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13,151 In Stock
Can ship immediately
 

Quantity
All prices are in JPY.
Price Break Unit Price Extended Price
1 28.00000 ¥28
10 24.90000 ¥249
50 22.36000 ¥1,118
100 19.78000 ¥1,978
500 17.20400 ¥8,602
1,000 12.90200 ¥12,902
5,000 11.18200 ¥55,910

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HF115AC-0.0055-AC-58

Datasheet
Digi-Key Part Number BER168-ND
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Manufacturer

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Manufacturer Part Number HF115AC-0.0055-AC-58
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Description THERM PAD 19.05MMX12.7MM W/ADH
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Manufacturer Standard Lead Time 10 Weeks
Detailed Description

Thermal Pad Gray 19.05mm x 12.70mm Rectangular Adhesive - One Side

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Customer Reference
Product Attributes
Type Description Select All
Categories
Manufacturer Bergquist
Series Hi-Flow® 115-AC
Part Status Active
Usage TO-220
Type Pad, Sheet
Shape Rectangular
Outline 19.05mm x 12.70mm
Thickness 0.0055" (0.140mm)
Material Phase Change Compound
Adhesive Adhesive - One Side
Backing, Carrier Fiberglass
Color Gray
Thermal Resistivity 0.35°C/W
Thermal Conductivity 0.8W/m-K
Shelf Life 6 Months
Shelf Life Start -
Storage/Refrigeration Temperature -
 
Environmental & Export Classifications
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
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Additional Resources
Standard Package 100
Other Names 2191182
BER168
BG426642
HF115-0.0055-AC-58
HF115AC-58
HF115AC00055AC58
HF115TAAC-58