TB0640H - TB3500H Datasheet by Diodes Incorporated

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TB0640H , TBSSOOH to! 6 Document number Dsaoaso Rev 1072 www.diodes.com
TB0640H - TB3500H
Document number: DS30360 Rev. 10 - 2
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TB0640H - TB3500H
100A BIDIRECTIONAL SURFACE MOUNT THYRISTOR SURGE PROTECTIVE DEVICE
Features
100A Peak Pulse Current @ 10/1000μs
400A Peak Pulse Current @ 8/20μs
58 - 320V Stand-Off Voltages
Oxide-Glass Passivated Junction
Bidirectional Protection In a Single Device
High Off-State Impedance and Low On-State Voltage
Helps Equipment Meet GR-1089-CORE, IEC 61000-4-5, FCC
Part 68, ITU-T K.20/K.21, and UL497B
UL Listed Under Recognized Component Index, File Number
156346
Lead Free Finish/RoHS Compliant (Note 1)
Green Molding Compound (No Halogen and Antimony)
(Note 2)
Mechanical Data
Case: SMB
Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Lead Free Plating (Matte Tin Finish). Solderable per
MIL-STD-202, Method 208
Polarity: None; Bidirectional Devices Have No Polarity Indicator
Weight: 0.093 grams (approximate)
Ordering Information (Note 3)
Part Number Case Packaging
TB0640H-13-F SMB 3000/Tape & Reel
TB0720H-13-F SMB 3000/Tape & Reel
TB0900H-13-F SMB 3000/Tape & Reel
TB1100H-13-F SMB 3000/Tape & Reel
TB1300H-13-F SMB 3000/Tape & Reel
TB1500H-13-F SMB 3000/Tape & Reel
TB1800H-13-F SMB 3000/Tape & Reel
TB2300H-13-F SMB 3000/Tape & Reel
TB2600H-13-F SMB 3000/Tape & Reel
TB3100H-13-F SMB 3000/Tape & Reel
TB3500H-13-F SMB 3000/Tape & Reel
Notes: 1. EU Directive 2002/95/EC (RoHS). All applicable RoHS exemptions applied, see EU Directive 2002/95/EC Annex Notes.
2. Product manufactured with Data Code 0924 (week 24, 2009) and newer are built with Green Molding Compound.
3. For packaging details, go to our website at http://www.diodes.com.
Marking Information
Green
Top View Bottom View
xxxxx = Product type marking code (See table on page 2)
= Manufacturers’ code marking
YWW = Date code marking
Y = Last digit of year (ex: 6 for 2006)
WW = Week code (01 to 53)
YWW
xxxxx
m5” 100 50 TB0640H , TBSSOOH 2 a! 6 Dncumenmumber 0530360 Rev 10 2 www.diodes.cnm TIMF
TB0640H - TB3500H
Document number: DS30360 Rev. 10 - 2
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TB0640H - TB3500H
Maximum Ratings @TA = 25°C unless otherwise specified
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitance load, derate current by 20%.
Characteristic Symbol Value Unit
Non-Repetitive Peak Impulse Current @10/1000us I
pp
100 A
Non-Repetitive Peak On-State Current @8.3ms (one-half cycle) ITSM 50 A
Typical Positive Temperature Coefficient for Breakdown Voltage ΔVBR/ΔTJ 0.1 %/°C
Thermal Characteristics
Characteristic Symbol Value Unit
Thermal Resistance, Junction to Lead R
θ
JL 20 °C/W
Thermal Resistance, Junction to Ambient R
θ
JA 100 °C/W
Junction Temperature Range TJ -40 to +150 °C
Storage Temperature Range TSTG -55 to +150 °C
Maximum Rated Surge Waveform
Waveform Standard Ipp (A)
2/10μs GR-1089-CORE 500
8/20μs IEC 61000-4-5 400
10/160μs FCC Part 68 250
10/700μs (Note 4) ITU-T, K.20/K.21 200
10/560μs FCC Part 68 160
10/1000μs GR-1089-CORE 100
Notes: 4. Applied 6kV, 10/700μs waveform
I , PEAK PULSE CURRENT (%)
PP
Peak Value (I )
pp
Half Value
t = rise time to peak value
t = decay time to half value
r
p
t
r
t
p
m5” May 2011 re, Dmdes hvcmpnmled
TB0640H - TB3500H
Document number: DS30360 Rev. 10 - 2
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TB0640H - TB3500H
Electrical Characteristics @TA = 25°C unless otherwise specified
Part Number
Maximum
Rated
Repetitive
Off-State
Voltage
Maximum
Off-State
Leakage
Current @
VDRM
Maximum
Breakover
Voltage
Maximum
On-State
Voltage
@ IT = 1A
Breakover
Current
IBO
Holding Current
IH
Typical
Off-State
Capacitance Marking
Code
VDRM (V) IDRM (uA) VBO (V) VT (V) Min
(mA) Max
(mA) Min
(mA) Max
(mA) CO (pF)
TB0640H 58 5 77 3.5 50 800 150 800 200 T064H
TB0720H 65 5 88 3.5 50 800 150 800 200 T072H
TB0900H 75 5 98 3.5 50 800 150 800 200 T090H
TB1100H 90 5 130 3.5 50 800 150 800 120 T110H
TB1300H 120 5 160 3.5 50 800 150 800 120 T130H
TB1500H 140 5 180 3.5 50 800 150 800 120 T150H
TB1800H 160 5 220 3.5 50 800 150 800 120 T180H
TB2300H 190 5 265 3.5 50 800 150 800 80 T230H
TB2600H 220 5 300 3.5 50 800 150 800 80 T260H
TB3100H 275 5 350 3.5 50 800 150 800 80 T310H
TB3500H 320 5 400 3.5 50 800 150 800 80 T350H
Symbol Parameter
VDRM Stand-off Voltage
IDRM Leakage current at stand-off voltage
VBR Breakdown voltage
IBR Breakdown current
VBO Breakover voltage
IBO Breakover current
IH Holding current (Note 5)
VT On state voltage
IPP Peak pulse current
CO Off-state capacitance (Note 6)
Notes: 5. IH > (VL/RL) If this criterion is not obeyed, the TSPD triggers but does not return correctly to high-resistance state. The surge recovery time does not
exceed 30ms.
6. Off-state capacitance measured at f = 1.0MHz, 1.0VRMS signal, VR = 2VDC bias.
I
BO
V
BR
V
DRM
V
T
V
BO
I
H
I
V
I
BR
I
DRM
I
PP
SE '3 O > z E O D x E: m E: O 2 (D ’3 O o E D a: El: 3 CE 0 m LU E a, O I . 0 2 E 0 g 5 U >: 2 U a n. 0 g D D m m N CE 0 Z NOR
TB0640H - TB3500H
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I , OFF-STATE CURRENT (uA)
(DRM)
T , JUNCTION TEMPERATURE (°C)
Fig. 1 Off-State Current vs. Junction Temperature
J
0.001
0.01
1
0.1
10
100
-25 025 50 75 100 125 150
V = 50V
DRM
0.9
T , JUNCTION TEMPERATURE (°C)
Fig. 2 Relative Variation of Breakdown Voltage
vs. Junction Temperature
J
0.95
1
1.05
1.1
1.15
1.2
-50 -25 0 25 50 75 100 125 150 175
N
O
R
MALIZED B
R
EAKD
O
W
N
V
O
L
T
A
G
E
1
1.05
0.95
-50
N
O
R
MALIZED B
R
EAKD
O
WN V
O
L
T
A
G
E
1.1
-25 075
50
25 125
100 175
150
T , JUNCTION TEMPERATURE
Fig. 3 Relative Variation of Breakover Voltage
vs. Junction Temperature
J
(ºC)
1
10
100
11.5 32.524
3.5 5
4.5
I,
O
N-S
T
A
T
E
C
U
R
R
EN
T
(A)
T
V , ON-STATE VOLTAGE (V)
Fig. 4 On-State Current vs. On-State Voltage
T
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
1.1
1.4
1.3
1.2
-50 -25 025 50 10075 125
N
O
R
MALIZED
H
O
LDIN
G
C
U
R
R
EN
T
T , JUNCTION TEMPERATURE (°C)
J
Fig. 5 Relative Variation of Holding Current vs.
Junction Temperature
0.1
1
110100
N
O
R
MALIZED
C
A
P
A
C
I
T
A
N
C
E
V , REVERSE VOLTAGE (V)
Fig. 6 Relative Variation of Junction Capacitance
vs. Reverse Voltage Bias
R
Dimensions EH F——4 + + TB0640H , TBSSOOH 5 a! 6 Document number Dsaoaso Rev 1072 www.diodes.com
TB0640H - TB3500H
Document number: DS30360 Rev. 10 - 2
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TB0640H - TB3500H
Package Outline Dimensions
Suggested Pad Layout
SMB
Dim Min Max
A 3.30 3.94
B 4.06 4.57
C 1.96 2.21
D 0.15 0.31
E 5.00 5.59
G 0.05 0.20
H 0.76 1.52
J 2.00 2.50
All Dimensions in mm
Dimensions Value (in mm)
Z 6.8
G 1.8
X 2.3
Y 2.5
C 4.3
A
B
C
D
G
H
E
J
Z
X
C
G
Y
TB0640H - TB3500H
Document number: DS30360 Rev. 10 - 2
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TB0640H - TB3500H
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2011, Diodes Incorporated
www.diodes.com

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