SE2611T Datasheet by Skyworks Solutions Inc.

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O® X SKYWORKS'
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
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DATA SHEET
SE2611T: 2.4 GHz High Efficiency Wireless LAN/BT Front End
Applications
IEEE 802.11b DSSS WLAN
IEEE 802.11g/n OFDM WLAN
Embedded applications with Bluetooth® (Mobile)
Features
Dual mode IEEE802.11b & IEEE802.11g
Integrated PA, harmonic filter, LNA and BT port
Integrated positive slope power detector
19 dBm @ 4.0 % EVM, 802.11g, 54 Mbps
Simultaneous WLAN and Bluetooth receive mode
Direct connection to battery with 3.3 V nominal supply
Lead-free, halogen-free, ROHS compliant QFN (20-pin,
3 3 0.6 mm) package (MSL1, 260 C per JEDEC J-STD-
020)
Skyworks Green™ products are compliant with
all applicable legislation and are halogen-free.
For additional information, refer to Skyworks
Definition of Green™, document number
SQ04-0074.
Description
The SE2611T is a complete 802.11 b/g/n WLAN RF front-end
module with a Bluetooth port. The device provides all the
functionality of the power amplifier, power detector, filter, switch,
Low Noise Amplifier (LNA), 2170 MHz notch filtering and
associated matching. The SE2611T provides a complete 2.4 GHz
WLAN RF solution from the output of the transceiver to the
antennas, and from the antennas to the input of the transceiver, in
an ultra-compact form factor.
The SE2611T is designed for ease of use, with all the critical
matching and harmonic filtering integrated, also offering a simple
50 interface to the antenna.
The SE2611T includes a low noise amplifier to increase the
receive sensitivity of embedded solutions to improve range or to
overcome the insertion loss of cellular filters often included for
mobile applications. It offers simultaneous WLAN and Bluetooth
receive mode.
The SE2611T also includes a transmitter power detector with
20 dB of dynamic range and a digital enable control for
transmitter power ramp on/off control. The power ramp rise/fall
time is 0.5 s typical.
The device package and pinout for the 20-pin QFN are shown in
Figure 1. A block diagram of the SE2611T is shown in Figure 2.
1
2
3
4
5
15
14
13
12
11
20 19 18 17 16
6 7 8 9 10
Y0974
DNC
CRX
DNC
CTX
NC
ANT
CBTB
LEN
GND
NC
DNC
TX
GND
RX
BT
VCC2
CBTR
PEN
VCC1
DET
Figure 1. SE2611T Pinout – 20-Pin QFN
(Top View)
DATA SHEET • SE2611T 2.4 GHZ HIGH EFFICIENCY WIRELESS LAN/BT FRONT END
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
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BT
RX
TX
ANT
DET
VCC2
VCC1VCC1
1
2
3
4
1
2
3
4
CBTB
CRX
CTX
CBTR
LEN PEN
Y0957
Figure 2. SE2611T Block Diagram
Electrical and Mechanical Specifications
Signal pin assignments and functional pin descriptions are
described in Table 1. The absolute maximum ratings of the
SE2611T are provided in Table 2. Recommended operating
conditions are specified in Table 3. Electrical specifications are
provided in Tables 4 through 10, and Figure 3.
Table 1. SE2611T Signal Descriptions
Pin Name Description Pin Name Description
1 DNC Do not connect 11 BT Bluetooth port
2 CRX WLAN receive antenna switch control 12 RX WLAN receive port
3 DNC Do not connect 13 GND Ground
4 CTX WLAN transmit antenna switch control 14 TX WLAN transmit port
5 NC No connect 15 DNC Do not connect
6 ANT Antenna port 16 DET Transmit power detector output
7 CBTB Bluetooth antenna switch control 17 VCC1 Power amplifier power supply
8 LEN LNA enable 18 PEN Power amplifier enable
9 GND Ground 19 CBTR Bluetooth back-end switch control
10 NC No connect 20 VCC2 Power amplifier power supply
Die paddle GND Ground
DATA SHEET • SE2611T: 2.4 GHZ HIGH EFFICIENCY WIRELESS LAN/BT FRONT END
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Table 2. SE2611T Absolute Maximum Ratings (Note 1)
Parameter Symbol Minimum Maximum Units
Supply voltage on VCC VCC 0.3 +6 V
DC input on EN VIN 0.3 +3.6 V
Tx input power. ANT terminated in 50 match PTXIN 5 dBm
Operating temperature range TA 40 +85 C
Storage temperature range TSTG 40 +150 C
Electrostatic discharge:
Human Body Model (HBM), Class 1C
ESD
1000
V
Note 1: Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other
parameters set at or below their nominal value. Exceeding any of the limits listed here may result in permanent damage to the device.
CAUTION: Although this device is designed to be as robust as possible, electrostatic discharge (ESD) can damage this device. This device
must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body
or equipment, which can discharge without detection. Industry-standard ESD precautions should be used at all times.
Table 3. SE2611T Recommended Operating Conditions
Parameter Symbol Minimum Typical Maximum Units
Ambient temperature TA 40 25 85 C
Supply voltage, relative to GND = 0 V VCC 2.7 3.3 4.8 V
Table 4. SE2611T Electrical Specifications: DC Characteristics (Note 1)
(VCC = VPEN = 3.3 V, TA = +25 C, as Measured on SE2611T-EK1 Evaluation Board, All Unused Ports Terminated with 50 , Unless
Otherwise Noted)
Parameter Symbol Test Condition Min Typ Max Units
Total supply current ICC_G POUT = 18 dBm, 54 Mbps OFDM signal, 64QAM 185 210 mA
Total supply current ICC_B POUT = 20 dBm, 11 Mbps CCK signal, BT = 0.45 215 248 mA
Quiescent current ICQ No RF 133 165 mA
Total supply current ICC_OFF PEN = 0 V, no RF applied, CBTR = CBTB = CTX =CRX= 0 V 5 10
A
Total supply current ICC_LNA LEN = VCC 8 12 mA
Total supply current in bypass mode ICC_LNA_BYP LEN = 0 V 250 280 A
Note 1: Performance is guaranteed only under the conditions listed in this table.
Table 5. SE2611T Electrical Specifications: Control Logic Characteristics (Note 1)
(VCC = VPEN = 3.3 V, TA = +25 C, as Measured on SE2611T-EK1 Evaluation Board, All Unused Ports Terminated with 50 , Unless
Otherwise Noted)
Parameter Symbol Test Condition Min Typical Max Units
Logic high voltage VIH 1.2
3.3 V
Logic low voltage VIL 0 0.4 V
Input current logic high voltage IIH
10
A
Input current logic low voltage IIL
1
A
Note 1: Performance is guaranteed only under the conditions listed in this table.
DATA SHEET • SE2611T 2.4 GHZ HIGH EFFICIENCY WIRELESS LAN/BT FRONT END
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Table 6. SE2611T Control Logic Table
Mode Mode Description CTX CRX CBTB PEN LEN CBTR
0 All off 0 0 0 0 0 0
1 BT 0 0 1 0 0 0
2 WLAN Rx, high gain 0 1 0 0 1 0
3 WLAN Rx, low gain 0 1 0 0 0 0
4 WLAN Tx 1 0 0 0 0 0
5 WLAN Tx + PA enabled 1 0 0 1 0 0
6 (BT + WLAN) Rx, high gain 0 1 0 0 1 1
7 (BT + WLAN) Rx, low gain 0 1 0 0 0 1
8 ANT to (BT + WLAN) connect 0 0 1 0 0 1
Table 7. SE2611T Electrical Specifications: AC Characteristics (802.11g Transmit) (Note 1)
(VCC = VPEN = 3.3 V, TA = +25 C, as Measured on SE2611T-EK1 Evaluation Board, All Unused Ports Terminated with 50 , Unless
Otherwise Noted)
Parameter Symbol Test Condition Min Typ Max Units
Frequency range fIN 2400 2500 MHz
EVM EVM
VCC = 3.3 V, POUT = 19 dBm, 54 Mbps OFDM signal, 64QAM
4 %
VCC = 3.0 V, POUT = 18 dBm, 54 Mbps OFDM signal, 64QAM
VCC = 2.7 V, POUT = 17 dBm, 54 Mbps, OFDM signal, 64QAM
Adjacent channel power ratio 11b ACPRb
POUT = 20 dBm, 11 Mbps CCK, BT = 0.45
11 MHz offset
22 MHz offset
37
58
32
55
dBc
Adjacent channel power ratio 11g ACPRg
POUT = 18 dBm, 54 Mbps OFDM, 64QAM
11 MHz offset
20 MHz offset
30 MHz offset
20
28
40
dBc
Out-of-band limited output power PMAX_OOB
11g - 54 Mbps
11b – 11 Mbps
PSDOOB = 43 dBm/MHz, RB = 1 MHz
2310 2390 MHz
2483.5 2500 MHz
16
20
17
20
dBm
Small signal gain S21 25 27 30 dB
Small signal gain variation over band S21 2.0 dBpp
2nd and 3rd harmonics 2f POUT = 20 dBm, 1 Mbps, 802.11b
POUT = 18 dBm, 54 Mbps OFDM signal, 64QAM
35 25 dBm/MHz
3f 52 43 dBm/MHz
Delay & rise/fall time tDR, tDF 50 % of VPEN edge and 90/10 % of final output power level 0.5 1 s
Input return loss S11 Tx port 15 10 dB
Small signal gain in WCDMA band S21WCDMA 2110 2170 MHz, relative to min in-band gain 10 dBr
Output noise power in WCDMA band PNWCDMA
2110 2170 MHz
POUT = 20 dBm, 1 Mbps, 802.11b
POUT = 18 dBm, 54 Mbps OFDM signal, 64QAM
130 127 dBm/Hz
Stability STAB CW, PIN = 5 dBm, 0.1 GHz 20 GHz, load VSWR = 6:1 All non-harmonically related outputs less
than 43 dBm/MHz
Ruggedness RGGD CW, PIN = 5 dBm, 0.1 GHz 20 GHz, load VSWR = 10:1 No permanent damage or performance
degradation
Note 1: Performance is guaranteed only under the conditions listed in this table.
DATA SHEET • SE2611T: 2.4 GHZ HIGH EFFICIENCY WIRELESS LAN/BT FRONT END
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
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Table 8. SE2611T Electrical Specifications: Power Detector Characteristics (Note 1)
(VCC = VPEN = 3.3 V, TA = +25 C, as Measured on SE2611T-EK1 Evaluation Board, All Unused Ports Terminated with 50 , Unless
Otherwise Noted)
Parameter Symbol Test Condition Min Typ Max Units
Frequency range fOUT 2400 2500 MHz
Power detect range, CW PDR Measured at ANT 0 22 dBm
Output impedance PDZLOAD 2.2 k
Output voltage, POUT = no RF PDVNORF Measured into 1 M 0.1 0.125 0.15 V
Output voltage, POUT = 18.5 dBm CW PDVP18.5 Measured into 1 M 0.56 0.66 0.76 V
Output voltage, POUT = 20 dBm CW PDVP20 Measured into 1 M 0.70 0.80 0.90 V
Detector variation over temperature PDtTVAR
30 to 25 C
25 to 85 C
given detector voltage
0.6 0.5 dB
Detector variation over frequency PDFVAR 2400 2500 MHz,
given detector voltage 0.5 0.5 dB
Detector variation over load VSWR PDVSWR Forward power, ANT VSWR 3:1, all phases,
given detector voltage 2 1 dB
Detector bandwidth PDBW 1 MHz
Note 1: Performance is guaranteed only under the conditions listed in this table.
Power Detector Response
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
1.1
1.2
10 12 14 16 18 20 22
Output Power (dBm)
VDET (V)
2400 2450
2500
Y0959
Figure 3. SE2611T Power Detector Characteristics
Table 9. SE2611T Electrical Specifications: Bluetooth Characteristics
(VCC = 3.3 V, TA = +25 C, as Measured on Skyworks Solutions’ SE2611T-EK1 Evaluation Board, All Unused Ports Terminated with 50 ,
Unless Otherwise Noted)
Parameter Symbol Test Condition Min Typ Max Units
Frequency range fOUT 2400 2500 MHz
Insertion loss BTIL BT-ANT, CBTB = High, CBTR = CTX = CRX = Low 1.2 1.5 dB
Bt port return loss S11 CBTB = High, CBTR = CTX = CRX = Low 12 dB
Switch isolation ISOLSW ANT-RX, CBTB = High, CBTR = CTX = CRX = Low 20 dB
DATA SHEET • SE2611T 2.4 GHZ HIGH EFFICIENCY WIRELESS LAN/BT FRONT END
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Table 10. SE2611T Electrical Specifications: 2.4 GHz Receive Characteristics
(VCC = 3.3 V, LEN = CRX = CBTR = 3.3 V, PEN = CBTB = CTX = 0 V, TA = +25 C, as Measured on Skyworks Solutions’ SE2611T-EK1
Evaluation Board, All Unused Ports Terminated with 50 , Unless Otherwise Noted)
Parameter Symbol Test Condition Min Typ Max Units
Frequency range fOUT 2400 2500 MHz
Receive gain, LNA enabled. S21
(BT + WLAN) Rx, high gain 11 13 15 dB
WLAN Rx, high gain only,
LEN = CRX = 3.3 V,
PEN = CBTB = CTX =CBTR= 0 V
14 16 18 dB
Gain variation S21 2400 2485 MHz, over any 20 MHz band 0.5 dB
Noise figure NF 2.0 2.5 dB
Third order intercept IIP3 3 dBm
Input return loss S11 8 dB
Reverse isolation S12 20 dB
Input P1dB IP1dB CW 8 dBm
Enable time tEN 10% to 90% of RX RF power,
from time that LEN is at 50% 500 ns
Receive gain, LNA bypassed S21_BYP LEN = 0 V 20 10 dB
Input return loss, LNA bypassed S11_BYP LEN = 0 V 7 dB
Switch isolation ISOLSW CBTB = CBTR = Low, CRX = High,
ANT_BT + BT_RX 20
dB
Package Dimensions
The PCB layout footprint for the SE2611T is provided in
Figure 4. Typical case markings are shown in Figure 5. Package
dimensions for the 20-pin QFN are shown in Figure 6, and carrier
tape dimensions are provided in Figure 7.
Package and Handling Information
Because of its sensitivity to moisture absorption, instructions on
the shipping container label regarding exposure to moisture after
the container seal is broken must be followed. Otherwise,
problems related to moisture absorption may occur when the part
is subjected to high temperature during solder assembly.
The SE2611T is rated to Moisture Sensitivity Level 1 (MSL1) at
260 C. It is capable of withstanding a Pb-free solder reflow. For
additional information, refer to the Skyworks Application Note,
Solder Reflow Information, document number 200164.
Care must be taken when attaching this product, whether it is
done manually or in a production solder reflow environment. If the
part is manually attached, precaution should be taken to insure
that the device is not subjected to temperatures above its rated
peak temperature for an extended period of time. For details on
both attachment techniques, precautions, and handling
procedures recommended by Skyworks, please refer to the
following Skyworks Application Notes:
QFN Solder Reflow and Rework Information Application Note,
document number QAD-00045.
Handling, Packing, Shipping and Use of Moisture Sensitive
QFN Application Note, document number QAD-00044.
Production quantities of this product are shipped in a standard
tape and reel format.
DATA SHEET • SE2611T: 2.4 GHZ HIGH EFFICIENCY WIRELESS LAN/BT FRONT END
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Notes:
1. All dimensions are in millimeters.
2. Dimensions and tolerances according to ASME Y14.5M-1994.
3. Unless specified, dimensions are symmetrical about center lines.
4. Via hole recommendations: 0.025 mm Cu via wall plating (minimum),
via hole to be filled with conductive paste and plated over.
5. Stencil recommendations: 0.10 mm stencil thickness, laser cut
apertures, trapezoidal walls and rounded corners offer better paste release.
6. Solder mask recommendations: contact board fabricator for recommended
solder mask offset and tolerance.
9X ø0.254
3X 0.62
Via Pattern
(Note 4)
Board Metal
Solder Mask Pattern
(Note 6)
Stencil Pattern
(Note 5)
3.40
1.80
0.400
Typ
56% solder coverage
on center pads
0.20
Typ
1.80
3.40
3X 0.62
0
3X 0.62
3X 0.62
0
0
0
0.55 Typ
3.40
3.50
0.65 Typ
3.40
0.55 Typ
0.60 Typ
0.60 Typ
0.20
0.20
0.400
Typ
0.20
Typ
Package
Outline
0.30
Typ
0.400
Typ
1.60
1.60
3.50
Y0975
Figure 4. PCB Layout Footprint for the SE2611T
Y0960
Pin 1
Indicator
Part Number
Lot Code
SiGe
2611T
XXXXX
Figure 5. Typical Case Markings
(Top View)
\ fiifl m h m
DATA SHEET • SE2611T 2.4 GHZ HIGH EFFICIENCY WIRELESS LAN/BT FRONT END
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Top View Bottom View
Pin 1
Indicator
Pin 1 Indicator
Detail A
Exposed Pad
Detail A
Scale: 2X
20 Places
Side View
3.00 ± 0.05
0.05 C
Notes:
1. All measurements are in millimeters.
2. Dimensions and tolerances according to ASME Y14.5M-1994.
3. Unless otherwise specified, the following values apply:
Decimal Tolerance: Angular Tolerance:
X.X (1 place)
± 0.1 mm ±1/2°
X.XX (2 places) ± 0.05 mm
X.XXX (3 places) ± 0.025 mm
4. Coplanarity applies to the terminals as well as all other bottom surface metallization.
5. Dimension applies to metallized terminal. If terminal tip has a radius, dimension
should not be measured in that radius area.
6. Unless specified, dimensions are symmetrical about center lines.
0.05 C
0.55 ± 0.05
Seating
Plane
A
B
Y0977
0.35 ± 0.05
2X
2X
0.20 ± 0.05
5
1.70 ± 0.05
0.40
0.02 +0.03
–0.02
0.30 X 45°
20X 0.25 Min
0.05
M
C
0.10
M
C A B
0.05 C
3.00 ± 0.05
0.05 C
21X
4
1.70 ± 0.05
2X R0.075
0.152 Ref
R0.075
Typ
C
Figure 6. SE2611T 20-Pin QFN Package Dimensions
1.75 ± 0.1
ø1.55
±
0.05
4.0 ± 0.1
5.50- ± 0.1
(Note 3)
Pin 1
Indicator
Notes:
1. Measured from center line of sprocket hole to center line of pocket.
2. 10-sprocket hole pitch cumulative tolerance: ±0.20.
3. Measured from center line of sprocket hole to center line of pocket.
4. Other material available.
5. Typical SR of form tape from 10
5
to 10
11
Ω/sq.
6. All dimensions are in millimeters.
3.30 ± 0.1
ø1.5 Min
12.00 ± 0.3
Y
Section Y
0.30 ± 0.05
Ref 3°
3.30 ± 0.1
0.80 ± 0.1
8.00 ± 0.1
2.0 ± 0.1
(Note 1)
Y
A
Ref
R0.6
Ref
R0.50
Ref
R0.35
View A
Y0978
Figure 7. SE2611T 20-Pin QFN Carrier Tape Dimensions
DATA SHEET • SE2611T: 2.4 GHZ HIGH EFFICIENCY WIRELESS LAN/BT FRONT END
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Ordering Information
Model Name Manufacturing Part Number Evaluation Board Part Number
SE2611T: 2.4 GHz High Efficiency Wireless LAN/BT Front End SE2611T SE2611T-EK1
Copyright © 2012-2014 Skyworks Solutions, Inc. All Rights Reserved.
Information in this document is provided in connection with Skyworks Solutions, Inc. (“Skyworks”) products or services. These materials, including the information contained herein, are provided by
Skyworks as a service to its customers and may be used for informational purposes only by the customer. Skyworks assumes no responsibility for errors or omissions in these materials or the
information contained herein. Skyworks may change its documentation, products, services, specifications or product descriptions at any time, without notice. Skyworks makes no commitment to
update the materials or information and shall have no responsibility whatsoever for conflicts, incompatibilities, or other difficulties arising from any future changes.
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Customers are responsible for their products and applications using Skyworks products, which may deviate from published specifications as a result of design defects, errors, or operation of
products outside of published parameters or design specifications. Customers should include design and operating safeguards to minimize these and other risks. Skyworks assumes no liability for
applications assistance, customer product design, or damage to any equipment resulting from the use of Skyworks products outside of stated published specifications or parameters.
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