- Henkel’s BERGQUIST® brand thermal management materials include a broad range of solutions for reliability-enhancing heat dissipation within modern electronic devices. The company’s BERGQUIST GAP PAD® gap filling thermal interface materials (TIMs) are soft, compliant, pre-cut pads that reduce assembly stress while providing excellent thermal conductivity. Liquid BERGQUIST Gap Filler TIMs, which can be automatically dispensed, are ideal for applications where complex dimensions are the norm and/or high throughput is required. The expansive thermal solutions portfolio also includes SIL PAD® thermally conductive insulators, BOND PLY® thermal adhesives, HI FLOW® phase change materials and TCLAD® Insulated Metal Substrates (IMS®).


Thermally Conductive Epoxy

Image of LOCTITE/STYCAST's Thermally Conductive Epoxy

LOCTITE STYCAST 2850FT is a two-part, thermally conductive epoxy potting material that provides electrical insulation, thermal-shock resistance, low CTE and is available with multiple catalysts. Learn More

LOCTITE / Multicore Solder Wires

Image of LOCTITE/Multicore's Solder Wire

The LOCTITE / Multicore cored solder wire portfolio features multiple flux core technology that ensures even and consistent distribution of flux throughout the solder wire, and is available in multiple alloys and diameters. Learn More

Thermal Gap Pads

Image of Henkel/Bergquist's Thermal Gap Pads

Henkel / Bergquist’s extensive GAP PAD family provides an effective thermal interface between heat sinks and electronic devices, improving an assembly’s thermal performance and reliability. Learn More

Newest Products すべてを閲覧 (6)

ギャップパッドHC 5.0

ソフトなコンプライアンスギャップ充填材である BergquistのギャップパッドHC 5.0は、5.0W/m-Kの熱伝導性を備え、非常に低い圧縮応力で傑出した熱性能を提供します。 詳細はこちら

Sil-Pad® 900S

Sil-Pad® 900S絶縁材は、電源などのアプリケーション向けに、0.61°Cインチ2/W(@50psi)の熱インピーダンスを特長とます。 詳細はこちら

Q-Pad® 3

Q-Pad® 3ガラス強化グリース置き換え熱インターフェースは、はんだ付けや洗浄を行う前にインストールすることができます。 詳細はこちら

Gap Pad® 1500

Gap Pad® 1500非強化ギャップ充填材料は、1.5W/m-Kの熱伝導性およびコンフォーマブルで、低硬度を特徴とします。 詳細はこちら

Sil-Pad® K-10

Sil-Pad® K-10 Kaptonベースの絶縁体は、良好な切断特性と優れた熱性能を提供します。 詳細はこちら

Gap Pad® VOウルトラソフト

エアギャップ充填用のGap Pad® VOウルトラソフトギャップは1.0W/m-Kの熱伝導性を特長とし、低応力アプリケーション向けに設計されています。 詳細はこちら

Recent PTMs すべてを閲覧 (5)

Gap Pad EMI 1 Publish Date: 2015-11-16

Explore potential markets and applications for the Bergquist Gap Pad EMI 1.0 product.

Duration: 15 minutes
Thermal Interface Material (TIM), Gap Pad® VO Ultra Soft Publish Date: 2014-02-18

Gap Pad VO offers a thermally conductive, electrically isolating material with a wide array of secondary benefits.

Duration: 5 minutes
Thermal Interface materials (TIM) Gap Pad Key Product Characteristics Publish Date: 2013-11-04

Thermal interface materials (TIM) Gap Pad characteristics including thermal, electrical, and mechanical.

Duration: 15 minutes
Thermal Interface Materials (TIM) Gap Pad Publish Date: 2013-07-24

An electrically isolating material which provides protection between heat sinks and high voltage devices.

Duration: 5 minutes

Featured Videos すべてを閲覧 (1)

Liquid Dispensed TIM

This animation demonstrates how to combine your Thermal Clad® IMS with Bergquist Liquid Dispensed TIM for an optimal thermal solution.