RT9193 Datasheet by Richtek USA Inc.

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RICHTEK DDT f E I ”Z «HI—l RICHTEK
RT9193
®
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©
300mA, Ultra-Low Noise, Ultra-Fast CMOS LDO Regulator
Marking Information
For marking information, contact our sales representative
directly or through a Richtek distributor located in your
area.
Ordering Information
General Description
The RT9193 is designed for portable RF and wireless
applications with demanding performance and space
requirements. The RT9193 performance is optimized for
battery-powered systems to deliver ultra low noise and
low quiescent current. A noise bypass pin is available for
further reduction of output noise. Regulator ground current
increases only slightly in dropout, further prolonging the
battery life. The RT9193 also works with low-ESR ceramic
capacitors, reducing the amount of board space necessary
for power applications, critical in hand-held wireless
devices. The RT9193 consumes less than 0.01μA in
shutdown mode and has fast turn-on time less than 50μs.
The other features include ultra low dropout voltage, high
output accuracy, current limiting protection, and high ripple
rejection ratio. Available in the SC-70-5, SOT-23-5,
TSOT-23-5, WDFN-6L 2x2 and MSOP-8 packages.
Features
Ultra Low Noise for RF Application
Ultra Fast Response in Line/Load Transient
Quick Start-Up (Typically 50μμ
μμ
μs)
<0.01μμ
μμ
μA Standby Current When Shutdown
Low Dropout : 220mV @ 300mA
Wide Operating Voltage Ranges : 2.5V to 5.5V
TTL-Logic-Controlled Shutdown Input
Low Temperature Coefficient
Current Limiting Protection
Thermal Shutdown Protection
Only 1μμ
μμ
μF Output Capacitor Required for Stability
High Power Supply Rejection Ratio
Custom Voltage Available
RoHS Compliant and 100% Lead (Pb)-Free
Applications
CDMA/GSM Cellular Handsets
Battery-Powered Equipment
Laptop, Palmtops, Notebook Computers
Hand-Held Instruments
PCMCIA Cards
Portable Information Appliances
Note :
Richtek products are :
RoHS compliant and compatible with the current require-
ments of IPC/JEDEC J-STD-020.
Suitable for use in SnPb or Pb-free soldering processes.
Typical Application Circuit
RT9193- Package Type
U5 : SC-70-5
B : SOT-23-5
J5 : TSOT-23-5
QW : WDFN-6L 2x2 (W-Type)
F : MSOP-8
Output Voltage
15 : 1.5V
16 : 1.6V
:
49 : 4.9V
50 : 5.0V
1H : 1.85V
2H : 2.85V
4G : 4.75V
(1.5V to 5V with 0.1V step is available)
Lead Plating System
P : Pb Free
G : Green (Halogen Free and Pb Free)
VIN
GND
VOUT
RT9193
COUT
1µF/X7R
CIN
1µF/X7R
VIN VOUT
EN BP
CBP
22nF
Chip Enable
(Option for low noise)
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Function Block Diagram
Functional Pin Description
Pin Name Pin Function
EN Chip Enable (Active High). Note that this pin is high impedance. There should be a pull low 100k
resistor connected to GND when the control signal is floating.
BP Reference Noise Bypass. This pin can be floating. For lowest noise performance, connect a 22nF
capacitor between the BP and GND pins.
GND Ground.
VOUT Output Voltage.
VIN Power Input Voltage.
Pin Configurations
(TOP VIEW)
SC-70-5/SOT-23-5/TSOT-23-5
WDFN-6L 2x2 MSOP-8
5
6
7
8
4
3
2
NC NC
EN
BP
GND
VOUT
NC
VIN
EN
GND
BP
NC
VOUTVIN
5
4
1
2
3
6
7
VIN GND EN
VOUT BP
4
23
5
Current-Limit
and
Thermal
Protection
MOSFET
Driver
+
-
VOUT
Shutdown
and
Logic Control
VIN
Error
Amplifier
VREF
BP
EN
GND
Quick
Start
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Electrical Characteristics
(VIN = VOUT + 1V, CIN = COUT = 1μF, CBP = 22nF, TA = 25°C, unless otherwise specified)
Parameter Symbol Test Conditions Min Typ Max Unit
Output Voltage Accuracy VOUT I
OUT = 1mA 2 -- 2 %
Current Limit ILIM R
LOAD = 1 360 400 -- mA
Quiescent Current IQ V
EN 1.2V, IOUT = 0mA -- 90 130 A
IOUT = 200mA, VOUT > 2.8V 170 200
Dropout Voltage (Note 5) VDROP IOUT = 300mA, VOUT > 2.8V -- 220 300 mV
Line Regulation VLINE VIN = (VOUT + 1V) to 5.5V,
IOUT = 1mA -- -- 0.3 %
Load Regulation VLOAD 1mA IOUT 300mA -- -- 0.6 %
Standby Current ISTBY V
EN = GND, Shutdown -- 0.01 1 A
Absolute Maximum Ratings (Note 1)
Supply Input Voltage------------------------------------------------------------------------------------------------------ 6V
Power Dissipation, PD @ TA = 25°C
SC-70-5 ---------------------------------------------------------------------------------------------------------------------- 300mW
TSOT-23-5/SOT-23-5 ------------------------------------------------------------------------------------------------------ 400mW
WDFN-6L 2x2 -------------------------------------------------------------------------------------------------------------- 606mW
MSOP-8 --------------------------------------------------------------------------------------------------------------------- 625mW
Package Thermal Resistance (Note 2)
SC-70-5, θJA ---------------------------------------------------------------------------------------------------------------- 333°C/W
SC-70-5, θJC ---------------------------------------------------------------------------------------------------------------- 200°C/W
TSOT-23-5/SOT-23-5, θJA ------------------------------------------------------------------------------------------------ 250°C/W
TSOT-23-5/SOT-23-5, θJC ----------------------------------------------------------------------------------------------- 25°C/W
WDFN-6L 2x2, θJA --------------------------------------------------------------------------------------------------------- 165°C/W
WDFN-6L 2x2, θJC -------------------------------------------------------------------------------------------------------- 20°C/W
MSOP-8 θJA ---------------------------------------------------------------------------------------------------------------- 160°C/W
MSOP-8 θJC ---------------------------------------------------------------------------------------------------------------- 55°C/W
Junction Temperature ----------------------------------------------------------------------------------------------------- 150°C
Lead Temperature (Soldering, 10 sec.)------------------------------------------------------------------------------- 260°C
Storage Temperature Range -------------------------------------------------------------------------------------------- 65°C to 150°C
ESD Susceptibility (Note 3)
HBM (Human Body Model)---------------------------------------------------------------------------------------------- 2kV
MM (Machine Model) ----------------------------------------------------------------------------------------------------- 200V
Recommended Operating Conditions (Note 4)
Supply Input Voltage------------------------------------------------------------------------------------------------------ 2.5V to 5.5V
EN Input Voltage ----------------------------------------------------------------------------------------------------------- 0V to 5.5V
Junction Temperature Range-------------------------------------------------------------------------------------------- 40°C to 125°C
Ambient Temperature Range-------------------------------------------------------------------------------------------- 40°C to 85°C
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Note 1. Stresses beyond those listed Absolute Maximum Ratings may cause permanent damage to the device. These are
stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in
the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions may
affect device reliability.
Note 2. θJA is measured at TA = 25°C on a low effective thermal conductivity single-layer test board per JEDEC 51-3.
Note 3. Devices are ESD sensitive. Handling precaution is recommended.
Note 4. The device is not guaranteed to function outside its operating conditions.
Note 5. The dropout voltage is defined as VIN VOUT, which is measured when VOUT is VOUT(NORMAL) 100mV.
Parameter Symbol Test Conditions Min Typ Max Unit
EN Input Bias Current IIBSD V
EN = GND or VIN -- 0 100 nA
Logic-Low VIL V
IN = 3V to 5.5V, Shutdown -- -- 0.4
EN Threshold
Voltage Logic-High VIH V
IN = 3V to 5.5V, Start-Up 1.2 -- -- V
Output Noise Voltage eNO 10Hz to 100kHz, IOUT = 200mA
COUT = 1F -- 100 -- VRMS
f = 100Hz -- 70 -- Power Supply
Rejection Rate f = 10kHz PSRR COUT = 1F, IOUT = 10mA -- 50 -- dB
Thermal Shutdown Temperature TSD -- 165 -- C
Thermal Shutdown Temperature TSD -- 30 -- C
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Quiescent Current vs. Temperature
60
65
70
75
80
85
90
95
-50 -25 0 25 50 75 100 125
TemperatureC)
Quiescent CurrentA
)
Dropout Voltage vs. Load Current
0
50
100
150
200
250
300
0 0.05 0.1 0.15 0.2 0.25 0.3
Load Current (A)
Dropout Voltage (mV)
RT9193-33xB
CIN = COUT = 1μF
TJ = 125°C
TJ = 25°C
TJ = -40°C
Typical Operating Characteristics
PSRR
-80
-60
-40
-20
0
20
0.01 0.1 1 10 100 1000
Frequency (kHz)
PSRR (dB)
ILoad = 10mA
ILoad = 100mA
10 100 1K 10K 100K 1M
(Hz)
VIN = 4V to 5V
CIN = COUT = 1μF, X7R
Time (500μs/Div)
VIN = 5V
CIN = COUT = 1μF
EN Pin Shutdown Response
EN Pin Voltage
(V)
Output Voltage
(V)
RT9193-28xU5
No Load
10
5
0
2
1
0
Output Voltage vs. Temperature
1.2
1.3
1.4
1.5
1.6
1.7
1.8
-50 -25 0 25 50 75 100 125
Temperature (C)
Output Voltage (V)
RT9193-15xU5
VIN = 3.3V
CIN = COUT = 1μF X7R
RT9193-15xU5
VIN = 3.3V
CIN = COUT = 1μF X7R
EN Pin Shutdown Threshold vs. Temperature
0.50
0.75
1.00
1.25
1.50
1.75
-50 -25 0 25 50 75 100 125
TemperatureC)
EN Pin Shutdown Threshold (V) 1
RT9193-15xU5
VIN = 3.3V
CIN = COUT = 1μF X7R
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Time (10ms/Div)
VIN = 4.5V
CIN = COUT = 1μF, X7R
Noise
Noise (μV)
200
100
0
-100
-200
RT9193-15xU5
ILOAD = 50mA
f = 10Hz to 100kHz
Time (10ms/Div)
VIN = 4.5V
CIN = COUT = 1μF, X7R
Noise
Noise (μV)
200
100
0
-100
-200
RT9193-30xB
ILOAD = 50mA
f = 10Hz to 100kHz
Time (100μs/Div)
Line Transient Response
Output Voltage
Deviation (mV) Input Voltage
Deviation (V)
6
5
4
10
0
-10
VIN = 4V to 5V
COUT = 1μFRT9193-25xB
ILOAD = 100mA
Time (50μs/Div)
VIN = 4V to 5V
COUT = 1μF
Line Transient Response
Output Voltage
Deviation (mV)
Input Voltage
Deviation (V)
RT9193-25xB
ILOAD = 1mA
6
5
4
10
0
-10
Time (500μs/Div)
VIN = 5V, VOUT = 2.8V
CIN = COUT = 1μF
Load Transient Response
Output Voltage
Deviation (mV) Load Current
(mA)
ILOAD = 1mA to 60mA
100
50
0
20
0
-20
Time (500μs/Div)
Load Transient Response
Output Voltage
Deviation (mV) Load Current
(mA)
ILOAD = 1mA to 250mA
400
200
0
50
0
-50
VIN = 5V, VOUT = 2.8V
CIN = COUT = 1μF
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Time (10μs/Div)
VIN = 5V
CIN = COUT = 1μF
Start Up
EN Pin Voltage
(V)
Output Voltage
(V)
10
5
0
2
1
0
RT9193-28xU5
No Load
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Applications Information
Like any low dropout regulator, the external capacitors
used with the RT9193 must be carefully selected for
regulator stability and performance. Using a capacitor
whose value is >1μF on the RT9193 input and the amount
of capacitance can be increased without limit. The input
capacitor must be located a distance of not more than 0.5
inch from the input pin of the IC and returned to a clean
analog ground. Any good quality ceramic or tantalum can
be used for this capacitor. The capacitor with larger value
and lower ESR (equivalent series resistance) provides
better PSRR and line-transient response. The output
capacitor must meet both requirements for minimum
amount of capacitance and ESR in all LDOs application.
The RT9193 is designed specifically to work with low ESR
ceramic output capacitor in space-saving and performance
consideration. Using a ceramic capacitor whose value is
at least 1μF with ESR is >1mΩ on the RT9193 output
ensures stability. The RT9193 still works well with output
capacitor of other types due to the wide stable ESR range.
Figure 1 shows the curves of allowable ESR range as a
function of load current for various output capacitor values.
Output capacitor of larger capacitance can reduce noise
and improve load transient response, stability, and PSRR.
The output capacitor should be located not more than 0.5
inch from the VOUT pin of the RT9193 and returned to a
clean analog ground.
Figure 1
Bypass Capacitor and Low Noise
Connecting a 22nF between the BP pin and GND pin
significantly reduces noise on the regulator output, it is
critical that the capacitor connection between the BP pin
and GND pin be direct and PCB traces should be as short
as possible. There is a relationship between the bypass
capacitor value and the LDO regulator turn on time. DC
leakage on this pin can affect the LDO regulator output
noise and voltage regulation performance.
Enable Function
The RT9193 features an LDO regulator enable/disable
function. To assure the LDO regulator will switch on, the
EN turn on control level must be greater than 1.2 volts.
The LDO regulator will go into the shutdown mode when
the voltage on the EN pin falls below 0.4 volts. For to
protecting the system, the RT9193 have a quick-discharge
function. If the enable function is not needed in a specific
application, it may be tied to VIN to keep the LDO regulator
in a continuously on state.
Thermal Considerations
Thermal protection limits power dissipation in RT9193.
When the operation junction temperature exceeds 165°C,
the OTP circuit starts the thermal shutdown function turn
the pass element off. The pass element turn on again
after the junction temperature cools by 30°C.
For continue operation, do not exceed absolute maximum
operation junction temperature 125°C. The power
dissipation definition in device is :
PD = (VIN VOUT) x IOUT + VIN x IQ
The maximum power dissipation depends on the thermal
resistance of IC package, PCB layout, the rate of
surroundings airflow and temperature difference between
junction to ambient. The maximum power dissipation can
be calculated by following formula :
PD(MAX) = ( TJ(MAX) TA ) /θJA
Where TJ(MAX) is the maximum operation junction
temperature 125°C, TA is the ambient temperature and
the θJA is the junction to ambient thermal resistance.
Region of Stable COUT ESR vs. Load Current
0.001
0.01
0.1
1
10
100
0 50 100 150 200 250 300
Load Current (mA)
COUT ESR ( )
Instable
Stable
RT9193-15xU5
CIN = COUT = 1μF, X7R
Ω
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For recommended operating conditions specification of
RT9193, where TJ(MAX) is the maximum junction
temperature of the die (125°C) and TA is the maximum
ambient temperature. The junction to ambient thermal
resistance (θJA is layout dependent) for TSOT-23-5/
SOT-23-5 package is 250°C/W, SC-70-5 package is
333°C/W, WDFN-6L 2x2 package is 165°C/W and MSOP-
8 package is 160°C/W on standard JEDEC 51-3 thermal
test board. The maximum power dissipation at TA = 25°C
can be calculated by following formula :
PD(MAX) = (125°C 25°C) / 333 = 300mW for
SC-70-5
PD(MAX) = (125°C 25°C) / 250 = 400mW for
TSOT-23-5/SOT-23-5
PD(MAX) = (125°C 25°C) / 165 = 606mW for
WDFN-6L 2x2
PD(MAX) = (125°C 25°C) / 160 = 625mW for
MSOP-8
The maximum power dissipation depends on operating
ambient temperature for fixed TJ(MAX) and thermal
resistance θJA. For RT9193 packages, the Figure 2 of
derating curves allows the designer to see the effect of
rising ambient temperature on the maximum power
allowed.
Figure 2. Derating Curve for Packages
0
100
200
300
400
500
600
700
0 25 50 75 100 125
Ambient Temperature (°C)
Power Dissipation (mW)
TSOT-23-5/
SOT-23-5
SC 70-5
WDFN-6L 2x2
MSOP-8
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A
A1
e
b
B
D
C
H
L
SC-70-5 Surface Mount Package
Dimensions In Millimeters Dimensions In Inches
Symbol Min Max Min Max
A 0.800 1.100 0.031 0.044
A1 0.000 0.100 0.000 0.004
B 1.150 1.350 0.045 0.054
b 0.150 0.400 0.006 0.016
C 1.800 2.450 0.071 0.096
D 1.800 2.250 0.071 0.089
e 0.650 0.026
H 0.080 0.260 0.003 0.010
L 0.210 0.460 0.008 0.018
Outline Dimension
RICHTEK U D] x» A m RICHTEK
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TSOT-23-5 Surface Mount Package
Dimensions In Millimeters Dimensions In Inches
Symbol Min Max Min Max
A 0.700 1.000 0.028 0.039
A1 0.000 0.100 0.000 0.004
B 1.397 1.803 0.055 0.071
b 0.300 0.559 0.012 0.022
C 2.591 3.000 0.102 0.118
D 2.692 3.099 0.106 0.122
e 0.838 1.041 0.033 0.041
H 0.080 0.254 0.003 0.010
L 0.300 0.610 0.012 0.024
A
A1
e
b
B
D
C
H
L
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A
A1
e
b
B
D
C
H
L
SOT-23-5 Surface Mount Package
Dimensions In Millimeters Dimensions In Inches
Symbol Min Max Min Max
A 0.889 1.295 0.035 0.051
A1 0.000 0.152 0.000 0.006
B 1.397 1.803 0.055 0.071
b 0.356 0.559 0.014 0.022
C 2.591 2.997 0.102 0.118
D 2.692 3.099 0.106 0.122
e 0.838 1.041 0.033 0.041
H 0.080 0.254 0.003 0.010
L 0.300 0.610 0.012 0.024
RICHTEK \ T U MVP} - l m mkm‘ Hal—t» Lfl—D—Ufi mfi D ETAI L RICHTEK
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Dimensions In Millimeters Dimensions In Inches
Symbol Min Max Min Max
A 0.700 0.800 0.028 0.031
A1 0.000 0.050 0.000 0.002
A3 0.175 0.250
0.007 0.010
b 0.200 0.350 0.008 0.014
D 1.950 2.050 0.077 0.081
D2 1.000 1.450 0.039 0.057
E 1.950 2.050 0.077 0.081
E2 0.500 0.850 0.020 0.033
e 0.650 0.026
L 0.300 0.400
0.012 0.016
W-Type 6L DFN 2x2 Package
D
1
E
A3
A
A1
eb
L
D2
E2
SEE DETAIL A
11
2
2
Note : The configuration of the Pin #1 identifier is optional,
but must be located within the zone indicated.
DETAIL A
Pin #1 ID and Tie Bar Mark Options
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Richtek Technology Corporation
14F, No. 8, Tai Yuen 1st Street, Chupei City
Hsinchu, Taiwan, R.O.C.
Tel: (8863)5526789
Richtek products are sold by description only. Richtek reserves the right to change the circuitry and/or specifications without notice at any time. Customers should
obtain the latest relevant information and data sheets before placing orders and should verify that such information is current and complete. Richtek cannot
assume responsibility for use of any circuitry other than circuitry entirely embodied in a Richtek product. Information furnished by Richtek is believed to be
accurate and reliable. However, no responsibility is assumed by Richtek or its subsidiaries for its use; nor for any infringements of patents or other rights of third
parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Richtek or its subsidiaries.
L
D
EE1
e
A
b
A1
A2
Dimensions In Millimeters Dimensions In Inches
Symbol Min Max Min Max
A 0.810 1.100 0.032 0.043
A1 0.000 0.150 0.000 0.006
A2 0.750 0.950 0.030 0.037
b 0.220 0.380 0.009 0.015
D 2.900 3.100 0.114 0.122
e 0.650 0.026
E 4.800 5.000 0.189 0.197
E1 2.900 3.100 0.114 0.122
L 0.400 0.800
0.016 0.031
8-Lead MSOP Plastic Package

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