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Price & Procurement
4,197 In Stock
Can ship immediately
 

Quantity
All prices are in JPY.
Price Break Unit Price Extended Price
1 269.00000 ¥269
10 262.00000 ¥2,620
25 254.96000 ¥6,374
50 240.80000 ¥12,040
100 226.63000 ¥22,663
250 212.46800 ¥53,117
500 205.38600 ¥102,693
1,000 184.14000 ¥184,140
5,000 180.59860 ¥902,993

Submit a request for quotation on quantities greater than those displayed.

BDN09-3CB/A01

Datasheet
Digi-Key Part Number 294-1097-ND
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Manufacturer

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Manufacturer Part Number BDN09-3CB/A01
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Description HEATSINK CPU W/ADHESIVE .91"SQ
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Manufacturer Standard Lead Time 14 Weeks
Detailed Description

Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Aluminum Top Mount

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Product Attributes
Type Description Select All
Categories
Manufacturer CTS Thermal Management Products
Series BDN
Part Status Active
Type Top Mount
Package Cooled Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method Thermal Tape, Adhesive (Included)
Shape Square, Pin Fins
Length 0.910" (23.11mm)
Width 0.910" (23.11mm)
Diameter -
Height Off Base (Height of Fin) 0.355" (9.02mm)
Power Dissipation @ Temperature Rise -
Thermal Resistance @ Forced Air Flow 9.60°C/W @ 400 LFM
Thermal Resistance @ Natural 26.90°C/W
Material Aluminum
Material Finish Black Anodized
 
Environmental & Export Classifications
RoHS Status RoHS Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
California Prop 65
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Additional Resources
Standard Package 1,000
Other Names 294-1097
BDN093CB/A01