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21,271 In Stock
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All prices are in JPY.
Price Break Unit Price Extended Price
1 101.00000 ¥101.00
10 90.60000 ¥906.00
50 81.24000 ¥4,062.00
100 71.87000 ¥7,187.00
500 62.49600 ¥31,248.00
1,000 46.87300 ¥46,873.00
5,000 40.62300 ¥203,115.00

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HF115AC-0.0055-AC-58

Datasheet
Digi-Key Part Number BER168-ND
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Manufacturer

Bergquist

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Manufacturer Part Number HF115AC-0.0055-AC-58
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Description THERM PAD 19.05MMX12.7MM W/ADH
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Manufacturer Standard Lead Time 10 Weeks
Detailed Description

Thermal Pad Gray 19.05mm x 12.70mm Rectangular Adhesive - One Side

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Customer Reference
Product Attributes
Type Description Select All
Categories
Manufacturer Bergquist
Series Hi-Flow® 115-AC
Packaging Bulk 
Part Status Active
Usage TO-220
Type Pad, Sheet
Shape Rectangular
Outline 19.05mm x 12.70mm
Thickness 0.0055" (0.140mm)
Material Phase Change Compound
Adhesive Adhesive - One Side
Backing, Carrier Fiberglass
Color Gray
Thermal Resistivity 0.35°C/W
Thermal Conductivity 0.8W/m-K
Shelf Life 12 Months
Shelf Life Start Date of Manufacture
Storage/Refrigeration Temperature -
Base Part Number HF115AC
 
Environmental & Export Classifications
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
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Additional Resources
Standard Package 100
Other Names 2191182
BER168
BG426642
HF115-0.0055-AC-58
HF115AC-58
HF115AC00055AC58
HF115TAAC-58