Microchip Technologyが提供するMIC37100, MIC37101, MIC37102のデータシート

Mucgmp M|C37100I01I02
2018 Microchip Technology Inc. DS20006104A-page 1
MIC37100/01/02
Features
Fixed and Adjustable Output Voltages to 1.24V
µCap Regulator, 10 µF Ceramic Output Capacitor
Stable
280 mV Typical Dropout at 1A
- Ideal for 3.0V to 2.5V Conversion
- Ideal for 2.5V to 1.8V, 1.65V or 1.5V
Conversion
1A Minimum Guaranteed Output Current
1% Initial Accuracy
Low Ground Current
Current Limiting and Thermal Shutdown
Reversed Leakage Protection
Fast Transient Response
Low Profile SOT-223 Package
Power SO-8 Package
S-PAK Package (MIC37102 Only)
Applications
LDO Linear Regulator for PC Add In Cards
PowerPC Power Supplies
High Efficiency Linear Power Supplies
SMPS Post Regulator
Multimedia and PC Processor Supplies
Battery Chargers
Low Voltage Microcontrollers and Digital Logic
General Description
The MIC37100, MIC37101, and MIC37102 are 1A low
dropout, linear voltage regulators that provide low
voltage, high current output from an extremely small
package. Utilizing Microchip’s proprietary Super βeta
PNP pass element, the MIC37100/01/02 offers
extremely low dropout (typically 280 mV at 1A) and low
ground current (typically 11 mA at 1A).
The MIC37100 is a fixed output regulator offered in the
SOT-223 package. The MIC37101 and MIC37102 are
fixed and adjustable regulators, respectively, in a
thermally enhanced power 8-pin SOIC (small outline
package). The MIC37102 is also available in the S-PAK
power package, for applications that require higher
power dissipation or higher operating ambient
temperatures.
The MIC37100/01/02 is ideal for PC add in cards that
need to convert from standard 5V to 3.3V, 3.3V to 2.5V
or 2.5V to 1.8V or lower. A guaranteed maximum
dropout voltage of 500 mV over all operating conditions
allows the MIC37100/01/02 to provide 2.5V from a
supply as low as 3V and 1.8V from a supply as low as
2.3V.
The MIC37100/01/02 is fully protected with overcurrent
limiting and thermal shutdown. Fixed output voltages of
1.5V, 1.65V, 1.8V, 2.5V and 3.3V are available on
MIC37100/01 with adjustable output voltages to 1.24V
on MIC37102.
Typical Application
2.5V/1A Regulator
0
50
100
150
200
250
300
350
0 0.25 0.5 0.75 1
DROPOUT (mV)
OUTPUT CURRENT (A)
2.5VOUT
3.3VOUT
Dropout vs. Output Current
IN 2.5V
V
IN
3.3V
10µF
ceramic
OUT
GND
MIC37100
1A Low-Voltage µCap LDO Regulator
3333 CECE 3333 CCCC
MIC37100/01/02
DS20006104A-page 2 2018 Microchip Technology Inc.
Package Types
MIC37100-X.X (FIXED)
3-Pin SOT223 (S)
(Top View)
MIC37102 (ADJUSTABLE)
5-Pin S-PAK (R)
(Top View)
123
GND
IN OUT
GND
TAB
MIC37101-X.X (FIXED)
8-Pin SOIC (M)
(Top View)
MIC37102 (ADJUSTABLE)
8-Pin SOIC (M)
(Top View)
TAB
5 ADJ
4 OUT
3 GND
2IN
1EN
1EN
IN
OUT
ADJ
8 GND
GND
GND
GND
7
6
5
2
3
4
1EN
IN
OUT
FLG
8 GND
GND
GND
GND
7
6
5
2
3
4
2018 Microchip Technology Inc. DS20006104A-page 3
MIC37100/01/02
Functional Diagrams
Fixed Output Voltage
Ref.
Thermal
Shut-
down
1.240V
IN OUT
MIC37100
Ref.
Thermal
Shut-
down
1.240V1.180V
EN
IN
FLAG
GND
OUT
MIC37101
MIC37101 Fixed Regulator with Flag and Enable Block Diagram
MIC37102 Adjustable Regulator Block Diagram
MIC37100/01/02
DS20006104A-page 4 2018 Microchip Technology Inc.
1.0 ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings †
Supply Voltage (VIN)....................................................................................................................................... 0V to +6.5V
Enable Voltage (VEN) ...............................................................................................................................................+6.5V
Power Dissipation (PDIS) ........................................................................................................................Internally Limited
ESD Rating (Note 1)................................................................................................................................... ESD Sensitive
Operating Ratings ‡
Supply Voltage (VIN)................................................................................................................................... +2.25V to +6V
Enable Voltage (VEN) ........................................................................................................................................ 0V to +6V
Maximum Power Dissipation (PD(max))................................................................................................................. (Note 2)
Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of the device at those or any other conditions above those indicated
in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended
periods may affect device reliability. Specifications are for packaged product only.
‡ Notice: The device is not guaranteed to function outside its operating ratings.
Note 1: Devices are ESD sensitive. Handling precautions are recommended. Human body model, 1.5 kΩ in series
with 100 pF.
2: PD(max) = (TJ(max) TA) ÷ θJA, where θJA depends upon the printed circuit layout. See “Section 4.0 “Appli-
cation Information” section.
ELECTRICAL CHARACTERISTICS
Electrical Characteristics: VIN = VOUT + 1V; VEN = 2.25V; TJ = 25°C, Bold values indicate –40°C ≤ TJ ≤ +125°C;
unless otherwise specified.
Parameter Symbol Min. Typ. Max. Units Conditions
Output Voltage
VOUT
–1
1%10 mA
–2 2 %10 mA ≤ IOUT ≤ 1A, VOUT + 1V ≤
VIN ≤ 6V
Line Regulation 0.06 0.5 % IOUT = 10 mA, VOUT + 1V ≤ VIN ≤
6V
Load Regulation 0.2 1 % VIN = VOUT + 1V, 10 mA ≤ IOUT
1A
Output Voltage Temperature
Coefficient (Note 1)
ΔVOUT/ΔT —40—pm/°C
Dropout Voltage (Note 2)V
DO
—125200 mV IOUT = 100 mA, ΔVOUT = –2%
—210350 mV IOUT = 500 mA, ΔVOUT = –2%
—250400 mV IOUT = 750 mA, ΔVOUT = –2%
—280500 mV IOUT = 1A, ΔVOUT = –1%
Ground Current (Note 3)I
GND
—650— µAI
OUT = 100 mA, VIN = VOUT + 1V
—3.5—mAI
OUT = 500 mA, VIN = VOUT + 1V
—6.7—mAI
OUT = 750 mA, VIN = VOUT + 1V
—1125 mA IOUT = 1A, VIN = VOUT + 1V
Current Limit IOUT(lim) —1.62.5 AV
OUT = 0V, VIN = VOUT + 1V
FLGmo
2018 Microchip Technology Inc. DS20006104A-page 5
MIC37100/01/02
Enable Input
Enable Input Voltage VEN ——0.8 V Logic low (OFF)
2.25 V Logic high (ON)
Enable Input Current IEN
11030 µA VEN = 2.25V
—— 2µA
VEN = 0.8V
—— 4µA
Flag Output
Output Leakage Current IFLG(leak)
—0.01 1 µA VOH = 6V
—— 2
Output Low Voltage VFLG(do) —210500 mV VIN = 2.25V, IOL, = 250 µA
Low Threshold
VFLG
93 — % % of VOUT
High Threshold 99.2 % % of VOUT
Hysteresis — 1 %—
MIC37102 Only
Reference Voltage 1.228 1.240 1.252 V
1.215 1.265 V
Adjust Pin Bias Current 40 80 nA
——120 nA
1: Output voltage temperature coefficient is ΔVOUT(worst case) ÷ (TJ(max) – TJ(min)) where TJ(max) is +125°C
and TJ(min) is –40°C.
2: VDO = VIN – VOUT when VOUT decreases to 98% of its nominal output voltage with VIN = VOUT + 1V. For
output voltages below 2.25V, dropout voltage is the input-to-output voltage differential with the minimum
input voltage being 2.25V. Minimum input operating voltage is 2.25V.
3: IGND is the quiescent current. IIN = IGND + IOUT.
ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrical Characteristics: VIN = VOUT + 1V; VEN = 2.25V; TJ = 25°C, Bold values indicate –40°C ≤ TJ ≤ +125°C;
unless otherwise specified.
Parameter Symbol Min. Typ. Max. Units Conditions
MIC37100/01/02
DS20006104A-page 6 2018 Microchip Technology Inc.
TEMPERATURE SPECIFICATIONS (Note 1)
Parameters Sym. Min. Typ. Max. Units Conditions
Temperature Ranges
Lead Temperature (soldering, 5 sec.) 260 °C
Junction Operating Temperature
Range
TJ–40 +125 °C —
Storage Temperature Range TS–65 +150 °C —
Package Thermal Resistances
Thermal Resistance SOT-223 JC —15 —°C/W
Thermal Resistance SOIC-8 JC —20 —°C/W
Thermal Resistance SPAK-5 JC —2 —°C/W
Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the
maximum allowable power dissipation will cause the device operating junction temperature to exceed the
maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.
2018 Microchip Technology Inc. DS20006104A-page 7
MIC37100/01/02
2.0 TYPICAL PERFORMANCE CURVES
FIGURE 2-1: Power Supply Rejection
Ratio.
FIGURE 2-2: Power Supply Rejection
Ratio.
FIGURE 2-3: Power Supply Rejection
Ratio.
FIGURE 2-4: Power Supply Rejection
Ratio.
FIGURE 2-5: Dropout vs. Output Current.
FIGURE 2-6: Dropout vs. Temperature.
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
0
10
20
30
40
50
60
70
0.01 0.1 11 0 100 1000
PSRR (dB)
FREQUENCY (KHz)
IOUT = 1000mA
COUT = 10μF
CIN = 0
VIN = 5V
VOUT = 3.3V
0
10
20
30
40
50
60
70
80
0.01 0.1 11 0 100 1000
PSRR (dB)
IOUT = 1000mA
COUT = 47μF
CIN = 0
VIN = 5V
VOUT = 3.3V
FREQUENCY (KHz)
0
10
20
30
40
50
60
70
80
0.01 0.1 11 0 100 1000
PSRR (dB)
IOUT = 1000mA
COUT = 10μF
CIN = 0
VIN = 3.3V
VOUT = 2.5V
0.01
FREQUENCY (KHz)
0
10
20
30
40
50
60
70
80
0.01 0.1 11 0 100 1000
PSRR (dB)
IOUT = 1000mA
COUT = 47μF
CIN = 0
VIN = 3.3V
VOUT = 2.5V
FREQUENCY (KHz)
0
50
100
150
200
250
300
350
0 0.25 0.5 0.75 1
DROPOUT (mV)
OUTPUT CURRENT (A)
2.5VOUT
3.3VOUT
0
50
100
150
200
250
300
350
400
450
-40 -20 0 20 40 60 80 100 120
DROPOUT (mV)
TEMPERATURE (°C)
2.5VOUT
MIC37100/01/02
DS20006104A-page 8 2018 Microchip Technology Inc.
FIGURE 2-7: Dropout Characteristics
(1.5V).
FIGURE 2-8: Dropout Characteristics
(1.8V).
FIGURE 2-9: Dropout Characteristics
(2.5V).
FIGURE 2-10: Dropout Characteristics
(3.3V).
FIGURE 2-11: Ground Current vs. Output
Current.
FIGURE 2-12: Ground Current vs. Supply
Voltage (1.5V).
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
1.5 1.7 1.9 2.1 2.3 2.5
OUTPUT VOLTAGE (V)
INPUT VOLTAGE (V)
10mA Load
1000mA Load
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
1.5 1.7 1.9 2.1 2.3 2.5 2.7
OUTPUT VOLTAGE (V)
INPUT VOLTAGE (V)
10mA Load
1000mA Load
0
0.5
1.0
1.5
2.0
2.5
3.0
1.5 2 2.5 3 3.5
OUTPUT VOLTAGE (V)
INPUT VOLTAGE (V)
10mA Load
1000mA Load
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
1.5 2 2.5 3 3.5 4
OUTPUT VOLTAGE (V)
INPUT VOLTAGE (V)
10mA Load
1000mA Load
0
2
4
6
8
10
12
0 0.25 0.5 0.75 1
GROUND CURRENT (mA)
OUTPUT CURRENT (A)
1.5VOUT 3.3VOUT
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0 1 2 3 4 5 6
GROUND CURRENT (mA)
INPUT VOLTAGE (V)
10mA
100mA
2018 Microchip Technology Inc. DS20006104A-page 9
MIC37100/01/02
FIGURE 2-13: Ground Current vs. Supply
Voltage (1.5V).
FIGURE 2-14: Ground Current vs. Supply
Voltage (1.8V).
FIGURE 2-15: Ground Current vs. Supply
Voltage (1.8V).
FIGURE 2-16: Ground Current vs. Supply
Voltage (2.5V).
FIGURE 2-17: Ground Current vs. Supply
Voltage (2.5V).
FIGURE 2-18: Ground Current vs. Supply
Voltage (3.3V).
0
2
4
6
8
10
12
14
16
18
0 1 2 3 4 5 6
GROUND CURRENT (mA)
INPUT VOLTAGE (V)
1000mA
750mA
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0 1 2 3 4 5 6
GROUND CURRENT (mA)
INPUT VOLTAGE (V)
100mA
10mA
0
5
10
15
20
25
GROUND CURRENT (mA)
INPUT VOLTAGE (V)
1000mA
750mA
0 1 2 3 4 5 6
0
0.2
0.4
0.6
0.8
1
1.2
1.4
GROUND CURRENT (mA)
INPUT VOLTAGE (V)
100mA
10mA
0 1 2 3 4 5 6
0
5
10
15
20
25
30
GROUND CURRENT (mA)
INPUT VOLTAGE (V)
1000mA
750mA
0 1 2 3 4 5 6
0
0.2
0.4
0.6
0.8
1
1.2
1.4
GROUND CURRENT (mA)
INPUT VOLTAGE (V)
100mA
10mA
0 1 2 3 4 5 6
MIC37100/01/02
DS20006104A-page 10 2018 Microchip Technology Inc.
FIGURE 2-19: Ground Current vs. Supply
Voltage (3.3V).
FIGURE 2-20: Ground Current vs.
Temperature.
FIGURE 2-21: Ground Current vs.
Temperature.
FIGURE 2-22: Ground Current vs.
Temperature.
FIGURE 2-23: Output Voltage vs.
Temperature.
FIGURE 2-24: Short Circuit Current vs.
Supply Voltage.
0
5
10
15
20
25
30
GROUND CURRENT (mA)
INPUT VOLTAGE (V)
750mA
500mA
0 1 2 3 4 5 6
0
0.05
0.1
0.15
0.2
0.25
0.3
0.35
0.4
-40-200 20406080100120
GROUND CURRENT (mA)
TEMPERATURE (°C)
2.5VOUT
IOUT=10mA
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
-40 -20 100 120
GROUND CURRENT (mA)
2.5VOUT
IOUT=500mA
TEMPERATURE (°C)
0 20406080
0
2
4
6
8
10
12
14
16
-40 -20 100 120
GROUND CURRENT (mA)
2.5VOUT
IOUT=1000mA
TEMPERATURE (°C)
0 20406080
2.4
2.45
2.5
2.55
2.6
-40 -20 100 120
OUTPUT VOLTAGE (V)
2.5VOUT
TEMPERATURE (°C)
0 20406080
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
2.25 3 3.75 4.5 5.25 6
SHORT CIRCUIT CURRENT (A)
SUPPLY VOLTAGE (V)
2018 Microchip Technology Inc. DS20006104A-page 11
MIC37100/01/02
FIGURE 2-25: Short Circuit Current vs.
Temperature.
FIGURE 2-26: Flag Voltage vs. Flag
Current.
FIGURE 2-27: Flag Low Voltage vs.
Temperature.
FIGURE 2-28: Error Flag Pull-Up Resistor.
FIGURE 2-29: Enable Current vs.
Temperature.
FIGURE 2-30: Load Transient Response.
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
-40 -20 100 120
SHORT CIRCUIT CURRENT (A)
2.5VIN
TEMPERATURE (°C)
0 20406080
0
0.2
0.4
0.6
0.8
1.0
00.511.522.533.54
FLAG VOLTAGE (V)
FLAG CURRENT (mA)
3.3VIN 5VIN
2.5VIN
0
50
100
150
200
250
300
350
-40 -20 100 120
FLAG LOW VOLTAGE (mV)
Fla
g
Current = 250
μ
A
TEMPERATURE (°C)
0 20406080
0
1
2
3
4
5
6
0.01 0.1 1 10 100 1000 10000
FLAG VOLTAGE (V)
RESISTANCE (kΩ)
Flag High (OK) VIN=5V
Flag Low (FAULT)
0
1
2
3
4
5
6
7
8
9
-40 -20 100 120
ENABLE CURRENT (μA)
2.5VEN
TEMPERATURE (°C)
0 20406080
TIME (400µs/div.)
LOAD CURRENT
(500mA/div)
OUTPUT VOLTAGE
(200mV/div)
VIN = 3.3V
VOUT = 2.5V
COUT = 10µF Ceramic
1000mA
100mA
MIC37100/01/02
DS20006104A-page 12 2018 Microchip Technology Inc.
FIGURE 2-31: Load Transient Response.
FIGURE 2-32: Line Transient Response.
FIGURE 2-33: Enable Transient Response.
TIME (400µs/div.)
LOAD CURRENT
(500mA/div)
OUTPUT VOLTAGE
(200mV/div)
VIN = 3.3V
VOUT = 2.5V
COUT = 10µF Ceramic
1000mA
10mA
TIME (400µs/div.)
OUTPUT VOLTAGE
(50mV/div)
INPUT VOLTAGE
(2V/div)
VOUT = 2.5V
COUT = 10µF Ceramic
Load=100mA
5V
3.3V
TIME (10µs/div.)
OUTPUT VOLTAGE
(1V/div)
ENABLE VOLTAGE
(2V/div)
VIN = 3.3V
VOUT = 2.5V
IOUT = 100mA
COUT = 10µF Ceramic
2018 Microchip Technology Inc. DS20006104A-page 13
MIC37100/01/02
3.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1: PIN FUNCTION TABLE
Pin Number
MIC37100
SOT223-3
Pin Number
MIC37101
SOIC-8
Pin Number
MIC37102
SOIC-8
Pin Number
MIC37102
S-PAK-5
Pin
Name Description
111EN
Enable (Input): CMOS compatible control
input. Logic high = enable,
Logic low or open = shutdown.
1222INSupply (Input).
3334OUTRegulator output.
—4—FLG
Flag (Output): Open collector error flag
output. Active low = output under voltage.
—— 4 5ADJ
Adjustment Input: Feedback input. Connect
to resistive voltage divider network.
2, TAB 5-8 5-8 3, TAB GND Ground.
MIC37100/01/02
DS20006104A-page 14 2018 Microchip Technology Inc.
4.0 APPLICATION INFORMATION
The MIC37100/01/02 is a high-performance low
dropout voltage regulator suitable for moderate to high
current voltage regulator applications. Its 500 mV
dropout voltage at full load and overtemperature makes
it especially valuable in battery powered systems and
as high efficiency noise filters in post regulator
applications. Unlike older NPN-pass transistor designs,
where the minimum dropout voltage is limited by the
base-to-emitter voltage drop and collector-to-emitter
saturation voltage, dropout performance of the PNP
output of these devices is limited only by the low VCE
saturation voltage.
A trade-off for the low dropout voltage is a varying base
drive requirement. Microchip’s Super βeta PNP
process reduces this drive requirement to only 2% of
the load current.
The MIC37100/01/02 regulator is fully protected from
damage due to fault conditions. Linear current limiting
is provided. Output current during overload conditions
is constant. Thermal shutdown disables the device
when the die temperature exceeds the maximum safe
operating temperature. The output structure of these
regulators allows voltages in excess of the desired
output voltage to be applied without reverse current
flow.
FIGURE 4-1: Capacitor Requirements.
4.1 Output Capacitor
The MIC37100/01/02 requires an output capacitor to
maintain stability and improve transient response. As a
µCap LDO, the MIC37100/01/02 can operate with
ceramic output capacitors as long as the amount of
capacitance is 10 µF or greater. For values of output
capacitance lower than 10 µF, the recommended ESR
range is 200 to 2Ω. The minimum value of output
capacitance recommended for the MIC37100/01/02 is
4.7 µF.
For 10 µF or greater the ESR range recommended is
less than 1Ω. Ultra-low ESR ceramic capacitors are
recommended for output capacitance of 10 µF or
greater to help improve transient response and noise
reduction at high frequency. X7R/X5R dielectric-type
ceramic capacitors are recommended because of their
temperature performance. X7R-type capacitors
change capacitance by 15% over their operating
temperature range and are the most stable type of
ceramic capacitors. Z5U and Y5V dielectric capacitors
change value by as much as 50% and 60%
respectively over their operating temperature ranges.
To use a ceramic chip capacitor with Y5V dielectric, the
value must be much higher than an X7R ceramic
capacitor to ensure the same minimum capacitance
over the equivalent operating temperature range.
4.2 Input Capacitor
An input capacitor of 1 µF or greater is recommended
when the device is more than 4 inches away from the
bulk ac supply capacitance or when the supply is a
battery. Small, surface mount, ceramic chip capacitors
can be used for bypassing. Larger values will help to
improve ripple rejection by bypassing the input to the
regulator, further improving the integrity of the output
voltage.
4.3 Error Flag
The MIC37101 features an error flag (FLG), which
monitors the output voltage and signals an error
condition when this voltage drops 5% below its
expected value. The error flag is an open-collector
output that pulls low under fault conditions and may
sink up to 10 mA. Low output voltage signifies a
number of possible problems, including an overcurrent
fault (the device is in current limit) or low input voltage.
The flag output is inoperative during overtemperature
conditions. A pull-up resistor from FLG to either VIN or
VOUT is required for proper operation. For information
regarding the minimum and maximum values of pull-up
resistance, refer to FIGURE 2-28: “Error Flag Pull-Up
Resistor.”in the 2.0 “Typical Performance Curves”
section of the data sheet.
4.4 Enable Input
The MIC37101 and MIC37102 versions feature an
active-high enable input (EN) that allows on-off control
of the regulator. Current drain reduces to “zero” when
the device is shutdown, with only microamperes of
leakage current. The EN input has TTL/CMOS
compatible thresholds for simple logic interfacing. EN
may be directly tied to VIN and pulled up to the
maximum supply voltage.
4.5 Transient Response and 3.3V to
2.5V or 2.5V to 1.8V, 1.65V or 1.5V
Conversion
The MIC37100/01/02 has excellent transient response
to variations in input voltage and load current. The
device has been designed to respond quickly to load
MIC37100-x.x
IN OUT
GND
CIN COUT
VIN VOUT
2018 Microchip Technology Inc. DS20006104A-page 15
MIC37100/01/02
current variations and input voltage variations. Large
output capacitors are not required to obtain this
performance. A standard 10 µF output capacitor, is all
that is required. Larger values help to improve
performance even further.
By virtue of its low dropout voltage, this device does not
saturate into dropout as readily as similar NPN-based
designs. When converting from 3.3V to 2.5V or 2.5V to
1.8V, or lower, the NPN based regulators are already
operating in dropout, with typical dropout requirements
of 1.2V or greater. To convert down to 2.5V or 1.8V
without operating in dropout, NPN-based regulators
require an input voltage of 3.7V at the very least. The
MIC37100 regulator will provide excellent performance
with an input as low as 3.0V or 2.5V respectively. This
gives the PNP based regulators a distinct advantage
over older, NPN based linear regulators.
4.6 Minimum Load Current
The MIC37100/01/02 regulator is specified between
finite loads. If the output current is too small, leakage
currents dominate and the output voltage rises. A
10 mA minimum load current is necessary for proper
regulation.
4.7 Adjustable Regulator Design
FIGURE 4-2: Adjustable Regulator with
Resistors.
EQUATION 4-1:
The MIC37102 allows programming the output voltage
anywhere between 1.24V and the 6V maximum
operating rating of the family. Two resistors are used.
Resistors can be quite large, up to 1 MΩ, because of
the very high input impedance and low bias current of
the sense comparator. The resistor values are
calculated by:
EQUATION 4-2:
Where VOUT is the desired output voltage. Figure 4-2
shows the component definition. Applications with
widely varying load currents may scale the resistors to
draw the minimum load current required for proper
operation.
4.8 Power SOIC-8 Thermal
Characteristics
One of the secrets of the MIC37101/02’s performance
is its power SO-8 package featuring half the thermal
resistance of a standard SO-8 package. Lower thermal
resistance means more output current or higher input
voltage for a given package size.
Lower thermal resistance is achieved by joining the
four ground leads with the die attach paddle to create a
single piece electrical and thermal conductor. This
concept has been used by MOSFET manufacturers for
years, proving very reliable and cost effective for the
user.
Thermal resistance consists of two main elements, θJC
(junction-to-case thermal resistance) and θCA
(case-to-ambient thermal resistance). See Figure 4-3.
θJC is the resistance from the die to the leads of the
package. θCA is the resistance from the leads to the
ambient air and it includes θCS (case-to-sink thermal
resistance) and θSA (sink-to-ambient thermal
resistance).
FIGURE 4-3: Thermal Resistance.
IN
R1
VIN
R2
EN
OUT
ADJ
GND
MIC37102
ENABLE
SHUTDOWN
VOUT
COUT
VOUT 1.240V1R1
R2
-------
+


=
R1R2
VOUT
1.240
------------- 1


=
qJA
qJC qCA
AMBIENT
printed circuit board
ground plane
heat sink area
SOP-8
Using Figure 474, the minimum amount of required From Figure 44, me minimum amount of copper
MIC37100/01/02
DS20006104A-page 16 2018 Microchip Technology Inc.
Using the power SOIC-8 reduces the θJC dramatically
and allows the user to reduce θCA. The total thermal
resistance, θJA (junction-to-ambient thermal
resistance) is the limiting factor in calculating the
maximum power dissipation capability of the device.
Typically, the power SOIC-8 has a θJC of 20°C/W, this
is significantly lower than the standard SOIC-8 which is
typically 75°C/W. θCA is reduced because pins 5
through 8 can now be soldered directly to a ground
plane which significantly reduces the case-to-sink
thermal resistance and sink to ambient thermal
resistance.
Low dropout linear regulators from Microchip are rated
to a maximum junction temperature of 125°C. It is
important not to exceed this maximum junction
temperature during operation of the device. To prevent
this maximum junction temperature from being
exceeded, the appropriate ground plane heat sink must
be used.
FIGURE 4-4: Copper Area vs. Power
SO-8 Power Dissipation.
Figure 4-4 shows copper area versus power
dissipation with each trace corresponding to a different
temperature rise above ambient.
From these curves, the minimum area of copper
necessary for the part to operate safely can be
determined. The maximum allowable temperature rise
must be calculated to determine operation along which
curve.
EQUATION 4-3:
For example, the maximum ambient temperature is
50°C, the ΔT is determined as follows:
EQUATION 4-4:
Using Figure 4-4, the minimum amount of required
copper can be determined based on the required
power dissipation. Power dissipation in a linear
regulator is calculated as follows:
EQUATION 4-5:
If we use a 2.5V output device and a 3.3V input at an
output current of 1A, then our power dissipation is as
follows:
EQUATION 4-6:
From Figure 4-4, the minimum amount of copper
required to operate this application at a ΔT of 75°C is
160 mm2.
4.9 Quick Method
Determine the power dissipation requirements for the
design along with the maximum ambient temperature
at which the device will be operated. Refer to
Figure 4-5, which shows safe operating curves for
three different ambient temperatures: 25°C, 50°C and
85°C. From these curves, the minimum amount of
copper can be determined by knowing the maximum
power dissipation required. If the maximum ambient
temperature is 50°C and the power dissipation is as
above, 836 mW, the curve in Figure 4-5 shows that the
required area of copper is 160 mm2.
The θJA of this package is ideally 63°C/W, but it will
vary depending upon the availability of copper ground
plane to which it is attached.
0
100
200
300
400
500
600
700
0 0.25 0.50 0.75 1.00 1.25 1.50
COPPER AREA (mm2)
POWER DISSIPATION (W)
40°C
50°C
55°C
65°C
75°C
85°C
100°C
∆TJA =
TT
Jmax
TAmax
=
Where:
TJ(max) = 125°C
TA(max)
= maximum ambient operating
temperature
T75C=
T125C50 C=
PDVIN VOUT
IOUT VIN IGND
+=
PD3.3V2.5V1A3.3V11+mA=
PD800mV 36 mV+=
PD836mW=
2018 Microchip Technology Inc. DS20006104A-page 17
MIC37100/01/02
FIGURE 4-5: Copper Area vs.
Power-SOIC Power Dissipation.
0
100
200
300
400
500
600
700
800
900
0 0.25 0.50 0.75 1.00 1.25 1.50
COPPER AREA (mm2)
POWER DISSIPATION (W)
TA = 85°C 50°C 25°C
TJ = 125°C
NNN namr ( )
MIC37100/01/02
DS20006104A-page 18 2018 Microchip Technology Inc.
5.0 PACKAGING INFORMATION
5.1 Package Marking Information
XXXXX
Example
8-Pin SOIC*
-X.XXX
37101
-3.3YM
Example
3-Pin SOT223*
XXXXX
X.XWNNNP
37100
1.52196P
WNNN 1986
XXXXX
Example
5-Pin S-PAK*
XX
37101
WR
WNNNP XXX 1930P USA
Legend: XX...X Product code or customer-specific information
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
*This package is Pb-free. The Pb-free JEDEC designator ( )
can be found on the outer packaging for this package.
●, ▲, ▼ Pin one index is identified by a dot, delta up, or delta down (triangle
mark).
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information. Package may or may not include
the corporate logo.
Underbar (_) and/or Overbar (‾) symbol may not be to scale.
3
e
3
e
TITLE 8 LEAD SOICK ,ACKAGE OUTLINE E RECOMMENDED LAND PATTERN nnwms « ISOICNEBLDEPLTL PIN u [D mm azasmnns [59mm TEIP VIEu _nmmm %L_l :5, aunmxgm‘ SEE [m w] DETAIL nascm; ® mm w W “53:35,; 4.‘ r. ' J nnuB‘K% m. fuss fig man :nnl] a VHS mm *m a. :gg; I [n 15 1:5: I W NEITEST I DIMENSJDNS ARE IN INENEETNNI CEINTREILLINE DIMENSIDNT INCHES DIMENSJDN qus NEIT INCLUDE MEILD FLASH an PRDTRUSJDNS. EXTRHESRDEIF WHICH SHALL NuT EXCEED mamas] E I E L—ln n25 i“? to 64 :m I UNIT | INCH [MM] Eflflfl mm mm Y mum nu: HE EriégJ L J L wanna] as: U U WM L J L [1.27 ESE] Issal"E§I PEEDMMENDED LAND PATTERN
2018 Microchip Technology Inc. DS20006104A-page 19
MIC37100/01/02
8-Lead SOIC-8 Package Outline and Recommended Land Pattern
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
TITLE 3 LEAD SOT223 PACKAGE OUTLINE & RECOMMENDED LAND PATTERN DRAWING “sou-22373342131 650102 30 7:010 m o 7 H c) C) ,\ o (‘4 7, c) 0751010 V g «3 was; ‘L m (‘5 mm § E 3113: lew 52 1313- S _ j._ _ dfifi ”"5”“ $533 5?? Elm NOTE I Dimensmus and tolerance: are .5 1m ANS] m 5% 1952 2 Cantrelling dimenswn Millimeter: a Dzmnnsionx are exclusive or mold Club and gate bun- 4 m specmcauan comp|y to Jedac spec T0261 Issue c 150:005 UNITIMM 15010 05 800:0‘05 :DDD E 30 05 1301005 W LAND PATTERN
MIC37100/01/02
DS20006104A-page 20 2018 Microchip Technology Inc.
3-Lead SOT223 Package Outline and Recommended Land Pattern
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
TITLE 5 LEAD SPAR PACKAGE OUTLINE & RECOMMENDED LAND PATTERN DRAWING # | SPAK75LD7PL71 UNIT | MN A mm mums A1 A 0:65 0315 w as: A. “so an 5.. <7 u="" 4.="" ab—{fi="" e="" a="" mum="" man="" mi="" 313="" c="" me="" am="" m="" and="" f="" n="" was="" mm="" m="" m="" l="" j="" e="" 3::="" m="" n:="" n="" ma="" m="" rm="" m="" k="" h="" m="" men="" mu="" um="" v="" m="" x="" arm="" m="" m="" m="" b="" l="" m.="" m="" m="" m="" h="" m="" was="" m="" m="" n4="" l="" n="" am="" as:="" m="" as:="" y="" mm="" t="" um="" m="" t="" m4="" .2="" v="" t="" s'="" m="" t="" r="" t="" t="" t="" t="" t="" u="" “an="" .5:="" 315="" m="" i="" v="" was="" as:="" viz="" n:="" e="" n="" p="" a="" t‘="" 1:="" air="" [3="" a="" 8="" 45+!)="" 05=""> F——T L Z E “o? n 3 m o H O, m 17 ESE NEITET g 11101005 1 DIMENSIEIN DEIES NEIT INCLUDE MEILD FLASH EIR D" PREITRUSIEINS‘ +w a‘ DIMENSIEIN INCLUDES PLATINE THICKNESS E SEILDER MASK EIPENINE 3‘ RED CIRCLES IN LAND PATTERN REPRESENT THERMAL VIA, UBUMM IN DIAMETER & SHEIULD BE CIIINNECTED m GND FEIR MAXIMUM PEPPERMANCE PECDMMENDED T P 4 GREEN RECTANGLES IN LAND PATTERN RE RESENT LAND PATTERN SDLDER STENCIL EIPENING (IIIPTIEINAL), LSUXLSUMM‘
2018 Microchip Technology Inc. DS20006104A-page 21
MIC37100/01/02
5-Lead S-PAK Package Outline and Recommended Land Pattern
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
MIC37100/01/02
DS20006104A-page 22 2018 Microchip Technology Inc.
NOTES:
2018 Microchip Technology Inc. DS20006104A-page 23
MIC37100/01/02
APPENDIX A: REVISION HISTORY
Revision A (November 2018)
Converted Micrel document MIC37100/01/02 to
Microchip data sheet DS20006104A.
Minor text changes throughout.
MIC37100/01/02
DS20006104A-page 24 2018 Microchip Technology Inc.
NOTES:
PART No. v —x.x 41x
2018 Microchip Technology Inc. DS20006104A-page 25
MIC37100/01/02
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.
Examples:
a) MIC37100-1.8WS: 1A Low-Voltage µCap LDO
Regulator, 1.8V Fixed Output
Voltage option, –40°C to +125°C
Junction Temperature Range,
RoHS Compliant*, 3-Lead SOT-
223 Package, 78/Tube
b) MIC37100-1.8WS-TR: 1A Low-Voltage µCap LDO
Regulator, 1.8V Fixed Output
Voltage option, –40°C to +125°C
Junction Temperature Range,
RoHS Compliant*, 3-Lead SOT-
223 Package, 2500/Reel
c) MIC37101-1.5YM: 1A Low-Voltage µCap LDO
Regulator, 1.5V Fixed Output
Voltage option, –40°C to +125°C
Junction Temperature Range,
RoHS Compliant, 8-Lead SOIC
Package, 95/Tube
d) MIC37101-1.5YM-TR: 1A Low-Voltage µCap LDO
Regulator, 1.5V Fixed Output
Voltage option, –40°C to +125°C
Junction Temperature Range,
RoHS Compliant, 8-Lead SOIC
Package, 2500/Reel
e) MIC37102YM: 1A Low-Voltage µCap LDO
Regulator, Adjustable Output
Voltage, –40°C to +125°C Junction
Temperature Range, RoHS
Compliant, 8-Lead SOIC Package,
95/Tube
f) MIC371012YM-TR: 1A Low-Voltage µCap LDO
Regulator, Adjustable Output
Voltage, –40°C to +125°C Junction
Temperature Range, RoHS
Compliant, 8-Lead SOIC Package,
2500/Reel
g) MIC37102WR: 1A Low-Voltage µCap LDO
Regulator, Adjustable Output
Voltage, –40°C to +125°C
Junction Temperature Range,
RoHS Compliant*, 5-Lead SPAK
Package, 48/Tube
h) MIC371012WR-TR: 1A Low-Voltage µCap LDO
Regulator, Adjustable Output
Voltage, –40° to +125°C Junction
Temperature Range, RoHS
Compliant*, 8-Lead SPAK
Package, 2500/Reel
PART NO. XX
Package
Device
Device:
MIC371xx: 1A Low-Voltage µCap LDO Regulator
MIC37100: Fixed VOUT to 1.24V in SOT-223
Package
MIC37101: Fixed VOUT to 1.24V in Power SOIC
Package
MIC37102: Adjustable VOUT to 1.24V in Power
SOIC and S-PAK Packages
Output Voltage:
Fixed Output Voltage Option (MIC37100/37101)
1.5 = 1.5V
1.65 = 1.65V
1.8 = 1.8V
2.5 = 2.5V
3.3 = 3.3V
Adjustable <blank> = Adjustable (MIC37102)
Junction
Temperature Range:
W = –40°C to +125°C, RoHs Compliant*
Y = –40°C to +125°C, RoHs Compliant
Package: M = 8-Lead SOIC(MIC37101/37102)
R = 5-Lead SPAK (MIC37102)
S = 3-Lead SOT-223 (MIC37100)
Media Type: <Blank> = 78/Tube (S, SOT-223)
<Blank> = 48/Tube (R, SPAK)
<Blank> = 95/Tube (M, SOIC)
TR = 2,500/Reel
X
Junction
Note 1: Tape and Reel identifier only appears in the
catalog part number description. This identifier is
used for ordering purposes and is not printed on
the device package. Check with your Microchip
Sales Office for package availability with the
Tape and Reel option.
–XX
Media Type
–X.X
Output
Voltage Temperature
Range
MIC37100/01/02
DS20006104A-page 26 2018 Microchip Technology Inc.
NOTES:
YSTEM
2018 Microchip Technology Inc. DS20006104A-page 27
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Trademarks
The Microchip name and logo, the Microchip logo, AnyRate, AVR,
AVR logo, AVR Freaks, BitCloud, chipKIT, chipKIT logo,
CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo,
JukeBlox, KeeLoq, Kleer, LANCheck, LINK MD, maXStylus,
maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB,
OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip
Designer, QTouch, SAM-BA, SpyNIC, SST, SST Logo,
SuperFlash, tinyAVR, UNI/O, and XMEGA are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
and other countries.
ClockWorks, The Embedded Control Solutions Company,
EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS,
mTouch, Precision Edge, and Quiet-Wire are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any
Capacitor, AnyIn, AnyOut, BodyCom, CodeGuard,
CryptoAuthentication, CryptoAutomotive, CryptoCompanion,
CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average
Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial
Programming, ICSP, INICnet, Inter-Chip Connectivity,
JitterBlocker, KleerNet, KleerNet logo, memBrain, Mindi, MiWi,
motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB,
MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation,
PICDEM, PICDEM.net, PICkit, PICtail, PowerSmart, PureSilicon,
QMatrix, REAL ICE, Ripple Blocker, SAM-ICE, Serial Quad I/O,
SMART-I.S., SQI, SuperSwitcher, SuperSwitcher II, Total
Endurance, TSHARC, USBCheck, VariSense, ViewSpan,
WiperLock, Wireless DNA, and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated in
the U.S.A.
Silicon Storage Technology is a registered trademark of Microchip
Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip
Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2018, Microchip Technology Incorporated, All Rights Reserved.
ISBN: 978-1-5224-3841-0
Note the following details of the code protection feature on Microchip devices:
Microchip products meet the specification contained in their particular Microchip Data Sheet.
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
QUALITYMANAGEMENTS
YSTEM
CERTIFIEDBYDNV
== ISO/TS16949==
6‘ ‘MICROCHIP AMERICAS ASIA/PACIFIC ASIA/PACIFIC EUROPE
DS20006104A-page 28 2018 Microchip Technology Inc.
AMERICAS
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