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ISL3293E through ISL3298E Datasheet

Intersil

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FN6544 Rev 3.00 Page 1 of 17
September 25, 2015
FN6544
Rev 3.00
September 25, 2015
ISL3293E, ISL3294E, ISL3295E ISL3296E, ISL3297E,
ISL3298E
DATASHEET
The Intersil ISL3293E, ISL3294E, ISL3295E, ISL3296E,
ISL3297E, ISL3298E are ±16.5kV HBM ESD Protected (7kV
IEC61000 contact), 3.0V to 5.5V powered, single transmitters
for balanced communication using the RS-485 and RS-422
standards. These drivers have very low bus currents (±40mA),
so they present less than a “1/8 unit load” to the RS-485 bus.
This allows more than 256 transmitters on the network without
violating the RS-485 specification’s 32 unit load maximum, and
without using repeaters.
Hot Plug circuitry ensures that the Tx outputs remain in a high
impedance state while the power supply stabilizes.
The ISL3293E, ISL3294E, ISL3296E, ISL3297E utilize slew rate
limited drivers which reduce EMI, and minimize reflections from
improperly terminated transmission lines, or from unterminated
stubs in multidrop and multipoint applications. Drivers on the
ISL3295E and ISL3298E are not limited, so they can achieve the
20Mbps data rate. All versions are offered in industrial and
extended industrial (-40°C to +125°C) temperature ranges.
A 26% smaller footprint is available with the ISL3296E,
ISL3297E, ISL3298E’s TDFN package. These devices also
feature a logic supply pin (VL) that sets the switching points of
the DE and DI inputs to be compatible with a lower supply
voltage in mixed voltage systems.
For companion single RS-485 receivers in micro packages,
please see the ISL3280E, ISL3281E, ISL3282E, ISL3283E,
ISL3284E datasheet.
Features
•High ESD protection on RS-485 outputs . . . . ±16.5kV HBM
- IEC61000-4-2 contact test method . . . . . . . . . . . . . . . ±7kV
- Class 3 ESD level on all other pins. . . . . . . . . . . .>8kV HBM
•Specified for +125°C operation (VCC 3.6V only)
Logic supply pin (VL) eases operation in mixed supply
systems (ISL3296E through ISL3298E only)
Hot plug - Tx outputs remain three-state during power-up
Low Tx leakage allows >256 devices on the bus
High data rates. . . . . . . . . . . . . . . . . . . . . . . . . . up to 20Mbps
Low quiescent supply current. . . . . . . . . . . . . . . 150µA (max)
- Very low shutdown supply current . . . . . . . . . . . 1µA (max)
-7V to +12V common-mode output voltage range
(VCC 3.6V only)
Current limiting and thermal shutdown for driver overload
protection (VCC 3.6V only)
Tri-statable Tx outputs
5V tolerant logic inputs when VCC 5V
Pb-free (RoHS compliant)
Applications
Clock distribution
High node count systems
Space constrained systems
•Security camera networks
Building environmental control/lighting systems
Industrial/process control networks
TABLE 1. SUMMARY OF FEATURES
PART NUMBER FUNCTION
DATA
RATE
(Mbps)
SLEW RATE
LIMITED?
HOT
PLUG?
VL
PIN?
TX
ENABLE?
(Note 11)
MAXIMUM
QUIESCENT
ICC (µA)
LOW POWER
SHUTDOWN?
PIN
COUNT
ISL3293E (No longer available or supported,
recommended replacement: ISL32613E)
1 Tx 0.25 YES YES NO YES 150 YES 6 Ld SOT
ISL3294E (No longer available or supported,
recommended replacement: ISL32614E)
1 Tx 0.5 YES YES NO YES 150 YES 6 Ld SOT
ISL3295E 1 Tx 20 NO YES NO YES 150 YES 6 Ld SOT
ISL3296E
(No longer available or supported)
1 Tx 0.25 YES YES YES YES 150 YES 8 Ld TDFN
ISL3297E
(No longer available or supported)
1 Tx 0.5 YES YES YES YES 150 YES 8 Ld TDFN
ISL3298E 1 Tx 20 NO YES YES YES 150 YES 8 Ld TDFN
ISL3293E, ISL3294E, ISL3295E ISL3296E, ISL3297E, ISL3298E
FN6544 Rev 3.00 Page 2 of 17
September 25, 2015
Pin Configurations
ISL3293E, ISL3294E, ISL3295E
(6 LD SOT-23)
TOP VIEW
ISL3296E, ISL3297E, ISL3298E
(8 LD TDFN)
TOP VIEW
NOTE: BOTH GND PINS MUST BE CONNECTED
DI
VCC
DE
1
2
3
6
5
4
Y
GND
Z
D
2
3
4
1
7
6
5
8
VL
DE
DI
GND
VCC
Z
Y
GND
D
Truth Tables
TRANSMITTING
INPUTS OUTPUTS
DE (Note 11)DI Z Y
1101
1010
0XHigh-Z *High-Z *
NOTE: *Shutdown Mode
Pin Descriptions
PIN
NAME FUNCTION
DE Driver output enable. The driver outputs, Y and Z, are enabled by
bringing DE high, and are high impedance when DE is low. If the
driver enable function isn’t needed, connect DE to VCC (or VL)
through a 1kΩ to 3kΩ resistor.
DI Driver input. A low on DI forces output Y low and output Z high.
Similarly, a high on DI forces output Y high and output Z low.
GND Ground connection. This is also the potential of the TDFN
thermal pad.
Y ±15kV HBM, ±7kV IEC61000 (contact method) ESD Protected
RS-485/422 level, noninverting transmitter output.
Z ±15kV HBM, ±7kV IEC61000 (contact method) ESD Protected
RS-485/422 level, inverting transmitter output.
VCC System power supply input (3.0V to 5.5V). On devices with a VL
pin powered from a separate supply, power-up VCC first.
VLLogic-level supply which sets the VIL/VIH levels for the DI and DE
pins (ISL3296E, ISL3297E, ISL3298E only). If VL and VCC are
different supplies, power-up this supply after VCC, and keep
VLVCC.
ISL3293E, ISL3294E, ISL3295E ISL3296E, ISL3297E, ISL3298E
FN6544 Rev 3.00 Page 3 of 17
September 25, 2015
Ordering Information
PART NUMBER
(Notes 1, 2, 3)
PART
MARKING
(Note 4)
TEMP.
RANGE
(°C)
PACKAGE
(RoHS
Compliant)
PKG.
DWG. #
ISL3293EFHZ-T
(No longer available or supported, recommended replacement: ISL32613E)
293F -40 to +125 6 Ld SOT-23 P6.064
ISL3293EIHZ-T
(No longer available or supported, recommended replacement: ISL32613E)
293I -40 to +85 6 Ld SOT-23 P6.064
ISL3294EFHZ-T
(No longer available or supported, recommended replacement: ISL32614E)
294F -40 to +125 6 Ld SOT-23 P6.064
ISL3294EIHZ-T
(No longer available or supported, recommended replacement: ISL32614E)
294I -40 to +85 6 Ld SOT-23 P6.064
ISL3295EFHZ-T 295F -40 to +125 6 Ld SOT-23 P6.064
ISL3295EIHZ-T 295I -40 to +85 6 Ld SOT-23 P6.064
ISL3296EFRTZ-T (No longer available or supported) 96F -40 to +125 8 Ld TDFN L8.2x3A
ISL3296EIRTZ-T (No longer available or supported) 96I -40 to +85 8 Ld TDFN L8.2x3A
ISL3297EFRTZ-T (No longer available or supported) 97F -40 to +125 8 Ld TDFN L8.2x3A
ISL3297EIRTZ-T (No longer available or supported) 97I -40 to +85 8 Ld TDFN L8.2x3A
ISL3298EFRTZ-T 98F -40 to +125 8 Ld TDFN L8.2x3A
ISL3298EIRTZ-T (No longer available or supported) 98I -40 to +85 8 Ld TDFN L8.2x3A
NOTES:
1. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte
tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil
Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
2. Please refer to TB347 for details on reel specifications.
3. For Moisture Sensitivity Level (MSL), please see product information page for ISL3293E, ISL3294E, ISL3295E, ISL3296E, ISL3297E, ISL3298E. For
more information on MSL, please see tech brief TB363.
4. SOT-23 “PART MARKING” is branded on the bottom side.
ISL3293E, ISL3294E, ISL3295E ISL3296E, ISL3297E, ISL3298E
FN6544 Rev 3.00 Page 4 of 17
September 25, 2015
Typical Operating Circuits
FIGURE 1. NETWORK WITH ENABLES
FIGURE 2. NETWORK WITHOUT ENABLE
FIGURE 3. NETWORK WITH VL PIN FOR INTERFACING TO LOWER VOLTAGE LOGIC DEVICES
0.1µF
+
R
6
4
1
3
5
2
VCC
GND
RO
RE
B
A
+3.3V TO 5V
0.1µF +
D
4
6
2
3
1
5
VCC
GND
DE
DI
Z
Y
RT
+3.3V
ISL3281E ISL329xE
0.1µF
+
R
5
4
1
3
2
VCC
GND
RO B
A
+3.3V TO 5V
0.1µF +
D
4
6
23
1
5
VCC
GND
DE
DI
Z
Y
RT
+3.3V
ISL3280E ISL329xE
1kΩ TO 3kΩ Note 10
0.1µF
+
R
5
8
4
1
7
2
VCC
GND
RO
RE
B
A
+3.3V TO 5V
0.1µF +
D
7
6
8
2
3
4, 5
VCC
GND
DE
DI
Z
Y
RT
+3.3V
ISL3282E ISL3298E
1
VL
1.8V
6
VL
2.5V
VCC
LOGIC
DEVICE
(µP, ASIC,
UART)
VCC
LOGIC
DEVICE
(µP, ASIC,
UART)
NOTE: IF POWERED FROM SEPARATE SUPPLIES,
POWER-UP VCC BEFORE VL
ISL3293E, ISL3294E, ISL3295E ISL3296E, ISL3297E, ISL3298E
FN6544 Rev 3.00 Page 5 of 17
September 25, 2015
Absolute Maximum Ratings Thermal Information
VCC to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V
VL to GND (ISL3296E thru ISL3298E Only) . . . . . . . . -0.3V to (VCC + 0.3V)
Input Voltages
DI, DE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V
Output Voltages
Y, Z (VCC 3.6V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -8V to +13V
Y, Z (VCC > 3.6V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to VCC +0.5V
Short-circuit Duration
Y, Z (VCC 3.6V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous
Y, Z (VCC > 3.6V, Note 13) . . . . . . . . . . . . . . . . . . . . . . . . . 1s at <300mA
ESD Rating . . . . . . . . . . . . . . . . . . See Electrical Specifications on page 6
Thermal Resistance (Typical) JA (°C/W) JC (°C/W)
6 Ld SOT-23 Package (Note 5) . . . . . . . . . . 177 N/A
8 Ld TDFN Package (Notes 6, 7). . . . . . . . . 65 8
Maximum Junction Temperature (Plastic Package) . . . . . . . . . . . +150°C
Maximum Storage Temperature Range . . . . . . . . . . . . . .-65°C to +150°C
Pb-free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . see TB493
Operating Conditions
Temperature Range
F Suffix (VCC 3.6V only). . . . . . . . . . . . . . . . . . . . . . . . .-40°C to +125°C
I Suffix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40°C to +85°C
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product
reliability and result in failures not covered by warranty.
NOTES:
5. JA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
6. JA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See Tech
Brief TB379.
7. For JC, the “case temp” location is the center of the exposed metal pad on the package underside.
Electrical Specifications Test Conditions: VCC = 3.0V to 5.5V, VL = VCC (ISL3296E, ISL3297E, ISL3298E only), typicals are at
TA= +25°C, unless otherwise specified. (Note 8)
PARAMETER SYMBOL TEST CONDITIONS
TEMP
(°C)
MIN
(Note 12)
TYP
(Note 14)
MAX
(Note 12)UNIT
DC CHARACTERISTICS
Driver Differential VOUT VOD RL = 100Ω (RS-422)
(Figure 4A)
VCC 3.15V Full 2 2.3 - V
VCC 4.5V Full 3 3.8 - V
RL = 54Ω (RS-485)
(Figure 4A)
VCC 3.0V Full 1.5 2 VCC V
VCC 4.5V Full 2.5 3.4 VCC V
No load Full - - VCC
RL = 60Ω, -7V VCM 12V (Figure 4B) Full 1.5 2, 3.4 - V
Change in Magnitude of Driver
Differential VOUT for
Complementary Output States
VOD RL = 54Ω or 100Ω (Figure 4A) Full - 0.01 0.2 V
Driver Common-mode VOUT VOC RL = 54Ω or 100Ω
(Figure 4A)
VCC 3.6V Full - 2 3 V
VCC 5.5V Full - - 3.2 V
Change in Magnitude of Driver
Common-mode VOUT for
Complementary Output States
VOC RL = 54Ω or 100Ω (Figure 4A) Full - 0.01 0.2 V
Input High Voltage (DI, DE) VIH1 VL = VCC if ISL3296E,
ISL3297E, ISL3298E
VCC 3.6V Full 2.2 - - V
VIH2 VCC 5.5V Full 3 - - V
VIH3 2.7V VL < 3.0V (ISL3296E, ISL3297E,
ISL3298E only)
Full 2 - - V
VIH4 2.3V VL < 2.7V (ISL3296E, ISL3297E,
ISL3298E only)
Full 1.65 - - V
VIH5 1.6V VL < 2.3V (ISL3296E, ISL3297E,
ISL3298E only)
Full 0.7*VL--V
VIH6 1.35V VL < 1.6V (ISL3296E, ISL3297E,
ISL3298E only)
25 - 0.5*VL-V
ISL3293E, ISL3294E, ISL3295E ISL3296E, ISL3297E, ISL3298E
FN6544 Rev 3.00 Page 6 of 17
September 25, 2015
Input Low Voltage (DI, DE) VIL1 VL = VCC if ISL3296E, ISL3297E, ISL3298E Full - - 0.8 V
VIL2 VL 2.7V (ISL3296E, ISL3297E, ISL3298E
only)
Full - - 0.8 V
VIL3 2.3V VL < 2.7V (ISL3296E, ISL3297E,
ISL3298E only)
Full - - 0.65 V
VIL4 1.6V VL < 2.3V (ISL3296E, ISL3297E,
ISL3298E only)
Full - - 0.22*VLV
VIL5 1.35V VL < 1.6V (ISL3296E, ISL3297E,
ISL3298E only)
25 - 0.3*VL-V
Logic Input Current IIN DI = DE = 0V or VCC (Note 11)Full-2-2µA
Output Leakage Current
(Y, Z, Note 11)
IOZ DE = 0V,
VCC = 0V, 3.6V, or 5.5V
VIN = 12V Full - 0.1 40 µA
VIN = -7V Full -40 -10 - µA
Driver Short-circuit Current,
VO = High or Low (Note 9)
IOSD1 DE = VCC, -7V VO 12V, VCC 3.6V Full - - ±250 mA
DE = VCC, 0V VO VCC, VCC > 3.6V (Note 13) Full - - ±450 mA
Thermal Shutdown Threshold TSD Full - 160 - °C
SUPPLY CURRENT
No-load Supply Current ICC DI = 0V or VCC DE = VCC Full - 120 150 µA
Shutdown Supply Current ISHDN DE = 0V, DI = 0V or VCC Full - 0.01 1 µA
ESD PERFORMANCE
RS-485 Pins (Y, Z) Human Body Model, from bus pins to GND 25 - ±16.5 - kV
IEC61000 Contact, from bus pins to GND 25 - ±7 - kV
All Pins HBM, per MIL-STD-883 Method 3015 25 - ±8 - kV
Machine Model 25 - ±400 - V
DRIVER SWITCHING CHARACTERISTICS (ISL3293E, ISL3296E, 250kbps)
Maximum Data Rate fMAX VOD = ±1.5V, CD = 820pF (Figure 7) Full 250 - - kbps
Driver Single-ended Output
Delay
tSD RDIFF = 54Ω, CD = 50pF (Figure 5) Full 400 1350 1700 ns
Part-to-part Output Delay Skew tSKPP RDIFF = 54Ω, CD = 50pF (Figure 5, Note 10)Full - - 900 ns
Driver Single-ended Output
Skew
tSSK RDIFF = 54Ω, CD = 50pF (Figure 5) Full - 600 750 ns
Driver Differential Output Delay tDD RDIFF = 54Ω CD = 50pF (Figure 5) Full 400 1100 1500 ns
Driver Differential Output Skew tDSK RDIFF = 54Ω, CD = 50pF (Figure 5) Full - 4, 1 30 ns
Driver Differential Rise or Fall
Time
tR, tFRDIFF = 54Ω,
CD = 50pF (Figure 5)
VCC 3.6V Full 400 960 1500 ns
VCC = 5V 25 - 1300 - ns
Driver Enable to Output High tZH RL = 500Ω, CL = 50pF, SW = GND (Figure 6) Full - 100, 60 250 ns
Driver Enable to Output Low tZL RL = 500Ω, CL = 50pF, SW = VCC (Figure 6) Full - 60, 35 250 ns
Driver Disable from Output High tHZ RL = 500Ω, CL = 50pF, SW = GND (Figure 6) Full - 30, 22 60 ns
Driver Disable from Output Low tLZ RL = 500Ω, CL = 50pF, SW = VCC (Figure 6) Full - 25, 20 60 ns
DRIVER SWITCHING CHARACTERISTICS (ISL3294E, ISL3297E, 500kbps)
Maximum Data Rate fMAX VOD = ±1.5V, CD = 820pF (Figure 7) Full 500 - - kbps
Driver Single-ended Output
Delay
tSD RDIFF = 54Ω, CD = 50pF (Figure 5) Full 200 340 500 ns
Part-to-part Output Delay Skew tSKPP RDIFF = 54Ω, CD = 50pF (Figure 5, Note 10)Full - - 300 ns
Driver Single-ended Output
Skew
tSSK RDIFF = 54Ω, CD = 50pF (Figure 5) Full - 30, 80 150 ns
Driver Differential Output Delay tDD RDIFF = 54Ω, CD = 50pF (Figure 5) Full 200 345 500 ns
Electrical Specifications Test Conditions: VCC = 3.0V to 5.5V, VL = VCC (ISL3296E, ISL3297E, ISL3298E only), typicals are at
TA= +25°C, unless otherwise specified. (Note 8) (Continued)
PARAMETER SYMBOL TEST CONDITIONS
TEMP
(°C)
MIN
(Note 12)
TYP
(Note 14)
MAX
(Note 12)UNIT
ISL3293E, ISL3294E, ISL3295E ISL3296E, ISL3297E, ISL3298E
FN6544 Rev 3.00 Page 7 of 17
September 25, 2015
Driver Differential Output Skew tDSK RDIFF = 54Ω, CD = 50pF (Figure 5)Full-230ns
Driver Differential Rise or Fall
Time
tR, tFRDIFF = 54Ω, CD = 50pF (Figure 5) Full 200 350 800 ns
Driver Enable to Output High tZH RL = 500Ω, CL = 50pF, SW = GND (Figure 6) Full - 100, 60 250 ns
Driver Enable to Output Low tZL RL = 500Ω, CL = 50pF, SW = VCC (Figure 6) Full - 60, 35 250 ns
Driver Disable from Output High tHZ RL = 500Ω, CL = 50pF, SW = GND (Figure 6) Full - 30, 22 60 ns
Driver Disable from Output Low tLZ RL = 500Ω, CL = 50pF, SW = VCC (Figure 6) Full - 25, 20 60 ns
DRIVER SWITCHING CHARACTERISTICS (ISL3295E, ISL3298E, 20Mbps)
Maximum Data Rate fMAX VOD = ±1.5V, CD = 360pF (Figure 7) Full 20 - - Mbps
Driver Single-ended Output
Delay
tSD RDIFF = 54Ω,
CD = 50pF (Figure 5)
VL = VCC Full 15 29, 23 42 ns
VL 1.8V 25 - 32 - ns
VL = 1.5V 25 - 36 - ns
VL = 1.35V 25 - 40 - ns
Part-to-part Output Delay Skew tSKPP RDIFF = 54Ω, CD = 50pF (Figure 5, Note 10)Full - - 25 ns
Driver Single-ended Output
Skew
tSSK RDIFF = 54Ω,
CD = 50pF (Figure 5)
VL = VCC Full - 3 7 ns
VL 1.8V 25 - 3 - ns
VL = 1.5V 25 - 4 - ns
VL = 1.35V 25 - 5 - ns
Driver Differential Output Delay tDD RDIFF = 54Ω,
CD = 50pF (Figure 5)
VL = VCC Full - 29, 22 42 ns
VL 1.8V 25 - 32 - ns
VL = 1.5V 25 - 36 - ns
VL = 1.35V 25 - 42 - ns
Driver Differential Output Skew tDSK RDIFF = 54Ω,
CD = 50pF (Figure 5)
VL = VCC 3.6V Full - 0.5 3 ns
VL = VCC = 5V 25 - 2 - ns
VL 1.8V 25 - 0.5, 1 - ns
VL 1.5V 25 - 1, 2 - ns
VL = 1.35V 25 - 2, 4 - ns
Driver Differential Rise or Fall
Time
tR, tFRDIFF = 54Ω,
CD = 50pF (Figure 5)
VL = VCC Full - 9 15 ns
VL 1.35V 25 - 9 - ns
Driver Enable to Output High tZH RL = 500Ω, CL = 50pF, SW = GND (Figure 6) Full - 100, 60 250 ns
Driver Enable to Output Low tZL RL = 500Ω, CL = 50pF, SW = VCC (Figure 6) Full - 60, 35 250 ns
Driver Disable from Output High tHZ RL = 500Ω CL = 50pF, SW = GND (Figure 6) Full - 30, 22 60 ns
Driver Disable from Output Low tLZ RL = 500Ω, CL = 50pF, SW = VCC (Figure 6) Full - 25, 20 60 ns
NOTES:
8. All currents into device pins are positive; all currents out of device pins are negative. All voltages are referenced to device ground unless otherwise
specified.
9. Applies to peak current. See “Typical Performance Curves” on page 11 for more information.
10. tSKPP is the magnitude of the difference in propagation delays of the specified terminals of two units tested with identical test conditions (VCC,
temperature, etc.).
11. If the driver enable function isn’t needed, connect DE to VCC (or VL) through a 1kΩ to 3kΩ resistor.
12. Parts are 100% tested at +25°C. Over-temperature limits established by characterization and are not production tested.
13. Due to the high short-circuit current at VCC > 3.6V, the outputs must not be shorted outside the range of GND to VCC or damage may occur. To prevent
excessive power dissipation that may damage the output, the short-circuit current should be limited to 300mA during testing. It is best to use an
external resistor for this purpose, since the current limiting on the VO supply may respond too slowly to protect the output.
14. Typicals are measured at VCC = 3.3V for parameters specified with 3V VCC 3.6V, and are measured at VCC = 5V for parameters specified with
4.5V VCC 5.5V. If VCC isn’t specified, then a single “TYP” entry applies to both VCC = 3.3V and 5V, and two entries separated by a comma refer to
VCC = 3.3V and 5V, respectively.
Electrical Specifications Test Conditions: VCC = 3.0V to 5.5V, VL = VCC (ISL3296E, ISL3297E, ISL3298E only), typicals are at
TA= +25°C, unless otherwise specified. (Note 8) (Continued)
PARAMETER SYMBOL TEST CONDITIONS
TEMP
(°C)
MIN
(Note 12)
TYP
(Note 14)
MAX
(Note 12)UNIT
ISL3293E, ISL3294E, ISL3295E ISL3296E, ISL3297E, ISL3298E
FN6544 Rev 3.00 Page 8 of 17
September 25, 2015
Test Circuits and Waveforms
FIGURE 4A. VOD AND VOC FIGURE 4B. VOD WITH COMMON-MODE LOAD
FIGURE 4. DC DRIVER TEST CIRCUITS
FIGURE 5A. TEST CIRCUIT FIGURE 5B. MEASUREMENT POINTS
FIGURE 5. DRIVER PROPAGATION DELAY AND DIFFERENTIAL TRANSITION TIMES
FIGURE 6A. TEST CIRCUIT FIGURE 6B. MEASUREMENT POINTS
FIGURE 6. DRIVER ENABLE AND DISABLE TIMES
D
DE
DI
VCC OR VL
VOD
VOC
RL/2
RL/2
Z
Y
D
DE
DI
VCC OR VL
VOD
375Ω
375Ω
Z
Y
RL = 60Ω
VCM
-7V TO +12V
D
DE
DI
VCC OR VL
SIGNAL
GENERATOR
CD
RDIFF
Z
Y
OUT (Z)
3V OR VL
0V
50%50%
VOH
VOL
OUT (Y)
tSD1 tSD2
DIFF OUT (Y - Z)
tR
+VOD
-VOD
90% 90%
tF
10% 10%
DI
tDSK = |tDDLH - tDDHL|tSSK = |tSD1(Y) - tSD2(Y)| OR |tSD1(Z) - tSD2(Z)|
50%50%
50%
tDDLH tDDHL
50%
D
DE
DI Z
Y
VCC
GND
SW
PARAMETER OUTPUT DI SW
tHZ Y/Z 1/0 GND
tLZ Y/Z 0/1 VCC
tZH Y/Z 1/0 GND
tZL Y/Z 0/1 VCC
SIGNAL
GENERATOR
500Ω
50pF
OUT (Y, Z)
3V OR VL
0V
50%50%
VOH
0V
VOH - 0.25V
tHZ
OUT (Y, Z)
VCC
VOL
VOL + 0.25V
tLZ
DE
OUTPUT HIGH
OUTPUT LOW
tZL
tZH
50%
50%
ISL3293E, ISL3294E, ISL3295E ISL3296E, ISL3297E, ISL3298E
FN6544 Rev 3.00 Page 9 of 17
September 25, 2015
Application Information
RS-485 and RS-422 are differential (balanced) data
transmission standards for use in long haul or noisy
environments. RS-422 is a subset of RS-485, so RS-485
transmitters and receivers are also RS-422 compliant. RS-422 is
a point-to-multipoint (multidrop) standard, which allows only one
driver and up to 10 (assuming one unit load devices) receivers on
each bus. RS-485 is a true multipoint standard, which allows up
to 32 one unit load devices (any combination of drivers and
receivers) on each bus. To allow for multipoint operation, the
RS-485 specification requires that drivers must handle bus
contention without sustaining any damage.
Another important advantage of RS-485 is the extended
Common-Mode Range (CMR), which specifies that the driver
outputs and receiver inputs withstand signals that range from
+12V to -7V. RS-422 and RS-485 are intended for runs as long as
4000’, so the wide CMR is necessary to handle ground potential
differences, as well as voltages induced in the cable by external
fields.
Driver Features
These RS-485/RS-422 drivers are differential output devices that
delivers at least 1.5V across a 54Ω load (RS-485) and at least 2V
across a 100Ω load (RS-422). The drivers feature low
propagation delay skew to maximize bit width and to minimize
EMI.
All drivers are tri-statable via the active high DE input. If the Tx
enable function is not needed, tie DE to VCC (or VL) through a 1kΩ
to 3kΩ resistor.
The 250kbps and 500kbps driver outputs are slew rate limited to
minimize EMI, and to reduce reflections in unterminated or
improperly terminated networks. Outputs of the ISL3295E and
ISL3298E drivers are not limited, so faster output transition
times allow data rates of at least 20Mbps.
Wide Supply Range
The ISL3293E through ISL3298E are optimized for 3.3V
operation, but can be operated with supply voltages as high as
5.5V. These devices meet the RS-422 and RS-485
specifications for supply voltages less than 4V, and are RS-422
and RS-485 compatible for supplies greater than 4V. Operation
at +125°C requires VCC 3.6V, while 5V operation requires
adding output current limiting resistors (as described in the
Driver Overload Protection” on page 10) if output short-circuits
(e.g., from bus contention) are a possibility.
5.5V Tolerant Logic Pins
Logic input pins (DI, DE) contain no ESD nor parasitic diodes to
VCC (nor to VL), so they withstand input voltages exceeding 5.5V
regardless of the VCC and VL voltages.
Logic Supply (VL Pin, ISL3296E through
ISL3298E)
Note: If powered from separate supplies, power-up VCC before
powering up the VL supply and keep VL VCC.
The ISL3296E through ISL3298E include a VL pin that powers the
logic inputs (DI and DE). These pins interface with “logic” devices
such as UARTs, ASICs, and µcontrollers, and today most of these
devices use power supplies significantly lower than 3.3V. Thus,
the logic device’s low VOH might not exceed the VIH of a 3.3V or
5V powered DI or DE input. Connecting the VL pin to the power
supply of the logic device (as shown in Figure 8) reduces the DI
and DE input switching points to values compatible with the logic
device’s output levels. Tailoring the logic pin input switching
points and output levels to the supply voltage of the UART, ASIC,
or µcontroller eliminates the need for a level shifter/translator
between the two ICs.
FIGURE 7A. TEST CIRCUIT FIGURE 7B. MEASUREMENT POINTS
FIGURE 7. DRIVER DATA RATE
Test Circuits and Waveforms (Continued)
D
DE
DI
VCC OR VL
SIGNAL
GENERATOR
Z
Y
CDVOD
+
-
54Ω
3V OR VL
0V
DIFF OUT (Y - Z) +VOD
-VOD
DI
0V
ISL3293E, ISL3294E, ISL3295E ISL3296E, ISL3297E, ISL3298E
FN6544 Rev 3.00 Page 10 of 17
September 25, 2015
VL can be anywhere from VCC down to 1.35V, but the input
switching points may not provide enough noise margin and
20Mbps data rates may not be achievable, when VL<1.5V.
Table 2 indicates typical VIH and VIL values for various VL settings
so the user can ascertain whether or not a particular VL voltage
meets his needs.
The VL supply current (IL) is typically much less than 20µA, as
shown in Figure 12 on page 11, when DE and DI are
above/below VIH/VIL.
Hot Plug Function
When a piece of equipment powers up, there is a period of time
where the processor or ASIC driving the RS-485 control line (DE)
is unable to ensure that the RS-485 Tx outputs are kept disabled.
If the equipment is connected to the bus, a driver activating
prematurely during power-up may crash the bus. To avoid this
scenario, the ISL329xE family incorporates a “Hot Plug” function.
During power-up, circuitry monitoring VCC ensures that the Tx
outputs remain disabled for a period of time, regardless of the state
of DE. This gives the processor/ASIC a chance to stabilize and drive
the RS-485 control lines to the proper states.
ESD Protection
All pins on these devices include class 3 (8kV) Human Body
Model (HBM) ESD protection structures, but the RS-485 pins
(driver outputs) incorporate advanced structures allowing them
to survive ESD events in excess of ±16.5kV HBM and ±7kV to
the IEC61000 contact test method. The RS-485 pins are
particularly vulnerable to ESD damage because they typically
connect to an exposed port on the exterior of the finished
product. Simply touching the port pins, or connecting a cable,
can cause an ESD event that might destroy unprotected ICs.
These new ESD structures protect the device whether or not it is
powered up and without degrading the RS-485 common-mode
range of -7V to +12V. This built-in ESD protection eliminates the
need for board level protection structures (e.g., transient
suppression diodes) and the associated, undesirable capacitive
load they present.
Data Rate, Cables and Terminations
RS-485/RS-422 are intended for network lengths up to 4000’,
but the maximum system data rate decreases as the
transmission length increases. Devices operating at 20Mbps are
limited to lengths less than 100’, while the 250kbps versions can
operate at full data rates with lengths of several 1000’.
Twisted pair is the cable of choice for RS-485/RS-422 networks.
Twisted pair cables tend to pick up noise and other
electromagnetically induced voltages as common-mode signals,
which are effectively rejected by the differential receivers in
these ICs.
Proper termination is imperative, when using the 20Mbps
devices, to minimize reflections. Short networks using the
250kbps versions need not be terminated, but, terminations are
recommended unless power dissipation is an overriding concern.
In point-to-point, or point-to-multipoint (single driver on bus)
networks, the main cable should be terminated in its
characteristic impedance (typically 120Ω) at the end farthest
from the driver. In multireceiver applications, stubs connecting
receivers to the main cable should be kept as short as possible.
Multipoint (multidriver) systems require that the main cable be
terminated in its characteristic impedance at both ends. Stubs
connecting a transmitter or receiver to the main cable should be
kept as short as possible.
Driver Overload Protection
As stated previously, the RS-485 specification requires that
drivers survive worst case bus contentions undamaged. These
drivers meet this requirement, for VCC 3.6V, via driver output
short-circuit current limits and on-chip thermal shutdown
circuitry.
The driver output stages incorporate short-circuit current limiting
circuitry, which ensures that the output current never exceeds the
RS-485 specification, for VCC 3.6V, even at the common-mode
voltage range extremes. Additionally, these devices utilize a
foldback circuit which reduces the short-circuit current and thus
the power dissipation, whenever the contending voltage exceeds
either VCC or GND.
TABLE 2. VIH AND VIL vs VL FOR VCC = 3.3V OR 5V
VL (V) VIH (V) VIL (V)
1.35 0.7 0.4
1.5 0.8 0.5
1.8 0.9 0.7
2.3 1.1 1.0
2.7 1.3 1.1
3.3 1.5 1.4
5.0 (i.e., VCC)2.7 2.3
ISL3293E, ISL3294E, ISL3295E ISL3296E, ISL3297E, ISL3298E
FN6544 Rev 3.00 Page 11 of 17
September 25, 2015
In the event of a major short-circuit condition, devices also include
a thermal shutdown feature that disables the drivers whenever the
die temperature becomes excessive. This eliminates the power
dissipation, allowing the die to cool. The drivers automatically
reenable after the die temperature drops about +20°C. If the
contention persists, the thermal shutdown/reenable cycle repeats
until the fault is cleared.
At VCC > 3.6V, the instantaneous short-circuit current is high
enough that output stage damage may occur during short-circuit
conditions to voltages outside of GND to VCC, before the
short-circuit limiting and thermal shutdown activate. For
VCC = 5V operation, if output short-circuits are a possibility
(e.g., due to bus contention), it is recommended that a 5Ω
resistor be inserted in series with each output. This resistor limits
the instantaneous current below levels that can cause damage.
The driver VOD at VCC = 5V is so large that this small added
resistance has little impact.
High Temperature Operation
Due to power dissipation and instantaneous output short-circuit
current levels at VCC = 5V, these transmitters may not be
operated at +125°C with VCC > 3.6V.
At VCC = 3.6V, even the SOT-23 versions may be operated at
+125°C, while driving a 100’, double terminated, CAT 5 cable at
20Mbps, without triggering the thermal SHDN circuit.
Low Power Shutdown Mode
These BiCMOS transmitters all use a fraction of the power
required by their bipolar counterparts, but they also include a
shutdown feature that reduces the already low quiescent ICC to a
1µA trickle. These devices enter shutdown whenever the driver
disables (DE = GND).
Typical Performance Curves VCC = VL = 3.3V, TA = +25°C, unless otherwise specified.
FIGURE 9. DRIVER OUTPUT CURRENT vs DIFFERENTIAL OUTPUT
VOLTAGE
FIGURE 10. DRIVER DIFFERENTIAL OUTPUT VOLTAGE vs
TEMPERATURE
FIGURE 11. SUPPLY CURRENT vs TEMPERATURE FIGURE 12. VL SUPPLY CURRENT vs LOGIC PIN VOLTAGE
DIFFERENTIAL OUTPUT VOLTAGE (V)
DRIVER OUTPUT CURRENT (mA)
0 0.5 1.0 1.5 2.0 2.5 3.0 3.5
0
10
20
30
40
50
60
70
80
90
100
110
+25°C
+8C
+125°C
+25°C
1.5
1.6
1.7
1.8
1.9
2.0
2.1
2.2
2.3
2.4
-40 10 60 110
TEMPERATURE (°C)
DIFFERENTIAL OUTPUT VOLTAGE (V)
-15 35 85
RDIFF = 54Ω
RDIFF = 100Ω
125
TEMPERATURE (°C)
ICC (µA)
-40 10 60 110
-15 35 85 125
DE = VCC = VL
0
10
20
30
40
50
60
70
80
90
100
024
DI VOLTAGE (V)
IL (µA)
135677.5
VL = 3.3V
0
5
10
15
20
25
30
35
40
V
CC
= 3.3V
VL ≤ 2V
VL = 2.5V
ISL3293E, ISL3294E, ISL3295E ISL3296E, ISL3297E, ISL3298E
FN6544 Rev 3.00 Page 12 of 17
September 25, 2015
FIGURE 13. DRIVER DIFFERENTIAL PROPAGATION DELAY vs
TEMPERATURE (ISL3293E, ISL3296E)
FIGURE 14. DRIVER SKEW vs TEMPERATURE (ISL3293E,
ISL3296E)
FIGURE 15. DRIVER DIFFERENTIAL PROPAGATION DELAY vs
TEMPERATURE (ISL3294E, ISL3297E)
FIGURE 16. DRIVER SKEW vs TEMPERATURE (ISL3294E,
ISL3297E)
FIGURE 17. DRIVER DIFFERENTIAL PROPAGATION DELAY vs
TEMPERATURE (ISL3295E, ISL3298E)
FIGURE 18. DRIVER DIFFERENTIAL SKEW vs TEMPERATURE
(ISL3295E, ISL3298E)
Typical Performance Curves VCC = VL = 3.3V, TA = +25°C, unless otherwise specified. (Continued)
TEMPERATURE (°C)
PROPAGATION DELAY (ns)
-40 10 60 110
-15 35 85 125
tDDHL
1050
1075
1100
1125
1150
1175
1200
1225
1250
tDDLH
VL = 1.35V TO VCC
TEMPERATURE (°C)
SKEW (ns)
-40 10 60 110-15 35 85 125
tDSK
tSSK
0
100
200
300
400
500
600
700
VL = 1.35V TO VCC
TEMPERATURE (°C)
PROPAGATION DELAY (ns)
-40 10 60 110-15 35 85 125
tDDLH
tDDHL
330
340
350
360
370
380
390
VL = 1.35V TO VCC
TEMPERATURE (°C)
SKEW (ns)
-40 10 60 110-15 35 85 125
tDSK
tSSK
0
10
20
30
40
50
60
VL = 1.35V TO VCC
TEMPERATURE (°C)
PROPAGATION DELAY (ns)
-40 10 60 110-15 35 85 125
20
25
30
35
40
45
50
VL = 1.35V, tDDLH
VL = 1.35V, tDDHL
VL = 1.8V, tDDLH, tDDHL
VL = VCC, tDDLH, tDDHL
VL = 1.5V, tDDLH, tDDHL
TEMPERATURE (°C)
SKEW (ns)
-40 10 60 110-15 35 85 125
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
VL = 1.35V
VL = 1.5V
VL ≥ 1.8V
ISL3293E, ISL3294E, ISL3295E ISL3296E, ISL3297E, ISL3298E
FN6544 Rev 3.00 Page 13 of 17
September 25, 2015
FIGURE 19. DRIVER SINGLE-ENDED SKEW vs TEMPERATURE
(ISL3295E, ISL3298E)
FIGURE 20. DRIVER OUTPUT CURRENT vs SHORT-CIRCUIT
VOLTAGE
FIGURE 21. DRIVER WAVEFORMS, LOW-TO-HIGH
(ISL3293E, ISL3296E)
FIGURE 22. DRIVER WAVEFORMS, HIGH-TO-LOW
(ISL3293E, ISL3296E)
FIGURE 23. DRIVER WAVEFORMS, LOW-TO-HIGH
(ISL3294E, ISL3297E)
FIGURE 24. DRIVER WAVEFORMS, HIGH-TO-LOW
(ISL3294E, ISL3297E)
Typical Performance Curves VCC = VL = 3.3V, TA = +25°C, unless otherwise specified. (Continued)
TEMPERATURE (°C)
SKEW (ns)
-40 10 60 110-15 35 85 125
0
1
2
3
4
5
6
VL = 1.35V
VL = 1.5V
VL 1.8V
OUTPUT VOLTAGE (V)
-7 -6 -4 -2 0 2 4 6 8 10 12
OUTPUT CURRENT (mA)
-50
0
50
100
150
200
-100
-150
Y OR Z = HIGH
Y OR Z = LOW
ISL329xE
OTHER ISL329xE
ISL3295E/ISL3298E
TIME (400ns/DIV)
DRIVER OUTPUT (V)
RDIFF = 54Ω, CD = 50pF
1.5
3.0
DRIVER OUTPUT (V)
0
3
DRIVER INPUT (V)
DI
Z
Y
0
-3
-2
-1
0
1
2
3
Y - Z
TIME (400ns/DIV)
DRIVER OUTPUT (V)
RDIFF = 54Ω, CD = 50pF
1.5
3.0
DRIVER OUTPUT (V)
0
3
DRIVER INPUT (V)
DI
Y
Z
0
-3
-2
-1
0
1
2
3
Y - Z
TIME (200ns/DIV)
DRIVER OUTPUT (V)
RDIFF = 54Ω, CD = 50pF
1.5
3.0
DRIVER OUTPUT (V)
0
3
DRIVER INPUT (V)
DI
Z
Y
0
-3
-2
-1
0
1
2
3
Y - Z
TIME (200ns/DIV)
DRIVER OUTPUT (V)
RDIFF = 54Ω, CD = 50pF
1.5
3.0
DRIVER OUTPUT (V)
0
3
DRIVER INPUT (V)
DI
Y
Z
0
-3
-2
-1
0
1
2
3
Y - Z
ISL3293E, ISL3294E, ISL3295E ISL3296E, ISL3297E, ISL3298E
FN6544 Rev 3.00 Page 14 of 17
September 25, 2015
FIGURE 25. DRIVER WAVEFORMS, LOW-TO-HIGH
(ISL3295E, ISL3298E)
FIGURE 26. DRIVER WAVEFORMS, HIGH-TO-LOW
(ISL3295E, ISL3298E)
FIGURE 27. DRIVER WAVEFORMS, LOW-TO-HIGH
(ISL3295E, ISL3298E)
FIGURE 28. DRIVER WAVEFORMS, HIGH-TO-LOW
(ISL3295E, ISL3298E)
Die Characteristics
SUBSTRATE AND TDFN THERMAL PAD POTENTIAL
(POWERED UP):
GND
TRANSISTOR COUNT:
516
PROCESS:
Si Gate BiCMOS
Typical Performance Curves VCC = VL = 3.3V, TA = +25°C, unless otherwise specified. (Continued)
TIME (10ns/DIV)
DRIVER OUTPUT (V)
RDIFF = 54Ω, CD = 50pF
1.5
3.0
DRIVER OUTPUT (V)
0
3
DRIVER INPUT (V)
DI
Z
Y
0
-3
-2
-1
0
1
2
3
Y - Z
TIME (10ns/DIV)
DRIVER OUTPUT (V)
RDIFF = 54Ω, CD = 50pF
1.5
3.0
DRIVER OUTPUT (V)
0
3
DRIVER INPUT (V)
DI
Y
Z
0
-3
-2
-1
0
1
2
3
Y - Z
TIME (10ns/DIV)
DRIVER OUTPUT (V)
RDIFF = 54Ω CD = 50pF
1.5
3.0
DRIVER OUTPUT (V)
0
3
DRIVER INPUT (V)
DI
Z
Y
0
-3
-2
-1
0
1
2
3
Y - Z
VL = 1.35V
TIME (10ns/DIV)
DRIVER OUTPUT (V)
RDIFF = 54Ω, CD = 50pF
1.5
3.0
DRIVER OUTPUT (V)
0
3
DRIVER INPUT (V)
DI
Y
Z
0
-3
-2
-1
0
1
2
3
Y - Z
VL = 1.35V
FN6544 Rev 3.00 Page 15 of 17
September 25, 2015
ISL3293E, ISL3294E, ISL3295E ISL3296E, ISL3297E, ISL3298E
Intersil products are manufactured, assembled and tested utilizing ISO9001 quality systems as noted
in the quality certifications found at www.intersil.com/en/support/qualandreliability.html
Intersil products are sold by description only. Intersil may modify the circuit design and/or specifications of products at any time without notice, provided that such
modification does not, in Intersil's sole judgment, affect the form, fit or function of the product. Accordingly, the reader is cautioned to verify that datasheets are
current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its
subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or
otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
For additional products, see www.intersil.com/en/products.html
© Copyright Intersil Americas LLC 2007-2015. All Rights Reserved.
All trademarks and registered trademarks are the property of their respective owners.
About Intersil
Intersil Corporation is a leading provider of innovative power management and precision analog solutions. The company's products
address some of the largest markets within the industrial and infrastructure, mobile computing and high-end consumer markets.
For the most updated datasheet, application notes, related documentation and related parts, please see the respective product
information page found at www.intersil.com.
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Reliability reports are also available from our website at www.intersil.com/support
Revision History
The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to the web to make sure that
you have the latest revision.
DATE REVISION CHANGE
September 25, 2015 FN6544.3 On page 1, table 1, for ISL3293E entry, added "Recommended replacement: ISL32613E" after "No longer
available or supported". For ISL3294E entry, added "Recommended replacement: ISL32614E" after "No
longer available or supported".
On page 3, "Ordering Information" table, for ISL3293E entries (rows 1 and 2), added "Recommended
replacement: ISL32613E" after "No longer available or supported". For ISL3294E entries (rows 3 and 4),
added "Recommended replacement: ISL32614E" after "No longer available or supported".
July 27, 2015 FN6544.2 Table 1 Summary of Features on page 1, added “No longer available or supported” to ISL3293E, ISL3294E,
ISL3296E, ISL3297E.
Ordering Information table on page 3, added “No longer available or supported” to the following parts:
ISL3293E and ISL3294E (1st 4 rows) and to ISL3296E and ISL3297E (rows 7-10).
Electrical Spec table, added “(Parts no longer available or supported)” to DRIVER SWITCHING
CHARACTERISTICS sections on page 6 (for parts ISL3293E, ISL3296E and ISL3294E, ISL3297E).
POD on page 16, updated from ref 1 to rev 2. Changes since rev 1:
Tiebar Note updated
From: Tiebar shown (if present) is a non-functional feature.
To: Tiebar shown (if present) is a non-functional feature and may be located on any of the 4 sides (or ends).
December 11, 2014 FN6544.1 Updated entire datasheet to Intersil new standard.
Added text in several places to clarify that VL can be connected to Vcc.
Updated PODs P6.064 and L8.2x3A to latest revisions with changes as follows:
Updated to new POD format by removing table listing dimensions and moving dimensions onto drawing.
Added Typical Recommended Land Pattern.
September 19, 2007 FN6544.0 Initial Release.
ISL3293E, ISL3294E, ISL3295E ISL3296E, ISL3297E, ISL3298E
FN6544 Rev 3.00 Page 16 of 17
September 25, 2015
Package Outline Drawing
P6.064
6 LEAD SMALL OUTLINE TRANSISTOR PLASTIC PACKAGE
Rev 4, 2/10
Dimension is exclusive of mold flash, protrusions or gate burrs.
Package conforms to JEDEC MO-178AB.
Foot length is measured at reference to guage plane.
Dimensions in ( ) for Reference Only.
Dimensioning and tolerancing conform to ASME Y14.5M-1994.
5.
3.
4.
2.
Dimensions are in millimeters.1.
NOTES:
DETAIL "X"
SIDE VIEW
TYPICAL RECOMMENDED LAND PATTERN
TOP VIEW
END VIEW
INDEX AREA
PIN 1
SEATING PLANE
GAUGE
0.45±0.1
(2 PLCS)
10° TYP
4
1.90
0.40 ±0.10
2.90 ±0.10
0.95
1.60 +0.15/-0.10
2.80
0.00-0.15
1.15 +0.15/-0.25
0.20 CA-B DM
(1.20)
(0.60)
(0.95)
(2.40)
0.10 C
0.08-0.22
SEE DETAIL X
(0.25)
1.45 MAX
(0.60)
0-8°
C
B
A
D
3
3
3
3
0.20 C
2x
123
654
PLANE
ISL3293E, ISL3294E, ISL3295E ISL3296E, ISL3297E, ISL3298E
FN6544 Rev 3.00 Page 17 of 17
September 25, 2015
Package Outline Drawing
L8.2x3A
8 LEAD THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE WITH E-PAD
Rev 2, 05/15
located within the zone indicated. The pin #1 indentifier may be
Unless otherwise specified, tolerance : Decimal ± 0.05
Tiebar shown (if present) is a non-functional feature and may
The configuration of the pin #1 identifier is optional, but must be
between 0.20mm and 0.32mm from the terminal tip.
Dimension b applies to the metallized terminal and is measured
Dimensions in ( ) for Reference Only.
Dimensioning and tolerancing conform to ASME Y14.5m-1994.
6.
either a mold or mark feature.
3.
5.
4.
2.
Dimensions are in millimeters.1.
NOTES:
BOTTOM VIEW
DETAIL "X"
SIDE VIEW
TYPICAL RECOMMENDED LAND PATTERN
TOP VIEW
(4X) 0.15
INDEX AREA
PIN 1
PIN #1 INDEX AREA
C
SEATING PLANE
BASE PLANE
0.08
SEE DETAIL "X"
C
C
5
6
6
A
B
0.75
0.05
0.05
0.20 REF
PACKAGE
2.00
3.00
1.80 +0.1/ -0.15
1.65 +
0.1/ -0.15
0.50
0.25
2.20
1.65
1.80
(8x0.25)
3.00
2.00
(8x0.20)
(8x0.40)
(8x0.40)
(6x0.50)
OUTLINE
be located on any of the 4 sides (or ends).

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IC DRIVER 1/0 SOT23-6
入手可能な数量0
単価0
IC DRIVER 1/0 SOT23-6
入手可能な数量0
単価0
IC DRIVER 1/0 8TDFN
入手可能な数量0
単価0
IC DRIVER 1/0 SOT23-6
入手可能な数量0
単価0
IC DRIVER 1/0 8TDFN
入手可能な数量0
単価0
IC DRIVER 1/0 8TDFN
入手可能な数量0
単価0
IC DRIVER 1/0 8TDFN
入手可能な数量0
単価0
IC DRIVER 1/0 SOT23-6
入手可能な数量0
単価0