FPF1005-06 Datasheet by ON Semiconductor

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1Publication Order Number:
FPF1006/D
©2007 Semiconductor Components Industries, LLC.
October-2017, Rev. 7
FPF1005-FPF1006 IntelliMAXTM Advanced Load Management Products
FPF1005-FPF1006
IntelliMAXTM Advanced Load Management Products
Features
1.2 to 5.5V Input Voltage Range
Typical RDS(ON) = 50m @ VIN = 5.5V
Typical RDS(ON) = 55m @ VIN = 3.3V
ESD Protected, above 2000V HBM
Applications
PDAs
Cell Phones
GPS Devices
MP3 Players
Digital Cameras
Peripheral Ports
Hot Swap Supplies
RoHS Compliant
General Description
The FPF1005 & FPF1006 are low RDS P-Channel MOSFET
load switches with CMOS controlled turn-on targeting small
package load switch applications. The input voltage range
operates from 1.2V to 5.5V. Switch control is by a logic
input (ON) capable of interfacing directly with low voltage
control signals. In FPF1006, 120 on-chip load resistor is
added for output quick discharge when switch is turned off.
Both FPF1005 & FPF1006 are available in a small 2X2
MicroFET-6 pin plastic package.
Typical Application Circuit
Ordering Information
Part Switch Input Buffer Output Discharge ON Pin Activity
FPF1005 55m, PMOS Schmitt NA Active HI
FPF1006 55m, PMOS Schmitt 120Active HI
OFF ON ON
VIN
GND
FPF1005/6
VOUT
TO LOAD
-
CIN
COUT
BOTTOM
PIN 1
TOP
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FPF1005-FPF1006 IntelliMAXTM Advanced Load Management Products
Functional Block Diagram
Pin Configuration
Pin Description
Pin Name Function
4, 5 VOUT Switch Output: Output of the power switch
2, 3 VIN Supply Input: Input to the power switch and the supply voltage for the IC
6, 7 GND Ground
1 ON ON/OFF Control Input
CONTROL
LOGIC
VIN
ON
VOUT
GND
Turn-On Slew Rate
Controlled Driver
Output Discharge
(Optional)
ESD protection
FPF1005/6
VOUT
VOUT
ON
MicroFET 2x2 6L BOTTOM
1
2
3
6
5
4
VIN
VIN
GND
7
GND
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FPF1005-FPF1006 IntelliMAXTM Advanced Load Management Products
Absolute Maximum Ratings
Recommended Operating Range
Electrical Characteristics
VIN = 1.2 to 5.5V, TA = -40 to +85°C unless otherwise noted. Typical values are at VIN = 3.3V and TA = 25°C.
Note 1: Package power dissipation on 1square inch pad, 2 oz. copper board
Parameter Min Max Unit
VIN, VOUT
, ON to GND -0.3 6 V
Maximum Continuous Switch Current 1.5 A
Power Dissipation @ TA = 25°C (Note 1) 1.2 W
Operating Temperature Range -40 85 °C
Storage Temperature -65 150 °C
Thermal Resistance, Junction to Ambient 86 °C/W
Electrostatic Discharge Protection HBM 2000 V
MM 200 V
Parameter Min Max Unit
VIN 1.2 5.5 V
Ambient Operating Temperature, TA-40 85 °C
Parameter Symbol Conditions Min Typ Max Unit
Basic Operation
Operating Voltage VIN 1.2 5.5 V
Quiescent Current IQIOUT = 0mA, VIN = VON A
Off Supply Current IQ(off) VON = GND, OUT = open 1 µA
Off Switch Current ISD(off)
VON = GND, VOUT = 0V @ VIN = 5.5V, TA = 85°C 1 µA
VON = GND, VOUT = 0V @ VIN = 3.3V, TA = 25°C 10 100 nA
On-Resistance RON
VIN = 5.5V, TA = 25°C 50 70
m
VIN = 3.3V, TA = 25°C 55 80
VIN = 1.5V, TA = 25°C 95 135
VIN = 1.2V, TA = 25°C 165 250
Output Pull Down Resistance RPD VIN = 3.3V, VON = 0V, TA = 25°C, FPF1006 75 120
ON Input Logic Low Voltage VIL
VIN = 5.5V 1.25
VVIN = 4.5V 1.10
VIN = 1.5V 0.50
ON Input Logic High Voltage VIH
VIN = 5.5V 2.00
VVIN = 4.5V 1.75
VIN = 1.5V 0.75
ON Input Leakage VON = VIN or GND -1 1 µA
Dynamic
Turn on delay tON VIN = 3.3V, RL = 500, CL = 0.1µF, TA = 25°C 10 µs
Turn off delay tOFF
VIN = 3.3V, RL = 500, CL = 0.1µF,
TA = 25°C, FPF1005 50 µs
VIN = 3.3V, RL = 500, CL = 0.1µF,
RL_CHIP = 120, TA = 25°C, FPF1006 10 µs
VOUT Rise Time tRVIN = 3.3V, RL = 500, CL = 0.1µF, TA = 25°C 10 µs
VOUT Fall Time tF
VIN = 3.3V, RL = 500, CL = 0.1µF,
TA = 25°C, FPF1005 100 µs
VIN = 3.3V, RL = 500, CL = 0.1µF,
RL_CHIP = 120, TA = 25°C, FPF1006 10 µs
541va vane: w) a 4 e swam vomxcs 1V7
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FPF1005-FPF1006 IntelliMAXTM Advanced Load Management Products
Typical Characteristics
Figure 1. Quiescent Current vs.VIN Figure 2. ON Threshold vs. VIN
Figure 3. Quiescent Current vs. Temperature Figure 4. Quiescent Current (off) vs. Temperature
Figure 5. ISWITCH-OFF Current vs. Temperature Figure 6. ISWITCH-OFF Current vs. VIN
0
2
4
6
8
10
1234567891
0
SUPPLY VOLTAGE
(
V
)
SUPPLY CURRENT (nA)
V
ON
= V
IN
V
ON
= 0V
0.0
0.5
1.0
1.5
2.0
2.5
12345
6
SUPPLY VOLTAGE (V)
ON THRESHOLD (V)
MAX LIMIT
TYPICAL
0
2
4
6
8
10
12
14
16
-40 -15 10 35 60 85
T
J
, JUNCTION TEMPERATURE (
o
C)
SUPPLY CURRENT (nA)
V
IN
= 3.3V
V
IN
= 5.5V
0
2
4
6
8
10
-40 -15 10 35 60 85
TJ, JUNCTION TEMPERATURE (oC)
SUPPLY CURRENT (nA)
VIN = 3.3V
VIN = 5.5V
0
10
20
30
40
50
60
70
80
90
100
12345
6
SUPPLY VOLTAGE
(
V
)
SUPPLY CURRENT (nA)
0
100
200
300
400
500
600
700
800
-50-250 255075100
TJ, JUNCTION TEMPERATURE (oC)
SUPPLY CURRENT (nA)
VIN = 5.5V
VIN = 3.3V
a 4 5 7 mo suppu VOLTAGE (V)
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FPF1005-FPF1006 IntelliMAXTM Advanced Load Management Products
Typical Characteristics
Figure 7. RON vs. VIN Figure 8. RON vs. Temperature
Figure 9. TON/TOff vs. Temperature Figure 10. TRISE/TFALL vs. Temperature
Figure 11. FPF1005 TON Response Figure 12. FPF1005 TOFF Response
0
50
100
150
200
250
300
350
400
0123456
7
SUPPLY VOLTAGE
(
V
)
ON RESISTANCE (mOhms)
I
OUT
= 1A
0.5
0.7
0.9
1.1
1.3
1.5
-50-250 25507510
0
T
J
, JUNCTION TEMPERATURE (
o
C)
R
ON NORMALIZED
V
IN
= 3.3V
I
OUT
= 1A
10
100
-50-250 255075100
TJ, JUNCTION TEMPERATURE (oC)
TURN ON/OFF TIME (uS)
FPF1005 TOFF
TON
VIN = 3.3V
RL = 500Ω
RL_CHIP = 120Ω, FPF1006
CL = 0.1uF
FPF1006 TOFF
1
10
100
1000
-50-25 0 255075100
TJ, JUNCTION TEMPERATURE (oC)
RISE / FALL TIME (uS)
TRISE
VIN = 3.3V
RL = 500
RL_CHIP = 120, FPF1006
CL = 0.1uF
FPF1006 TFALL
FPF1005 TFALL
VON
2V/DIV
IOUT
10mA/DIV
VOUT
2V/DIV
VON
2V/DIV
IOUT
10mA/DIV
VOUT
2V/DIV
50µs/DIV 50µs/DIV
VIN = 3.3V
CIN = 1µF
COUT = 0.1µF
RL = 500
VIN = 3.3V
CIN = 1µF
COUT = 0.1µF
RL = 500
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FPF1005-FPF1006 IntelliMAXTM Advanced Load Management Products
Typical Characteristics
Figure 13. FPF1005 TON Response Figure 14. FPF1005 TOFF Response
Figure 15. FPF1006 TON Response Figure 16. FPF1006 TOFF Response
Figure 17. FPF1006 TON Response Figure 18. FPF1006 TOFF Response
VON
2V/DIV
IOUT
200mA/DIV
VOUT
2V/DIV
VON
2V/DIV
IOUT
200mA/DIV
VOUT
2V/DIV
50µs/DIV 5µs/DIV
VIN = 3.3V
CIN = 1µF
COUT = 0.1µF
RL = 10
VIN = 3.3V
CIN = 1µF
COUT = 0.1µF
RL = 10
VON
2V/DIV
IOUT
10mA/DIV
VOUT
2V/DIV
VON
2V/DIV
IOUT
10mA/DIV
VOUT
2V/DIV
VIN = 3.3V
CIN = 1µF
COUT = 0.1µF
RL = 500
50µs/DIV 50µs/DIV
VIN = 3.3V
CIN = 1µF
COUT = 0.1µF
RL = 500
VON
2V/DIV
IOUT
200mA/DIV
VOUT
2V/DIV
VON
2V/DIV
IOUT
200mA/DIV
VOUT
2V/DIV
5µs/DIV50µs/DIV
VIN = 3.3V
CIN = 1µF
COUT = 0.1µF
RL = 10
VIN = 3.3V
CIN = 1µF
COUT = 0.1µF
RL = 10
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FPF1005-FPF1006 IntelliMAXTM Advanced Load Management Products
Description of Operation
The FPF1005 & FPF1006 are low RDS(ON) P-Channel load
switches with controlled turn-on. The core of each device is a
55m P-Channel MOSFET and a controller capable of
functioning over a wide input operating range of 1.2-5.5V. The
ON pin, an active HI TTL compatible input, controls the state of
the switch. The FPF1006 contains a 120 on-chip load resistor
for quick output discharge when the switch is turned off.
However, VOUT pin of FPF1006 should not be connected
directly to the battery source due to the discharge mechanism of
the load switch.
Application Information
Typical Application
Input Capacitor
To limit the voltage drop on the input supply caused by transient
in-rush currents when the switch turns-on into a discharged load
capacitor or short-circuit, a capacitor needs to be placed
between VIN and GND. A 1µF ceramic capacitor, CIN, placed
close to the pins is usually sufficient. Higher values of CIN can
be used to further reduce the voltage drop during higher current
application.
Output Capacitor
A 0.1µF capacitor, COUT
, should be placed between VOUT and
GND. This capacitor will prevent parasitic board inductance
from forcing VOUT below GND when the switch turns-off. Due to
the integral body diode in the PMOS switch, a CIN greater than
COUT is highly recommended. A COUT greater than CIN can
cause VOUT to exceed VIN when the system supply is removed.
This could result in current flow through the body diode from
VOUT to VIN.
Board Layout
For best performance, all traces should be as short as possible.
To be most effective, the input and output capacitors should be
placed close to the device to minimize the effects that parasitic
trace inductances may have on normal and short-circuit
operation. Using wide traces or large copper planes for all pins
(VIN, VOUT
, ON and GND) will help minimize the parasitic
electrical effects along with minimizing the case to ambient
thermal impedance.
OFF ON ON
VIN
GND
FPF1005/6
VOUT
-
VIN = 3.3V
CIN
VON = 3.3V
RLCOUT
56 mm 00 mm E“ w.» an FFm n .0 N. V E 1000 AI woo IV
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FPF1005-FPF1006 IntelliMAXTM Advanced Load Management Products
Evaluation Board Layout
FPF1005/6 Demo board has the components and circuitry to demonstrate the load switch functions. Thermal performance of the load
switch can be improved significantly by connecting the middle pad (pin 7) to the GND area of the PCB.
Figure 19. Demo board silk screen top
and component assembly drawing.
Figure 20. Demo board top and surface
mount top layers view.(Pin 7 is connected
to GND).
Figure 21. Demo board bottom layer view.
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