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PLT10HHyyyyyyPNy Spec Sheet

Murata Electronics North America

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Spec No. JEFL243B-9101G-01 P1/10
MURATA MFG.CO.,LTD
Reference Only
SMD type common-mode choke coil
PLT10HH□□□□□□PN Murata Standard Reference Specification
[AEC-Q200]
1. Scope
This reference specification applies to SMD type common-mode choke coil PLT10H Series for Automotive Electronics
based on AEC-Q200.
2. Part Numbering
(Ex.) PLT 10H H 102 6R0 P N L
Product ID Type Application Common Mode Rated Winding Dimenssion Packaging
Impedance Zc Current Mode code
HAutomotive LTaping (Φ178mm reel)
KTaping (Φ330mm reel)
B Bulk
3. Rating
Customer
Part Number
MURATA
Part Number
Common
Mode Impedance
Zc (at10MHz)
() Typ.
Rated
Voltage
V(DC)
Withstand
Voltage
V(DC)
*
Rated
Current
(A)
DC
Resistance
(Rdc)
(m)
Insulation
Resistance
(I.R.)
(M min.)
Inductance
(L)
(μH min.)
ESD Rank
6:25kV
(AD)
PLT10HH1026R0PNL
1000 100 250 6 8.0±0.5 10 20
6
PLT10HH1026R0PNK
PLT10HH1026R0PNB
PLT10HH9016R0PNL
900 100 250 6 8.0±0.5 10 14
PLT10HH9016R0PNK
PLT10HH9016R0PNB
PLT10HH501100PNL
500 100 250 10 3.6±0.5 10 9
PLT10HH501100PNK
PLT10HH501100PNB
PLT10HH401100PNL
400 100 250 10 3.6±0.5 10 6
PLT10HH401100PNK
PLT10HH401100PNB
PLT10HH101150PNL
100 300 750 15 1.8±0.5 10 2
PLT10HH101150PNK
PLT10HH101150PNB
PLT10HH450180PNL
45 300 750 18 1.3±0.5 10 0.8
PLT10HH450180PNK
PLT10HH450180PNB
Operating Temperature range (Product temperature; Self- temperature rise is included)
-55℃~+125 (PLT10HH9016R0 / PLT10HH401100/ PLT10HH101150/ PLT10HH450180)
-55℃~+105 (PLT10HH1026R0 / PLT10HH501100)
Storage Temperature range-55℃~+125
* Rated Current is derated as below figure depending on the operating temperature.
Spec No. JEFL243B-9101G-01 P2/10
MURATA MFG.CO.,LTD
Reference Only
13.4 max
6.6±0.2
9.4 max
3.2±0.3
1.0±0.21.0±0.2
2.1±0.3 2.0±0.3
12.9±0.2
2.1±0.3
9.1±0.2
:Electrode
①②
102
Standard Testing Conditions
< Unless otherwise specified > < In case of doubt >
Temperature: Ordinary Temp.15 ºC to 35 °C Temperature: 20 °C ± 2 °C
Humidity: Ordinary Humidity 25 %(RH) to 85 %(RH) Humidity: 60 %(RH) to 70 %(RH)
Atmospheric pressure: 86 kPa to 106 kPa
4. Dimenssion
Equivalent Circuit
Unit Mass (Typical value)
2.1g
(in mm)
5. Marking
(1)Manufacturer Identification( )
(2)Parts NumberCommon Mode Impedance Zc
PLT10HH1026R0PN□:( 102 )
PLT10HH9016R0PN□:( 901 )
PLT10HH501100PN□:( 501 )
PLT10HH401100PN□:( 401 )
PLT10HH101150PN□:( 101 )
PLT10HH450180PN□:( 450 )
Common Mode Impedance Zc (3 digits)
Manufacturer Identification
No p o l a
r
ity
Spec No. JEFL243B-9101G-01 P3/10
MURATA MFG.CO.,LTD
Reference Only
6. Electrical Performance
No. Item Specification Test method
6.1 Common
Mode
Impedance
(Zc) Typ.
Meet item 3 Measuring Frequenc
y
: 10MHz (ref.item 8)
Measuring Equipment: KEYSIGHT 4294A or the equivalent
Use a cable / connector of 50 impedance.
6.2 Withstand
Voltage
Products shall not be damaged. Voltage: Rated Voltage×250% (ref.item 8)
Time:15s
Measuring current: 10mA max.
6.3 Insulation
Resistance
(I.R.)
Meet item 3 Voltage: Rated Voltage (ref.item 8)
Time: 30s max.
Measuring current: 10mA max
Measuring Equipment: KEYSIGHT 4339A or the equivalent
6.4 DC
Resistance
(Rdc)
Meet item 3 Measuring method: fou
r
-terminal method (ref.item 8)
6.5 Inductance
(L)
Meet item 3 Measuring Frequenc
y
:1±0.1kHz (ref.item 8)
Voltage: 1V (rms) max.
Measuring Equipment: KEYSIGHT 4284A or the equivalent
7Q200 Requirement
7-1. Performance (based on Table 13 for Ferrite EMI SUPPRESSORS/FILTERS)
AEC-Q200 Rev.D issued June 1. 2010
AEC-Q200 Murata Specification / Deviation
No. Stress Test Method
3 High Temperature
Exposure
1000hours at Maximum
Operating Temperature Set
for 24hours at room
temperature, then measured.
Meet Table A after testing.
Table A
4 Temperature Cycling 1000cycles
-55 deg C to + Maximum
Operating Temperature
Set for 24hours at room
temperature, then measured.
Meet Table A after testing.
5 Destructive
Physical Analysis
Per EIA469
No electrical tests
Not Applicable
7 Biased Humidity 1000hours at 85 deg C,
85%RH
Apply max rated voltage.
Meet Table A after testing.
(ref.item 8.2)
8 Operational Life Apply Maximum Operating
Temperature 1000hours
Set for 24hours at room
temperature, then measured.
Meet Table A after testing.
Apply rated voltage.
(ref.item 8.2)
9 External Visual Visual inspection No abnormalities
10 Physical Dimension Meet ITEM 4
Style and Dimensions
No defects
12 Resistance to Solvents Per MIL-STD-202 Method
215
Not Applicable
13 Mechanical Shock Per MIL-STD-202 Method
213
Condition F:
1500g’s(14.7N)/0.5ms/
Half sine
Meet Table A after testing.
Appearance No damage
Inductance
change
(%L)
within ±15%
Insulation
Resistance
(I.R.)
Meet item 3
Withstand
Voltage
Products shall not
be damaged.
Spec No. JEFL243B-9101G-01 P4/10
MURATA MFG.CO.,LTD
Reference Only
AEC-Q200 Murata Specification / Deviation
No
.
Stress Test Method
14 Vibration 5g's(0.049N) for 20 minutes,
12cycles each of 3 oritentations
Test from 10-2000Hz.
12cycles each of 3 orientations
Meet Table A after testing.
15 Resistance
to Soldering Heat
No-heating
Solder temperature
260C+/-5 deg C
Immersion time 10s
Pre-heating150 to 180C / 90±30s
Meet Table A after testing.
17 ESD
Per AEC-Q200-002 Meet Table A after testing.
ESD Rank: Refer to Item 3. Rating.
18 Solderbility
Per J-STD-002 Method b : Not Applicable
95% of the terminations is to be soldered.(except partly-exposed wire)
Flux:Ethanol solution of rosin,25(wt)% includes activator equivalent to
0.06 to 0.10(wt)% chlorine
19 Electrical
Characterization
Measured : Inductance Refer to 3.Rating.
20 Flammability Per UL-94 Not Applicable
21 Board Flex Epoxy-PCB(1.6mm)
Deflection 2mm(min)
60 sec minimum holding time
Meet Table A after testing.
22 Terminal Strength
Per AEC-Q200-006
A force of 17.7N for 60sec
No defects
30 Electrical Transient
Conduction
Per ISO-7637-2 Not Applicable
8. Measuring Terminal
(When measuring and supplying the voltage, the following terminal is applied.)
No. Item Measuring terminal
8.1 Inductance (L)
DC Resistance (Rdc)
8.2
Withstand voltage
Insulation Resistance (I.R.)
Biased Humidity
Operational Life
8.3 Common Mode Impedance(Zc)
9. Measuring method for common mode impedance.
Measured common mode impedance may be included measurement error due to stray capacitance, residual
inductance of test fixture.
To correct this error, the common mode impedance should be calculate as follows;
(1) Measure admittance of the fixture(opened), Go Bo.
(2) Measure impedance of the fixture(shorted), Rs Xs.
(3) Measure admittance of the specimen, Gm Bm.
(4) Calculate corrected impedance Z using the formula below.
Z = (Rx2+Xx2) 1/2
Where
Rx = Gm - Go
(Gm-Go) + (Bm-Bo) Rs
Xx = - (Bm - Bo)
(Gm-Go) + (Bm-Bo) Xs
N
OUT
I
OU T
I N
IOU T
N
Spec No. JEFL243B-9101G-01 P5/10
MURATA MFG.CO.,LTD
Reference Only
10. P.C.B., Flux, Solder and Soldering condition
Test shall be done using P.C.B., Flux, Solder and Soldering condition which are specified in item 13 except the
case of being specified special condition.
11. Specification of Packaging
11.1 Appearance and Dimensions (24mm-wide,Plastic tape)
< Product direction >
11.2 Specification of Taping
(1) Packing quantity (Standard quantity)
Φ178 mm reel: 125 pcs. / reel
Φ330 mm reel: 500 pcs. / reel
(2) Packing Method
Products shall be packaged in each embossed cavity of plastic tape and sealed with cover tape.
(3) Spliced point
The cover tape has no spliced point.
(4) Sprocket Hole
The sprocket holes are to the right as the tape is pulled toward the user.
(5) Missing components number
Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater, and are
not continuous. The specified quantity per reel is kept.
11.3 Pull Strength of Cover Tape
10N minimum
11.4 Peeling off force of Cover Tape
0.2N to 0.7N (minimum value is typical.)
Speed of Peeling off: 300 mm / min
165 to 180 degree FCover tape
Plastic tape
4.0×10pitch = 40.0±0.2
φ1.5+0.1/-0
Direction of feed (@mm)
(in mm)
*Dimension of the Cavity is measured
at the bottom side.
Spec No. JEFL243B-9101G-01 P6/10
MURATA MFG.CO.,LTD
Reference Only
11.5 Dimensions of Leader-tape, Trailer and Reel
There shall be leader-tape (cover tape only and empty tape) and trailer-tape (empty tape) as follows.
Packaging codeLΦ178mm reel
Packaging codeKΦ330mm reel
(In mm)
11.6 Marking for reel
Customer part number, MURATA part number, Inspection number(*1), RoHS Marking(*2), Quantity, etc
*1) < Expression of Inspection No. > □□ ○○○○ ◇◇
① ② ③
Factory code
Date First digityearLast digit of year
Second digitMonthJan. to Sep.1 to 9Oct. to Dec.O,N,D
Third, Fourth digitDay
Serial No.
*2) < Expression of RoHS Marking > ROHS – Y ()
① ②
RoHS regulation conformity parts
MURATA classification number
11.7 Marking for Outside package
Customer name, Purchasing Order Number, Customer Part Number, MURATA part number,
RoHS Marking (*2), Quantity, etc
11.8 Specification of Outer Case
Reel
Outer case Dimensions
(mm)
Standard Reel
Quantity in
Outer case
(Reel)
W D H
Φ178mm 186 186 93 3
Φ330mm 340 340 85 2
*Above Outer Case size is typical. It depends on a quantity of an order.
W
D
Label
H
Spec No. JEFL243B-9101G-01 P7/10
MURATA MFG.CO.,LTD
Reference Only
12.!Caution
12.1 Mounting Direction
Mount products in right direction.
Wrong direction which is 90°rotated from right direction causes not only open or short circuit but also flames or
other serious trouble.
12.2 Fail Safe
Be sure to provide an appropriate fail-safe function on your product to prevent from a second damage that may
be caused by the abnormal function or the failure of our products.
12.3 Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high
reliability for the prevention of defects which might directly cause damage to the third party's life, body or property.
(1) Aircraft equipment (6) Transportation equipment (trains, ships, etc.)
(2) Aerospace equipment (7) Traffic signal equipment
(3)Undersea equipment (8) Disaster prevention / crime prevention equipment
(4)Power plant control equipment (9) Data-processing equipment
(5) Medical equipment (10) Applications of similar complexity and /or reliability requirements
to the applications listed in the above
12.4 Attention regarding product's heat generation
Please pay special attention to the product’s heat generation such as beyond Operating Temperature range,
mounting product in close proximity to other products that radiate heat and beyond the rated current.
13. Notice
Products can only be soldered with reflow.
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
13.1 Flux and Solder
Flux Use rosin-based flux.Do not use highly acidic flux
(with chlorine content exceeding0.2(wt)%)
Do not use water soluble flux.
Solder Use Sn-3.0Ag-0.5Cu solder
Other flux (except above) please contacts us for details, then use.
13.2 Notes for Assembling
<Exclusive Use of Reflow Soldering>
When installing by the flow soldering, the degradation of the insulation resistance sometimes occurs.
Products can only be soldered with reflow.
The use in flow soldering is reserved.
< Thermal Shock >
Pre-heating should be in such a way that the temperature difference between solder and products
surface is limited to 150 °C max. Also cooling into solvent after soldering should be in such a way that
the temperature difference is limited to 150 °C max.
Insufficient pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality.
13.3 Attention Regarding P.C.B. Bending
The following shall be considered when designing P.C.B.'s and laying out products.
(1) P .C.B. shall be designed so that products are not subject to the mechanical stress for board warpage.
Products Direction
Products shall be located in the sideways
direction (Length:a<b) to the mechanical stress.
Z Z
right direction wrong direction
Poor example
Good example
b
a
Spec No. JEFL243B-9101G-01 P8/10
MURATA MFG.CO.,LTD
Reference Only
Pick- up nozzle
Support pin
P.C.B.
Product
(2)Components location on P.C.B. separation.
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as possible
to reduce stress.
Contents of Measures Stress Level
(1) Turn the mounting direction of the component parallel to the board separation surface. A > D *1
(2) Add slits in the board separation part. A > B
(3) Keep the mounting position of the component away from the board separation surface. A > C
*1 A > D is valid when stress is added vertically to the perforation as with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.
(3) Mounting Components Near Screw Holes
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during
the tightening of the screw. Mount the component in a position as far away from the screw holes as possible.
13.4 Attention Regarding P.C.B. Design
< The Arrangement of Products >
P.C.B. shall be designed so that products are
far from the portion of perforation.
The portion of perforation shall be designed
as narrow as possible, and shall be designed
so as not to be applied the stress in the
case of P.C.B. separation.
Products shall not be arranged on the line
of a series of holes when there are big holes in P.C.B.
(Because the stress concentrates on the line of holes.)
< Products Placing >
Support pins shall be set under P.C.B
to prevent causing a warp to P.C.B.
during placing the products on the other
side of P.C.B.
< P.C.B. Separation >
P.C.B. shall not be separated with hand.
P.C.B. shall be separated with the fixture so as not to cause P.C.B. bending.
×
×
P.C.B.
Portion of
Perforation
Portion of
Perforation
Product
Product
P.C.B.
Hole
×
Perforation
Slit
A
B
C
D
Screw Hole Recommended
Spec No. JEFL243B-9101G-01 P9/10
MURATA MFG.CO.,LTD
Reference Only
13.5 Standard Land Dimensions
(1) Design the land pads for this part as shown above on both side printed circuit boards
(or a multiple layered substrate ).
(2) To use PLT10HH with high current such as its rated current 6A~18A,the pattern is also should be applicable
for such high current.
The thickness of copper foil for PLT10HH should be designed as temperature rise is lower than 40 degree C
(DC resistance of land and pattern should be low according to the current).
13.6 Reflow Soldering
Standard soldering profile and the limit soldering profile is as follows.
The excessive soldering conditions may cause leaching of the electrode and/or resulting in the deterioration
of product quality.
Standard Profile Limit Profile
Pre-heating 150°C ~ 180°C , 90s ± 30s
Heating above 220°C , 30s ~ 60s above 230°C , 60s max.
Peak temperature 250°C ± 3°C 260°C , 10s
Cycle of reflo
w
2 times 2 times
(1)Solder paste printing for reflow soldering
· Standard thickness of solder paste should be 150 to 200 μm.
Incidentally, depending on the reflow condition and the way of heat conduction, the solder would not wet up the
terminal, being possible to lead to not enough connection between terminals and lands on the circuit
board / open circuit in the circuit board. In case of use, always evaluate this part in your products with actual use
condition.
· For the solder paste printing pattern, use standard land dimensions.
· For the resist and copper foil pattern, use standard land dimensions.
· Use Sn-3.0Ag-0.5Cu solder
150
90s±30s Time(s)
250±3°C
Tem
p
(°C)
220°C
3060s
180
260°C /10s
230°C
60s max.
Limit Profile
Standard Profile
Spec No. JEFL243B-9101G-01 P10/10
MURATA MFG.CO.,LTD
Reference Only
(2) Reworking with Soldering iron
· The following conditions shall be strictly followed when using a soldering iron.
Pre-heating: 150°C, 1 min
Soldering iron: 80W max.
Tip temperature/ Soldering time: 400°C ± 5°C, within 5s
Times : 2times max.
Note: Do not touch the products directly with the tip of the soldering iron.
13.7 Cleaning Conditions
Do not clean after soldering. If cleaning, please contact us.
13.8 Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to
the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to
the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending Twisting
13.9 Operating Environment
Do not use this product under the following environmental conditions, on deterioration of the Insulation
Resistance and/or corrosion of Inner Electrode may result from the use.
(1) In the corrodible atmosphere (acidic gas, alkaline gas, chlorine, sulfur gas, organic gas and etc.)
(2) In the atmosphere where liquid such as organic solvent, may splash on the products.
(3) In the atmosphere where the temperature / humidity changes rapidly and it is easy to dew.
(4) In the atmosphere where the product is covered with dust or is subjected to salty breeze.
13.10 Storage Conditions
(1)Storage period
Use the products within 12 months after delivered.
Solderability should be checked if this period is exceeded.
(2)Storage conditions
• Products should be stored in the warehouse on the following conditions.
Temperature: -10°C to 40°C
Humidity: 15% to 85% relative humidity
No rapid change on temperature and humidity
• Don't keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization of
electrode, resulting in poor solderability.
• Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
• Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
• Products should be stored under the airtight packaged condition.
(3)Delivery
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
14. !Note
(1)Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2)You are requested not to use our product deviating from the reference specifications.
(3)The contents of this reference specification are subject to change without advance notice. Please approve our
product specifications or transact the approval sheet for product specifications before ordering.

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