MIC33153 Data Sheet Datasheet by Microchip Technology

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‘ MICRQICHIP M|C33153
2019 Microchip Technology Inc. DS20006223A-page 1
MIC33153
Features
Internal Inductor
Simplifies Design to Two External Capacitors
Input Voltage: 2.7V to 5.5V
Output Voltage: Fixed or Adjustable (0.62V to
3.6V)
Up to 1.2A Output Current
Up to 93% Peak Efficiency
85% Typical Efficiency at 1 mA
Power Good (PG) Output
Programmable Soft-Start
•22 μA Typical Quiescent Current
•4 MHz PWM Operation in Continuous Mode
Ultra-Fast Transient Response
Low Ripple Output Voltage
-35 mVPP Ripple in HyperLight Load® Mode
-7 mV Output Voltage Ripple in Full PWM
Mode
0.01 μA Shutdown Current
Thermal Shutdown and Current Limit Protection
14-pin 3.0 x 3.5 x 1.1 mm TDFN Package
–40°C to +125°C Junction Temperature Range
Applications
Solid State Drives (SSD)
Mobile Handsets
Portable Media/MP3 Players
Portable Navigation Devices (GPS)
WiFi/WiMax/WiBro Modules
Wireless LAN Cards
Portable Applications
General Description
The MIC33153 is a high-efficiency 4 MHz 1.2A
synchronous buck regulator with an internal inductor,
HyperLight Load® mode, Power Good (PG) output
indicator, and programmable soft-start. HyperLight
Load® provides very high efficiency at light loads and
ultra-fast transient response which makes the
MIC33153 perfectly suited for supplying processor
core voltages. An additional benefit of this proprietary
architecture is very low output ripple voltage throughout
the entire load range with the use of small output
capacitors.
The MIC33153 is designed so that only two external
capacitors as small as 2.2
μF are needed for stability.
This gives the MIC33153 the ease of use of an LDO
with the efficiency of a HyperLight Load® DC converter.
The MIC33153 achieves efficiency in HyperLight
Load® mode as high as 85% at 1 mA, with a very low
quiescent current of 22
μA. At higher loads, the
MIC33153 provides a constant switching frequency up
to 4
MHz.
The MIC33153 is available in 14-pin 3.0 mm x 3.5 mm
TDFN package with an operating junction temperature
range from –40°C to +125°C.
4 MHz 1.2A Internal Inductor PWM Buck Regulator
with HyperLight Load® and Power Good
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MIC33153
DS20006223A-page 2 2019 Microchip Technology Inc.
Typical Application Circuits
Fixed Output MIC33153
Adjustable Output MIC33153
J
J
Package Types
14-Pin 3.0 mm x 3.5 mm TDFN
Fixed (Top View)
14-Pin 3.0 mm x 3.5 mm TDFN
Adjustable (Top View)
EN SS PG EN 55 PG VIN UVLO CONTROL _ LOGIC I» TIMER a. - SOFT START GATE REFERENCE DRIVE |.‘: ERROR AMPLIFIER CURRENT —“> LIMIT _‘ . ' ISENSE , ZERO 1 AGND VIN UVLO CONTROL ,_ LOGIC I» TIMER & sOFT START GATE K; REFERENCE DRIVE |.': ERROR AMPLIFIER CURRE —'> LIMIT a . ZERO I ISENSE AGND SW OUT PGND SNS SW OUT PGND SNS FB
2019 Microchip Technology Inc. DS20006223A-page 3
MIC33153
Functional Block Diagrams
Simplified MIC33153 Fixed Output Functional Block
Simplified MIC33153 Adjustable Output Functional Block
lour VOUNNOM) LOAD 'LOAD OUTLNOM) LOAD LOAD
MIC33153
DS20006223A-page 4 2019 Microchip Technology Inc.
1.0 ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings †
Supply Voltage (VIN)....................................................................................................................................... –0.3 to +6V
Sense Voltage (VSNS) ..................................................................................................................................... –0.3 to VIN
Output Switch Voltage (VSW) .......................................................................................................................... –0.3 to VIN
Enable Input Voltage (VEN) ............................................................................................................................. –0.3 to VIN
Power Good (PG) Voltage (VPG)..................................................................................................................... –0.3 to VIN
ESD Rating (Note 1)...................................................................................................................................ESD Sensitive
Storage Temperature Range (TS) ..........................................................................................................–65°C to +150°C
Lead Temperature (soldering, 10 sec.)....................................................................................................................260°C
Operating Ratings ‡
Supply Voltage (VIN)..................................................................................................................................+2.7V to +5.5V
Enable Input Voltage (VEN) ................................................................................................................................ 0V to VIN
Sense Voltage (VSNS) .................................................................................................................................0.62V to 3.6V
Junction Temperature Range (TJ) ................................................................................................... –40°C ≤ TJ ≤ +125°C
Thermal Resistance
3.0 mm x 3.5 mm TDFN-14 (JA) ......................................................................................................................... 55°C/W
Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of the device at those or any other conditions above those indicated
in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended
periods may affect device reliability. Specifications are for packaged product only.
‡ Notice: The device is not guaranteed to function outside its operating ratings.
Note 1: Devices are ESD sensitive. Handling precautions are recommended. Human body model, 1.5 kΩ in series
with 100 pF.
ELECTRICAL CHARACTERISTICS
Electrical Characteristics: TA = 25°C, VIN = VEN = 3.6V; COUT = 4.7 μF; unless otherwise specified. Bold values
indicate –40°C ≤ TJ ≤ +125°C.
Parameter Symbol Min. Typ. Max. Units Conditions
Supply Voltage Range 2.7 5.5 V —
Undervoltage Lockout
Threshold 2.45 2.55 2.65 V Turn-On
Undervoltage Lockout
Hysteresis 75 mV —
Quiescent Current 22 45 μA IOUT = 0 mA, SNS > 1.2 * VOUT(NOM)
Shutdown Current 0.01 5μA VEN = 0V; VIN = 5.5V
Output Voltage Accuracy –2.5 +2.5 %
VIN = 3.6V if VOUT(NOM) < 2.5V, ILOAD
= 20
mA
VIN = 4.5V to 5.5V if VOUT(NOM)
2.5V, ILOAD = 20 mA
Feedback Regulation Voltage 0.6045 0.62 0.6355 V ILOAD = 20 mA
Current Limit 2.2 3.3 A SNS = 0.9*VOUT(NOM)
Output Voltage Line
Regulation — 0.3
%/V
VIN = 3.6V to 5.5V if VOUT(NOM) <
2.5V, ILOAD = 20 mA
VIN = 4.5V to 5.5V if VOUT(NOM)
2.5V, ILOAD = 20 mA
VOUT NOM VOUT NOM 'sw 'sw
2019 Microchip Technology Inc. DS20006223A-page 5
MIC33153
Output Voltage Load
Regulation
0.8 —
%/A
1 mA < ILOAD < 1A, VIN = 3.6V if
VOUT(NOM) < 2.5V
0.85 — 1 mA < ILOAD < 1A, VIN = 5.0V if
VOUT(NOM) ≥ 2.5V
PWM Switch On-Resistance 0.2 — ΩISW = 100 mA PMOS
0.19 — ISW = –100 mA NMOS
Maximum Switching
Frequency 4 MHz IOUT = 300 mA
Soft-Start Time 320 μs VOUT = 90%, CSS = 470 pF
Soft-Start Current 2.7 μA VSS = 0V
PG Threshold (Rising) 86 92 96 %
PG Threshold Hysteresis 7 %
PG Delay Time 68 μs Rising
Enable Threshold 0.5 0.9 1.2 V Turn-On
Enable Input Current 0.1 2μA —
Overtemperature Shutdown 160 °C
Overtemperature Shutdown
Hysteresis 20 °C —
ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrical Characteristics: TA = 25°C, VIN = VEN = 3.6V; COUT = 4.7 μF; unless otherwise specified. Bold values
indicate –40°C ≤ TJ ≤ +125°C.
Parameter Symbol Min. Typ. Max. Units Conditions
TEMPERATURE SPECIFICATIONS (Note 1)
Parameters Symbol Min. Typ. Max. Units Conditions
Temperature Ranges
Junction Operating Temperature Range TJ–40 +125 °C —
Storage Temperature Range TS–65 +150 °C —
Lead Temperature 260 °C Soldering, 10 sec.
Package Thermal Resistances
Thermal Resistance 14-Lead TDFN JA 55 °C/W —
Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the
maximum allowable power dissipation will cause the device operating junction temperature to exceed the
maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.
MIC33153
DS20006223A-page 6 2019 Microchip Technology Inc.
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2019 Microchip Technology Inc. DS20006223A-page 7
MIC33153
2.0 TYPICAL PERFORMANCE CURVES
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
FIGURE 2-1: Efficiency (VOUT = 3.3V).
FIGURE 2-2: Efficiency (VOUT = 2.5V).
FIGURE 2-3: Efficiency (VOUT = 1.8V)
FIGURE 2-4: Efficiency (VOUT = 1.5V).
FIGURE 2-5: Efficiency (VOUT = 1.2V).
FIGURE 2-6: Efficiency (VOUT = 1.0V).
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MIC33153
DS20006223A-page 8 2019 Microchip Technology Inc.
FIGURE 2-7: Current-Limit vs. Output
Voltage.
0
5
10
15
20
25
30
35
40
2.7 3.2 3.7 4.2 4.7 5.2 5.7
INPUT VOLTAGE (V)
QUIESCENT CURRENT (μA)
No Switching
SNS > 1.2 * V
OUTNOM
C
OUT
= 4.7μF
T = 125°C T = 20°C
T = - 45°C
FIGURE 2-8: Quiescent Current vs. Input
Voltage.
FIGURE 2-9: Shutdown Current vs. Input
Voltage.
FIGURE 2-10: Line Regulation (Light
Load).
FIGURE 2-11: Line Regulation (Heavy
Load).
FIGURE 2-12: Load Regulation.
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2019 Microchip Technology Inc. DS20006223A-page 9
MIC33153
FIGURE 2-13: Feedback Voltage vs.
Temperature.
FIGURE 2-14: UVLO Threshold vs.
Temperature.
FIGURE 2-15: Enable Threshold vs.
Temperature.
FIGURE 2-16: Enable Voltage vs. Input
Voltage.
FIGURE 2-17: VOUT Rise Time vs. CSS.
FIGURE 2-18: SW Frequency vs.
Temperature.
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MIC33153
DS20006223A-page 10 2019 Microchip Technology Inc.
FIGURE 2-19: Switching Frequency vs.
Output Current.
FIGURE 2-20: Switching Waveform
Discontinuous Mode (Load = 1 mA).
FIGURE 2-21: Switching Waveform
Discontinuous Mode (Load = 50 mA).
FIGURE 2-22: Switching Waveform
Discontinuous Mode (Load = 150 mA).
FIGURE 2-23: Switching Waveform
Continuous Mode (Load = 300 mA).
FIGURE 2-24: Switching Waveform
Continuous Mode (Load = 800 mA).
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2019 Microchip Technology Inc. DS20006223A-page 11
MIC33153
FIGURE 2-25: Switching Waveform
Continuous Mode (Load = 1.2A).
FIGURE 2-26: Load Transient (10 mA to
200 mA).
FIGURE 2-27: Load Transient (10 mA to
500 mA).
FIGURE 2-28: Load Transient (10 mA to
1.2A).
FIGURE 2-29: Load Transient (300 mA to
1.2A).
FIGURE 2-30: Load Transient (10 mA to
1.2A) with PGOOD.
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MIC33153
DS20006223A-page 12 2019 Microchip Technology Inc.
FIGURE 2-31: Line Transient (3.6V to 5.5V)
at 1.2A.
FIGURE 2-32: Line Transient (3.6V to 5.5V)
at 20 mA.
FIGURE 2-33: Start-Up with PGOOD
(CSS = 470 pF).
IN Com
2019 Microchip Technology Inc. DS20006223A-page 13
MIC33153
3.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1: PIN FUNCTION TABLE
Pin Number
(Fixed)
Pin Number
(Adjustable)
Pin
Name Description
11 SS
Soft-Start: Place a capacitor from this pin to ground to program the
soft start time.
Do not leave floating, 100 pF minimum CSS is required.
2 2 AGND Analog Ground: Connect to central ground point where all high
current paths meet (CIN, COUT, PGND) for best operation.
3 3 VIN Input Voltage: Connect a capacitor to ground to decouple the noise.
4 4 PGND Power Ground.
5, 6, 7 5, 6, 7 OUT Output Voltage: The output of the regulator. Connect to SNS pin. For
adjustable option, connect to feedback resistor network.
8, 9, 10 8, 9, 10 SW Switch: Internal power MOSFET output switches before inductor.
11 11 EN Enable: Logic high enables operation of the regulator. Logic low will
shut down the device. Do not leave floating.
12 12 SNS Sense: Connect to VOUT as close to output capacitor as possible to
sense output voltage.
13 13 PG
Power Good: Open-drain output for the Power Good (PG) indicator.
Use a pull-up resistor from this pin to a voltage source to detect a
power good condition.
14 NC Not internally connected.
14 FB Feedback: Connect a resistor divider from the output to ground to set
the output voltage.
MIC33153
DS20006223A-page 14 2019 Microchip Technology Inc.
4.0 FUNCTIONAL DESCRIPTION
4.1 VIN
The input supply (VIN) provides power to the internal
MOSFETs for the switch mode regulator along with the
internal control circuitry. The VIN operating range is
2.7V to 5.5V so an input capacitor, with a minimum
voltage rating of 6.3V, is recommended. Due to the high
switching speed, a minimum 2.2 μF bypass capacitor
placed close to VIN and the power ground (PGND) pin
is required.
4.2 EN
A logic high signal on the enable pin activates the
output voltage of the device. A logic low signal on the
enable pin deactivates the output and reduces supply
current to 0.01 μA. MIC33153 features external
soft-start circuitry via the soft-start (SS) pin that
reduces in rush current and prevents the output voltage
from overshooting at start up. Do not leave the EN pin
floating.
4.3 SW
The switch (SW) connects directly to one end of the
inductor and provides the current path during switching
cycles. The other end of the inductor is connected to
the load, SNS pin and output capacitor. Due to the high
speed switching on this pin, the switch node should be
routed away from sensitive nodes whenever possible.
4.4 SNS
The sense (SNS) pin is connected to the output of the
device to provide feedback to the control circuitry. The
SNS connection should be placed close to the output
capacitor.
4.5 AGND
The analog ground (AGND) is the ground path for the
biasing and control circuitry. The current loop for the
signal ground should be separate from the power
ground (PGND) loop.
4.6 PGND
The power ground pin is the ground path for the high
current in PWM mode. The current loop for the power
ground should be as small as possible and separate
from the analog ground (AGND) loop as applicable.
4.7 Power Good (PG)
The Power Good (PG) pin is an open-drain output that
indicates logic high when the output voltage is typically
above 92% of its steady state voltage. When the output
voltage is below 86%, the PG pin indicates logic low. A
pull up resistor of more than 10 should be
connected from PG to VOUT.
4.8 Soft-Start
The soft-start (SS) pin is used to control the output
voltage ramp up time. The approximate equation for
the ramp time in milliseconds is:
EQUATION 4-1:
tms 270 103ln 10CSS
=
Where:
t = The time in milliseconds
CSS = External soft-start capacitance (in Farads)
For example, for a CSS = 470 pF, TRISE ~ 0.3 ms or
300 μs. See Section 2.0, Typical Performance Curves
for a graphical guide. The minimum recommended
value for CSS is 100 pF.
4.9 FB
The feedback (FB) pin is provided for the adjustable
voltage option (no internal connection for fixed
options). This is the control input for programming the
output voltage. A resistor divider network is connected
to this pin from the output and is compared to the
internal 0.62V reference within the regulation loop.
The output voltage can be programmed between 0.65V
and 3.6V using the following equation:
EQUATION 4-2:
VOUT VREF 1R1
R2
-------+


=
Where:
R1 = Top resistor
R2 = Bottom resistor
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2019 Microchip Technology Inc. DS20006223A-page 15
MIC33153
5.0 APPLICATIONS INFORMATION
The MIC33153 is a high performance DC-to-DC step
down regulator offering a small solution size. With the
HyperLight Load® switching scheme, the MIC33153 is
able to maintain high efficiency throughout the entire
load range while providing ultra-fast load transient
response. The following sections provide additional
device application information.
5.1 Input Capacitor
A 2.2μF ceramic capacitor or greater should be placed
close to the VIN pin and PGND pin for bypassing. A
Murata GRM188R60J475ME84D, size 0603, 4.7 μF
ceramic capacitor is recommended based upon
performance, size, and cost. A X5R or X7R
temperature rating is recommended for the input
capacitor. Y5V temperature rating capacitors, aside
from losing most of their capacitance over temperature,
can also become resistive at high frequencies. This
reduces their ability to filter out high frequency noise.
5.2 Output Capacitor
The MIC33153 is designed for use with a 2.2 μF or
greater ceramic output capacitor. Increasing the output
capacitance will lower output ripple and improve load
transient response but could also increase solution size
or cost. A low equivalent series resistance (ESR)
ceramic output capacitor such as the Murata
GRM188R60J475ME84D, size 0603, 4.7 μF ceramic
capacitor is recommended based upon performance,
size, and cost. Both the X7R or X5R temperature rating
capacitors are recommended. The Y5V and Z5U
temperature rating capacitors are not recommended
due to their wide variation in capacitance over
temperature and increased resistance at high
frequencies.
5.3 Compensation
The MIC33153 is designed to be stable with a 4.7 μF
ceramic (X5R) output capacitor.
5.4 Duty Cycle
The typical maximum duty cycle of the MIC33153 is
80%.
5.5 Efficiency Considerations
Efficiency is defined as the amount of useful output
power, divided by the amount of power supplied.
EQUATION 5-1:
VOUT IOUT
VIN IIN
----------------------------------


100=
Maintaining high efficiency serves two purposes. It
reduces power dissipation in the power supply,
reducing the need for heat sinks and thermal design
considerations and it reduces consumption of current
for battery powered applications. Reduced current
draw from a battery increases the devices operating
time which is critical in hand held devices.
There are two types of losses in switching converters:
DC losses and switching losses. DC losses are simply
the power dissipation of I2R. Power is dissipated in the
high-side switch during the on cycle. Power loss is
equal to the high-side MOSFET RDS(ON) multiplied by
the switch current squared. During the off cycle, the
low-side N-channel MOSFET conducts, also
dissipating power. Device operating current also
reduces efficiency. The product of the quiescent
(operating) current and the supply voltage represents
another DC loss. The current required driving the gates
on and off at a constant 4 MHz frequency and the
switching transitions make up the switching losses.
FIGURE 5-1: Efficiency under Load.
Figure 5-1 shows an efficiency curve. From no load to
100 mA, efficiency losses are dominated by quiescent
current losses, gate drive and transition losses. By
using the HyperLight Load® mode, the MIC33153 is
able to maintain high efficiency at low output currents.
Over 100 mA, efficiency loss is dominated by MOSFET
RDS(ON) and inductor losses. Higher input supply
voltages will increase the gate to source threshold on
the internal MOSFETs, thereby reducing the internal
RDS(ON). This improves efficiency by reducing DC
losses in the device. All but the inductor losses are
inherent to the device. In which case, inductor selection
becomes increasingly critical in efficiency calculations.
As the inductors are reduced in size, the DC resistance
(DCR) can become quite significant.
WW
MIC33153
DS20006223A-page 16 2019 Microchip Technology Inc.
The DCR losses can be calculated by using
Equation 5-2:
EQUATION 5-2:
PDCR IOUT
2DCR=
From that, the loss in efficiency due to inductor
resistance can be calculated by using Equation 5-3:
EQUATION 5-3:
E
fficiencyLoss 1VOUT IOUT
VOUT IOUT PDCR
+
-------------------------------------------------------


– 100=
Efficiency loss due to DCR is minimal at light loads and
gains significance as the load is increased. Inductor
selection becomes a trade-off between efficiency and
size in this case.
The effect of MOSFET voltage drops and DCR losses
in conjunction with the maximum duty cycle combine to
limit maximum output voltage for a given input voltage.
The following graph shows this relationship based on
the typical resistive losses in the MIC33153:
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
2.5 3 3.5 4 4.5 5 5.5
INPUT VOLTAGE (V)
OUTPUT VOLTAGE (V)
1.2A
800mA
400mA
100mA
FIGURE 5-2: VOUT(MAX) vs. VIN.
5.6 HyperLight Load® Mode
The MIC33153 uses a minimum on and off time
proprietary control loop. When the output voltage falls
below the regulation threshold, the error comparator
begins a switching cycle that turns the PMOS on and
keeps it on for the duration of the minimum on-time.
When the output voltage is over the regulation
threshold, the error comparator turns the PMOS off for
a minimum off-time. The NMOS acts as an ideal
rectifier that conducts when the PMOS is off. Using a
NMOS switch instead of a diode allows for lower
voltage drop across the switching device when it is on.
The asynchronous switching combination between the
PMOS and the NMOS allows the control loop to work
in discontinuous mode for light load operations. In
discontinuous mode, MIC33153 works in pulse
frequency modulation (PFM) to regulate the output. As
the output current increases, the switching frequency
increases. This improves the efficiency of the
MIC33153 during light load currents. As the load
current increases, the MIC33153 goes into continuous
conduction mode (CCM) at a constant frequency of
4 MHz. The equation to calculate the load when the
MIC33153 goes into continuous conduction mode may
be approximated by the following Equation 5-4:
EQUATION 5-4:
ILOAD
VIN VOUT
D
2Lf
----------------------------------------------


=
As shown in the above equation, the load at which
MIC33153 transitions from HyperLight Load® mode to
PWM mode is a function of the input voltage (VIN),
output voltage (VOUT), duty cycle (D), inductance (L)
and frequency (f). For example, if VIN = 3.6V,
VOUT = 1.8V, D = 0.5, f = 4 MHz and the internal
inductance of MIC33153 is 0.47 μH, then the device
will enter HyperLight Load® mode or PWM mode at
approximately 200 mA.
5.7 Power Dissipation Considerations
As with all power devices, the ultimate current rating of
the output is limited by the thermal properties of the
package and the PCB it is mounted on. There is a
simple, Ohm’s law type relationship between thermal
resistance, power dissipation, and temperature which
are analogous to an electrical circuit:
WW
Isource
Rxy Ryz
Vz
Vx Vy Vz
+
2019 Microchip Technology Inc. DS20006223A-page 17
MIC33153
FIGURE 5-3: Electrical Circuit Analogous
to the Thermal Relief.
From this simple circuit Vx can be calculated if ISOURCE,
Vz and the resistor values, Rxy and Ryz are known,
using the Equation 5-5:
EQUATION 5-5:
VXISOURCE RXY RYZ
+VZ
+=
Thermal circuits can be considered using these same
rules and can be drawn similarly replacing current
sources with power dissipation (in Watts), resistance
with thermal resistance (in °C/W) and voltage sources
with temperature (in °C):
Pdiss
RT
JC
Tamb
Tj Tc Tamb
+
RT
CA
FIGURE 5-4: Thermal Relief Circuit.
Now replacing the variables in the equation for Vx, we
can find the junction temperature (TJ) from power
dissipation, ambient temperature and the known
thermal resistance of the PCB (RθCA) and the package
(RθJC):
EQUATION 5-6:
TJPDISS RJC RCA
+TAMB
+=
As can be seen in Figure 5-4, total thermal resistance
JA = RθJC + RθCA. This can also be calculated using
Equation 5-6:
EQUATION 5-7:
TJPDISS RJA
TAMB
+=
Because effectively all of the power loss in the
converter is dissipated within the MIC33153 package,
PDISS can be calculated by using Equation 5-8:
EQUATION 5-8:
PDISS POUT
1
--- 1


=
Where:
η = Efficiency taken from Efficiency Curves
JC and JA are found in the Section “Operating
Ratings ‡” of the data sheet.
EXAMPLE:
A MIC33153 is intended to drive a 1A load at 1.8V and
is placed on a printed circuit board which has a ground
plane area of at least 25 mm square. The voltage
source is a Li-ion battery with a lower operating
threshold of 3V and the ambient temperature of the
assembly can be up to 50°C.
Summary of variables:
•I
OUT = 1A
•V
OUT = 1.8V
•V
IN = 3V to 4.2V
•T
AMB = 50°C
•Rθ
JA = 55°C/W
η @ 1A = 80% (worst case with VIN = 4.2V) See
Section 2.0, Typical Performance Curves.
W
MIC33153
DS20006223A-page 18 2019 Microchip Technology Inc.
EQUATION 5-9:
PDISS 1.8 1 1
0.80
---------- 1


0.45W==
The worst case switch and inductor resistance will
increase at higher temperatures, so a margin of 20%
can be added to account for this:
EQUATION 5-10:
PDISS 0.45 1.20.54W==
Therefore:
TJ = 0.54W x (55°C/W) + 50°C
TJ = 79.7°C
This is well below the maximum 125°C.
2019 Microchip Technology Inc. DS20006223A-page 19
MIC33153
6.0 PACKAGING INFORMATION
6.1 Package Marking Information
Example
14-Lead TDFN
(Fixed Output)*
33153
415Y
-4
Example
14-Lead TDFN
(Adjustable Output)*
XXXXX
NNNX 927Y
33153
XXXXX
NNNX
-X
XXX MIC
Legend: XX...X Product code or customer-specific information
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
*This package is Pb-free. The Pb-free JEDEC designator ( )
can be found on the outer packaging for this package.
●, ▲, ▼ Pin one index is identified by a dot, delta up, or delta down (triangle
mark).
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information. Package may or may not include
the corporate logo.
Underbar (_) and/or Overbar (‾) symbol may not be to scale.
3
e
3
e
TITLE I4 LEAD HJDFN 3.0 x 3.5 mm PACKAGE OUTLINE & RECOMMENDED LAND PATTERN DRAWING n | HJDFN3035714LD7PL71 | UNIT | MM nafintonsw. ”303:5 r-ijsunéuusufi usun as I: Em ‘ U U U U U Ummusn 1420 REF | . Ianumusn annmusu ‘m M MW 7W W ‘ Imam n F‘ , . E n n W H n .t'mnI-sga 1 “SJ L25 W W (nmnncnmn TDP vIEw w mm.“ m 2 a Immusa a 05070 050 SIDE VIEW Nuns I a. 3 NOTE- MAX PACKAGE WARPAGE IS 0 05mm MAX ALLOWABLE EURR Is 0.076Imu IN ALL DIRECTIONS PIN :I IS ON TOP WILL BE LASER MARKED. RED CIRCLES WRECOMMENDED LAND PATJ'EKV ARE THERMAL VIAs SIZE Is 0.300.35mAND SHOULD EE CONNECTED TO GND FOR MAXIMUM PERFORMANCE GREEN REEI'ANGLE REPRESENTS (OPTIONAL) soLDER STENCIL OPENING, 5 PURPLE PADS REPRESENT DIFFERENT POTENTIAL DO NOT CONNECT TO END
MIC33153
DS20006223A-page 20 2019 Microchip Technology Inc.
14-Lead TDFN 3.0 mm x 3.5 mm Package Outline and Recommended Land Pattern
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
POD-Land Patlem dmwing # HJDFN3035—14LD—PL—l PECDMMENDED LAND PATTERN Num 4, s, s EEEEEEZ H/ A‘ aaaazaa STACKED’UP mim‘ ‘ 02mg magma 7 \ 7 mm 77’7UDDDDDD g EB aamamg Egg 0 5 5 Ed HZ am:i” 2 a 2 O V—\ g E E VA Z22:;, DDD‘UJDDm é Zaaflqafl§3 N amuse D N ‘ n was g ‘ 033x002 i mamas EXPDSED METAL TRACE :DLDER STENCIL EIFENING
2019 Microchip Technology Inc. DS20006223A-page 21
MIC33153
14-Lead TDFN 3.0 mm x 3.5 mm Recommended Land Pattern
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
MIC33153
DS20006223A-page 22 2019 Microchip Technology Inc.
NOTES:
2018 Microchip Technology Inc. DS20006223A-page 23
MIC33153
APPENDIX A: REVISION HISTORY
Revision A (June 2019)
Converted Micrel document MIC33153 to Micro-
chip data sheet DS20006223A.
Minor text changes throughout.
MIC33153
DS20006223A-page 24 2018 Microchip Technology Inc.
NOTES:
—4>< 41x="">
2019 Microchip Technology Inc. DS20006223A-page 25
MIC33153
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.
Examples:
a) MIC33153-4YHJ-TR: 4 MHz PWM 1.2A Internal Inductor
Buck Regulator with HyperLight
Load® and Power Good, 1.2V
Fixed Output Voltage,
–40°C to +125°C Junction
Temperature Range, Pb-Free,
RoHS Compliant, 14-Lead TDFN
Package, 5000/Reel
b) MIC33153-SYHK-TR: 4 MHz PWM 1.2A Internal Inductor
Buck Regulator with HyperLight
Load® and Power Good, 3.3V
Fixed Output Voltage,
–40°C to +125°C Junction
Temperature Range, Pb-Free,
RoHS Compliant, 14-Lead TDFN
Package, 5000/Reel
c) MIC33153-YHJ-TR: 4 MHz PWM 1.2A Internal Inductor
Buck Regulator with HyperLight
Load® and Power Good,
Adjustable Output Voltage,
–40°C to +125°C Junction
Temperature Range, Pb-Free,
RoHS Compliant, 14-Lead TDFN
Package, 5000/Reel
PART NO. XX
Package
Device
Device:
MIC33153: 4 MHz PWM 1.2A Internal Inductor Buck
Regulator with HyperLight Load® and
Power Good
Output Voltage:
4 = 1.2V
S = 3.3V
Blank = Adjustable
Junction
Temperature Range: Y = –40°C to +125°C
Package: HJ = 14-Lead 3.0 mm x 3.5 mm x 1.1 mm TDFN
Media Type: TR = 5000/Reel
X
Junction
Note 1: Tape and Reel identifier only appears in the
catalog part number description. This identifier is
used for ordering purposes and is not printed on
the device package. Check with your Microchip
Sales Office for package availability with the
Tape and Reel option.
XX
Media Type
-X
Output
Voltage Temperature
Range
Option
Note: Other output voltage options are available. Contact Factory for
details.
MIC33153
DS20006223A-page 26 2019 Microchip Technology Inc.
NOTES:
2019 Microchip Technology Inc. DS20006223A-page 27
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Trademarks
The Microchip name and logo, the Microchip logo, Adaptec,
AnyRate, AVR, AVR logo, AVR Freaks, BesTime, BitCloud, chipKIT,
chipKIT logo, CryptoMemory, CryptoRF, dsPIC, FlashFlex,
flexPWR, HELDO, IGLOO, JukeBlox, KeeLoq, Kleer, LANCheck,
LinkMD, maXStylus, maXTouch, MediaLB, megaAVR, Microsemi,
Microsemi logo, MOST, MOST logo, MPLAB, OptoLyzer,
PackeTime, PIC, picoPower, PICSTART, PIC32 logo, PolarFire,
Prochip Designer, QTouch, SAM-BA, SenGenuity, SpyNIC, SST,
SST Logo, SuperFlash, Symmetricom, SyncServer, Tachyon,
TempTrackr, TimeSource, tinyAVR, UNI/O, Vectron, and XMEGA
are registered trademarks of Microchip Technology Incorporated in
the U.S.A. and other countries.
APT, ClockWorks, The Embedded Control Solutions Company,
EtherSynch, FlashTec, Hyper Speed Control, HyperLight Load,
IntelliMOS, Libero, motorBench, mTouch, Powermite 3, Precision
Edge, ProASIC, ProASIC Plus, ProASIC Plus logo, Quiet-Wire,
SmartFusion, SyncWorld, Temux, TimeCesium, TimeHub,
TimePictra, TimeProvider, Vite, WinPath, and ZL are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any
Capacitor, AnyIn, AnyOut, BlueSky, BodyCom, CodeGuard,
CryptoAuthentication, CryptoAutomotive, CryptoCompanion,
CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average
Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial
Programming, ICSP, INICnet, Inter-Chip Connectivity, JitterBlocker,
KleerNet, KleerNet logo, memBrain, Mindi, MiWi, MPASM, MPF,
MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach,
Omniscient Code Generation, PICDEM, PICDEM.net, PICkit,
PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE, Ripple
Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI,
SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC,
USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and
ZENA are trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated in
the U.S.A.
The Adaptec logo, Frequency on Demand, Silicon Storage
Technology, and Symmcom are registered trademarks of Microchip
Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology Germany
II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in
other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2019, Microchip Technology Incorporated, All Rights Reserved.
ISBN: 978-1-5224-4736-8
Note the following details of the code protection feature on Microchip devices:
Microchip products meet the specification contained in their particular Microchip Data Sheet.
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
For information regarding Microchip’s Quality Management Systems,
please visit www.microchip.com/quality.
6‘ ‘MICFIOCHIP AMERICAS ASIA/PACIFIC ASIA/PACIFIC EUROPE
DS20006223A-page 28 2019 Microchip Technology Inc.
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