USB6B1 Datasheet by STMicroelectronics

View All Related Products | Download PDF Datasheet
Description In order to prevent last transients lrom leading to severe damages in a high speed data system, a specific protection has been developed by STMicroelectronics. The USBSBt protects the two input lines against overvoltage. Besides, this device also keeps the power rails in a safe limit thanks to the integrated Transil diode. Benefits I Provides protection for each line and between the supply voltage and GND: 25 A, 8/20 ps. I High ESD protection level: up to level 3 per MIL STD 88307Meth0d 301576 I Separated inputs and outputs (sorcalled 4rpoint structure) to improve ESD susceptibility. I Comprehensive package pinrout for immediate implementation. August 2006 I/Ol I/Oz GND Complies with the tollowin MIL STD 8830 - Method 3015-6 class 3 C :100 pF 3 positive strikes and 3 negative st IEC 61000-4—2 level 4 15 kV (air discha 8 kV (Contact dis Flev 1O
August 2006 Rev 10 1/9
9
USB6B1
Data line protection
Applications
Where transient overvoltage protection in
sensitive equipment is required, such as:
Universal Serial Bus ports
RS-423 interfaces
RS-485 interfaces
ISDN equipment
T1/E1 line cards
HDSL / ASDL interfaces
Features
Full diode bridge with integrated clamping
protection
Breakdown voltage: VBR = 6 V min.
Peak pulse power dissipation: PPP = 500 W
(8/20 µs)
Very low capacitance, compatible with high
debit data or signal rates.
Description
In order to prevent fast transients from leading to
severe damages in a high speed data system, a
specific protection has been developed by
STMicroelectronics.
The USB6B1 protects the two input lines against
overvoltage. Besides, this device also keeps the
power rails in a safe limit thanks to the integrated
Transil diode.
Benefits
Provides protection for each line and between
the supply voltage and GND: 25 A, 8/20 µs.
High ESD protection level: up to level 3 per MIL
STD 883C-Method 3015-6
Separated inputs and outputs (so-called 4-point
structure) to improve ESD susceptibility.
Comprehensive package pin-out for immediate
implementation.
Order Codes
Functional diagram
Complies with the following standards:
Part Numbers Marking
USB6B1 USB62
USB6B1RL USB62
MIL STD 883C - Method 3015-6
class 3 C = 100 pF R = 1500
3 positive strikes and 3 negative strikes (F = 1 Hz)
IEC 61000-4-2 level 4
15 kV (air discharge)
8 kV (contact discharge)
SO-8
VCC VCC
I/O1I/O1
I/O2I/O2
GNDGND
www.st.com
Characteristics USB6B1
2/9
1 Characteristics
Table 1. Absolute maximum ratings
Symbol Parameter Value Unit
VPP Peak pulse voltage
IEC61000-4-2 contact discharge
IEC61000-4-2 air discharge
MIL STD883C-Method 30 15-6
8
15
4
kV
PPP Peak pulse power 8/20 µs 500 W
IPP Peak pulse current 8/20 µs 25 A
2/10 µs 40
Tstg
Top
Storage temperature range
Operating temperature range
- 55 to + 150
- 40 to + 85
° C
° C
TLLead solder temperature (10 s duration) 260 ° C
Table 2. Electrical characteristics (Tamb = 25° C)
Symbol Parameter
Value
Unit
Min Typ Max
VBR Breakdown voltage between VBUS and GND IR = 1 mA 6 V
IRM Leakage current VRM = 5.25 V 10 µA
C
Capacitance between pins D+ and D-
VOSC = 30 mV, F = 1 MHz, VR = 0 V
VCC
not connected 15 pF
Capacitance between pins D+(or D-) and GND
VOSC = 30 mV, F = 1 MHz, VR = 5 V VCC = 5 V 25 pF
USB6B1 Characteristics
3/9
Figure 1. Peak power dissipation versus
initial junction temperature
Figure 2. Relative variation of leakage
current versus junction
temperature (typical values)
Figure 3. Relative variation of breakdown
voltage versus junction temperature
(typical values)
-40 -20 0 20 40 60 80 100 120 140 160
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
P [T initial]/P [T initial=25°C]
pp j pp j
T initial(°C)
j
I [T ] / I [T =25°C]
Rj Rj
-40 -20 0 20 40 60 80 100 120 140
0.1
1.0
10.0
T (°C)
j
-40 -20 0 20 40 60 80 100 120 140
0.90
0.95
1.00
1.05
1.10 V [T ] / V [T =25°C]
BR j BR j
T (°C)
j
Technical information USB6B1
4/9
2 Technical information
2.1 Surge protection
The USB6B1 is optimized to perform surge protection based on the rail to rail topology.
The clamping voltage VCL can be estimated as follow:
VCL+ = VCC + VF for positive surges
VCL - = - VF for negative surges
with: VF =Vt + rd.Ip
VF = forward drop voltage, Vt = forward drop threshold voltage
Note: The estimations do not take into account phenomena due to parasitic inductances.
2.2 How to ensure good ESD protection
While the USB6B1 provides a high immunity to ESD surge, an efficient protection depends
on the layout of the board. In the same way, with the rail to rail topology, the track from the
VCC pin to the power supply and from the GND pin to GND voltage must be as short as
possible to avoid overvoltages due to parasitic phenomena (see Figure 4.)
It’s often harder to connect the power supply near to the USB6B1 unlike the ground thanks
to the ground plane that allows a short connection. To ensure the same efficiency for
positive surges when the connections can’t be short enough, we recommend to putting a
100 nF c apacitor close to the USB6B1 between VCC and ground to prevvent these kinds of
overvoltage disturbances (see Figure 5.) The addition of this capacitor offers better
protection by providing a constant voltage during the surge.
Figure 6. shows the improvement of the ESD protection according to the recommendations
described above.
Important: An imortant precaution to take is to put the protection device closer to the disturbance
source (generally the connection).
Figure 4. Surge behavior Figure 5. ESD behavior: optimized
layout and addition of a
100 nF capacitor
Lw
VI/O
ESD
SURGE
GND
I/O
+Vcc
Vf Lw di
dt
Lw di
dt
Vcl+ = Vcc+Vf+Lw di
dt surge >0
-Vf- Lw di
dt surge <0
Vcl- =
t
tr=1ns
Vcc+Vf
Lw di
dt
Vcl+
POSITIVE
SURGE -Lw di
dt
t
tr=1ns
-Vf
Vcl-
NEGATIVE
SURGE
REF1=GND
VI/O
ESD
SURGE
I/O
REF2=+Vcc
C=100nF
Lw
Vcl+ = Vcc+Vf
-Vf
surge >0
surge <0
Vcl- =
t
Vcl+
POSITIVE
SURGE
t
Vcl-
NEGATIVE
SURGE
LJ LJ LJ LJ The capamtance between the I/O transmission wires provides at the 12 Mbii/s data rate, thus aliowing compatibility With USB Avaiiable in a compam 5078 this proiective element requires eases the PCB layout thanks to its direct compatibility with the
USB6B1 Technical information
5/9
2.3 Universal Serial Bus
The data transmission standard, Universal Serial Bus (USB) is being driven by market
leaders in the world of Computer and Telecommunications, including Compaq, DEC,
IBM, Intel, Microsoft, NEC and Nortel, and has become a leading transmission protocol.
This standard mainly provides simplified interconnectivity. Specialized ports on the back of
the present PC will largely be replaced by USB ports. Many peripherals such as printers,
key-boards, monitors and joysticks use USB ports.
The USB offers high speed communication rates up to 480 Mbit/s. Only two wires (D+, D-)
are required for data transfer. Additionally, limited amount of power for USB devices located
on the downstream can also be transmitted on two separate conductors within the same
cable.
2.4 Protection to support USB
Designers dealing with the USB chips are concerned about electrostatic discharge
sensitivity (ESD) of their USB controller ICs.
The USB controller is more than just a driver / receiver; it acts as a microcontroller which
manages power and direct signal traffic. This complexity increases its cost over
conventional devices. Therefore, a failure of a USB port could result in costly computer
failure.
In order to prevent these fast transients from leading to severe damages in a system, a
specific protection has been developed by STMicroelectronics. The USB6Bx protects not
only the two wires of data transmission, but also keep the power rails in a safe limit.
Figure 6. Recommended configuration for USB port protection
The capacitance between the I/O transmission wires provides no significant signal distortion
at the 12 Mbit/s data rate, thus allowing compatibility with USB standard.
Available in a compact SO-8 this protective element requires minimal board space and
eases the PCB layout thanks to its direct compatibility with the USB connector pin-out.
1
USB
IC
VBUS
D+
D-
GND
USB output
connector
Telecom and daiacom applications 3 6/9 Telecom and datacom Figure 7. ISBN U interface prote USES v » 5 u 1 1’11 5 fi H i_i L :I ‘ :I Figure 8. T1 IE1 Line Card Proiection. Figure 9. High Speed Line Driver] Receiver Protection +5V Q I I b 1 g x y, i USEEBI
Telecom and datacom applications USB6B1
6/9
3 Telecom and datacom applications
Figure 7. ISDN U interface protection
Figure 8. T1 / E1 Line Card Protection.
Figure 9. High Speed Line Driver / Receiver Protection
USB6Bx 3* SMP100
DC Power
Source
LT
+Vcc
RTIP USB6B1
USB6B1
RRING
TTIP
TRING
SMP75-8 or SMP100-8
SMP75-8 or SMP100-8
+Vcc
+Vcc
DRIVER
SM6T6V8A
USB6B1
INPUT
+5V
RECEIVER
SM6T6V8A
USB6B1
OUTPUT
+5V
+Vcc
+Vcc
US BB Fl
USB6B1 Ordering information scheme
7/9
4 Ordering information scheme
5 Package information
Epoxy meets UL94, V0
USB 6 B1 RL
USB Protection
Breakdown voltage
Packaging
6 = 6V min.
RL = Tape & reel
Blank = Tube
Package
B1 = SO-8
Table 3. SO-8 dimensions
Ref.
Dimensions
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A 1.75 0.069
A1 0.1 0.25 0.004 0.010
A2 1.25 0.049
b 0.28 0.48 0.011 0.019
C 0.17 0.23 0.007 0.009
D 4.80 4.90 5.00 0.189 0.193 0.197
E 5.80 6.00 6.20 0.228 0.236 0.244
E1 3.80 3.90 4.00 0.150 0.154 0.157
e 1.27 0.050
h 0.25 0.50 0.010 0.020
L 0.40 1.27 0.016 0.050
L1 1.04 0.041
k°0808
ccc 0.10 0.004
E1
D
8
41
5
E
k
h x 45°
L
L1
C
(Seating
Plane) 0.25mm
(Gage Plane)
e
A
A2
bA1
ccc C
C
L4
Ordering information USB6B1
8/9
Figure 10. SO-8 footprint (dimensions in mm)
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
6 Ordering information
7 Revision history
6.8
4.2
1.27
0.6
Ordering code Marking Package Weight Base qty Delivery mode
USB6B1 USB62 SO-8 0.077 g 100 Tube
USB6B1RL USB62 2500 Tape and reel
Date Revision Description of Changes
Oct-2003 6A Previous issue.
03-May-2005 7 Figure 1 on page 1: dots connection corrected.
22-Feb-2006 8 Marking typing error corrected on page 1 and 7.
16-Aug-2006 9 Reformated to current standard. ECOPACK statement
added. SO-8 package dimensions corrected.
USB6B1
9/9
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such
third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT
RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING
APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY,
DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE
GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
© 2006 STMicroelectronics - All rights reserved
STMicroelectronics group of companies
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan -
Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America
www.st.com

Products related to this Datasheet

TVS DIODE 5.25V 8SO
TVS DIODE 5.25V 8SO
TVS DIODE 5.25V 8SO
TVS DIODE 5.25V 8SO