MBR130TxG, NRVB130T1G Datasheet by ON Semiconductor

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w 0" Semioonductor®
© Semiconductor Components Industries, LLC, 2014
April, 2013 − Rev. 5 1Publication Order Number:
MBR130T1/D
MBR130, NRVB130
Surface Mount
Schottky Power Rectifier
Plastic SOD−123 Package
This device uses the Schottky Barrier principle with a large area
metal−to−silicon power diode. Ideally suited for low voltage, high
frequency rectification or as free wheeling and polarity protection
diodes in surface mount applications where compact size and weight
are critical to the system. This package also provides an easy to work
with alternative to leadless 34 package style.
Features
Guardring for Stress Protection
Low Forward Voltage
125°C Operating Junction Temperature
Epoxy Meets UL 94 V−0 @ 0.125 in
Package Designed for Optimal Automated Board Assembly
ESD Rating:
Human Body Model = 3
Machine Model = C
NRVB Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC-Q101
Qualified and PPAP Capable
These are Pb−Free Packages*
Mechanical Characteristics
Device Marking: S3
Polarity Designator: Cathode Band
Weight: 11.7 mg (approximately)
Case: Epoxy, Molded
Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
Device Package Shipping
ORDERING INFORMATION
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SOD−123
CASE 425
STYLE 1
SCHOTTKY BARRIER
RECTIFIER
1.0 AMPERES
30 VOLTS
MARKING DIAGRAM
S3 MG
G
1
S3 = Specific Device Code
M = Date Code
G= Pb−Free Package
MBR130T1G,
NRVB130T1G SOD−123
(Pb−Free)
3,000 /
Tape & Reel **
10,000 /
Tape & Reel ***
For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
(Note: Microdot may be in either location)
MBR130T3G,
NRVB130T3G SOD−123
(Pb−Free)
** 8 mm Tape, 7” Reel
*** 8 mm Tape, 13” Reel
BJL
MBR130, NRVB130
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2
MAXIMUM RATINGS
Rating Symbol Value Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
30 V
Average Rectified Forward Current
(Rated VR) TL = 65°CIF(AV) 1.0 A
Non−Repetitive Peak Surge Current
(Surge Applied at Rated Load Conditions, Halfwave, Single Phase, 60 Hz) IFSM 5.5 A
Storage Temperature Range Tstg −65 to +125 °C
Operating Junction Temperature TJ−65 to +125 °C
Voltage Rate of Change (Rated VR) dv/dt 1000 V/ms
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
THERMAL CHARACTERISTICS
Characteristic Symbol Value Unit
Thermal Resistance, Junction to Ambient (Note 1) RθJA 230 °C/W
Thermal Resistance, Junction to Lead (Note 1) RθJL 108 °C/W
1. FR−4 or FR−5 = 3.5 × 1.5 inches using a 1 inch Cu pad.
ELECTRICAL CHARACTERISTICS
Characteristic Symbol Typ Max Unit
Instantaneous Forward Voltage (Note 2)
(IF = 0.1 A, TJ = 25°C)
(IF = 0.7 A, TJ = 25°C)
(IF = 1.0 A, TJ = 25°C)
VF
0.47
0.35
0.45
V
Maximum Instantaneous Reverse Current (Note 2)
(Rated DC Voltage, TC = 25°C)
(VR = 5 V, TC = 25°C)
IR60
10
mA
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
2. Pulse Test: Pulse Width = 300 ms, Duty Cycle 2%.
Figure 5. Current Deraling, Lead, RNL
MBR130, NRVB130
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3
10
1
0.1
VF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS)
Figure 1. Maximum Forward Voltage
0.2 0.25 0.3 0.35 0.4 0.45 0.5 0.6
Figure 2. Typical Forward Voltage
TJ = 125°C
75°C 25°C
0.55 0.65
10
1
0.1
VF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS)
0.2 0.25 0.3 0.35 0.4 0.45 0.5 0.6
TJ = 125°C
75°C 25°C
0.55 0.6
5
IF, INSTANTANEOUS FORWARD
CURRENT (AMPS)
I
F
, INSTANTANEOUS FORWARD
CURRENT (AMPS)
Figure 3. Typical Reverse Current
VR, REVERSE VOLTAGE (VOLTS)
0.01
0.001
0.0001
0.00001
302520151050
Figure 4. Typical Capacitance
VR, REVERSE VOLTAGE (VOLTS)
3
5
302520151050
180
160
140
120
100
80
60
40
20
0
200
Figure 5. Current Derating, Lead, Rq
JL
= 1085C/W
TL, LEAD TEMPERATURE (°C)
1.8
1.6
1.4
1.2
1
0.8
0.6
0.4
120100806040200
Figure 6. Forward Power Dissipation
IF(AV), AVERAGE FORWARD CURRENT (AMPS)
1.
8
1.41.210.80.60.40.20
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
0.2
0
0.8
0.9
I
R
, REVERSE CURRENT (AMPS)
0.000001
0.0000001
C, CAPACITANCE (pF)
TJ = 125°C
75°C
25°C
I
F(AV)
, AVERAGE FORWARD CURRENT (AMPS)
SQUARE
WAVE
RATED
VOLTAGE
APPLIED
dc
PF(AV), AVERAGE FORWARD POWER
DISSIPATION (WATTS)
1.6
SQUARE
WAVE
dc
fl wfla 419 Semiconducmvavm J
MBR130, NRVB130
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4
PACKAGE DIMENSIONS
SOD−123
CASE 425−04
ISSUE G
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
E
b
DA
L
C
1
2
A1
DIM MIN NOM MAX
MILLIMETERS INCHES
A0.94 1.17 1.35 0.037
A1 0.00 0.05 0.10 0.000
b0.51 0.61 0.71 0.020
c
1.60
0.15
0.055D1.40 1.80
E2.54 2.69 2.84 0.100
---
3.68 0.140
L0.25
3.86
0.010
HE
0.046
0.002
0.024
0.063
0.106
0.145
0.053
0.004
0.028
0.071
0.112
0.152
MIN NOM MAX
3.56
HE
---
--- ---
0.006
--- ---
--- ---
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
STYLE 1:
PIN 1. CATHODE
2. ANODE
1.22
0.048
0.91
0.036
2.36
0.093
4.19
0.165
ǒmm
inchesǓ
SCALE 10:1
q
--- ---
q00
10 10
°°° °
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to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
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MBR130T1/D
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