Tflex™ 700 Series

5 W/mK soft gap filler thermal interface material from Laird Thermal

Tflex™ 700 SeriesLaird Thermal's Tflex 700 is a 5 W/mK soft gap filler thermal interface material with great thermal performance and high compliancy. The soft interface pad conforms to component topography, resulting in little or no stress on the components and mating chassis or parts. Tflex 700's unique silicone and ceramic filler technology allows a combination of high compliancy and high thermal performance. Tflex 700 is naturally tacky and requires no additional adhesive coating to inhibit thermal performance. Tflex 700 is electrically insulating and stable from -45°C thru +200°C. It also meets UL 94V0 flame rating.

  • Thermal conductivity 5.0 W/mK
  • Highly compliant
  • Lowest thermal resistance even at low pressure
  • Available in thicknesses from 0.020" to 0.200" (0.5 mm to 5.0 mm)
  • Naturally tacky for adhesion during assembly and transport
  • Cooling components to chassis, frame, or other mating components
  • Mass storage devices
  • Heat pipe thermal solutions for the notebook computers
  • Automotive engine control
  • Telecommunication hardware
  • LED solid state relay lighting
  • Power electronics
  • Flat panel displays
  • Audio and video components
  • Computer servers and other IT infrastructure
  • GPS navigation and other portable devices

Tflex 700 Series

THERM PAD 228.6MMX228.6MM GRAYA15896-04THERM PAD 228.6MMX228.6MM GRAY183 - 即時詳細を閲覧
THERM PAD 228.6MMX228.6MM GRAYA15896-02THERM PAD 228.6MMX228.6MM GRAY217 - 即時詳細を閲覧
THERM PAD 228.6MMX228.6MM GRAYA15996-04THERM PAD 228.6MMX228.6MM GRAY73 - 即時詳細を閲覧
THERM PAD 228.6MMX228.6MM GRAYA15796-26THERM PAD 228.6MMX228.6MM GRAY39 - 即時詳細を閲覧
THERM PAD 228.6MMX228.6MM GRAYA15796-27THERM PAD 228.6MMX228.6MM GRAY70 - 即時詳細を閲覧
刊行: 2012-06-29