in a single intensity and color bin to provide close uniformity.

Features
  • High-reliability package with enhanced silicone resin encapsulation
  • Available in yellow-green, amber, red, blue, green, and phosphor-converted (PC) amber
  • Wide 120° viewing angle
  • Small package form factor and thickness for better design flexibility
  • JEDEC MSL 3
Applications
  • Status indicators
  • Indoor information signs and displays
  • Backlight for switches
  • Wearables and portable devices
  • Backlighting (front-panel, pushbutton, display, keypad, and symbol) in office automation, home appliances, and industrial equipment
Published: 2024-03-14