AP2162A/72A Datasheet by Diodes Incorporated

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Lem-he: Grew AP2162A/AP2172A Document number 0532192 Rev 472 E l: l: l: |_||_||_||_| 1 0! 16 www.diodes.com
AP2162A/ AP2172A
Document number: DS32192 Rev. 4 - 2
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AP2162A/ AP2172A
1A DUAL CHANNEL CURRENT-LIMITED
POWER SWITCH WITH OUTPUT DISCHARGE
Description
The AP2162A and AP2172A are dual channel current-limited
integrated high-side power switches optimized for Universal Serial
Bus (USB) and other hot-swap applications. The family of devices
complies with USB standards and available with both polarities of
Enable input.
The devices have fast short-circuit response time for improved overall
system robustness, and have integrated output discharge function to
ensure completely controlled discharging of the output voltage
capacitor. They provide a complete protection solution for application
subject to heavy capacitive loads and the prospect of short circuit,
and offer reverse current blocking, over-current, over-temperature
and short-circuit protection, as well as controlled rise time and under-
voltage lockout functionality. A 7ms deglitch capability on the open-
drain flag output prevents false over-current reporting and does not
require any external components.
All devices are available in SO-8, MSOP-8EP and U-DFN3030-8
packages.
Features
Dual Channel Current-Limited Power Switch with Output
Discharge
Fast Short-Circuit Response Time: 2µs
1.4A Accurate Current Limiting
Reverse Current Blocking
85m On-Resistance
Input Voltage Range: 2.7V - 5.5V
Built-In Soft-Start with 0.6ms Typical Rise Time
Short Circuit and Thermal Protection
Fault Report (FLG) with Blanking Time (7ms typ)
ESD protection: 2kV HBM, 300V MM
Active High (AP2172A) or Active Low (AP2162A) Enable
Ambient Temperature Range: -40°C to +85°C
SO-8, MSOP-8EP and DFN3030E-8 (Exposed Pad): Available
in “Green” Molding Compound (No Br, Sb)
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
UL Recognized, File Number E322375
IEC60950-1 CB Scheme Certified
Pin Assignments
SO-8
( Top View )
1
2
3
4
8
7
6
5
FLG1
OUT1
FLG2
OUT2
GND
EN2
EN1
IN
MSOP-8EP
1
2
3
4
8
7
6
5
FLG1
OUT1
FLG2
OUT2
GND
EN2
EN1
IN
( Top View )
( Top View )
EN2
GND FLG1
1
2
IN
3
4
6
5
8
7
FLG2
EN1
OUT1
OUT2
U-DFN3030-8
Applications
LCD TVs & Monitors
Set-Top-Boxes, Residential Gateways
Laptops, Desktops, Servers,
Printers, Docking Stations, HUBs
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
AP2162A/ APZW 72A 2 0116 Document number 0532192 Rev 4 2 www.diodes.com
AP2162A/ AP2172A
Document number: DS32192 Rev. 4 - 2
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AP2162A/ AP2172A
Typical Applications Circuit
1uF
IN
GND
EN2
OUT1
ON
10uF*
Power Supply
2.7V to 5.5V 1uF
OFF
FLG1
Load
10k10k
FLG2
EN1
OUT2
10uF*1uF
Load
AP 2172 A Enable Active High
Note: * USB 2.0 requires 120 F per hub
Available Options
Part Number Channel Enable Pin
(EN) Current Limit
(typ) Recommended Maximum
Continuous Load Current
AP2162A 2 Active Low 1.4A 1.0A
AP2172A 2 Active High 1.4A 1.0A
Pin Descriptions
Pin Name
Pin Number
Function
SO-8 MSOP-8EP
U-DFN3030-8
GND 1 1 Ground
IN 2 2 Voltage input pin
EN1 3 3 Switch 1 enable input, active low (AP2142A) or active high (AP2152A)
EN2 4 4 Switch 2 enable input, active low (AP2142A) or active high (AP2152A)
FLG2 5 5 Switch 2 over-current and over-temperature fault report; open-drain flag is active low when triggered
OUT2 6 6 Switch 2 voltage output pin
OUT1 7 7 Switch 1 voltage output pin
FLG1 8 8 Switch 1 over-current and over-temperature fault report; open-drain flag is active low when triggered
Exposed Pad Exposed Pad
Exposed Pad:
It should be connected to GND and thermal mass for enhanced thermal impedance.
It should not be used as electrical ground conduction path.
T? f BLUES D Din—E |_ {D C} |_ “LIL. .»_UL. *T Lg AP2162A/ APZT 72A Dncumenlnumber 0532192 Rev 4 2
AP2162A/ AP2172A
Document number: DS32192 Rev. 4 - 2
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AP2162A/ AP2172A
Functional Block Diagram
Thermal
Sense
Driver
FLG2
OUT2
GND
IN
EN2
UVLO
Current
Limit
D eg litch
Thermal
Sense
Driver
UVLO
Current
Limit
D eg litch
OUT1
FLG1
EN1
GND
Current
Sense
Current
Sense
AP2162A, AP2172A
Discharge
Control
Discharge
Control
Absolute Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Symbol Parameter Ratings Unit
ESD HBM Human Body Model ESD Protection 2 kV
ESD MM Machine Model ESD Protection 300 V
VIN Input Voltage 6.5 V
VOUT Output Voltage VIN +0.3 V
VEN , VFLG Enable Voltage 6.5 V
ILOAD Maximum Continuous Load Current Internal Limited A
TJ(MAX) Maximum Junction Temperature 150 °C
TST Storage Temperature Range (Note 4) -65 to +150 °C
Note: 4. UL Recognized Rating from -30°C to +70°C (Diodes qualified TST from -65°C to +150°C)
Recommended Operating Conditions (@TA = +25°C, unless otherwise specified.)
Symbol Parameter Min Max Unit
VIN Input Voltage 2.7 5.5 V
IOUT Output Current 0 1.0 A
VIH High-Level Input Voltage on EN or EN 2 VIN V
VIL Low-Level Input Voltage on EN or EN 0 0.8 V
TA Operating Ambient Temperature Range -40 +85 °C
AP2162A/ APZT 72A 4 of 16 Ducumenlnumber 0532192 Rev 4 2 www.diodes.cnm
AP2162A/ AP2172A
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AP2162A/ AP2172A
Electrical Characteristics (@TA = +25°C, VIN = +5.0V, unless otherwise specified.)
Symbol Parameter Test Conditions (Note 5) Min Typ Max Unit
VUVLO Input UVLO 1.6 2.0 2.4 V
ISHDN Input Shutdown Current Disabled, IOUT = 0 0.1 1 µA
IQ Input Quiescent Current, Dual Enabled, IOUT = 0 115 180 µA
ILEAK Input Leakage Current Disabled, OUT grounded 1 µA
IREV Reverse Leakage Current Disabled, VIN = 0V, VOUT = 5V, IREV at VIN 0.01 0.1 µA
RDS(ON) Switch On-Resistance
VIN = 5V, IOUT = 1A,
TA = +25°C
SO-8 90 110
m
MSOP-8EP,
U-DFN3030-8 85 105
VIN = 5V, IOUT = 1A, -40°C TA +85°C 135
VIN = 3.3V, IOUT = 1A,
TA = +25°C
SO-8 110 130
MSOP-8EP,
U-DFN3030-8 105 125
VIN = 3.3V, IOUT = 1A, -40°C TA +85°C 170
ILIMIT Over-Load Current Limit VIN = 5V, VOUT = 4V, CL = 10µF -40°C TA +85°C 1.1 1.4 1.7 A
ILIMIT_G Ganged Over-Load Current Limit VIN = 5V, VOUT = 4.8V, OUT1 &
OUT2 tied together, CL = 10µF -40°C TA +85°C 2.2 2.8 3.4 A
ITrig Current Limiting Trigger Threshold Output Current Slew rate (<100A/s), CL = 10µF 1.8 A
ITrig_G Ganged Current Limiting Trigger
Threshold OUT1 & OUT2 tied together, Output Current Slew rate
(<100A/s), CL = 10µF 3.6 A
IOS Short-Circuit Current per Channel OUTx connected to ground, device enabled into short
circuit, CL = 10µF 1.4 A
IOS_G Ganged Short-Circuit Current OUT1 & OUT2 connected to ground, device enabled into
short-circuit, CL = 10µF 2.2 2.8 3.4 A
TSHORT Short-Circuit Response Time VOUT = 0V to IOUT = ILIMIT (output shorted to ground) 2 µs
VIL EN Input Logic Low Voltage VIN = 2.7V to 5.5V 0.8 V
VIH EN Input Logic High Voltage VIN = 2.7V to 5.5V 2 V
ISINK EN Input Leakage VEN = 0V to 5.5V 1 µA
ILEAK-O Output Leakage Current Disabled, VOUT = 0V 0.5 1 µA
TR Output Turn-On Rise Time CL = 1µF, RLOAD = 5 0.6 1.5 ms
TF Output Turn-Off Fall Time CL = 1µF, RLOAD = 5 0.05 0.3 ms
TD(ON) Output Turn-On Delay Time CL = 100µF, RLOAD = 5 0.2 0.5 ms
TD(OFF) Output Turn-Off Delay Time CL = 100µF, RLOAD = 5 0.1 0.3 ms
RFLG FLG Output FET On-Resistance IFLG = 10mA 20 40
IFOH FLG Off Current VFLG = 5V 0.01 1 µA
TBlank FLG Blanking Time CL = 10µF 4 7 15 ms
RDIS Discharge Resistance (Note 6) VIN = 5V, disabled, IOUT =1mA 100
TSHDN Thermal Shutdown Threshold Enabled, RLOAD =1k 140 C
THYS Thermal Shutdown Hysteresis 25 C
JA Thermal Resistance Junction-to-Ambient
SO-8 (Note 7) 115
°C/W
MSOP-8EP (Note 8) 75
U-DFN3030-8 (Note 8) 60
Notes: 5. Pulse-testing techniques maintain junction temperature close to ambient temperature; thermal effects must be taken into account separately.
6. The discharge function is active when the device is disabled (when enable is de-asserted or during power-up / power-down when VIN < VUVLO). The
discharge function offers a resistive discharge path for the external storage capacitor for limited time.
7. Test condition for SO-8: Device mounted on FR-4 substrate PCB with minimum recommended pad layout.
8. Test condition for MSOP-8EP and U-DFN3030-8: Device mounted on 2” x 2” FR-4 substrate PCB, 2oz copper, with minimum recommended pad on top
layer and thermal vias to bottom layer ground plane.
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AP2162A/ AP2172A
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AP2162A/ AP2172A
Typical Performance Characteristics
VEN
90%
VOUT
TD(ON)
10%
TD(OFF)
50% 50%
TR
10%
90%
TF
VEN
90%
VOUT
TD(ON)
10%
TD(OFF)
50% 50%
TR
10%
90%
TF
Figure 1 Voltage Waveforms: AP2162A (left), AP2172A (right)
Figure 2 Response Time to Short Circuit Waveform
All Enable Plots are for AP2162A Active Low
Turn-On Delay and Rise Time
500µs/div
Turn-Off Delay and Fall Time
500µs/div
Vout
2V/div
EN
5V/div
CL=1F
TA= +25°C
RL=5
Vout
2V/div
EN
5V/div
CL=1F
TA= +25°C
RL=5
Iin
500mA/div Iin
500mA/div
1“ .“ w a: m WT T ., —/ _ w AP2162A/AP2172A 6 al 16 Document number 0532192 Rev 472 www.diodes.com
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Typical Performance Characteristics (cont.)
Turn-On Delay and Rise Time
500µs/div
Turn-Off Delay and Fall Time
500µs/div
Short Circuit Current,
Device Enabled Into Short
500µs/div
Inrush Current with
Different Load Capacitance
500µs/div
2 Load Connected to Enabled Device
2ms/div
1 Load Connected to Enabled Device
2ms/div
Vout
2V/div
EN
5V/div
CL=100F
TA= +25°C
RL=5
Vout
2V/div
EN
5V/div
CL=100F
TA= +25°C
RL=5
Iin
500mA/div Iin
500mA/div
Iout
500mA/div
EN
5V/div
VIN=5V
TA= +25°C
CL=1F
Iin
500mA/div
EN
5V/div
VIN=5V
TA= +25°C
RL=5
CL=470F CL=220F
CL=100
F
VIN=5V
TA= +25°C
CL=1F
FLG
2V/div
Iout
1A/div
VIN=5V
TA= +25°C
CL=1F
FLG
2V/div
Iout
1A/div
AP2162A/AP2172A 7 0116 Document number 0532192 Rev 472 www.diodes.com
AP2162A/ AP2172A
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AP2162A/ AP2172A
Typical Performance Characteristics (cont.)
Short Circuit with Blanking Time and Recovery
20ms/div
Power On
1ms/div
Power Off
10ms/div
Device Enabled
1ms/div
Device Disabled
1ms/div
UVLO Increasing
1ms/div
Iout
1A/div
Vout
5V/div
FLG
5V/div
TA= +25°C
CL=1F
RL=5
Vout
5V/div
FLG
5V/div
Iout
500mA/div
Vin
5V/div
VIN=5V
TA= +25°C
CL=1F
TA= +25°C
CL=1F
RL=5
Vout
5V/div
FLG
5V/div
Iout
500mA/div
Vin
5V/div
TA= +25°C
CL=1F
RL=5
Vout
5V/div
FLG
5V/div
Iout
500mA/div
EN
5V/div
TA= +25°C
CL=1F
RL=5
FLG
5V/div
Iout
500mA/div
EN
5V/div
Vout
5V/div TA= +25°C
CL=1F
RL=5
Vin
2V/div
Iout
500mA/div
Vout
5V/div
AP2162A/AP2172A 5 0116 Document number 0532192 Rev 472 www.diodes.com
AP2162A/ AP2172A
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Typical Performance Characteristics (cont.)
UVLO Decreasing
10ms/div
UVLO Increasing (No Load)
1ms/div
UVLO Decreasing (No Load)
20ms/div
Channel 1 Enabled and Shorted
with Channel 2 Enabled
5ms/div
Channel 2 Enabled and Shorted
with Channel 1 Enabled
5ms/div
Channels 1 and 2 Enabled and
Shorted
5ms/div
TA= +25°C
CL=1F
RL=0
Vin
2V/div
Vout
5V/div
TA= +25°C
CL=1F
RL=5
Vin
2V/div
Iout
500mA/div
Vout
5V/div
Vout1
5V/div
FLG1
5V/div
Vout2
5V/div
FLG2
5V/div
TA= +25°C
CL=1F
RL=0
Vin
2V/div
Vout
5V/div
VIN=5V
TA= +25°C
CL=1F
Vout1
5V/div
FLG1
5V/div
Vout2
5V/div
FLG2
5V/div
VIN=5V
TA= +25°C
CL=1F
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AP2162A/ AP2172A
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Typical Performance Characteristics (cont.)
CL=100µF
RL=5
TA= +25°C
CL=100µF
RL=5
TA= +25°C
CL=1µF
RL=5
TA= +25°C
CL=1µF
RL=5
TA= +25°C
Vin=2.7V
Vin=5.5V
Vin=5.0V
Vin=2.7V
Vin=5.0V
Vin=5.5V
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Typical Performance Characteristics (cont.)
CL=1µF
Vin=5V
Vin=3.3V
Vin=3.3V
Vin=5V
UVLO Falling
UVLO Rising
VIN=5V
VOUT=4V
CL=1µF
VIN=5V
TA= +25°C
CL=1µF
TA= +25°C
CL=1µF
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Application Information
Power Supply Considerations
A 0.1F to 1F X7R or X5R ceramic bypass capacitor between IN and GND, close to the device, is recommended. Placing a high-value electrolytic
capacitor on the input and output pin(s) is recommended when the output load is heavy. This precaution reduces power-supply transients that may
cause ringing on the input. Additionally, bypassing the output with a 1F ceramic capacitor improves the immunity of the device to short-circuit
transients.
Over-Current and Short Circuit Protection
An internal sensing FET is employed to check for over-current conditions. Unlike current-sense resistors, sense FETs do not increase the series
resistance of the current path. When an overcurrent condition is detected, the device maintains a constant output current and reduces the output
voltage accordingly. Complete shutdown occurs only if the fault stays long enough to activate thermal limiting.
Three possible overload conditions can occur. In the first condition, the output has been shorted to GND before the device is enabled or before VIN
has been applied. The AP2162A/AP2172A senses the short circuit and immediately clamps output current to a certain safe level namely ILIMIT.
In the second condition, an output short or an overload occurs while the device is enabled. At the instance the overload occurs, higher inrush
current may flow for a very short period of time before the current limit function can react. The input capacitor(s) rapidly discharge through the
device, activating current limit circuitry. Protection is achieved by momentarily opening the P-MOS high-side power switch and then gradually
turning it on. After the current limit function has tripped (reached the over-current trip threshold), the device switches into current limiting mode and
the current is clamped at ILIMIT. The threshold for activating current limiting is 1.4A typical per channel.
In the third condition, the load has been gradually increased beyond the recommended operating current. The current is permitted to rise until the
current-limit threshold (ITRIG) is reached or until the thermal limit of the device is exceeded. The AP2162A/AP2172A is capable of delivering current
up to the current-limit threshold without damaging the device. Once the threshold has been reached, the device switches into its current limiting
mode and is set at ILIMIT.
FLG Response
When an over-current or over-temperature shutdown condition is encountered, the FLG open-drain output goes active low after a nominal 7-ms
deglitch timeout. The FLG output remains low until both over-current and over-temperature conditions are removed. Connecting a heavy capacitive
load to the output of the device can cause a momentary over-current condition, which does not trigger the FLG due to the 7-ms deglitch timeout.
The AP2162A/AP2172A is designed to eliminate false over-current reporting without the need of external components to remove unwanted pulses.
Power Dissipation and Junction Temperature
The low on-resistance of the internal MOSFET allows the small surface-mount packages to pass large current. Using the maximum operating
ambient temperature (TA) and RDS(ON), the power dissipation can be calculated by:
P
D = RDS(ON)× I2
Finally, calculate the junction temperature:
T
J = PD x RJA + TA
Where:
T
A = Ambient temperature C
R
JA = Thermal resistance
P
D = Total power dissipation
Thermal Protection
Thermal protection prevents the IC from damage when heavy-overload or short-circuit faults are present for extended periods of time. The
AP2162A/AP2172A implements a thermal sensing to monitor the operating junction temperature of the power distribution switch. Once the die
temperature rises to approximately 140°C due to excessive power dissipation in an over-current or short-circuit condition the internal thermal sense
circuitry turns the power switch off, thus preventing the power switch from damage. Hysteresis is built into the thermal sense circuit allowing the
device to cool down approximately 25°C before the switch turns back on. The switch continues to cycle in this manner until the load fault or input
power is removed. The FLG open-drain output is asserted when an over-temperature shutdown or over-current occurs with 7-ms deglitch.
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Application Information (cont.)
Under-Voltage Lockout (UVLO)
Under-voltage lockout function (UVLO) keeps the internal power switch from being turned on until the power supply has reached at least 2V, even if
the switch is enabled. Whenever the input voltage falls below approximately 2V, the power switch is quickly turned off. This facilitates the design of
hot-insertion systems where it is not possible to turn off the power switch before input power is removed.
Discharge Function
The discharge function of the device is active when enable is disabled or de-asserted. The discharge function with the N-MOS power switch
implementation is activated and offers a resistive discharge path for the external storage capacitor. This is designed for discharging any residue of
the output voltage when either no external output resistance or load resistance is present at the output.
Host/Self-Powered HUBs
Hosts and self-powered hubs (SPH) have a local power supply that powers the embedded functions and the downstream ports. This power supply
must provide from 5.25V to 4.75V to the board side of the downstream connection under both full-load and no-load conditions. Hosts and SPHs are
required to have current-limit protection and must report over-current conditions to the USB controller. Typical SPHs are desktop PCs, monitors,
printers, and stand-alone hubs.
Generic Hot-Plug Applications
In many applications it may be necessary to remove modules or pc boards while the main unit is still operating. These are considered hot-plug
applications. Such implementations require the control of current surges seen by the main power supply and the card being inserted. The most
effective way to control these surges is to limit and slowly ramp the current and voltage being applied to the card, similar to the way in which a
power supply normally turns on. Due to the controlled rise times and fall times of the AP2162A/AP2172A, these devices can be used to provide a
softer start-up to devices being hot-plugged into a powered system. The UVLO feature of the AP2162A/AP2172A also ensures that the switch is off
after the card has been removed, and that the switch is off during the next insertion.
By placing the AP2162A/AP2172A between the VCC input and the rest of the circuitry, the input power reaches these devices first after insertion.
The typical rise time of the switch is approximately 1ms, providing a slow voltage ramp at the output of the device. This implementation controls
system surge current and provides a hot-plugging mechanism for any device.
Ordering Information
Part Number Package
Code Packaging 7”/13” Tape and Reel
Quantity Part Number Suffix
AP21X2ASG-13 S SO-8 250/Tape & Reel -13
AP21X2AMPG-13 MP MSOP-8EP 2500/Tape & Reel -13
AP21X2AFGEG-7 FGE U-DFN3030-8 3000/Tape & Reel -7
If L°9°<—73::yfl e="" part="" number=""><— 5="" :="" active="" low="" 7:="" active="" high="" h="" h="" h="" h="" 3::="" :7="" 1x)‘(_="" fl="" flmix="" x="" i="" l”—="" u="" u="" u="" u="" (topvlnwi="" iii="" |7|="" iii="" ifi="" —h="" a~z:="" green="" —p="" msop-bep="" 1="" :="" year="" :="" o~9="" eek:="" a~z="" 1~25="" week:="" a~z="" :="" 27~52="" week:="" 1="" represents="" 52="" and="" 53="" week="">
AP2162A/ AP2172A
Document number: DS32192 Rev. 4 - 2
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AP2162A/ AP2172A
Marking Information
(1) SO-8
AP21X X A
( Top view )
YY WW X X
Part Number
Logo
WW : Week : 01~52; 52
YY : Year : 08, 09,10~
G : Green
X : Internal Code
8765
1234
6 : Active Low
7 : Active High
2 : 2 Channel
represents 52 and 53 week
(2) MSOP-8EP
(3) U-DFN3030-8
XX : Identification Code
( Top View )
X : A~Z : Green
XY
X X
W
Y : Year : 0~9
W : Week : A~Z : 1~26 week;
a~z : 27~52 week; z represents
52 and 53 week
Part Number Package Identification Code
AP2162AFGEG-7 U-DFN3030-8 AA
AP2172AFGEG-7 U-DFN3030-8 AB
Gauge P‘ane y mane H? Jéfi%% , +Hf i m + \« \HM k AP2162A/AP2172A Document number 0532192 Rev 472 14 a! 16 www.diodes.com
AP2162A/ AP2172A
Document number: DS32192 Rev. 4 - 2
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© Diodes Incorporated
AP2162A/ AP2172A
Package Outline Dimensions (All dimensions in mm.)
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.
(1) Package Type: SO-8
(2) Package Type: MSOP-8EP
(3) Package Type: U-DFN3030-8
SO-8
Dim Min Max
A - 1.75
A1 0.10 0.20
A2 1.30 1.50
A3 0.15 0.25
b 0.3 0.5
D 4.85 4.95
E 5.90 6.10
E1 3.85 3.95
e 1.27 Typ
h - 0.35
L 0.62 0.82
 0 8
All Dimensions in mm
MSOP-8EP
Dim Min Max Typ
A - 1.10 -
A1 0.05 0.15 0.10
A2 0.75 0.95 0.86
A3 0.29 0.49 0.39
b 0.22 0.38 0.30
c 0.08 0.23 0.15
D 2.90 3.10 3.00
D1 1.60 2.00 1.80
E 4.70 5.10 4.90
E1 2.90 3.10 3.00
E2 1.30 1.70 1.50
E3 2.85 3.05 2.95
e - - 0.65
L 0.40 0.80 0.60
a 8° 4°
x - - 0.750
y - - 0.750
All Dimensions in mm
U-DFN3030-8
Type E
Dim Min Max Typ
A 0.57 0.63 0.60
A1 0 0.05 0.02
A3   0.15
b 0.20 0.30 0.25
D 2.95 3.05 3.00
D2 2.15 2.35 2.25
E 2.95 3.05 3.00
e   0.65
E2 1.40 1.60 1.50
L 0.30 0.60 0.45
Z   0.40
All Dimensions in mm
Gauge Plane
Seating Plane
Detail ‘A
Detail ‘A
E
E1
h
L
D
eb
A2
A1
A
45
°
7
°~
9
°
A3
0.254
1
D
A
A1
A2
E
e
y
x
Seating Plane
Gauge Plane
L
D
8Xb
See Detail C
Detail C
c
a
E1
E3
A3
E2
4X10°
4X10°
0.25
D1
b (x8)
e
L (x8)
A1
A3
Z (x4)
D
D2
E2
E
A
AP2162A/ AP2172A
Document number: DS32192 Rev. 4 - 2
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© Diodes Incorporated
AP2162A/ AP2172A
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
(1) Package Type: SO-8
(2) Package Type: MSOP-8EP
(3) Package Type: U-DFN3030-8
Dimensions Value (in mm)
X 0.60
Y 1.55
C1 5.4
C2 1.27
Dimensions Value
(in mm)
C 0.650
G 0.450
X 0.450
X1 2.000
Y 1.350
Y1 1.700
Y2 5.300
Dimensions Value (in mm)
C 0.65
C1 2.35
X 0.30
Y 0.65
Y1 1.60
Y2 2.75
X
C1
C2
Y
G
X C
Y
Y2 Y1
X1
Y
(x8)
X (x8) C
C1
Y1 Y2
AP2162A/AP2172A 16 ml 16 Document number D532192 Rev 4 , 2 WWW.diOdeS.COm
AP2162A/ AP2172A
Document number: DS32192 Rev. 4 - 2
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© Diodes Incorporated
AP2162A/ AP2172A
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
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This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2013, Diodes Incorporated
www.diodes.com

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