MPLAB® ICE2000 Spec Datasheet by Microchip Technology

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8‘ MICROCHIP Host to Pod Cable Emulator Pod Hale) Toglcs Processor Module
© 2007 Microchip Technology Inc. DS51140N-page 1
CONTENTS
1.0 Introduction ......................................................... 1
2.0 MPLAB ICE 2000 System................................... 1
3.0 Emulator-Related Issues .................................... 2
4.0 Processor Modules ............................................. 2
5.0 Device Adapters ................................................. 4
6.0 Device Adapter Target Footprints ....................... 9
1.0 INTRODUCTION
The processor modules for MPLAB® ICE 2000 are
interchangeable personality modules that allow
MPLAB ICE 2000 to be reconfigured for emulation of
different PIC® microcontrollers (MCUs). This modular-
ity allows the emulation of many different devices with
the addition of a processor module and device adapter,
which provides a very cost effective multiprocessor
emulation system.
The device adapters for MPLAB ICE 2000 are inter-
changeable assemblies that allow the emulator system
to interface to a target application system. Device
adapters also have control logic that allows the target
application to provide a clock source and power to the
processor module. The device adapters support PIC
MCUs in DIP, SDIP and PLCC packages.
Transition sockets, used along with a device adapter,
provide a method of accommodating all PIC MCU
packages, including SOIC, SSOP, PQFP and TQFP
packages.
2.0 MPLAB ICE 2000 SYSTEM
A brief overview of the different components of the
system is shown in the figure below. Each component
is discussed in the following subsections.
FIGURE 2-1: MPLAB® ICE 2000
EMULATOR SYSTEM
2.1 Host to Pod Cable
This is a standard parallel interface cable. MPLAB ICE
2000 is tested with a 6-foot cable. A longer cable may
work, but is not ensured. The cable connects to a par-
allel port on the PC. If a PC has a printer connected to
an LPT device, it is recommended that an additional
interface card be installed, rather than using a splitter
or an A/B switch.
2.2 Emulator Pod
The Emulator Pod contains emulator memory and
control logic. MPLAB ICE 2000 contains a main board
and an additional board for expanded trace memory
and complex control logic. There are no field service-
able parts in the pod. For more information on the pod,
see the MPLAB ICE 2000 on-line help file in MPLAB
IDE (Help>Topics) or the “MPLAB® ICE 2000
In-Circuit Emulator User’s Guide” (DS51488).
The MPLAB ICE 2000 processor module is inserted
into the pod for operation.
2.3 Processor Module
The processor module contains the emulator chip, logic
and low-voltage circuitry. There are no field-serviceable
parts mounted on the printed circuit board housed
within the processor module enclosure.
Communications Cable
Power Supply
Cable
Emulator Pod
Processor Module
with Cable
Logic Probe
Connector
Device Adapter
Transition Socket
Processor Module and Device Adapter Specification
MPLAB® ICE 2000
Flex Circuit Cable Device Adagter Transition Socket Help Toglcs DebuggeDSettings DO Power
MPLAB® ICE 2000
DS51140N-page 2 © 2007 Microchip Technology Inc.
2.4 Flex Circuit Cable
Once the processor module is inserted into the
emulator pod, the flex circuit cable extends the
emulator system to the target application. This is a
custom cable that is attached inside the processor
module enclosure, and can be replaced in the field by
removing the end cap of the processor module
enclosure.
Please, DO NOT PULL on the flex circuit cable to
remove the processor module from the pod. Use the
fins of the processor module end cap to leverage the
module from the pod.
Emulator analog functions may not operate within the
performance specifications published in the device
data sheet due to parasitic capacitance (up to 120 pf)
of the flex cable.
2.5 Device Adapter
The device adapter provides a common interface for
the device being emulated. It is provided in standard
DIP and PLCC styles. The adapter also contains a spe-
cial device that provides an oscillator clock to accu-
rately emulate the oscillator characteristics of the PIC
MCU.
Due to components on the device adapter, which
require target power, the device adapter should be
removed from the flex circuit cable (see Figure 2-1)
when emulator power is being used and the processor
module is not connected to the target. This will
eliminate any loading effects on I/O pins.
2.6 Transition Socket
Transition Sockets are available in various styles to
allow a common device adapter to be connected to one
of the supported surface mount package styles. Transi-
tion sockets are available for various pin counts and
pitches for SOIC, QFP and other styles. For more infor-
mation on transition sockets, see the “MPLAB® ICE
2000/4000 Transition Socket Specification” (DS51194).
An emulator system consists of the following
components which can be ordered separately:
An emulator pod (including the host-to-pod cable
and power supply)
A processor module (including the flex circuit
cable)
A device adapter
An optional transition socket (for surface mount
emulation)
3.0 EMULATOR-RELATED ISSUES
General limitations that apply to the MPLAB ICE 2000
emulator may be found in the on-line help. Select
Help>Topics and then select “MPLAB ICE 2000” under
“Debuggers”.
Device-specific limitations can be found as above or by
selecting Debugger>Settings, clicking the Limitations
tab, and then clicking the Details button.
4.0 PROCESSOR MODULES
Processor modules are identified on the top of the
assembly (e.g., PCM18XA0). To determine which
processors are supported by a specific module, refer to
the file “Readme for MPLAB ICE 2000.txt” in the
MPLAB IDE installation directory or the latest “Product
Selector Guide” (DS00148), which can be found on the
Microchip web site at www.microchip.com.
A typical processor module contains a special bond-out
version of a PIC MCU, with device buffers to control
data flow and control logic. It provides the means of
configuring the MPLAB ICE 2000 emulator for a
specific PIC MCU family and handles low-voltage emu-
lation when needed.
4.1 Power
The operating voltage for most of the control logic and
buffering on the processor module is +5V and is
supplied by the emulator pod. Power to the emulator
processor and some of its surrounding buffers is user-
selectable, and can be powered by the emulator pod
(at +5V only) or the target application system (from
2.0V to 5.5V). This is software selectable and is
configurable through the MPLAB IDE software. At no
time will the emulator system directly power the target
application system. ALWAYS insert the processor
module into the emulator pod before applying power to
the pod.
When connecting to a target application system, there
may be a voltage level on the target application even
though power has not yet been applied to the target
application circuit. This is normal, and is due to current
leakage through VCC of the device adapter. The current
leakage will typically be less than 20 mA. However, if
the target application is using a voltage regulator, it
should be noted that some regulators require the use of
an external shunt diode between VIN and VOUT for
reverse-bias protection. Refer to the manufacturer’s
data sheets for additional information.
Note: When removing the processor module, DO
NOT PULL on the flex cable. Use the tabs
on the processor module or damage to the
flex cable may occur.
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© 2007 Microchip Technology Inc. DS51140N-page 3
4.1.1 EMULATOR PROCESSOR POWER
SUPPLIED BY EMULATOR SYSTEM
If the emulator system is selected to power the emula-
tor processor in the processor module, the emulator
system can be operated without being connected to a
target application. If the system is being connected to a
target application, the power to the pod should be
applied before applying power to the target application.
The target application system’s VCC will experience a
small current load (10 mA typical) when the emulator
system is connected via a device adapter. This is
because the target system must always power the
clock chip in the processor module.
4.1.2 EMULATOR PROCESSOR POWER
SUPPLIED BY TARGET APPLICATION
SYSTEM
When the MPLAB IDE software is brought up, the
emulator system is first initialized with the emulator
system powering the emulator processor. The
“Processor Power Supplied by Target Board” option
may then be selected using the Power tab of the
Settings dialog (Debugger>Settings) to power the
processor module from the target board.
When operating from external power, the processor
module will typically represent a current load equivalent
to the device being emulated (according to its data
sheet) plus approximately 100 mA. Keep in mind that
the target application will affect the overall current load
of the processor module, dependent upon the load
placed upon the processor I/O.
When the processor power is supplied by the target
application system, an external clock (from the target
board) may also be provided. MPLAB IDE will not allow
use of an external clock without the use of external
power.
4.1.3 OPERATING VOLTAGE OF 4.6 TO 5.5
VOLTS
If the target application system’s operating voltage is
between 4.55V (±120 mV) and 5.5V, the processor
module will consider this a STANDARD VOLTAGE
condition. In this mode, the processor can run to its
highest rated speed (as indicated in its data sheet).
The recommended power-up sequence is:
1. Apply power to the PC host.
2. Apply power to the emulator pod and processor
module assembly.
3. Invoke MPLAB IDE.
4. Select Debugger > Settings and click the Power
tab. Configure system for “Processor Power
Supplied by Target Board”.
5. At the error message, apply power to the target
application circuit. Then acknowledge the error.
6. Issue a System Reset (from the debugger
menu) before proceeding.
4.1.4 OPERATING VOLTAGE OF 2.0 TO 4.6
VOLTS
If the target application system’s operating voltage is
between 2.0V and 4.55V (±120 mV), the processor
module will consider this a LOW VOLTAGE condition.
In this mode, the processor is limited to its rated speed
at a given voltage level (as indicated in its data sheet).
To minimize the amount of reverse current that the
target system is exposed to, the recommended
power-up sequence is:
1. Apply power to the PC host.
2. Apply power to the emulator pod and processor
module assembly.
3. Invoke MPLAB IDE.
4. Select Debugger > Settings and click the Power
tab. Configure system for “Processor Power
Supplied by Target Board”.
5. At the error message, apply power to the target
application circuit. Then acknowledge the error.
6. Issue a System Reset (from the debugger
menu) before proceeding.
7. Select Debugger > Settings and click the Power
tab. Verify that the dialog says “Low Voltage
Enabled.” Click Cancel to close the dialog.
4.2 Operating Frequency
The processor modules will support the maximum
frequency (except where noted in Section 3.0
“Emulator-Related Issues”) of the device under
emulation. The maximum frequency of a PIC MCU
device is significantly lower when the operating volt-
age is less than 4.5V.
The processor modules will support a minimum
frequency of 32 kHz. When operating at low
frequencies, response to the screen may be slow.
4.3 Clock Options
MPLAB ICE 2000 allows internal and external clocking.
When set to internal, the clock is supplied from the
internal programmable clock, located in the emulator
pod. When set to external, the oscillator on the target
application system will be utilized.
4.3.1 CLOCK SOURCE FROM EMULATOR
Refer to the MPLAB ICE 2000 on-line help file in
MPLAB IDE (Help>Topics) or the “MPLAB® ICE 2000
In-Circuit Emulator User’s Guide” (DS51488), “Using
the On-Board Clock”, for configuring MPLAB IDE to
supply the clock source.
Freeze Mode Helg>TogIcs Emulating a .600 28-Pin Part ESD Protection and Electrical T1OSC Jumeer Overstress
MPLAB® ICE 2000
DS51140N-page 4 © 2007 Microchip Technology Inc.
4.3.2 CLOCK SOURCE FROM THE TARGET
APPLICATION
If the target application is selected to provide the clock
source, the target board must also be selected to
power the emulator processor (see the MPLAB ICE
2000 on-line help file in MPLAB IDE (Help>Topics) or
the “MPLAB® ICE 2000 In-Circuit Emulator User’s
Guide” (DS51488), “Using a Target Board Clock”).
At low voltage, the maximum speed of the processor
will be limited to the rated speed of the device under
emulation.
An oscillator circuit on the device adapter generates a
clock to the processor module and buffers the clock
circuit on the target board. In this way, the MPLAB ICE
2000 emulator closely matches the oscillator options of
the actual device. All oscillator modes are supported
(as documented in the device’s data sheet) except as
noted in Section 3.0 “Emulator-Related Issues”. The
OSC1 and OSC2 inputs of the device adapter have a
5 pF to 10 pF load. Be aware of this when using a
crystal in HS, XT, LP or LF modes, or an RC network in
RC mode.
The frequency of the emulated RC network may vary
relative to the actual device due to emulator circuitry.
If a specific frequency is important, adjust the RC val-
ues to achieve the desired frequency. Another alterna-
tive would be to allow the emulator to provide the
clock as described in Section 4.3.1 “Clock Source
from Emulator”.
When using the target board clock, the system’s
operating voltage is between 2.5V and 5.5V.
4.4 ESD Protection and Electrical
Overstress
All CMOS chips are susceptible to electrostatic
discharge (ESD). In the case of the processor modules,
the pins of the CMOS emulator are directly connected
to the target connector, making the chip vulnerable to
ESD. ESD can also induce latch-up in CMOS chips,
causing excessive current through the chip and
possible damage. MPLAB ICE 2000 has been
designed to minimize potential damage by implement-
ing overcurrent protection and transient suppressors.
However, care should be given to minimizing ESD
conditions while using the system.
During development, contention on an I/O pin is
possible (e.g., when an emulator pin is driving a ‘1’ and
the target board is driving a ‘0’). Prolonged contention
may cause latch-up and damage to the emulator chip.
One possible precaution is to use current limiting
resistors (~100 Ω) during the development phase on
bidirectional I/O pins. Using limiting resistors can also
help avoid damage to modules, device adapters and
pods that occurs when a voltage source is accidentally
connected to an I/O pin on the target board.
4.5 Freeze Mode
The MPLAB ICE 2000 system allows the option of
“freezing” peripheral operation or allowing them to
continue operating when the processor is halted. This
option is configured in the MPLAB IDE. The Freeze
function is available on all processor modules except
the PCM16XA0.
This function is useful to halt an on-board timer while at
a break point. At a break point and while single
stepping, interrupts are disabled.
5.0 DEVICE ADAPTERS
Device adapters are identified by a DVA number (e.g.,
DVA16XP180, DVA1003). To determine which device
adapters support which processor modules, refer to the
file “Readme for MPLAB ICE 2000.txt” in the MPLAB
IDE installation directory.
Components on the device adapter are powered by the
target board, even when the emulator processor
module is being powered by the emulator system and
running an internal clock. This will cause a maximum
10 mA current draw from the target system.
5.1 Emulating a .600 28-Pin Part
When emulating a .600 wide, 28-pin device, an adapter
will be needed to convert the standard .300 wide
socket on the device adapters to the .600 wide socket
on the target board.
There are many adapters available for this purpose,
such as Digi-Key part number A502-ND.
5.2 T1OSC Jumper
Some device adapters are equipped with a 3-pin
jumper to force the device adapter to enable/disable
the Timer1 oscillator circuitry.
When in the “ON” position, the device adapter’s Timer1
oscillator circuitry is always enabled regardless of the
T1OSCEN bit in T1CON.
When in the “OFF” position, the device adapter’s
Timer1 oscillator circuit is enabled/disabled by software
in application code by the T1OSCEN bit in T1CON.
Note: PCM16XB0/B1, PCM16XE0/E1,
PCM16XK0 and PCM16XL0 do not
support software enable/disable of the
Timer1 circuitry and must use the jumper
to either enable or disable the function (see
Table 5-7 for DVA16XP282, DVA16XP401,
DVA16XL441 and DVA16PQ441).
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5.3 Power and Ground Detection
Two test points are provided on some device adapters
for the following: GND (black) and VCCME (red).
On certain Device Adapters, to visually indicate Target
Power mode, the “target power” LED will illuminate”
5.4 Specific Device Adapter Issues
This section details processor-specific considerations
that have been made on device adapters. Only
adapters with special considerations are listed.
5.4.1 DVA12XP080
5.4.2 DVA12XP081
This device adapter is intended for use with PIC12C50X
8-pin DIP devices. It has four mechanical switches that
allow target pins GP2 to GP5 to be routed to the emulator
silicon on the PCM16XA0 processor module or the
oscillator chip on the device adapter, as shown in Table 5-1.
In addition, a 24C00 EEPROM (U1) is connected to
RA0 and RA1 of the emulator silicon to support the
EEPROM capabilities of the PIC12CE51X family devices.
For information on how to use EEPROM memory, see the
MPLAB IDE on-line device-specific limitations for the
PCM16XA0 (PIC12CE518/519) devices by selecting
Debugger>Settings, clicking the Limitations tab, and then
clicking the Details button.
TABLE 5-1: DVA12XP080 DEVICE ADAPTER SWITCH ASSIGNMENT
Desired Function Switch Positions
RB2 Set S4 to RB2
RB3 Set S3 to RB3
RB4 Set S2 to RB4
RB5 Set S1 to RB5
MCLR Set S3 to MCLR
External Oscillator Input Set S1 to OSC1 and
set S2 to OSC2
TIMER0 Clock Input Set S4 to T0CKI
This device adapter is intended for use with PIC12C67X
8-pin DIP devices. It has two mechanical switches that
allow target pins GP4 and GP5 to be routed to the emulator
silicon on the PCM12XA0 processor module or the
oscillator device on the device adapter, as shown in
Table 5-2.
TABLE 5-2: DVA12XP081 DEVICE ADAPTER SWITCH ASSIGNMENT
Desired Function Switch Positions
GP4 Set S2 to GP4
GP5 Set S1 to GP5
External Oscillator Input Set S1 to OSC1 and
set S2 to OSC2
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MPLAB® ICE 2000
DS51140N-page 6 © 2007 Microchip Technology Inc.
5.4.3 DVA14XP280
5.4.4 DVA16XP140
This device adapter is intended for use with the PIC14000
28-pin DIP device. It has two mechanical switches that
allow target pins OSC1 and OSC2 to be routed to the
emulator silicon on the PCM14XA0 processor module or
the oscillator device on the device adapter, as shown in
Table 5-3.
TABLE 5-3: DVA14XP280 DEVICE ADAPTER SWITCH ASSIGNMENT
Desired Function Switch Position
IN Mode Set S1 to OSC2INT
Set S2 to OSC1INT
HS Mode Set S1 to OSC2EXT
Set S2 to OSC1EXT
This device adapter is intended for use with the PIC16C505
14-pin DIP device. It has four mechanical switches. Two of
the switches allow target pins RB4 and RB5 to be routed to
the emulator silicon on the PCM16XA0 processor module or
the oscillator device on the device adapter. The other two
switches control the routing of RB3 and RC5 signals. RB3
can be a general purpose input or MCLR. RC5 can be a
general purpose I/O or can drive the TOCKI input, as shown
in Table 5-4.
TABLE 5-4: DVA16XP140 DEVICE ADAPTER SWITCH ASSIGNMENT
Desired Function Switch Positions
RC5 Set S4 to RC5
RB3 Set S3 to RB3
RB4 Set S2 to RB4
RB5 Set S1 to RB5
MCLR Set S3 to MCLR
External Oscillator Input Set S1 to OSC1 and
set S2 to OSC2
TIMER0 Clock Input Set S4 to T0CKI
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© 2007 Microchip Technology Inc. DS51140N-page 7
5.4.5 DVA16XP182
5.4.6 DVA16XP187
This device adapter is intended for use with
PIC16C712/716 18-pin DIP devices. It has a second
oscillator device that allows TIMER1 oscillator input ranging
from 32-40 kHz. It has four mechanical switches. Target
pins RB1 and RB2 can be routed to the emulator silicon on
the PCM16XE1 processor module or the TIMER1 oscillator
device on the device adapter. Target pin RB1 is routed to
T1CKI. Target pin RB3 can be a general purpose input or
CCP1, as shown in Table 5-5.
TABLE 5-5: DVA16XP182 DEVICE ADAPTER SWITCH ASSIGNMENT
Desired Function Switch Positions
RB1 Set S2-1 to position B
RB2 Set S2-2 to position B
RB3 Set S2-3 to position B
CCP1 Set S2-3 to position A
TIMER1 Clock Input Set S2-1 to position A and
set S1 to position B
TIMER1 Oscillator Input Set S2-1 to position A and
set S2-2 to position A and
set S1 to position A
This device adapter is intended for use with PIC16F716
18-pin DIP devices. It has a second oscillator device that
allows TIMER1 oscillator input ranging from 32-40 kHz. It
has four mechanical switches. Target pins RB1 and RB2
can be routed to the emulator silicon on the PCM16YJ0
processor module or the TIMER1 oscillator device on the
device adapter. Target pin RB1 is routed to T1CKI. Target
pin RB3 can be a general purpose input or CCP1, as shown
in Table 5-5.
TABLE 5-6: DVA16XP187 DEVICE ADAPTER SWITCH ASSIGNMENT
Desired Function Switch Positions
RB1 Set S2-1 to position B
RB2 Set S2-2 to position B
RB3 Set S2-3 to position B
CCP1 Set S2-3 to position B
TIMER1 Clock Input Set S2-1 to position B and
set S1 to position B
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MPLAB® ICE 2000
DS51140N-page 8 © 2007 Microchip Technology Inc.
5.4.7 DVA16XP282, DVA16XP401, DVA16XL441
AND DVA16PQ441
5.4.8 DVA17XXXX0
These device adapters are intended for use with PIC
MCU devices supported by the PCM17XA0 processor
module. For all processors in EC mode, OSC/4 is not
supported. OSC/4 in EC mode is supported in
DVA17XXXX1 device adapters.
TIMER1 Oscillator Input Set S2-1 to position A and
set S2-2 to position A and
set S1 to position A
TABLE 5-6: DVA16XP187 DEVICE ADAPTER SWITCH ASSIGNMENT (CONTINUED)
Desired Function Switch Positions
These device adapters are intended for use with PIC MCU
devices supported by the PCM16XB0/B1, PCM16XE0/E1,
PCM16XK0 and the PCM16XL0 processor modules. The
device adapters have a second oscillator device that allows
TIMER1 oscillator input ranging from 32 to 40 kHz.
For PCM16XB0/B1, PCM16XE0/E1, PCM16XK0 and
PCM16XL0, configure jumper J1 per Table 5-7.
For all other processor modules supported by these device
adapters, leave the jumper on pins 1-2 (OFF); the Timer1
oscillator enable/disable function is software configurable.
TABLE 5-7: DVA16XP282, DVA16XP401, DVA16XL441 AND DVA16PQ441 JUMPER SETTINGS
Desired Function Switch Positions Results
TIMER1 Oscillator Input enabled Short J1 pins 2-3 (ON) RC0/T1OSO/T1CKI pin = T1OSO
RC1/T1OSI/CCP2 pin = T1OSI
TIMER1 Oscillator Input disabled Short J1 pins 1-2 (OFF) RC0/T1OSO/T1CKI pin = RC0 or T1CKI
RC1/T1OSI/CCP2 pin = RC1 or CCP2
© 2007 Microchip Technology Inc. DS51140N-page 9
6.0 DEVICE ADAPTER TARGET
FOOTPRINTS
To connect an emulator device adapter directly to a
target board (without the use of transition sockets) the
following information will be helpful.
6.1 DIP Device Footprints
DIP device adapter footprints shown will accept
adapter plugs like Samtec series APA plugs. These
plugs can be soldered in place during develop-
ment/emulation and eliminate the need for any other
sockets.
FIGURE 6-1: DVA DRAWING – DIP
x
A
B
x = Pin 1 location
See Table 6-1 for A & B dimensions.
0.100
0.028 DIA
PLATED-THRU
HOLES
C
UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE
IN INCHES.
Drawing of DIP is 40-pin.
DIP C DIP C
8-Pin 0.300 28-Pin 0.300
14-Pin 0.300 40-Pin 0.600
18-Pin 0.300 64-Pin 0.750
20-Pin 0.300
TABLE 6-1: DVA DIMENSIONS – DIP
Package DVA Number* A B
8P/14P DIP DVA1002 1.700 2.100
8P/14P/20P DIP DVA1004 1.700 2.425
8P/14P/20P DIP DVA1007 1.700 2.400
8P DIP DVA12XP080 2.200 1.650
8P DIP DVA12XP081 2.200 1.650
14P DIP DVA16XP140 2.200 1.650
14P DIP DVA16XP141 2.000 2.100
18P DIP DVA16XP180 2.200 1.650
18P DIP DVA16XP182 2.000 2.100
18P DIP DVA16XP183 2.150 2.575
18P DIP DVA16XP185 2.150 2.000
18P DIP DVA16XP186 2.000 2.100
18P DIP DVA16XP187 2.000 2.100
18P DIP DVA18XP180 2.150 2.575
18P DIP DVA1001 2.000 2.200
18P DIP DVA1006 2.000 2.100
20P DIP DVA16XP200 2.150 2.575
20P DIP DVA16XP201 2.150 1.825
20P DIP DVA16XP202 2.200 2.675
28P DIP DVA14XP280 2.200 1.700
28P DIP DVA16XP280 2.200 1.700
28P DIP DVA16XP282 2.000 2.100
28P DIP DVA18XP280 2.000 2.100
40P DIP DVA16XP401 2.200 2.200
40P DIP DVA17XP401 2.200 2.000
40P DIP DVA18XP400 2.200 2.200
64P DIP DVA16XP640 2.500 2.050
* See the MPLAB® ICE 2000 Readme file for
information on devices supported by each DVA.
MPLAB® ICE 2000
DS51140N-page 10 © 2007 Microchip Technology Inc.
6.2 TQFP/PLCC Device Footprints
TQFP/PLCC device adapter footprints shown will
accept board stackers like Samtec series DWM 0.050
Pitch Stackers. These stackers can be soldered in
place during development/emulation and eliminate the
need for any other sockets.
FIGURE 6-2: DVA DRAWING –
SINGLE-ROW TQFP/PLCC
FIGURE 6-3: DVA DRAWING –
DOUBLE-ROW TQFP/PLCC
B
A
w, x, y, z = TQFP Pin 1 location
w’, x’, y’, z’ = PLCC Pin 1 location
See Table 6-2 for A & B dimensions and
Pin 1 location.
C
C
0.050
0.028 DIA
PLATED-THRU
HOLES
UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE
IN INCHES.
Drawing of device is 80/84-pin TQFP/PLCC.
Device C
44-Pin (TQFP) 0.800
64/68-Pin (TQFP/PLCC) 0.960
80/84-Pin (TQFP/PLCC) 1.160
w’
w
x
x’
y
y’z
z’
B
w’
A
w
w, x, y, z = TQFP Pin 1 location
w’, x’, y’, z’ = PLCC Pin 1 location
See Table 6-2 for A & B dimensions and
Pin 1 location.
0.050
0.028 DIA
PLATED-THRU
HOLES
UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE
IN INCHES.
x
x’
y
y’z
z’
1.160
1.160
0.960
0.960
© 2007 Microchip Technology Inc. DS51140N-page 11
Device adapter pin-out matches the PLCC package.
PLCC will map to TQFP as follows:
DVA-44PL interface to 44-pin TQFP – one-to-one
mapping. (No mapping diagram needed.)
DVA-68PL interface to 64-pin TQFP – see
Figure 6-4 for mapping.
DVA-68PL2 interface to 64-pin TQFP – see
Figure 6-5 for mapping.
DVA-84PL interface to 80-pin TQFP – see
Figure 6-6 for mapping.
TABLE 6-2: DVA DIMENSIONS – PLCC/TQFP
Package DVA Number* Mapping Rows A B Pin 1
44P PLCC DVA16XL441 DVA – 44PL Single 2.200 2.200 w’
44P PLCC DVA17XL441 DVA – 44PL Single 1.850 2.100 z’
68P PLCC DVA16XL680 DVA – 68PL2 Single 1.850 2.100 z’
68P PLCC DVA17XL681 DVA – 68PL Single 1.850 2.500 z’
68P PLCC DVA18XL680 DVA – 68PL Single 2.050 2.575 y’
84P PLCC DVA17XL841 DVA – 84PL Single 2.150 2.575 z’
84P PLCC DVA18XL840 DVA – 84PL Single 2.200 2.675 y’
44P TQFP DVA16PQ441 DVA – 44PL Single 2.200 2.300 y
44P TQFP DVA17PQ441 DVA – 44PL Single 1.950 2.200 x
44P TQFP DVA18PQ440 DVA – 44PL Single 2.200 2.300 y
64P TQFP DVA16PQ640 DVA – 68PL2 Single 1.850 2.100 z
64P TQFP DVA17PQ641 DVA – 68PL Single 1.850 2.500 z
64P TQFP DVA18PQ640 DVA – 68PL Single 2.050 2.575 y
64P TQFP DVA1005 DVA – 68PL Single 2.200 2.875 y
80P TQFP DVA17PQ801 DVA – 84PL Single 2.150 2.575 z
80P TQFP DVA18PQ800 DVA – 84PL Single 2.200 2.675 y
68/84P PLCC, 64/80P TQFP DVA18PQ802 DVA – 68PL
DVA – 84PL
Double 2.200 2.675 y’, y
68/84P PLCC, 64/80P TQFP DVA1003 DVA – 68PL
DVA – 84PL
Double 2.200 2.975 y’, y
* See the MPLAB® ICE 2000 Readme file for information on devices supported by each DVA.
DDDDDDDDDDDDDDDD \ ’ \ \ ‘ \ ‘ w ‘ ’ ‘ \ ’ x 60 ‘ l ‘ DDEIEIDDDDEIEIDDDDDEIEI / / Hf DDDDDDDDDDUDDDDDU ‘ \7/ ‘ DDDDDDDDDUDDDDDU \ DDDDDDDDDDDDDDDDD \ \‘ 26 \ ‘ \ \ M. 11“ DDDDDDDDDDDDDDDD DDTEH‘EDDDDDDWJDFVDD H J 60 M‘ DDDDDDDDDDDDDDDDD /J a \\7 UDDDDDUDDDDDUDDD J ‘ \ \ D UDDDDDUDDDDDUDDDD DDDDDDDDDDDDDDDDD \ ‘ N ‘ ‘ M ,W w m DDDDDDDDDDDDDDDD
MPLAB® ICE 2000
DS51140N-page 12 © 2007 Microchip Technology Inc.
FIGURE 6-4: DVA-68PL TO 64-PIN TQFP
FIGURE 6-5: DVA-68PL2 TO 64-PIN TQFP
68 52
1
17
9
60
NC
NC
1
16
NC = No Connection
51
35
43
NC
48
33
64 49
18 3426
17 32
NC
68 52
1
17
13
60
NC
NC
1
16
NC = No Connection
51
35
43
NC
48
33
64 49
18 3427
17 32
NC
DDDDDDDDDDDDDDDDDDDD f H‘ J )‘174 H DDDDDDDDDDDDDDDDDDDDD D a; D D 7 D D D D / D D i i D D77 \ D D’ ‘ D D D D/ D D/fl D D 7,,777 D D\ D D D D D D D D D D D D 7 D D 7 D D 437 a ,DDDDDDDDDDDDDD \\ ”WW M H DDDDDDDDDDDDDDDDDDDD
© 2007 Microchip Technology Inc. DS51140N-page 13
FIGURE 6-6: DVA-84PL TO 80-PIN TQFP
84 64
22 42
1
21
63
43
80 61
11 53
32
74
NC
21 40
NC
60
41
NC NC
1
20
NC = No Connection
MPLAB® ICE 2000
DS51140N-page 14 © 2007 Microchip Technology Inc.
NOTES:
© 2007 Microchip Technology Inc. DS51140N-page 15
Processor Module and Device Adapter Specification
APPENDIX A: REVISION HISTORY
Revision M (March 2006)
Updated Table 5-2.
Revision N (September 2007)
Updated “Device Adapters” section. Added sec-
tion on “Power and Ground Detection”.
Rearranged other sections for clarity.
Updated Table 6-1.
MPLAB® ICE 2000
DS51140N-page 16 © 2007 Microchip Technology Inc.
NOTES:
QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV = ISO/TS 16949:2002 =
© 2007 Microchip Technology Inc. DS51140N-page 17
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, KEELOQ, KEELOQ logo, microID, MPLAB, PIC,
PICmicro, PICSTART, PRO MATE, rfPIC and SmartShunt are
registered trademarks of Microchip Technology Incorporated
in the U.S.A. and other countries.
AmpLab, FilterLab, Linear Active Thermistor, Migratable
Memory, MXDEV, MXLAB, SEEVAL, SmartSensor and The
Embedded Control Solutions Company are registered
trademarks of Microchip Technology Incorporated in the
U.S.A.
Analog-for-the-Digital Age, Application Maestro, CodeGuard,
dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, FlexROM, fuzzyLAB,
In-Circuit Serial Programming, ICSP, ICEPIC, Mindi, MiWi,
MPASM, MPLAB Certified logo, MPLIB, MPLINK, PICkit,
PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal,
PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, Select
Mode, Smart Serial, SmartTel, Total Endurance, UNI/O,
WiperLock and ZENA are trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2007, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Note the following details of the code protection feature on Microchip devices:
Microchip products meet the specification contained in their particular Microchip Data Sheet.
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Microchip received ISO/TS-16949:2002 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
Q MICROCHIP AMERICAS ASIA/PACIFIC ASIA/PACIFIC EUROPE
DS51140N-page 18 © 2007 Microchip Technology Inc.
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