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ED281DT 28 (2 x 14) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Tin Through Hole
Price & Procurement
17,838 In Stock
Can ship immediately
 

Quantity
All prices are in JPY.
Price Break Unit Price Extended Price
1 37.00000 ¥37
10 35.60000 ¥356
25 30.52000 ¥763
50 25.96000 ¥1,298
100 24.93000 ¥2,493
250 22.38400 ¥5,596
500 21.36800 ¥10,684
1,000 17.80600 ¥17,806
2,500 16.28000 ¥40,700

Submit a request for quotation on quantities greater than those displayed.

ED281DT

Datasheet
Digi-Key Part Number ED3050-5-ND
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Manufacturer

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Manufacturer Part Number ED281DT
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Description CONN IC DIP SOCKET 28POS TIN
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Manufacturer Standard Lead Time 8 Weeks
Detailed Description

28 (2 x 14) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Tin Through Hole

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Customer Reference
Documents & Media
Datasheets ED Series
ED Series Drawing
Environmental Information RoHS 3 Certificate
HTML Datasheet ED Series Drawing
EDA / CAD Models ED281DT by SnapEDA
Product Attributes
Type Description Select All
Categories
Manufacturer On Shore Technology Inc.
Series ED
Packaging Tube 
Part Status Active
Type DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid) 28 (2 x 14)
Pitch - Mating 0.100" (2.54mm)
Contact Finish - Mating Tin
Contact Finish Thickness - Mating 60.0µin (1.52µm)
Contact Material - Mating Phosphor Bronze
Mounting Type Through Hole
Features Open Frame
Termination Solder
Pitch - Post 0.100" (2.54mm)
Contact Finish - Post Tin
Contact Finish Thickness - Post 60.0µin (1.52µm)
Contact Material - Post Phosphor Bronze
Housing Material Polybutylene Terephthalate (PBT), Glass Filled
Operating Temperature -55°C ~ 110°C
Termination Post Length -
Material Flammability Rating UL94 V-0
Current Rating (Amps) 1A
Contact Resistance 20mOhm
 
Environmental & Export Classifications
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
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Additional Resources
Standard Package 17
Other Names ED3050-5