Texas Instrumentsが提供するTPS560430のデータシート

V'.‘ 1!. B X E I TEXAS INSTRUMENTS \/\/
IOUT (A)
Efficiency (%)
0.01 0.1 1
60
65
70
75
80
85
90
95
100
D000
VIN = 8 V
VIN = 12 V
VIN = 24 V
CB
SW
L
CBOOT
FB
VIN
VIN up to 36 V
COUT
EN
CIN
GND
VOUT
RFBT
RFBB
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An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. UNLESS OTHERWISE NOTED, this document contains PRODUCTION
DATA.
TPS560430
SLVSE22B –SEPTEMBER 2017REVISED JUNE 2018
TPS560430 SIMPLE SWITCHER
®
4-V to 36-V, 600-mA Synchronous Step-Down Converter
1
1 Features
1 Configured for Rugged Industrial Applications
Input Voltage Range: 4 V to 36 V
600-mA Continuous Output Current
Minimum Switching-On Time: 60 ns
98% Maximum Duty Cycle
Support Startup with Pre-Biased Output
Short Circuit Protection with Hiccup Mode
±1.5% Tolerance Voltage Reference over
Temperature from –40°C to 125°C
Precision Enable
Small Solution Size and Ease of Use
Integrated Synchronous Rectification
Internal Compensation for Ease of Use
SOT-23-6 Package
Various Options in Pin-to-Pin Compatible Package
1.1-MHz and 2.1-MHz Frequency Options
PFM and Forced PWM (FPWM) Options
Fixed 3.3-V Output Option
Create a Custom Design Using the TPS560430
With the WEBENCH®Power Designer
2 Applications
Grid Infrastructure: Advanced Metering
Infrastructure
Motor Drive: AC Inverters, VF Drives, Servos,
Field Actuators
Factory and Building Automation: PLC, Industrial
PC, Elevator Control, HVAC Control
Aftermarket Automotive: Camera
General Purpose Wide VIN Power Supplies
3 Description
The TPS560430 is an easy to use synchronous step-
down DC-DC converter capable of driving up to 600-
mA load current. With a wide input range of 4 V to 36
V, the device is suitable for a wide range of
applications from industrial to automotive for power
conditioning from an unregulated source.
The TPS560430 has 1.1-MHz and 2.1-MHz operating
frequency versions for either high efficiency or small
solution size. The TPS560430 also has FPWM
(forced PWM) version to achieve constant frequency
and small output voltage ripple over the full load
range. Soft-start and compensation circuits are
implemented internally which allows the device to be
used with minimum external components.
The device has built-in protection features, such as
cycle-by-cycle current limit, hiccup mode short-circuit
protection, and thermal shutdown in case of
excessive power dissipation. The TPS560430 is
available in SOT-23-6 package.
Device Information (1)
PART NUMBER PACKAGE BODY SIZE (NOM)
TPS560430 SOT-23-6 2.90 mm × 1.60 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Simplified Schematic Efficiency vs Output Current
VOUT = 5 V, 1100 kHz, PFM
l TEXAS INSTRUMENTS
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Table of Contents
1 Features.................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Revision History..................................................... 2
5 Device Comparison Table..................................... 3
6 Pin Configuration and Functions......................... 3
7 Specifications......................................................... 4
7.1 Absolute Maximum Ratings ...................................... 4
7.2 ESD Ratings.............................................................. 4
7.3 Recommended Operating Conditions....................... 4
7.4 Thermal Information.................................................. 4
7.5 Electrical Characteristics........................................... 5
7.6 Timing Requirements................................................ 6
7.7 Switching Characteristics.......................................... 6
7.8 Typical Characteristics.............................................. 7
8 Detailed Description.............................................. 9
8.1 Overview ................................................................... 9
8.2 Functional Block Diagram......................................... 9
8.3 Feature Description................................................. 10
8.4 Device Functional Modes........................................ 14
9 Application and Implementation ........................ 15
9.1 Application Information............................................ 15
9.2 Typical Application ................................................. 15
10 Power Supply Recommendations ..................... 22
11 Layout................................................................... 22
11.1 Layout Guidelines ................................................. 22
11.2 Layout Example .................................................... 23
12 Device and Documentation Support ................. 24
12.1 Device Support...................................................... 24
12.2 Documentation Support ........................................ 24
12.3 Receiving Notification of Documentation Updates 24
12.4 Community Resources.......................................... 24
12.5 Trademarks........................................................... 24
12.6 Electrostatic Discharge Caution............................ 24
12.7 Glossary................................................................ 25
13 Mechanical, Packaging, and Orderable
Information ........................................................... 25
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision A (May 2018) to Revision B Page
Changed marketing status of the TPS560430X orderable from Product Preview to Production........................................... 3
Changed marketing status of the TPS560430Y orderable from Product Preview to Production........................................... 3
Changed marketing status of the TPS560430YF orderable from Product Preview to Production. ....................................... 3
Added Figure 4 Efficiency vs Load Current............................................................................................................................ 7
Added Figure 5 Efficiency vs Load Current............................................................................................................................ 7
l TEXAS INSTRUMENTS
GND
1
2
3 4
5
EN
6CB
FB
SW
VIN
3
TPS560430
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5 Device Comparison Table
PART NUMBER Frequency PFM or FPWM Output
TPS560430XF 1.1 MHz FPWM Adjustable
TPS560430X3F 1.1 MHz FPWM Fixed 3.3 V
TPS560430X 1.1 MHz PFM Adjustable
TPS560430Y 2.1 MHz PFM Adjustable
TPS560430YF 2.1 MHz FPWM Adjustable
(1) A = Analog, P = Power, G = Ground.
6 Pin Configuration and Functions
DBV Package
6-Pin SOT-23-6
Top View
Pin Functions
PIN TYPE (1) DESCRIPTION
NO. NAME
1 CB P Bootstrap capacitor connection for high-side FET driver. Connect a high quality 100-nF capacitor
from this pin to the SW pin.
2 GND G Power ground terminals, connected to the source of low-side FET internally. Connect to system
ground, ground side of CIN and COUT. Path to CIN must be as short as possible.
3 FB A Feedback input to the convertor. Connect a resistor divider to set the output voltage. Never short
this terminal to ground during operation.
4 EN A Precision enable input to the convertor. Do not float. High = on, Low = off. Can be tied to VIN.
Precision enable input allows adjustable UVLO by external resistor divider.
5 VIN P Supply input terminal to internal bias LDO and high-side FET. Connect to input supply and input
bypass capacitors CIN. Input bypass capacitors must be directly connected to this pin and GND.
6 SW P Switching output of the convertor. Internally connected to source of the high-side FET and drain of
the low-side FET. Connect to power inductor.
l TEXAS INSTRUMENTS
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(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Operating at junction temperatures greater than 125°C, although possible, degrades the lifetime of the device.
7 Specifications
7.1 Absolute Maximum Ratings
Over the recommended operating junction temperature range of -40 °C to 125 °C (unless otherwise noted) (1)
PARAMETER MIN MAX UNIT
Input Voltages
VIN to GND –0.3 38
VEN to GND –0.3 VIN + 0.3
FB to GND –0.3 5.5
Output Voltages
SW to GND –0.3 VIN + 0.3
VSW to GND less than 10 ns transient –3.5 38
CB to SW –0.3 5.5
TJJunction temperature (2) –40 150 °C
Tstg Storage temperature –65 150
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.2 ESD Ratings
VALUE UNIT
VESD Electrostatic discharge Human-body model (HBM) (1) ± 2500 V
Charged-device model (CDM) (2) ± 750 V
(1) Recommended Operating Conditions indicate conditions for which the device is intended to be functional, but do not guarantee specific
performance limits. For guaranteed specifications, see Electrical Characteristics
7.3 Recommended Operating Conditions
Over the recommended operating junction temperature range of -40 °C to 125 °C (unless otherwise noted) (1)
PARAMETER MIN MAX UNIT
Input Voltages
VIN to GND 4 36
VEN 0 VIN
FB 0 4.5
Output Voltage VOUT 1.0 95% of VIN V
Output Current IOUT 0 600 mA
Temperature Operating junction temperature range, TJ–40 +125 °C
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953
(2) The value of RθJA given in this table is only valid for comparison with other packages and can not be used for design purposes. These
values were calculated in accordance with JESD 51-7, and simulated on a specified JEDEC board. They do not represent the
performance obtained in an actual application.
7.4 Thermal Information
THERMAL METRIC (1) DBV (6 PINS) UNIT
RθJA (2) Junction-to-ambient thermal resistance 173 °C/W
RθJC_T Junction-to-case (TOP) thermal resistance 116 °C/W
RθJC_B Junction-to-case (BOTTOM) thermal resistance 31 °C/W
ψJT Junction-to-top characterization parameter 20 °C/W
ψJB Junction-to-board characterization parameter 30 °C/W
l TEXAS INSTRUMENTS
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(1) Guaranteed by design.
7.5 Electrical Characteristics
Limits apply over the recommended operating junction temperature (TJ) range of –40°C to +125°C, unless otherwise stated.
Minimum and maximum limits are specified through test, design or statistical correlation. Typical values represent the most
likely parametric norm at TJ= 25 °C, and are provided for reference purposes only. Unless otherwise stated, the following
conditions apply: VIN = 4 V to 36 V.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
SUPPLY VOLTAGE (VIN PIN)
VIN Operation input voltage 4 36 V
VIN_UVLO Undervoltage lockout thresholds
Rising threshold 3.55 3.75 4.00
VFalling threshold 3.25 3.45 3.65
Hysteresis 0.3
IQOperating quiescent current (non-
switching) PFM version, VEN = 3.3 V, VFB =
1.1V 80 120 µA
ISHDN Shutdown current VEN = 0 V 3 10 µA
ENABLE (EN PIN)
VEN_H Enable rising threshold voltage 1.1 1.23 1.36 V
VEN_L Enable falling threshold voltage 0.95 1.1 1.22 V
VEN_HYS Enable hysteresis voltage 0.13 V
IEN Leakage current at EN pin VEN = 3.3 V 10 200 nA
VOLTAGE REFERENCE (FB PIN)
VREF Reference voltage
TJ= 25 °C 0.995 1.00 1.005 V
TJ= –40 °C to 125 °C 0.985 1.00 1.015 V
Fixed 3.3-V output, TJ= 25 °C 3.28 3.3 3.32 V
Fixed 3.3-V output, TJ= –10 °C to
85 °C 3.272 3.3 3.328 V
Fixed 3.3-V output, TJ= –40 °C to
125 °C 3.25 3.3 3.35 V
IFB Leakage current at FB pin VFB = 1.2 V 0.2 50 nA
Fixed 3.3-V output, VFB = 3.96 V 1.7 µA
CURRENT LIMITS AND HICCUP
IHS_LIMIT Peak inductor current limit 0.8 1.1 1.4 A
ILS_LIMIT Valley inductor current limit 0.62 0.8 0.98 A
ILS_ZC Zero cross current (PFM version) 20 mA
ILS_NEG Negative current limit (FPWM
version) -0.7 -0.5 -0.3 A
VHICCUP Hiccup threshold of FB pin % of reference voltage 40%
INTEGRATED MOSFETS
RDS_ON_HS High-side MOSFET ON-resistance TJ= 25 °C, VIN = 12 V 450 mΩ
RDS_ON_LS Low-side MOSFET ON-resistance TJ= 25 °C, VIN = 12 V 240 mΩ
THERMAL SHUTDOWN (1)
TSHDN Thermal shutdown threshold 170 °C
THYS Hysteresis 12 °C
l TEXAS INSTRUMENTS
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7.6 Timing Requirements
Limits apply over the recommended operating junction temperature (TJ) range of –40°C to +125°C, unless otherwise stated.
Minimum and maximum limits are specified through test, design or statistical correlation. Typical values represent the most
likely parametric norm at TJ= 25 °C, and are provided for reference purposes only. Unless otherwise stated, the following
conditions apply: VIN = 4 V to 36 V.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
SOFT START
TSS Internal soft-start time The time of internal reference to
increase from 10% to 90% of VREF,
VIN = 12 V 1.8 ms
HICCUP
THICCUP Hiccup time VIN = 12 V 135 ms
7.7 Switching Characteristics
Limits apply over the recommended operating junction temperature (TJ) range of –40°C to +125°C, unless otherwise stated.
Minimum and maximum limits are specified through test, design or statistical correlation. Typical values represent the most
likely parametric norm at TJ= 25 °C, and are provided for reference purposes only. Unless otherwise stated, the following
conditions apply: VIN = 4 V to 36 V.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
SWITCHING NODE (SW PIN)
tON_MIN Minimum turn-on time IOUT = 600 mA 60 ns
tOFF_MIN Minimum turn-off time IOUT = 600 mA 100 ns
tON_MAX Maximum turn-on time 7.5 µs
OSCILLATOR
fSW Oscillator frequency 1.1-MHz version 0.935 1.1 1.265 MHz
2.1-MHz version 1.785 2.1 2.415 MHz
l TEXAS INSTRUMENTS ma ma ma mo mo : m
IOUT (A)
Efficiency (%)
0.0001 0.001 0.01 0.1 1
0
10
20
30
40
50
60
70
80
90
100
D012
FPWM, 8 VIN
FPWM, 12 VIN
FPWM, 24 VIN
PFM, 8 VIN
PFM, 12 VIN
PFM, 24 VIN
IOUT (A)
Efficiency (%)
0.0001 0.001 0.01 0.1 1
0
10
20
30
40
50
60
70
80
90
100
D011
FPWM, 8 VIN
FPWM, 12 VIN
FPWM, 24 VIN
PFM, 8 VIN
PFM, 12 VIN
PFM, 24 VIN
IOUT (A)
Efficiency (%)
0.0001 0.001 0.01 0.1 1
0
10
20
30
40
50
60
70
80
90
100
D003
FPWM, 15 VIN
FPWM, 24 VIN
FPWM, 36 VIN
PFM, 15 VIN
PFM, 24 VIN
PFM, 36 VIN
IOUT (A)
Efficiency (%)
0.0001 0.001 0.01 0.1 1
0
10
20
30
40
50
60
70
80
90
100
D001
FPWM, 8 VIN
FPWM, 12 VIN
FPWM, 24 VIN
FPWM, 36 VIN
PFM, 8 VIN
PFM, 12 VIN
PFM, 24 VIN
PFM, 36 VIN
IOUT (A)
Efficiency (%)
0.0001 0.001 0.01 0.1 1
0
10
20
30
40
50
60
70
80
90
100
D002
FPWM, 8 VIN
FPWM, 12 VIN
FPWM, 24 VIN
FPWM, 36 VIN
PFM, 8 VIN
PFM, 12 VIN
PFM, 24 VIN
PFM, 36 VIN
7
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7.8 Typical Characteristics
VIN = 12 V, fSW = 1.1 MHz, TA= 25°C, unless otherwise specified.
fSW = 1.1 MHz VOUT = 3.3 V
Figure 1. Efficiency vs Load Current
fSW = 1.1 MHz VOUT = 5 V
Figure 2. Efficiency vs Load Current
fSW = 1.1 MHz VOUT = 12 V
Figure 3. Efficiency vs Load Current
fSW = 2.1 MHz VOUT = 3.3 V
Figure 4. Efficiency vs Load Current
fSW = 2.1 MHz VOUT = 5 V
Figure 5. Efficiency vs Load Current
fSW = 1.1 MHz VOUT = 5 V FPWM version
Figure 6. Load Regulation
l TEXAS INSTRUMENTS a m an ‘ unnz
Temperature (qC)
Reference Voltage (V)
-50 0 50 100 150
0.9986
0.9988
0.999
0.9992
0.9994
0.9996
0.9998
1
1.0002
D009
Temperature (qC)
HS and LS Current Limit (A)
-50 0 50 100 150
0.7
0.8
0.9
1
1.1
1.2
D010
HS
LS
Temperature (qC)
IQ (PA)
-50 0 50 100 150
60
65
70
75
80
D007
Temperature (qC)
VIN UVLO (V)
-50 0 50 100 150
3.3
3.4
3.5
3.6
3.7
3.8
3.9
D008
Rising
Falling
VIN (V)
VOUT (V)
4 4.5 5 5.5 6 6.5 7
3
3.5
4
4.5
5
5.5
D006
IOUT = 0 mA
IOUT = 100 mA
IOUT = 300 mA
IOUT = 600 mA
VIN (V)
VOUT (V)
5 10 15 20 25 30 35 40
5.03
5.031
5.032
5.033
5.034
5.035
5.036
D005
IOUT = 0 mA
IOUT = 100 mA IOUT = 300 mA
IOUT = 600 mA
8
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Typical Characteristics (continued)
VIN = 12 V, fSW = 1.1 MHz, TA= 25°C, unless otherwise specified.
fSW = 1.1 MHz VOUT = 5 V FPWM version
Figure 7. Line Regulation
fSW = 1.1 MHz VOUT = 5 V FPWM version
Figure 8. Dropout
VFB = 1.1 V PFM verison
Figure 9. IQvs Temperature Figure 10. VIN UVLO vs Temperature
Figure 11. Reference Voltage vs Temperature Figure 12. HS and LS Current Limit vs Temperature
l TEXAS INSTRUMENTS
EA
REF
EN
SW
CB
Internal
SS
Oscillator
Precision
Enable
LDO
PFM
Detector
Slope
Comp
PWM CONTROL LOGIC
UVLOTSD
Freq
Foldback Zero
Cross
HICCUP
Detector
VIN
RC
CC
GND
FB
LSI Sense
HSI Sense
FB
VCC
Enable
Ton_min/Toff_min
Detector
+
±
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8 Detailed Description
8.1 Overview
The TPS560430 regulator is an easy to use synchronous step-down DC-DC converter operating from 4-V to 36-
V supply voltage. It is capable of delivering up to 600-mA DC load current in a very small solution size. The
family has multiple versions applicable to various applications, refer to Device Comparison Table for detailed
information.
The TPS560430 employs fixed-frequency peak-current mode control. The device enters PFM Mode at light load
to achieve high efficiency for PFM version. And FPWM version is provided to achieve low output voltage ripple,
tight output voltage regulation, and constant switching frequency at light load. The device is internally
compensated, which reduces design time, and requires few external components.
Additional features such as precision enable and internal soft-start provide a flexible and easy to use solution for
a wide range of applications. Protection features include thermal shutdown, VIN under-voltage lockout, cycle-by-
cycle current limit, and hiccup mode short-circuit protection.
The family requires very few external components and has a pin-out designed for simple, optimum PCB layout.
8.2 Functional Block Diagram
l TEXAS INSTRUMENTS
VSW
VIN
D = tON/ TSW
tON tOFF
TSW
t
0
SW Voltahe
iL
IOUT
t
0
Inductor Current
ILPK
DiL
10
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8.3 Feature Description
8.3.1 Fixed Frequency Peak Current Mode Control
The following operation description of the TPS560430 will refer to the Functional Block Diagram and to the
waveforms in Figure 13. TPS560430 is a step-down synchronous buck regulator with integrated high-side (HS)
and low-side (LS) switches (synchronous rectifier). The TPS560430 supplies a regulated output voltage by
turning on the HS and LS NMOS switches with controlled duty cycle. During high-side switch ON time, the SW
pin voltage swings up to approximately VIN, and the inductor current iLincrease with linear slope (VIN – VOUT) / L.
When the HS switch is turned off by the control logic, the LS switch is turned on after an anti-shoot-through dead
time. Inductor current discharges through the low-side switch with a slope of –VOUT / L. The control parameter of
a buck converter is defined as Duty Cycle D = tON / TSW, where tON is the high-side switch ON time and TSW is
the switching period. The regulator control loop maintains a constant output voltage by adjusting the duty cycle
D. In an idea Buck converter, where losses are ignored, D is proportional to the output voltage and inversely
proportional to the input voltage: D = VOUT / VIN.
Figure 13. SW Node and Inductor Current Waveforms in Continuous Conduction Mode (CCM)
The TPS560430 employs fixed-frequency peak-current mode control. A voltage feedback loop is used to get
accurate DC voltage regulation by adjusting the peak-current command based on voltage offset. The peak
inductor current is sensed from the high-side switch and compared to the peak current threshold to control the
ON time of the high-side switch. The voltage feedback loop is internally compensated, which allows for fewer
external components, makes it easy to design, and provides stable operation with almost any combination of
output capacitors. The regulator operates with fixed switching frequency at normal load condition. At light-load
condition, the TPS560430 operates in PFM mode to maintain high efficiency (PFM version) or in FPWM mode for
low output voltage ripple, tight output voltage regulation, and constant switching frequency (FPWM version).
l TEXAS INSTRUMENTS R FEE Ag:
RENT
EN
VIN
RENB
OUT REF
FBT FBB
REF
V - V
R = ×R
V
VOUT
FB
RFBT
RFBB
11
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Feature Description (continued)
8.3.2 Adjustable Output Voltage
A precision 1.0-V reference voltage, VREF, is used to maintain a tightly regulated output voltage over the entire
operating temperature range. The output voltage is set by a resistor divider from output voltage to the FB pin. It
is recommended to use 1% tolerance resistors with a low temperature coefficient for the FB divider. Select the
bottom-side resistor RFBB for the desired divider current and use Device Support to calculate top-side resistor
RFBT. RFBT in the range from 10 kto 100 kis recommended for most applications. A lower RFBT value can be
used if static loading is desired to reduce VOUT offset in PFM operation. Lower RFBT reduces efficiency at very
light load. Less static current goes through a larger RFBT and might be more desirable when light-load efficiency
is critical. But RFBT larger than 1 Mis not recommended because it makes the feedback path more susceptible
to noise. Larger RFBT value requires more carefully designed feedback path on the PCB. The tolerance and
temperature variation of the resistor dividers affect the output voltage regulation.
Figure 14. Output Voltage Setting
(1)
8.3.3 Enable
The voltage on the EN pin controls the ON or OFF operation of TPS560430. A voltage of less than 0.95 V shuts
down the device, while a voltage of more than 1.36 V is required to start the regulator. The EN pin is an input
and cannot be left open or floating. The simplest way to enable the operation of the TPS560430 is to connect the
EN to VIN. This allows self-start-up of the TPS560430 when VIN is within the operating range.
Many applications will benefit from the employment of an enable divider RENT and RENB (Figure 15) to establish a
precision system UVLO level for the converter. System UVLO can be used for supplies operating from utility
power as well as battery power. It can be used for sequencing, ensuring reliable operation, or supply protection,
such as a battery discharge level. An external logic signal can also be used to drive EN input for system
sequencing and protection. Kindly note that, the EN pin voltage should never be higher than VIN + 0.3 V. It is not
recommended to apply EN voltage when VIN is 0 V.
Figure 15. System UVLO by Enable Divider
l TEXAS INSTRUMENTS Vw (Vi Vw (V) V sw oNMN V sw 0mm 12 12 1 1 g g me E 06 E é Ens ; t m N —\uur:momA 02 —\w:1onmA —\am mm —\W 300nm \guy=fiflumA \Dm=600mA 02 o 12 15 zn 2A 25 32 as 5 51 52 53 54 55 55 57 55 59 a
OUT
IN_MIN SW OFF_MIN
V
V = 1- f × T
OUT
IN_MAX SW ON_MIN
V
V = f × T
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Feature Description (continued)
8.3.4 Minimum ON-Time, Minimum OFF-Time and Frequency Foldback
Minimum ON-time, TON_MIN, is the smallest duration of time that the HS switch can be on. TON_MIN is typically 60
ns in the TPS560430. Minimum OFF-time, TOFF_MIN, is the smallest duration that the HS switch can be off.
TOFF_MIN is typically 100 ns. In CCM operation, TON_MIN and TOFF_MIN limit the voltage conversion range without
switching frequency foldback.
The minimum duty cycle without frequency foldback allowed is
DMIN = TON_MIN X fSW (2)
The maximum duty cycle without frequency foldback allowed is
DMAX = 1 - TOFF_MIN X fSW (3)
Given a required output voltage, the maximum VIN without frequency foldback can be found by
(4)
The minimum VIN without frequency foldback can be calculated by
(5)
In the TPS560430, a frequency foldback scheme is employed once the TON_MIN or TOFF_MIN is triggered, which
may extend the maximum duty cycle or lower the minimum duty cycle.
The on-time decreases while VIN voltage increases. Once the on-time decreases to TON_MIN, the switching
frequency starts to decrease while VIN continues to go up, which lowers the duty cycle further to keep VOUT in
regulation according to Equation 2.
The frequency foldback scheme also works once larger duty cycle is needed under low VIN condition. The
frequency decreases once the device hits its TOFF_MIN, which extends the maximum duty cycle according to
Equation 3. In such condition, the frequency can be as low as about 133 kHz minimum. Wide range of frequency
foldback allows the TPS560430 output voltage stay in regulation with a much lower supply voltage VIN, which
leads to a lower effective drop-out.
With frequency foldback, VIN_MAX is raised, and VIN_MIN is lowered by decreased fSW.
VOUT = 1 V fSW = 1.1 MHz
Figure 16. Frequency Foldback at TON_MIN
VOUT = 5 V fSW = 1.1 MHz
Figure 17. Frequency Foldback at TOFF_MIN
l TEXAS INSTRUMENTS sw
 
IN OUT OUT
OUT_MAX LS SW IN
V - V V
I =I + ×
2 × f × L V
13
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Feature Description (continued)
8.3.5 Bootstrap Voltage
The TPS560430 provides an integrated bootstrap voltage regulator. A small capacitor between the CB and SW
pins provides the gate drive voltage for the high-side MOSFET. The bootstrap capacitor is refreshed when the
high-side MOSFET is off and the low-side switch conducts. The recommended value of the bootstrap capacitor is
0.1 µF. A ceramic capacitor with an X7R or X5R grade dielectric with a voltage rating of 16 V or higher is
recommended for stable performance over temperature and voltage.
8.3.6 Over Current and Short Circuit Protection
The TPS560430 is protected from over-current conditions by cycle-by-cycle current limit on both the peak and
valley of the inductor current. Hiccup mode is activated if a fault condition persists to prevent over-heating.
High-side MOSFET over-current protection is implemented by the nature of the Peak Current Mode control. The
HS switch current is sensed when the HS is turned on after a set blanking time. The HS switch current is
compared to the output of the Error Amplifier (EA) minus slope compensation every switching cycle. Please refer
to Functional Block Diagram for more details. The peak current of HS switch is limited by a clamped maximum
peak current threshold IHS_LIMIT which is constant.
The current going through LS MOSFET is also sensed and monitored. When the LS switch turns on, the inductor
current begins to ramp down. The LS switch will not be turned OFF at the end of a switching cycle if its current is
above the LS current limit ILS_LIMIT. The LS switch is kept ON so that inductor current keeps ramping down, until
the inductor current ramps below the ILS_LIMIT. Then the LS switch will be turned OFF and the HS switch will be
turned on after a dead time. This is somewhat different to the more typical peak current limit, and results in
Equation 6 for the maximum load current.
(6)
If the feedback voltage is lower than 40% of the VREF, the current of the LS switch triggers ILS_LIMIT for 256
consecutive cycles, hiccup current protection mode is activated. In hiccup mode, the regulator shuts down and
keeps off for a period of hiccup, THICCUP (135 ms typical), before the TPS560430 tries to start again. If over-
current or short-circuit fault condition still exist, hiccup repeats until the fault condition is removed. Hiccup mode
reduces power dissipation under severe over-current conditions, prevents over-heating and potential damage to
the device.
For FPWM version, the inductor current is allowed to go negative. Should this current exceed the LS negative
current limit ILS_NEG, the LS switch is turned off and HS switch is turned on immediately. This is used to protect
the LS switch from excessive negative current.
8.3.7 Soft Start
The integrated soft-start circuit prevents input inrush current impacting the TPS560430 and the input power
supply. Soft-start is achieved by slowly ramping up the target regulation voltage when the device is first enabled
or powered up. The typical soft-start time is 1.8 ms.
The TPS560430 also employs over-current protection blanking time TOCP_BLK (33 ms typical) at the beginning of
power-up. Without this feature, in applications with a large amount of output capacitors and high VOUT, the inrush
current is large enough to trigger the current-limit protection, which may make the device entering into hiccup
mode. The device tries to restart after the hiccup period, then hit current-limit and enter into hiccup mode again,
so VOUT cannot ramp up to the setting voltage ever. By introducing OCP blanking feature, the hiccup protection
function is disabled during TOCP_BLK, and TPS560430 charges the VOUT with its maximum limited current, which
maximizes the output current capacity during this period. Kindly note that, the peak current limit (IHS_LIMIT) and
valley current limit (ILS_LIMIT) protection function are still available during TOCP_BLK, so there is no concern of
inductor current running away.
8.3.8 Thermal Shutdown
The TPS560430 provides an internal thermal shutdown to protect the device when the junction temperature
exceeds 170°C. Both HS and LS FETs stop switching in thermal shutdown. Once the die temperature falls below
158°C, the device reinitiates the power up sequence controlled by the internal soft-start circuitry.
l TEXAS INSTRUMENTS
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8.4 Device Functional Modes
8.4.1 Shutdown Mode
The EN pin provides electrical ON and OFF control for the TPS560430. When VEN is below 0.95 V, the device is
in shutdown mode. The TPS560430 also employs VIN under voltage lock out protection (UVLO). If VIN voltage is
below its UVLO threshold 3.25 V, the regulator is turned off.
8.4.2 Active Mode
The TPS560430 is in Active Mode when both VEN and VIN are above their respective operating threshold. The
simplest way to enable the TPS560430 is to connect the EN pin to VIN pin. This allows self-startup when the
input voltage is in the operating range: 4.0 V to 36 V. Please refer to Enable section for details on setting these
operating levels.
In Active Mode, depending on the load current, the TPS560430 will be in one of four modes:
1. Continuous conduction mode (CCM) with fixed switching frequency when load current is above half of the
peak-to-peak inductor current ripple (for both PFM and FPWM versions).
2. Discontinuous conduction mode (DCM) with fixed switching frequency when load current is lower than half of
the peak-to-peak inductor current ripple in CCM operation (only for PFM version).
3. Pulse frequency modulation mode (PFM) when switching frequency is decreased at very light load (only for
PFM version).
4. Forced pulse width modulation mode (FPWM) with fixed switching frequency even at light load (only for
FPWM version).
8.4.3 CCM Mode
Continuous Conduction Mode (CCM) operation is employed in the TPS560430 when the load current is higher
than half of the peak-to-peak inductor current. In CCM operation, the frequency of operation is fixed, output
voltage ripple is at a minimum in this mode and the maximum output current of 600 mA can be supplied by the
TPS560430.
8.4.4 Light-Load Operation (PFM Version)
For PFM version, when the load current is lower than half of the peak-to-peak inductor current in CCM, the
TPS560430 operates in Discontinuous Conduction Mode (DCM), also known as Diode Emulation Mode (DEM).
In DCM operation, the LS switch is turned off when the inductor current drops to ILS_ZC (20 mA typical) to improve
efficiency. Both switching losses and conduction losses are reduced in DCM, compared to forced PWM operation
at light load.
At even lighter current load, Pulse Frequency Modulation (PFM) mode is activated to maintain high efficiency
operation. When either the minimum HS switch ON time tON_MIN or the minimum peak inductor current IPEAK_MIN
(150mA typical) is reached, the switching frequency decreases to maintain regulation. In PFM mode, switching
frequency is decreased by the control loop to maintain output voltage regulation when load current reduces.
Switching loss is further reduced in PFM operation due to less frequent switching actions.
8.4.5 Light-Load Operation (FPWM Version)
For FPWM version, TPS560430 is locked in PWM mode at full load range. This operation is maintained, even in
no-load condition, by allowing the inductor current to reverse its normal direction. This mode trades off reduced
light load efficiency for low output voltage ripple, tight output voltage regulation, and constant switching
frequency.
l TEXAS INSTRUMENTS
CB
SW
L
10 µH
CBOOT
0.1 µF
FB
VIN
VIN 12 V
COUT
22 µF
EN
CIN
2.2 µF
GND
VOUT 5 V
RFBT
88.7
RFBB
22.1
Copyright © 2017, Texas Instruments Incorporated
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(1) Ceramic capacitor is used in this table.
9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
The TPS560430 is a step down DC-to-DC regulator. It is typically used to convert a higher DC voltage to a lower
DC voltage with a maximum output current of 600 mA. The following design procedure can be used to select
components for the TPS560430. Alternately, the WEBENCH® software may be used to generate complete
designs. When generating a design, the WEBENCH® software utilizes iterative design procedure and accesses
comprehensive databases of components. Please go to ti.com for more details.
9.2 Typical Application
The TPS560430 only requires a few external components to convert from a wide voltage range supply to a fixed
output voltage. Figure 18 shows a basic schematic.
Figure 18. Application Circuit
The external components have to fulfill the needs of the application, but also the stability criteria of the device's
control loop. Table 1 can be used to simplify the output filter component selection.
Table 1. L and COUT Typical Values
fSW (MHz) VOUT (V) L (µH) COUT (µF) (1) RFBT (kΩ) RFBB (kΩ)
1.1
3.3 12 22 µF / 10 V 51 22.1
5 18 22 µF / 10 V 88.7 22.1
12 33 10 µF / 25 V 243 22.1
2.1
3.3 6.8 10 µF / 10 V 51 22.1
5 10 10 µF / 10 V 88.7 22.1
12 18 10 µF / 25 V 243 22.1
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9.2.1 Design Requirements
Detailed design procedure is described based on a design example. For this design example, use the
parameters listed in Table 2 as the input parameters.
Table 2. Design Example Parameters
PARAMETER VALUE
Input voltage, VIN 12 V typical, range from 6 V to 36 V
Output voltage, VOUT 5 V ±3%
Maximum output current, IOUT_MAX 600 mA
Minimum output current, IOUT_MIN 30 mA
Output overshoot/ undershoot (0mA to 600mA ) 5%
Output voltage ripple 0.5%
Operating frequency 1.1 MHz
9.2.2 Detailed Design Procedure
9.2.2.1 Custom Design With WEBENCH® Tools
Click here to create a custom design using the TPS560430 device with the WEBENCH® Power Designer.
1. Start by entering the input voltage (VIN), output voltage (VOUT), and output current (IOUT) requirements.
2. Optimize the design for key parameters such as efficiency, footprint, and cost using the optimizer dial.
3. Compare the generated design with other possible solutions from Texas Instruments.
The WEBENCH Power Designer provides a customized schematic along with a list of materials with real-time
pricing and component availability.
In most cases, these actions are available:
Run electrical simulations to see important waveforms and circuit performance
Run thermal simulations to understand board thermal performance
Export customized schematic and layout into popular CAD formats
Print PDF reports for the design, and share the design with colleagues
Get more information about WEBENCH tools at www.ti.com/WEBENCH.
l TEXAS INSTRUMENTS R FEE w mm sw our Wm WM sw
IN_MAX OUT OUT
MIN OUT IND IN_MAX SW
V - V V
L = ×
I ×K V × f
OUT IN_MAX OUT
LIN_MAX SW
V × V - V
ûL V × L × f
OUT REF
FBT FBB
REF
V - V
R = ×R
V
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9.2.2.2 Output Voltage Set-Point
The output voltage of the TPS560430 device is externally adjustable using a resistor divider network. The divider
network is comprised of top feedback resistor RFBT and bottom feedback resistor RFBB.Equation 7 is used to
determine the output voltage of the converter:
(7)
Choose the value of RFBB to be 22.1 k. With the desired output voltage set to 5 V and the VREF = 1.0 V, the
RFBT value can then be calculated using Equation 7. The formula yields to a value 88.4 k, a standard value of
88.7 kis selected.
9.2.2.3 Switching Frequency
The higher switching frequency allows for lower value inductors and smaller output capacitors, which results in
smaller solution size and lower component cost. However higher switching frequency brings more switching loss,
which makes the solution less efficient and produce more heat. The switching frequency is also limited by the
minimum on-time of the integrated power switch, the input voltage, the output voltage and the frequency shift
limitation as mentioned in Minimum ON-Time, Minimum OFF-Time and Frequency Foldback section. For this
example, a switching frequency of 1.1 MHz is selected.
9.2.2.4 Inductor Selection
The most critical parameters for the inductor are the inductance, saturation current and the RMS current. The
inductance is based on the desired peak-to-peak ripple current ΔiL. Since the ripple current increases with the
input voltage, the maximum input voltage is always used to calculate the minimum inductance LMIN. Use
Equation 9 to calculate the minimum value of the output inductor. KIND is a coefficient that represents the amount
of inductor ripple current relative to the maximum output current of the device. A reasonable value of KIND should
be 20% to 60%. During an instantaneous over current operation event, the RMS and peak inductor current can
be high. The inductor current rating should be a bit higher than current limit.
(8)
(9)
In general, it is preferable to choose lower inductance in switching power supplies, because it usually
corresponds to faster transient response, smaller DCR, and reduced size for more compact designs. But too low
of an inductance can generate too large of an inductor current ripple such that over current protection at the full
load could be falsely triggered. It also generates more inductor core loss since the current ripple is larger. Larger
inductor current ripple also implies larger output voltage ripple with same output capacitors. With peak current
mode control, it is not recommended to have too small of an inductor current ripple. A larger peak current ripple
improves the comparator signal to noise ratio.
For this design example, choose KIND = 0.4, the minimum inductor value is calculated to be 16.3 µH. Choose the
nearest standard 18-µH ferrite inductor with a capability of 1-A RMS current and 1.5-A saturation current.
l TEXAS INSTRUMENTS mum L m our ESR sw om sw our sw ounsnom
 
OH OL
OUT SW OUT_SHOOT
8 × I -I
1
C > ×
2 f × û9
L IND OUT
OUT_C SW OUT SW OUT
ûL . ×I
û9
8×f × C 8×f × C
OUT_ESR L IND OUT
û9 ûL× ESR = K × I × ESR
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9.2.2.5 Output Capacitor Selection
The device is designed to be used with a wide variety of LC filters. It is generally desired to use as little output
capacitance as possible to keep cost and size down. The output capacitor (s), COUT, should be chosen with care
since it directly affects the steady state output voltage ripple, loop stability, output voltage overshoot and
undershoot during load current transient. The output voltage ripple is essentially composed of two parts. One is
caused by the inductor current ripple going through the Equivalent Series Resistance (ESR) of the output
capacitors:
(10)
The other is caused by the inductor current ripple charging and discharging the output capacitors:
(11)
The two components in the voltage ripple are not in phase, so the actual peak-to-peak ripple is smaller than the
sum of the two peaks.
Output capacitance is usually limited by transient performance specifications if the system requires tight voltage
regulation with presence of large current steps and fast slew rate. When a large load step happens, output
capacitors provide the required charge before the inductor current can slew up to the appropriate level. The
regulator’s control loop usually needs 8 or more clock cycles to regulate the inductor current equal to the new
load level. The output capacitance must be large enough to supply the current difference for 8 clock cycles to
maintain the output voltage within the specified range. Equation 12 shows the minimum output capacitance
needed for specified VOUT overshoot and undershoot.
(12)
where
• KIND = Ripple ratio of the inductor current (ΔiL/ IOUT)
• IOL = Low level output current during load transient
• IOH = High level output current during load transient
• VOUT_SHOOT = Target output voltage overshoot or undershoot
For this design example, the target output ripple is 30 mV. Presuppose ΔVOUT_ESR =ΔVOUT_C = 30 mV, and
chose KIND = 0.4. Equation 10 yields ESR no larger than 125 mand Equation 11 yields COUT no smaller than
0.91 µF. For the target overshoot and undershoot limitation of this design, ΔVOUT_SHOOT = 5% × VOUT = 250 mV.
The COUT can be calculated to be no smaller than 8.3 µF by Equation 12. In summary, the most stringent criteria
for the output capacitor is 8.3 µF. Consider of derating, one 22-µF, 10-V, X7R ceramic capacitor with 10-m
ESR is used.
l TEXAS INSTRUMENTS v m K \ R 7 E ENE
 
ENT ENB
IN_FALLING ENH EN_HYS ENB
R + R
V = V - V × R
IN_RISING
ENT ENB
ENH
V
R = -1 × R
V
§ ·
¨ ¸
¨ ¸
© ¹
ENT ENB
IN_RISING ENH ENB
R + R
V = V × R
19
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9.2.2.6 Input Capacitor Selection
The TPS560430 device requires high frequency input decoupling capacitor(s). The typical recommended value
for the high frequency decoupling capacitor is 2.2 µF or higher. A high-quality ceramic type X5R or X7R with
sufficiency voltage rating is recommended. The voltage rating must be greater than the maximum input voltage.
To compensate the derating of ceramic capacitors, a voltage rating of twice the maximum input voltage is
recommended. For this design, one 2.2-µF, X7R dielectric capacitor rated for 50 V is used for the input
decoupling capacitor. The equivalent series resistance (ESR) is approximately 10 m, and the current rating is 1
A. Include a capacitor with a value of 0.1 µF for high-frequency filtering and place it as close as possible to the
device pins.
9.2.2.7 Bootstrap Capacitor
Every TPS560430 design requires a bootstrap capacitor, CBOOT. The recommended bootstrap capacitor is 0.1 µF
and rated at 16 V or higher. The bootstrap capacitor is located between the SW pin and the CB pin. The
bootstrap capacitor must be a high-quality ceramic type with X7R or X5R grade dielectric for temperature
stability.
9.2.2.8 Under Voltage Lockout Set-Point
The system under voltage lockout (UVLO) is adjusted using the external voltage divider network of RENT and
RENB. The UVLO has two thresholds, one for power up when the input voltage is rising and one for power down
or brown outs when the input voltage is falling. The following equation can be used to determine the VIN UVLO
level.
(13)
The EN rising threshold (VENH) for TPS560430 is set to be 1.23 V (typical). Choose the value of RENB to be 200
kΩto minimize input current from the supply. If the desired VIN UVLO level is at 6.0 V, then the value of RENT can
be calculated using Equation 14:
(14)
The above equation yields a value of 775.6 kΩ, a standard value of 768 kΩis selected. The resulting falling
UVLO threshold, equals 5.3 V, can be calculated by Equation 15, where EN hysteresis voltage, VEN_HYS, is 0.13
V (typical).
(15)
*5; TEXAS INSTRUMENTS
VOUT(AC) [100mV/div]
iOUT [200mA/div]
Time [200s/div]
iL [500mA/div]
Time [10s/div]
VOUT(AC) [50mV/div]
VIN [10V/div]
iL [500mA/div]
Time [1ms/div]
VOUT [2V/div]
VIN [5V/div]
VEN [2V/div]
iL [500mA/div]
VOUT [2V/div]
Time [1ms/div]
VSW [5V/div]
iL [500mA/div]
VOUT(AC) [10mV/div]
Time [2s/div]
VSW [5V/div]
iL [500mA/div]
VOUT(AC) [10mV/div]
Time [2s/div]
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9.2.3 Application Curves
Unless otherwise specified the following conditions apply: VIN = 12 V, VOUT = 5 V, fSW = 1.1 MHz, L = 18 µH, COUT = 22 µF, TA
= 25 °C
IOUT = 0 mA FPWM Version
Figure 19. Ripple at No Load
IOUT = 600 mA FPWM Version
Figure 20. Ripple at Full Load
IOUT = 600 mA FPWM Version
Figure 21. Start Up by VIN
IOUT = 600 mA FPWM Version
Figure 22. Start-Up by EN
IOUT = 0 to 600
mA, 100 mA / µs FPWM Version
Figure 23. Load Transient
VIN = 12 V to 30 V,
0.18 V / µs IOUT = 600 mA FPWM Version
Figure 24. Line Transient
l TEXAS INSTRUMENTS
Time [100ms/div]
VOUT [2V/div]
iL [500mA/div]
VOUT [2V/div]
iL [500mA/div]
Time [100ms/div]
21
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Unless otherwise specified the following conditions apply: VIN = 12 V, VOUT = 5 V, fSW = 1.1 MHz, L = 18 µH, COUT = 22 µF, TA
= 25 °C
IOUT = 0 mA to
short FPWM Version
Figure 25. Short Protection
IOUT = short to 0
mA FPWM Version
Figure 26. Short Recovery
l TEXAS INSTRUMENTS
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10 Power Supply Recommendations
The TPS560430 is designed to operate from an input voltage supply range between 4.0 V and 36 V. This input
supply should be well regulated and able to withstand maximum input current and maintain a stable voltage. The
resistance of the input supply rail should be low enough that an input current transient does not cause a high
enough drop at the TPS560430 supply voltage that can cause a false UVLO fault triggering and system reset. If
the input supply is located more than a few inches from the TPS560430 additional bulk capacitance may be
required in addition to the ceramic bypass capacitors. The amount of bulk capacitance is not critical, but a 10-µF
or 22-µF electrolytic capacitor is a typical choice.
11 Layout
11.1 Layout Guidelines
Layout is a critical portion of good power supply design. The following guidelines will help users design a PCB
with the best power conversion performance, thermal performance, and minimized generation of unwanted EMI.
1. The input bypass capacitor CIN must be placed as close as possible to the VIN and GND pins. Grounding for
both the input and output capacitors should consist of localized top side planes that connect to the GND pin.
2. Minimize trace length to the FB pin net. Both feedback resistors, RFBT and RFBB should be located close to
the FB pin. If VOUT accuracy at the load is important, make sure VOUT sense is made at the load. Route VOUT
sense path away from noisy nodes and preferably through a layer on the other side of a shielded layer.
3. Use ground plane in one of the middle layers as noise shielding and heat dissipation path if possible.
4. Make VIN, VOUT and ground bus connections as wide as possible. This reduces any voltage drops on the
input or output paths of the converter and maximizes efficiency.
5. Provide adequate device heat-sinking. GND, VIN and SW pins provide the main heat dissipation path, make
the GND, VIN and SW plane area as large as possible. Use an array of heat-sinking vias to connect the top
side ground plane to the ground plane on the bottom PCB layer. If the PCB has multiple copper layers, these
thermal vias can also be connected to inner layer heat-spreading ground planes. Ensure enough copper area
is used for heat-sinking to keep the junction temperature below 125 °C.
11.1.1 Compact Layout for EMI Reduction
Radiated EMI is generated by the high di/dt components in pulsing currents in switching converters. The larger
area covered by the path of a pulsing current, the more EMI is generated. High frequency ceramic bypass
capacitors at the input side provide primary path for the high di/dt components of the pulsing current. Placing
ceramic bypass capacitor(s) as close as possible to the VIN and GND pins is the key to EMI reduction.
The SW pin connecting to the inductor should be as short as possible, and just wide enough to carry the load
current without excessive heating. Short, thick traces or copper pours (shapes) should be used for high current
conduction path to minimize parasitic resistance. The output capacitors should be placed close to the VOUT end
of the inductor and closely grounded to GND pin.
11.1.2 Feedback Resistors
To reduce noise sensitivity of the output voltage feedback path, it is important to place the resistor divider close
to the FB pin, rather than close to the load. The FB pin is the input to the error amplifier, so it is a high
impedance node and very sensitive to noise. Placing the resistor divider closer to the FB pin reduces the trace
length of FB signal and reduces noise coupling. The output node is a low impedance node, so the trace from
VOUT to the resistor divider can be long if short path is not available.
If voltage accuracy at the load is important, make sure voltage sense is made at the load. Doing so will correct
for voltage drops along the traces and provide the best output accuracy. The voltage sense trace from the load to
the feedback resistor divider should be routed away from the SW node path and the inductor to avoid
contaminating the feedback signal with switch noise, while also minimizing the trace length. This is most
important when high value resistors are used to set the output voltage. It is recommended to route the voltage
sense trace and place the resistor divider on a different layer than the inductor and SW node path, such that
there is a ground plane in between the feedback trace and inductor/SW node polygon. This provides further
shielding for the voltage feedback path from EMI noises.
l TEXAS INSTRUMENTS
EN
VIN
SW
CB
GND
FB
Input Bypass
Capacitor
Output Bypass
Capacitor
BOOT
Capacitor
VIA (Connect to GND Plane)
Output
Inductor
Output Voltage
Set Resistor
VIN
GND
GND
VOUT
23
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11.2 Layout Example
Figure 27. Layout
l TEXAS INSTRUMENTS
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12 Device and Documentation Support
12.1 Device Support
12.1.1 Development Support
12.1.1.1 Custom Design With WEBENCH® Tools
Click here to create a custom design using the TPS560430 device with the WEBENCH® Power Designer.
1. Start by entering the input voltage (VIN), output voltage (VOUT), and output current (IOUT) requirements.
2. Optimize the design for key parameters such as efficiency, footprint, and cost using the optimizer dial.
3. Compare the generated design with other possible solutions from Texas Instruments.
The WEBENCH Power Designer provides a customized schematic along with a list of materials with real-time
pricing and component availability.
In most cases, these actions are available:
Run electrical simulations to see important waveforms and circuit performance
Run thermal simulations to understand board thermal performance
Export customized schematic and layout into popular CAD formats
Print PDF reports for the design, and share the design with colleagues
Get more information about WEBENCH tools at www.ti.com/WEBENCH.
12.2 Documentation Support
12.2.1 Related Documentation
For related documentation see the following:
AN-1149 Layout Guidelines for Switching Power Supplies
12.3 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
12.4 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
12.5 Trademarks
E2E is a trademark of Texas Instruments.
SIMPLE SWITCHER, WEBENCH are registered trademarks of Texas Instruments.
12.6 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
l TEXAS INSTRUMENTS
25
TPS560430
www.ti.com
SLVSE22B –SEPTEMBER 2017REVISED JUNE 2018
Product Folder Links: TPS560430
Submit Documentation FeedbackCopyright © 2017–2018, Texas Instruments Incorporated
12.7 Glossary
SLYZ022 TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
I TEXAS INSTRUMENTS Samples Samples Samples Samples Samples Sample: Sample: Samples Samples Samples
PACKAGE OPTION ADDENDUM
www.ti.com 10-Dec-2020
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
TPS560430X3FDBVR ACTIVE SOT-23 DBV 6 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 N3XF
TPS560430X3FDBVT ACTIVE SOT-23 DBV 6 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 N3XF
TPS560430XDBVR ACTIVE SOT-23 DBV 6 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 NAXS
TPS560430XDBVT ACTIVE SOT-23 DBV 6 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 NAXS
TPS560430XFDBVR ACTIVE SOT-23 DBV 6 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 NAXF
TPS560430XFDBVT ACTIVE SOT-23 DBV 6 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 NAXF
TPS560430YDBVR ACTIVE SOT-23 DBV 6 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 NAYS
TPS560430YDBVT ACTIVE SOT-23 DBV 6 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 NAYS
TPS560430YFDBVR ACTIVE SOT-23 DBV 6 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 NAYF
TPS560430YFDBVT ACTIVE SOT-23 DBV 6 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 NAYF
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
I TEXAS INSTRUMENTS
PACKAGE OPTION ADDENDUM
www.ti.com 10-Dec-2020
Addendum-Page 2
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF TPS560430 :
Automotive: TPS560430-Q1
NOTE: Qualified Version Definitions:
Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
I TEXAS INSTRUMENTS REEL DIMENSIONS TAPE DIMENSIONS ’ I‘KO '«Pt» Reel DlameIer A0 Dimension designed to accommodate the component Width Bo Dimension designed to accommodate the component Iength K0 Dimension designed to accommodate the component thickness 7 w Overau Wiotn onhe carrier Iape i P1 Pitch between successive cawty centers f T Reel Width (W1) QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE QOODOOOO ,,,,,,,,,,, ‘ User DIreCIIOn 0' Feed SprockeI Hoies Pockel Quadrams
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
TPS560430X3FDBVR SOT-23 DBV 6 3000 180.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TPS560430X3FDBVT SOT-23 DBV 6 250 180.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TPS560430XDBVR SOT-23 DBV 6 3000 180.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TPS560430XDBVT SOT-23 DBV 6 250 180.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TPS560430XFDBVR SOT-23 DBV 6 3000 180.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TPS560430XFDBVT SOT-23 DBV 6 250 180.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TPS560430YDBVR SOT-23 DBV 6 3000 180.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TPS560430YDBVT SOT-23 DBV 6 250 180.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TPS560430YFDBVR SOT-23 DBV 6 3000 180.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TPS560430YFDBVT SOT-23 DBV 6 250 180.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
PACKAGE MATERIALS INFORMATION
www.ti.com 22-Jun-2018
Pack Materials-Page 1
I TEXAS INSTRUMENTS TAPE AND REEL BOX DIMENSIONS
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TPS560430X3FDBVR SOT-23 DBV 6 3000 210.0 185.0 35.0
TPS560430X3FDBVT SOT-23 DBV 6 250 210.0 185.0 35.0
TPS560430XDBVR SOT-23 DBV 6 3000 210.0 185.0 35.0
TPS560430XDBVT SOT-23 DBV 6 250 210.0 185.0 35.0
TPS560430XFDBVR SOT-23 DBV 6 3000 210.0 185.0 35.0
TPS560430XFDBVT SOT-23 DBV 6 250 210.0 185.0 35.0
TPS560430YDBVR SOT-23 DBV 6 3000 210.0 185.0 35.0
TPS560430YDBVT SOT-23 DBV 6 250 210.0 185.0 35.0
TPS560430YFDBVR SOT-23 DBV 6 3000 210.0 185.0 35.0
TPS560430YFDBVT SOT-23 DBV 6 250 210.0 185.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 22-Jun-2018
Pack Materials-Page 2
3: fig,
www.ti.com
PACKAGE OUTLINE
C
0.22
0.08 TYP
0.25
3.0
2.6
2X 0.95
1.45 MAX
0.15
0.00 TYP
6X 0.50
0.25
0.6
0.3 TYP
8
0 TYP
1.9
A
3.05
2.75
B
1.75
1.45
(1.1)
SOT-23 - 1.45 mm max heightDBV0006A
SMALL OUTLINE TRANSISTOR
4214840/C 06/2021
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Body dimensions do not include mold flash or protrusion. Mold flash and protrusion shall not exceed 0.25 per side.
4. Leads 1,2,3 may be wider than leads 4,5,6 for package orientation.
5. Refernce JEDEC MO-178.
0.2 C A B
1
34
5
2
INDEX AREA
PIN 1
6
GAGE PLANE
SEATING PLANE
0.1 C
SCALE 4.000
www.ti.com
EXAMPLE BOARD LAYOUT
0.07 MAX
ARROUND 0.07 MIN
ARROUND
6X (1.1)
6X (0.6)
(2.6)
2X (0.95)
(R0.05) TYP
4214840/C 06/2021
SOT-23 - 1.45 mm max heightDBV0006A
SMALL OUTLINE TRANSISTOR
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
SYMM
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:15X
PKG
1
34
5
2
6
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
SOLDER MASK
DEFINED
EXPOSED METAL
METAL
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
EXPOSED METAL
www.ti.com
EXAMPLE STENCIL DESIGN
(2.6)
2X(0.95)
6X (1.1)
6X (0.6)
(R0.05) TYP
SOT-23 - 1.45 mm max heightDBV0006A
SMALL OUTLINE TRANSISTOR
4214840/C 06/2021
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:15X
SYMM
PKG
1
34
5
2
6
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