FPF2165R Datasheet by ON Semiconductor

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© Semiconductor Components Industries, LLC, 2020
July, 2020 − Rev. 1 1Publication Order Number:
FPF2165R/D
Full Function Load Switch
with Adjustable Current
Limit
FPF2165R
Description
The FPF2165R is a load switch which provides full protection to
systems and loads which may encounter large current conditions. The
device contains a 0.12 W current−limited P−channel MOSFET which
can operate over an input voltage range of 1.8−5.5 V. Internally,
current is prevented from flowing when the MOSFET is off and the
output voltage is higher than the input voltage. Switch control is by a
logic input (ON) capable of interfacing directly with low−voltage
control signals. The FPF2165R contains thermal shutdown protection,
which shuts off the switch to prevent damage to the part when a
continuous over−current condition causes excessive heating.
When the switch current reaches the current limit, the part operates
in a Constant−Current (CC) mode to prohibit excessive currents from
causing damage. The FPF2165R does not turn off after a current limit
fault; it remains in the constant current mode indefinitely. The
minimum current limit is 150 mA.
The FPF2165R is available in a space−saving 6−pin 2 mm x 2 mm
Molded Leadless Package (MLP).
Features
1.8 to 5.5 V Input Voltage Range
Controlled Turn−On
0.15 − 1.5 A Adjustable Current Limit
±10% Current Limit Accuracy vs. Temperature
Under−Voltage Lockout (UVLO)
Thermal Shutdown
< 2 mA Shutdown Current
Fast Current Limit Response Time
5 ms to Moderate Over Currents
30 ns to Hard Shorts
Reverse Current Blocking
These Devices are Pb−Free and are RoHS Compliant
ORDERING INFORMATION
Part Number
Current Limit
[mA]
Current Limit
Blanking Time [ms
]
Auto Restart
Time [ms]
On Pin Activity
Top Mark
Shipping
FPF2165R
150 − 1500
0
NA
Active HI
65R
3000 / Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D
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WDFN6 2x2, 065P
CASE 511CY
(Bottom) (Top)
Pin 1
A
pplications
PDAs
Cell Phones
GPS Devices
MP3 Players
Digital Cameras
Peripheral Ports
Hot Swap Supplies
R
elated Resources
FPF2165R Product Information
THERMAL SHUTDDWN VIN ON VOUT FPF2165R GND FLAGB ISET CONTROL LOGK: CURRENT LIMIT TO LOAD REVERSE CURRENT BLOCKING Vour \SET FLAGB
FPF2165R
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2
Typical Application
Figure 1. Typical Application
+
Block Diagram
Figure 2. Block Diagram
Pin Configuration
Figure 3. Pin Assignment (Top Through View)
6ON
5GND
4FLAGB
1
2
3
7
ISET
VIN
VOUT
FPF2165R
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3
PIN DESCRIPTIONS
Name
Type
1
ISET
2
V
IN
3
V
OUT
4
FLAGB
under−voltage or over−temperature state
5, 7
GND
6
ON
ABSOLUTE MAXIMUM RATINGS
Symbol
Parameter
Min
Max
Unit
V
IN
V
IN
, V
OUT
, ON, FLAGB, ISET to GND
−0.3
6.0
V
P
D
Power Dissipation
1.2
W
T
STG
Operating and Storage Junction Temperature
−65
150
°
C
qJA
Thermal Resistance, Junction to Ambient
86
°
C/W
ESD Electrostatic Discharge
Capability
Human Body Model; JEDEC A1141
4000
V
Charged Device Model; JEDEC C101C
2000
Machine Model; JEDEC A115
400
IEC 61000−4−2
Air Discharge
15000
Contact Discharge
8000
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
Max
Unit
V
IN
Input Voltage
1.8
5.5
V
T
A
Ambient Operating Temperature
−40
85
°
C
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
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FPF2165R
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4
ELECTRICAL CHARACTERISTICS
V
IN = 1.8 to 5.5 V, TA = −40 to +85°C unless otherwise noted. Typical values are at VIN = 3.3 V and TA = 25°C.
Symbol
Parameter
Conditions
Min.
Typ.
Max.
Unit
Basic Operation
VIN Operating Voltage 1.8 5.5 V
IQQuiescent Current IOUT = 1 mA VIN = 1.8 V 63 100 mA
VIN = 3.3 V 68
VIN = 5.5 V 77 120
RON On Resistance VIN = 3.3 V, IOUT = 200 mA, TA = 25°C120 160 mW
VIN = 3.3 V, IOUT = 200 mA, TA = 85°C 135 180
VIN = 3.3 V, IOUT = 200 mA, TA = −40°C to +85°C65 180
VIN = 5 V, IOUT = 200 mA, TA = 25°C95 124
VIN = 5 V, IOUT = 200 mA, TA = 85°C110 143
VIN = 5 V, IOUT = 200 mA, TA = −40°C to +85°C 58 143
VIH ON Input Logic High Voltage (ON
)
VIN = 1.8 V 0.8 V
VIN = 5.5 V 1.4
VIL ON Input Logic Low Voltage VIN = 1.8 V 0.5 V
VIN = 5.5 V 1
ON Input Leakage VON = VIN or GND −1 1mA
VIN Shutdown Current VON = 0 V, VIN = 5.5 V, VOUT = Short to GND −2 2mA
FLAGB Output Logic Low Voltage VIN = 5 V, ISINK = 10 mA 0.05 0.20 V
VIN = 1.8 V, ISINK = 10 mA 0.12 0.30
FLAGB Output High Leakage
Current VIN = 5 V, Switch On 1mA
Reverse Block
VOUT Shutdown Current VON = 0 V, VOUT = 5.5 V, VIN = Short to GND −2 2mA
Protections
ILIM Current Limit VIN = 3.3 V, VOUT = 3.0 V, RSET = 1840 W135 150 165 mA
VIN = 3.3 V, VOUT = 3.0 V, RSET = 361 W720 800 880
VIN = 3.3 V, VOUT = 3.0 V, RSET = 196 W1350 1500 1650
Thermal Shutdown Shutdown Threshold 140 °C
Return from Shutdown 130
Hysteresis 10
UVLO Under−Voltage Shutdown VIN Increasing 1.55 1.65 1.75 V
Under−Voltage Shutdown
Hysteresis 50 mV
Dynamic
tdON Delay On Time RL = 500 W, CL = 0.1 mF25 ms
tdOFF Delay Off Time RL = 500 W, CL = 0.1 mF45 ms
tRISE VOUT Rise Time RL = 500 W, CL = 0.1 mF10 ms
tFALL VOUT Fall Time RL = 500 W, CL = 0.1 mF110 ms
Short−Circuit Response Time VIN = VOUT = 3.3 V, Moderate Over−Current Condition 5ms
VIN = VOUT = 3.3 V, Hard Short 30 ns
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
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FPF2165R
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TYPICAL PERFORMANCE CHARACTERISTICS
Figure 4. Quiescent Current vs. Input Voltage Figure 5. Quiescent Current vs. Temperature
Figure 6. VON High Voltage vs. Input Voltage Figure 7. VON Low Voltage vs. Input Voltage
Figure 8. RON vs. VIN Figure 9. RON vs. Temperature
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FPF2165R
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TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
Figure 10. tdON / tdOFF vs. Temperature Figure 11. TRISE / TFALL vs. Temperature
Figure 12. td
ON
Response Figure 13. tdOFF Response
Figure 14. Current Limit Response Time
(Switch Powered into Short)
FPF2165R
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7
Description of Operation
The FPF2165R is a current limited switch that protects
systems and loads which can be damaged or disrupted by the
application of high currents. The core of each device is a
0.12 W P−channel MOSFET and a controller capable of
functioning over a wide input operating range of 1.8−5.5 V.
The controller protects against system malfunctions through
current limiting, under−voltage lockout and thermal
shutdown. The current limit is adjustable from 0.15 A to
1.5 A through the selection of an external resistor.
On/Off Control
The ON pin controls the state of the switch. When ON is
high, the switch is in the On state. Activating ON
continuously holds the switch in the On state so long as there
is no fault. An under−voltage on VIN or a junction
temperature in excess of 140°C overrides the ON control to
turn off the switch. The FPF2165R does not turn off in
response to an over−current condition but instead remains
operating in a constant current mode so long as ON is active
and the thermal shutdown or under−voltage lockout have not
activated.
The ON pin control voltage and VIN pin have independent
recommended operating ranges. The ON pin voltage can be
driven by a voltage level higher than the input voltage.
Fault Reporting
Upon the detection of an over−current, an input under−
voltage, or an over−temperature condition, the FLAGB
signals the fault mode by activating LOW. With the
FPF2165R, FLAGB is LOW during the faults and
immediately returns HI at the end of the fault condition.
FLAGB is an open−drain MOSFET which requires a pull−
up resistor between VIN and FLAGB. During shutdown, the
pull−down on FLAGB is disabled to reduce current draw
from the supply.
Current Limiting
The current limit ensures that the current through the
switch doesn’t exceed a maximum value while not limiting
at less than a minimum value. The current at which the parts
will limit is adjustable through the selection of an external
resistor connected to ISET. Information for selecting the
resistor is found in the Application Info section. The
FPF2165R has no current limit blanking period so it remains
in a constant−current state until the ON pin is deactivated or
the thermal shutdown turns−off the switch.
For preventing the switch from large power dissipation
during heavy load a short circuit detection feature is
introduced. Short circuit condition is detected by observing
the output voltage. The switch is put into short circuit current
limiting mode if the switch is loaded with a heavy load.
When the output voltage drops below VSCTH, short circuit
detection threshold voltage, the current limit value
re−conditioned and short circuit current limit value is
decreased to 62.5% of the current limit value. This keeps the
power dissipation of the part below a certain limit even at
dead short conditions at 5.5 V input voltage. The VSCTH
value is set to be 1 V. At around 1.1 V of output voltage the
switch is removed from short circuit current limiting mode
and the current limit is set to the current limit value.
Under−Voltage Lockout
The under−voltage lockout turns−off the switch if the
input voltage drops below the under−voltage lockout
threshold. With the ON pin active the input voltage rising
above the under−voltage lockout threshold causes a
controlled turn−on of the switch which limits current
over−shoots.
Reverse Current Blocking
The FPF2165R family has a Reverse Current Blocking
feature that protects input source against current flow from
output to input. For a standard USB power design, this is an
important feature that protects the USB host from being
damaged due to reverse current flow on VBUS. The
reverse−current blocking feature is active when the load
switch is turned off.
If ON pin is LOW and output voltage becomes greater
than input voltage, no current can flow from the output to
the input. FLAGB operation is independent of the reverse
current blocking and does not report a fault condition if this
feature is activated.
Thermal Shutdown
The thermal shutdown protects the die from internally or
externally generated excessive temperatures. During an
over−temperature condition the FLAGB is activated and the
switch is turned−off. The switch automatically turns−on
again if temperature of the die drops below the threshold
temperature.
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FPF2165R
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APPLICATIONS INFORMATION
Figure 15. Typical Application
Setting Current Limit
The FPF2165R has a current limit which is set with an
external resistor connected between ISET and GND. This
resistor is selected by using equation (1),
ILIM +340.1 RSET
*1.0278 (eq. 1)
Table 1 can be used to select RSET. A typical application
would be the 500 mA current that is required by a single USB
port. Using Table 1 an appropriate selection for the RSET
resistor would be 570 W.
Table 1. CURRENT LIMIT VARIOUS R
SET
VALUES
R
SET
[
W
]
Min. Curren
t
Limit [mA] Typ. Curren
t
Limit [mA] Max. Curren
t
Limit [mA]
1840
135
150
165
1391
180
200
220
937
270
300
330
708
360
400
440
632
405
450
495
570
450
500
550
478
540
600
660
411
630
700
770
361
720
800
880
322
810
900
990
290
900
1000
1100
265
990
1100
1210
243
1080
1200
1320
225
1170
1300
1430
209
1260
1400
1540
196
1350
1500
1650
Input Capacitor
To limit the voltage drop on the input supply caused by
transient in−rush currents when the switch is turned on into
a discharged load capacitor or a short−circuit; a capacitor
needs to be placed between VIN and GND. A 4.7 mF ceramic
capacitor, CIN, must be placed close to the VIN pin. A higher
value of CIN can be used to further reduce the voltage drop
experienced as the switch is turned on into a large capacitive
load.
Output Capacitor
A 0.1 mF capacitor COUT, should be placed between VOUT
and GND. This capacitor prevents parasitic board
inductances from forcing VOUT below GND when the
switch turns−off.
Power Dissipation
During normal operation as a switch, the power dissipated
in the part depends upon the level at which the current limit
is set. The maximum allowed setting for the current limit is
0.77 A and this results in a power dissipation of,
P+(ILIM)2 RDS +(0.77)2 0.12 +71.148 mW(eq. 2)
If the part goes into current limit the maximum power
dissipation occurs when the output is shorted to ground. This
is more power than the package can dissipate, but the
thermal shutdown of the part activates to protect the part
from damage due to excessive heating. A short on the output
causes the part to operate in a constant−current state
dissipating a worst case power of,
P(max)
+
V
IN
(max)
I
LIM
(max)
+
5.5
0.77
+
4.235 W
(eq. 3
)
This large amount of power activates the thermal
shutdown and the part cycles in and out of thermal shutdown
so long as the ON pin is active and the short is present.
FPF2165R
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9
Board Layout
For best performance, all traces should be as short as
possible. To be most effective, the input and output
capacitors should be placed close to the device to minimize
the effects that parasitic trace inductances may have on
normal and short−circuit operation. Using wide traces for
VIN, VOUT and GND helps minimize parasitic electrical
effects along with minimizing the case−to−ambient thermal
impedance.
The middle pad (pin 7) should be connected to the GND
plate of PCB for improving thermal performance of the load
switch. An improper layout could result higher junction
temperature and triggering the thermal shutdown protection
feature. This concern applies when the switch is set at higher
current limit value and an over−current condition occurs. In
this case power dissipation of the switch (PD = (VIN VOUT)
x ILIM(max)) could exceed the maximum absolute power
dissipation of 1.2 W.
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WDFN6 2x2, 0.65P
CASE 511CY
ISSUE O
DATE 31 JUL 2016
TOP VIEW
0.05 C
0.05 C
2X
2X
2.0
2.0
PIN#1 IDENT
A
B
SIDE VIEW
RECOMMENDED
LAND PATTERN
BOTTOM VIEW
SEATING
PLANE
13
4
6
4
6
3
1
PIN #1 IDENT
0.65
1.30
1.21
0.52(6X)
0.90
0.42(6X)
0.65
2.2
5
1.68
(0.40)
(0.70)
NOTES:
A. PACKAGE DOES NOT FULLY CONFORM
TO JEDEC MO229 REGISTRATION
B. DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS AND TOLERANCES PER
ASME Y14.5M, 2009.
D. LAND PATTERN RECOMMENDATION IS
EXISTING INDUSTRY LAND PATTERN.
2.00±0.05
1.40±0.05
0.80±0.05
(0.20)4X
0.32±0.05
0.10 C A B
0.05 C
0.30±0.05 (6X)
(6X)
(0.60)
0.08 C
0.10 C
0.75±0.05
0.025±0.025 C
0.20±0.05
1.72
0.15
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
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