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BDN10 CTS Thermal Management Products - Thermal - Heat Sinks

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Compare Parts Datasheets Image Digi-Key Part Number Manufacturer Part Number Manufacturer Description Quantity Available
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JPY
Minimum Quantity Packaging Series Part Status Type Package Cooled Attachment Method Shape Length Width Diameter Fin Height Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural Material Material Finish
   
BDN10-3CB/A01 Datasheet BDN10-3CB/A01 - CTS Thermal Management Products 294-1098-ND BDN10-3CB/A01 CTS Thermal Management Products HEATSINK CPU W/ADHESIVE 1.01"SQ 5,003 - Immediate Available: 5,003 ¥276.00000 1 Minimum: 1 Box BDN Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Included) Square, Pin Fins 1.010" (25.65mm) 1.010" (25.65mm)
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0.355" (9.02mm)
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8.00°C/W @ 400 LFM 26.40°C/W Aluminum Black Anodized
BDN10-5CB/A01 Datasheet Photo Not Available BDN10-5CB/A01-ND BDN10-5CB/A01 CTS Thermal Management Products HEATSINK CPU W/ADHESIVE 1.01"SQ 0 Available: 0
Standard Lead Time 14 Weeks
¥190.50000 1,000
Non-Stock
Minimum: 1,000
Bulk BDN Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Included) Square, Pin Fins 1.010" (25.65mm) 1.010" (25.65mm)
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0.555" (14.10mm)
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6.30°C/W @ 400 LFM 20.80°C/W Aluminum Black Anodized
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10:33:42 7/31/2021