AP2161,71 Datasheet

Diodes Incorporated

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Datasheet

AP2161/ AP2171
Document number: DS31564 Rev. 9 - 2
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August 2015
© Diodes Incorporated
AP2161/ AP2171
1A SINGLE CHANNEL CURRENT-LIMITED POWER SWITCH
Description
The AP2161 and AP2171 are integrated high-side power switches
optimized for Universal Serial Bus (USB) and other hot-swap
applications. The family of devices complies with USB 2.0 and is
available with both polarities of Enable input. They offer current and
thermal limiting and short-circuit protection as well as controlled rise
time and undervoltage lockout functionality. A 7ms deglitch capability
on the open-drain Flag output prevents false overcurrent reporting
and does not require any external components.
All devices are available in SO-8, MSOP-8EP, SOT25, and
U-DFN2018-6 packages
Features
Single USB Port Power Switches
Overcurrent and Thermal Protection
1.5A Accurate Current Limiting
Reverse Current Blocking
95mΩ On-Resistance
Input Voltage Range: 2.7V 5.5V
0.6ms Typical Rise Time
Very Low Shutdown Current: 1µA (max)
Fault Report (FLG) with Blanking Time (7ms typ)
ESD Protection: 4kV HBM, 300V MM
Active Low (AP2161) or Active High (AP2171) Enable
Ambient Temperature Range: -40°C to +85°C
SOT25, SO-8, MSOP-8EP (Exposed Pad), and U-DFN2018-6:
Available in Green Molding Compound (No Br, Sb)
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green Device (Note 3)
UL Recognized, File Number E322375
IEC60950-1 CB Scheme Certified
Applications
Consumer Electronics LCD TVs & Monitors, Game Machines
Communications Set-Top-Boxes, GPS, Smartphones
Computing Laptops, Desktops, Servers, Printers, Docking
Station, HUB
Pin Assignments
SO-8
( Top View )
1
2
3
4
8
7
6
5
NC
OUT
FLG
OUT
GND
EN
IN
IN
MSOP-8EP
1
2
3
4
8
7
6
5
NC
OUT
FLG
OUT
GND
EN
IN
IN
( Top View )
FLGEN
GND
OUT
OUT
IN
1
3
2
4
5
6
U-DFN2018-6
( Top View )
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
AP2161/ AP2171
Document number: DS31564 Rev. 9 - 2
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AP2161/ AP2171
Typical Applications Circuit
0.1uF
IN
GND
EN
OUT
ON
120uF
Power Supply
2.7V to 5.5V
0.1uF
OFF
FLG
Load
10k10uF
AP2171 Enable Active High
Available Options
Part Number
Channel
Enable Pin (EN)
Current Limit
(typ)
Recommended Maximum Continuous
Load Current
AP2161
1
Active Low
1.5A
1.0A
AP2171
1
Active High
1.5A
1.0A
Pin Descriptions
Pin
Name
Pin Number
Function
SO-8
MSOP-8EP
SOT25
U-DFN2018-6
GND
1
1
2
1
Ground
IN
2, 3
2, 3
5
2
Voltage input pin (all IN pins must be tied together externally)
EN
4
4
4
3
Enable input, active low (AP2161) or active high (AP2171)
FLG
5
5
3
4
Overcurrent and over-temperature fault report; open-drain flag is active low when
triggered
OUT
6, 7
6, 7
1
5, 6
Voltage output pin (all OUT pins must be tied together externally)
NC
8
8
N/A
N/A
No internal connection; recommend tie to OUT pins
Exposed tab
-
Exposed tab
-
Exposed tab
Exposed pad.
It should be connected to GND and thermal mass for enhanced thermal
impedance. It should not be used as electrical ground conduction path.
AP2161/ AP2171
Document number: DS31564 Rev. 9 - 2
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August 2015
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AP2161/ AP2171
Functional Block Diagram
AP2161, AP2171
Thermal
Sense
Driver FLG
OUT
GND
IN
EN
UVLO
Current
Limit
Current
Sense
Deglitch
Absolute Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Symbol
Parameter
Ratings
Units
ESD HBM
Human Body Model ESD Protection
4
kV
ESD MM
Machine Model ESD Protection
for MSOP-8EP, SOT25 packages
400
V
Machine Model ESD Protection
for U-DFN2018-6, SO-8 packages
300
V
VIN
Input Voltage
6.5
V
VOUT
Output Voltage
VIN +0.3
V
VEN , VFLG
Enable Voltage
6.5
V
ILOAD
Maximum Continuous Load Current
Internal Limited
A
TJ(MAX)
Maximum Junction Temperature
+150
°C
TST
Storage Temperature Range (Note 4)
-65 to +150
°C
Caution: Stresses greater than the 'Absolute Maximum Ratings' specified above may cause permanent damage to the device. These are stress ratings only;
functional operation of the device at these or any other conditions exceeding those indicated in this specification is not implied. Device reliability may be
affected by exposure to absolute maximum rating conditions for extended periods of time.
Semiconductor devices are ESD sensitive and may be damaged by exposure to ESD events. Suitable ESD precautions should be taken when handling
and transporting these devices
Note: 4. UL Recognized Rating from -30°C to +70°C (Diodes qualified TST from -65°C to +150°C).
Recommended Operating Conditions (@TA = +25°C, unless otherwise specified.)
Symbol
Parameter
Min
Max
Units
VIN
Input Voltage
2.7
5.5
V
IOUT
Output Current
0
1.0
A
TA
Operating Ambient Temperature
-40
+85
°C
VIH
High-Level Input Voltage on EN or
EN
2.0
VIN
V
VIL
Low-Level Input Voltage on EN or
EN
0
0.8
V
AP2161/ AP2171
Document number: DS31564 Rev. 9 - 2
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AP2161/ AP2171
Electrical Characteristics (@TA = +25°C, VIN = +5V, unless otherwise specified.)
Symbol
Parameter
Test Conditions
Min
Typ
Max
Unit
VUVLO
Input UVLO
RLOAD = 1kΩ
1.6
1.9
2.5
V
ISHDN
Input Shutdown Current
Disabled, IOUT = 0
-
0.5
1
uA
IQ
Input Quiescent Current
Enabled, IOUT = 0
-
45
70
µA
ILEAK
Input Leakage Current
Disabled, OUT grounded
-
-
1
µA
IREV
Reverse Leakage Current
Disabled, VIN = 0V, VOUT = 5V, IREV at VIN
-
1
-
µA
RDS(ON)
Switch on-resistance
VIN = 5V,
IOUT = 1A
TA = +25°C
SOT25, MSOP-8EP, SO-8
-
95
115
U-DFN2018-6
-
90
110
-40°C TA ≤ +85°C
-
-
140
VIN = 3.3V,
IOUT = 1A
TA = +25°C
-
120
140
-40°C TA ≤ +85°C
-
-
170
ISHORT
Short-Circuit Current Limit
Enabled into short circuit, CL = 68µF
-
1.2
-
A
ILIMIT
Over-Load Current Limit
VIN = 5V, VOUT = 4.6V, CL = 68µF, -40°C TA ≤ +85°C
1.1
1.5
1.9
A
ITrig
Current limiting trigger threshold
Output Current Slew rate (<100A/s) , CL=68µF
-
2.0
-
A
ISINK
EN Input leakage
VEN = 5V
-
-
1
µA
tD(ON)
Output turn-on delay time
CL = 1µF, RLOAD = 10Ω
-
0.05
-
ms
tR
Output turn-on rise time
CL = 1µF, RLOAD = 10Ω
-
0.6
1.5
ms
tD(OFF)
Output turn-off delay time
CL = 1µF, RLOAD = 10Ω
-
0.01
-
ms
tF
Output turn-off fall time
CL = 1µF, RLOAD = 10Ω
-
0.05
0.1
ms
RFLG
FLG output FET on-resistance
IFLG = 10mA
-
20
40
Ω
tBlank
FLG blanking time
CIN = 10µF, CL = 68µF
4
7
15
ms
TSHDN
Thermal Shutdown Threshold
Enabled, RLOAD = 1kΩ
-
140
-
C
THYS
Thermal Shutdown Hysteresis
-
-
25
-
C
θJA
Thermal Resistance Junction-to-
Ambient
SO-8 (Note 5)
-
110
-
°C/W
MSOP-8EP (Note 6)
-
60
-
°C/W
SOT25 (Note 7)
-
157
-
°C/W
U-DFN2018-6 (Note 8)
-
70
-
°C/W
Notes: 5. Test condition for SO-8: Device mounted on FR-4, 2oz copper, with minimum recommended pad layout.
6. Test condition for MSOP-8EP: Device mounted on 2 x 2 FR-4 substrate PC board, 2oz copper, with minimum recommended pad on top layer and
thermal vias to bottom layer ground plane.
7. Test condition for SOT25: Device mounted on FR-4, 2oz copper, with minimum recommended pad layout.
8. Test condition for U-DFN2018-6: Device mounted on FR-4 2-layer board, 2oz copper, with minimum recommended pad on top layer and 3 vias to bottom
layer 1.0” x 1.4” ground plane.
AP2161/ AP2171
Document number: DS31564 Rev. 9 - 2
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AP2161/ AP2171
Typical Performance Characteristics
VEN
90%
VOUT
TD(ON)
10%
TD(OFF)
50%50%
TR
10%
90%
TF
VEN
90%
VOUT
TD(ON)
10%
TD(OFF)
50%50%
TR
10%
90%
TF
Figure 1 Voltage Waveforms: AP2161 (left), AP2171 (right)
All Enable Plots are for AP2171 Active High
Turn-On Delay and Rise Time
500µs/div
Turn-Off Delay and Fall Time
500µs/div
Turn-On Delay and Rise Time
500µs/div
Turn-Off Delay and Fall Time
500µs/div
Vout
2V/div
Ven
5V/div
CL = 1µF
TA = +25°C
RL = 10Ω
Vout
2V/div
Ven
5V/div
CL = 1µF
TA = +25°C
RL = 10Ω
Vout
2V/div
Ven
5V/div
CL = 100µF
TA = +25°C
RL = 10Ω
Vout
2V/div
Ven
5V/div
CL = 100µF
TA = +25°C
RL = 10Ω
AP2161/ AP2171
Document number: DS31564 Rev. 9 - 2
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AP2161/ AP2171
Typical Performance Characteristics (continued)
Short Circuit Current,
Device Enabled Into Short
500µs/div
Inrush Current
1ms/div
1 Ω Load Connected to Enabled Device
2ms/div
2Ω Load Connected to Enabled Device
2ms/div
Short Circuit with Blanking Time and Recovery
20ms/div
Power On
1ms/div
Iout
500mA/div
Ven
5V/div
Iout
1A/div
Vflag
2V/div
VIN = 5V
TA = +25°C
CL = 68µF
VIN = 5V
TA = +25°C
CL = 68µF
Iout
1A/div
Vflag
2V/div
VIN = 5V
TA = +25°C
CL= 68µF
Iout
1A/div
Vout
5V/div
Vin
5V/div
Vflag
5V/div
TA = +25°C
CL = 68µF
RL = 5
VIN = 5V
TA = +25°C
CL = 68µF
Vflag
5V/div
Iout
500mA/di
v
Ven
5V/div
Iout
200mA/div
Ven
5V/div
VIN = 5V
TA = +25°C
RL = 5
CL=470µF
CL=220µF
CL=100µF
AP2161/ AP2171
Document number: DS31564 Rev. 9 - 2
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AP2161/ AP2171
Typical Performance Characteristics (cont.)
UVLO Increasing
1ms/div
UVLO Decreasing
10ms/div
Turn-On Time vs Input Voltage
250
300
350
400
450
500
550
600
650
700
750
1.5 2 2.5 3 3.5 4 4.5 5 5.5 6
Input Voltage (V)
Turn-On Time (us)
Turn-Off Time vs Input Voltage
25
26
26
27
27
28
28
29
29
30
1.5 2 2.5 3 3.5 4 4.5 5 5.5 6
Input Voltage (V)
Turn-Off Time (us)
Rise Time vs Input Voltage
250
300
350
400
450
500
550
600
650
2 2.5 3 3.5 4 4.5 5 5.5 6
Input Voltage (V)
Rise Time (us)
Fall Time vs Input Voltage
19
20
20
21
21
22
22
2 2.5 3 3.5 4 4.5 5 5.5 6
Input Voltage (V)
Fall Time (us)
CL = 1µF
RL = 10Ω
TA = +25°C
CL = 1µF
RL = 10Ω
TA = +25°C
CL = 1µF
RL = 10Ω
TA = +25°C
CL = 1µF
RL = 10Ω
TA = +25°C
Iout
500mA/div
Vin
2V/div
Vin
2V/div
Iout
500mA/div
TA = +25°C
CL = 68µF
RL = 5
TA = +25°C
CL = 68µF
RL = 5
AP2161/ AP2171
Document number: DS31564 Rev. 9 - 2
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AP2161/ AP2171
Typical Performance Characteristics (cont.)
Supply Current, Output Enabled vs Ambient Temperature
28
33
38
43
48
53
58
63
68
-60 -40 -20 0 20 40 60 80 100
Ambient Temperature (°C)
Supply Current, Output Enabled (uA)
Supply Current, Output Disabled vs Ambient Temperature
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
-60 -40 -20 0 20 40 60 80 100
Ambient Temperature (°C)
Supply Current, Output Disabled (uA)
Static Drain-Source On-State Resistance vs Ambient
Temperature
80
90
100
110
120
130
140
150
160
170
-60 -40 -20 0 20 40 60 80 100
Ambient Temperature (°C)
Static Drain-Source On-State
Resistance (mΩ)
Short-Circuit Output Current vs Ambient Temperature
1.45
1.46
1.47
1.48
1.49
1.50
1.51
1.52
1.53
1.54
1.55
1.56
-60 -40 -20 0 20 40 60 80 100
Ambient Temperature (°C)
Short-Circuit Output Current (A)
Undervoltage Lockout vs Ambient Temperature
1.60
1.70
1.80
1.90
2.00
2.10
2.20
-60 -40 -20 0 20 40 60 80 100
Ambient Temperature (°C)
Undervoltage Lockout (V)
Threshold Trip Current vs Input Voltage
1.88
1.89
1.90
1.91
1.92
1.93
1.94
1.95
1.96
1.97
1.98
1.99
2.8 3.3 3.8 4.3 4.8 5.3
Input Voltage (V)
Threshold Trip Current (A)
UVLO Falling
UVLO Rising
Vin=2.7V
Vin=3.3V
Vin=5V
Vin=2.7V
Vin=3.3V
Vin=5.0V
Vin=5.5V
TA = +25°C
CL = 68µF
CL=100µF
Vin=2.7V
Vin=5.0V
Vin=3.3V
Vin=5.5V
Vin=5.0V
Vin=5.5V
Vin=3.3V
Vin=2.7V
AP2161/ AP2171
Document number: DS31564 Rev. 9 - 2
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AP2161/ AP2171
Typical Performance Characteristics (cont.)
Current Limit Response vs Peak Current
0
20
40
60
80
100
120
0246810 12
Peak Current (A)
Current Limit Response (us)
VIN = 5V
TA = +25°C
CL=68uF
AP2161/ AP2171
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AP2161/ AP2171
Application Information
Power Supply Considerations
A 0.01-μF to 0.1-μF X7R or X5R ceramic bypass capacitor between IN and GND, close to the device, is recommended. Placing a high-value
electrolytic capacitor on the input (10-μF minimum) and output pin(s) is recommended when the output load is heavy. This precaution reduces
power-supply transients that may cause ringing on the input. Additionally, bypassing the output with a 0.01-μF to 0.1-μF ceramic capacitor improves
the immunity of the device to short-circuit transients.
Overcurrent and Short Circuit Protection
An internal sensing FET is employed to check for overcurrent conditions. Unlike current-sense resistors, sense FETs do not increase the series
resistance of the current path. When an overcurrent condition is detected, the device maintains a constant output current and reduces the output
voltage accordingly. Complete shutdown occurs only if the fault stays long enough to activate thermal limiting.
Three possible overload conditions can occur. In the first condition, the output has been shorted to GND before the device is enabled or before VIN
has been applied. The AP2161/AP2171 senses the short circuit and immediately clamps output current to a certain safe level namely ILIMIT.
In the second condition, an output short or an overload occurs while the device is enabled. At the instance the overload occurs, higher current may
flow for a very short period of time before the current limit function can react. After the current limit function has tripped (reached the overcurrent trip
threshold), the device switches into current limiting mode and the current is clamped at ILIMIT.
In the third condition, the load has been gradually increased beyond the recommended operating current. The current is permitted to rise until the
current-limit threshold (ITRIG) is reached or until the thermal limit of the device is exceeded. The AP2161/AP2171 is capable of delivering current up
to the current-limit threshold without damaging the device. Once the threshold has been reached, the device switches into its current limiting mode
and is set at ILIMIT.
Note that when the output has been shorted to GND at an extremely low temperature (< -30°C), a minimum 120-μF electrolytic capacitor on the
output pin is recommended. A correct capacitor type with capacitor voltage rating and temperature characteristics must be properly chosen so that
capacitance value does not drop too low at the extremely low temperature operation. A recommended capacitor should have temperature
characteristics of less than 10% variation of capacitance change when operated at extremely low temp. Our recommended aluminum electrolytic
capacitor type is Panasonic FC series.
FLG Response
When an overcurrent or over-temperature shutdown condition is encountered, the FLG open-drain output goes active low after a nominal 7-ms
deglitch timeout. The FLG output remains low until both overcurrent and over-temperature conditions are removed. Connecting a heavy capacitive
load to the output of the device can cause a momentary overcurrent condition, which does not trigger the FLG due to the 7-ms deglitch timeout.
The AP2161/AP2171 is designed to eliminate false overcurrent reporting without the need of external components to remove unwanted pulses.
Power Dissipation and Junction Temperature
The low on-resistance of the internal MOSFET allows the small surface-mount packages to pass large current. Using the maximum operating
ambient temperature (TA) and RDS(ON), the power dissipation can be calculated by:
PD = RDS(ON)× I2
Finally, calculate the junction temperature:
TJ = PD x RθJA + TA
Where:
TA = Ambient temperature °C
RθJA = Thermal resistance
PD = Total power dissipation
Thermal Protection
Thermal protection prevents the IC from damage when heavy-overload or short-circuit faults are present for extended periods of time. The
AP2161/AP2171 implements a thermal sensing to monitor the operating junction temperature of the power distribution switch. Once the die
temperature rises to approximately +145°C due to excessive power dissipation in an overcurrent or short-circuit condition, the internal thermal
sense circuitry turns the power switch off, thus preventing the power switch from damage. Hysteresis is built into the thermal sense circuit allowing
the device to cool down approximately +25°C before the switch turns back on. The switch continues to cycle in this manner until the load fault or
input power is removed. The FLG open-drain output is asserted when an over-temperature shutdown or overcurrent occurs with 7-ms deglitch.
AP2161/ AP2171
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AP2161/ AP2171
Application Information (continued)
Undervoltage Lockout (UVLO)
Undervoltage lockout function (UVLO) keeps the internal power switch from being turned on until the power supply has reached at least 1.9V, even
if the switch is enabled. Whenever the input voltage falls below approximately 1.9V, the power switch is quickly turned off. This facilitates the design
of hot-insertion systems where it is not possible to turn off the power switch before input power is removed.
Host/Self-Powered And Bus-Powered HUBs
Hosts and self-powered hubs have a local power supply that powers the embedded functions and the downstream ports (see Figure 2). This power
supply must provide from 5.25V to 4.75V to the board side of the downstream connection under full-load and no-load conditions. Hosts and SPHs
are required to have current-limit protection and must report over-current conditions to the USB controller. Typical SPHs are desktop PCs, monitors,
printers, and stand-alone hubs.
IN OUT
FLG
EN GND
1
2,3 6,7
4
50.1uF 120uF
0.1uF
USB Control
5V3.3V
GND
D +
D -
Power Supply Downstream
USB Ports
AP2161
VBUS
Figure 2 Typical One-Port USB Host / Self-Powered Hub
Generic Hot-Plug Applications
In many applications it may be necessary to remove modules or pc boards while the main unit is still operating. These are considered hot-plug
applications. Such implementations require the control of current surges seen by the main power supply and the card being inserted. The most
effective way to control these surges is to limit and slowly ramp the current and voltage being applied to the card, similar to the way in which a
power supply normally turns on. Due to the controlled rise and fall times of the AP2161/AP2171, these devices can be used to provide a softer
start-up to devices being hot-plugged into a powered system. The UVLO feature of the AP2161/AP2171 also ensures that the switch is off after the
card has been removed, and that the switch is off during the next insertion.
By placing the AP2161/AP2171 between the VCC input and the rest of the circuitry, the input power reaches these devices first after insertion. The
typical rise time of the switch is approximately 1ms, providing a slow voltage ramp at the output of the device. This implementation controls system
surge current and provides a hot-plugging mechanism for any device.
Dual-Purpose Port Applications
AP2161/AP2171 is not recommended for use in dual-purpose port applications in which a single port is used for data communication between the
host and peripheral devices while simultaneously maintaining a charge to the battery of the peripheral device. An example of such a non-
recommended application is a shared HDMI/MHL (Mobile High-definition Link) port that allows streaming video between an HDTV or set-top box
and a smartphone or tablet while maintaining a charge to the smartphone or tablet battery. If a voltage is maintained across the output of the
AP2161/AP2171 when the output is disabled and the VIN of the device is subsequently ramped up, an overstress condition to the AP2161/AP2171
may result.
AP2161/ AP2171
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AP2161/ AP2171
Ordering Information
Part Number
Package Code
Packaging
7/13” Tape and Reel
Quantity
Part Number Suffix
AP21X1WG-7
W
SOT25
3,000/Tape & Reel
-7
AP21X1SG-13
S
SO-8
2,500/Tape & Reel
-13
AP21X1MPG-13
MP
MSOP-8EP
2,500/Tape & Reel
-13
AP21X1FMG-7
FM
U-DFN2018-6
3,000/Tape & Reel
-7
Marking Information
(1) SO-8
AP21X X
( Top view )
YY WW X X
Part Number
Logo
WW : Week : 01~52; 52
YY : Year : 08, 09,10~
G : Green
X : Internal Code
8 7 6 5
123 4
6 : Active Low
7 : Active High
1 : 1 Channel
represents 52 and 53 week
(2) MSOP-8EP
AP21X X
( Top view )
Y W X E
Part Number
Logo Y : Year : 0~9
A~Z : Green
8 7 6 5
12 3 4
6 : Active Low
7 : Active High 1 : 1 Channel
a~z : 27~52 week; z represents
W : Week : A~Z : 1~26 week;
52 and 53 week
MSOP-8EP
AP2161/ AP2171
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AP2161/ AP2171
Marking Information (cont.)
(3) SOT25
1 2 3
5
7
4
XX YW X
XX : Identification code
W : Week : A~Z : 1~26 week;
X : A~Z : Green
( Top View )
Y : Year 0~9
a~z : 27~52 week; z represents
52 and 53 week
Device
Package type
Identification Code
AP2161W
SOT25
HT
AP2171W
SOT25
HU
(4) U-DFN2018-6
Y : Year : 0~9
(Top View)
X : A~Z : Green
Y W X
XX XX : Identification Code
W : Week : A~Z : 1~26 week;
a~z : 27~52 week; z represents
52 and 53 week
Device
Package type
Identification Code
AP2161FM
U-DFN2018-6
HT
AP2171FM
U-DFN2018-6
HU
AP2161/ AP2171
Document number: DS31564 Rev. 9 - 2
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© Diodes Incorporated
AP2161/ AP2171
Package Outline Dimensions (All dimensions in mm.)
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for the latest version.
(1) Package Type: SO-8
(2) Package Type: MSOP-8EP
SO-8
Dim
Min
Max
A
-
1.75
A1
0.10
0.20
A2
1.30
1.50
A3
0.15
0.25
b
0.3
0.5
D
4.85
4.95
E
5.90
6.10
E1
3.85
3.95
e
1.27 Typ
h
-
0.35
L
0.62
0.82
0
8
All Dimensions in mm
MSOP-8EP
Dim
Min
Max
Typ
A
-
1.10
-
A1
0.05
0.15
0.10
A2
0.75
0.95
0.86
A3
0.29
0.49
0.39
b
0.22
0.38
0.30
c
0.08
0.23
0.15
D
2.90
3.10
3.00
D1
1.60
2.00
1.80
E
4.70
5.10
4.90
E1
2.90
3.10
3.00
E2
1.30
1.70
1.50
E3
2.85
3.05
2.95
e
-
-
0.65
L
0.40
0.80
0.60
a
x
-
-
0.750
y
-
-
0.750
All Dimensions in mm
Gauge Plane
Seating Plane
Detail A
Detail ‘A
E
E1
h
L
D
eb
A2
A1
A
45°7°~9°
A3
0.254
1
D
A
A1
A2
E
e
y
x
Seating Plane
Gauge Plane
L
D
8Xb
See Detail C
Detail C
c
a
E1
E3
A3
E2
4X10°
4X10°
0.25
D1
AP2161/ AP2171
Document number: DS31564 Rev. 9 - 2
15 of 18
www.diodes.com
August 2015
© Diodes Incorporated
AP2161/ AP2171
Package Outline Dimensions (All dimensions in mm.)
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.
(3) Package Type: SOT25
(4) Package Type: U-DFN2018-6
SOT25
Dim
Min
Max
Typ
A
0.35
0.50
0.38
B
1.50
1.70
1.60
C
2.70
3.00
2.80
D
0.95
H
2.90
3.10
3.00
J
0.013
0.10
0.05
K
1.00
1.30
1.10
L
0.35
0.55
0.40
M
0.10
0.20
0.15
N
0.70
0.80
0.75
All Dimensions in mm
U-DFN2018-6
Dim
Min
Max
Typ
A
0.545
0.605
0.575
A1
0
0.05
0.02
A3
0.13
b
0.15
0.25
0.20
D
1.750
1.875
1.80
D2
1.30
1.50
1.40
e
0.50
E
1.95
2.075
2.00
E2
0.90
1.10
1.00
L
0.20
0.30
0.25
z
0.30
All Dimensions in mm
A
M
JL
D
B C
H
KN
SEATING PLANE
EE2
L
A
D
D2
A3
A1
eb
Pin#1 ID
z
AP2161/ AP2171
Document number: DS31564 Rev. 9 - 2
16 of 18
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August 2015
© Diodes Incorporated
AP2161/ AP2171
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
(1) Package Type: SO-8
(2) Package Type: MSOP-8EP
(3) Package Type: SOT25
Dimensions
Value (in mm)
X
0.60
Y
1.55
C1
5.4
C2
1.27
Dimensions
Value
(in mm)
C
0.650
G
0.450
X
0.450
X1
2.000
Y
1.350
Y1
1.700
Y2
5.300
Dimensions
Value (in mm)
Z
3.20
G
1.60
X
0.55
Y
0.80
C1
2.40
C2
0.95
X
C1
C2
Y
G
X C
Y
Y2 Y1
X1
X
Z
Y
C1
C2C2
G
AP2161/ AP2171
Document number: DS31564 Rev. 9 - 2
17 of 18
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August 2015
© Diodes Incorporated
AP2161/ AP2171
Suggested Pad Layout (continued)
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
(4) Package Type: U-DFN2018-6
Taping Orientation (Note 9)
For U-DFN2018-6
Note: 9. The taping orientation of the other package type can be found on our website at http://www.diodes.com/datasheets/ap02007.pdf.
Dimensions
Value (in mm)
C
0.50
G
0.20
X
0.25
X1
1.60
Y
0.35
Y1
1.20
Y
X C
X1
G
Y1
AP2161/ AP2171
Document number: DS31564 Rev. 9 - 2
18 of 18
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August 2015
© Diodes Incorporated
AP2161/ AP2171
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2015, Diodes Incorporated
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