ADM690-95 Datasheet by Analog Devices Inc.

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REV. A
Information furnished by Analog Devices is believed to be accurate and
reliable. However, no responsibility is assumed by Analog Devices for its
use, nor for any infringements of patents or other rights of third parties
which may result from its use. No license is granted by implication or
otherwise under any patent or patent rights of Analog Devices.
a
Microprocessor
Supervisory Circuits
ADM690–ADM695
FEATURES
Superior Upgrade for MAX690–MAX695
Specified Over Temperature
Low Power Consumption (5 mW)
Precision Voltage Monitor
Reset Assertion Down to 1 V VCC
Low Switch On-Resistance 1.5 V Normal,
20 V in Backup
High Current Drive (100 mA)
Watchdog Timer—100 ms, 1.6 s, or Adjustable
600 nA Standby Current
Automatic Battery Backup Power Switching
Extremely Fast Gating of Chip Enable Signals (5 ns)
Voltage Monitor for Power Fail
APPLICATIONS
Microprocessor Systems
Computers
Controllers
Intelligent Instruments
Automotive Systems
GENERAL DESCRIPTION
The ADM690–ADM695 family of supervisory circuits offers
complete single chip solutions for power supply monitoring and
battery control functions in microprocessor systems. These
functions include µP reset, backup battery switchover, watchdog
timer, CMOS RAM write protection, and power failure warn-
ing. The complete family provides a variety of configurations to
satisfy most microprocessor system requirements.
The ADM690, ADM692 and ADM694 are available in 8-pin
DIP packages and provide:
1. Power-on reset output during power-up, power-down and
brownout conditions. The RESET output remains opera-
tional with V
CC
as low as 1 V.
2. Battery backup switching for CMOS RAM, CMOS
microprocessor or other low power logic.
3. A reset pulse if the optional watchdog timer has not been
toggled within a specified time.
4. A 1.3 V threshold detector for power fail warning, low battery
detection, or to monitor a power supply other than +5 V.
The ADM691, ADM693 and ADM695 are available in 16-pin
DIP and small outline packages and provide three additional
functions.
1. Write protection of CMOS RAM or EEPROM.
2. Adjustable reset and watchdog timeout periods.
3. Separate watchdog timeout, backup battery switchover, and
low V
CC
status outputs.
The ADM690–ADM695 family is fabricated using an advanced
epitaxial CMOS process combining low power consumption
(5 mW), extremely fast Chip Enable gating (5 ns) and high reli-
ability. RESET assertion is guaranteed with V
CC
as low as 1 V.
In addition, the power switching circuitry is designed for mini-
mal voltage drop thereby permitting increased output current
drive of up to 100 mA without the need for an external pass
transistor.
FUNCTIONAL BLOCK DIAGRAMS
4.65V
1
WATCHDOG
TRANSITION DETECTOR
1.3V
ADM691
ADM693
ADM695
V
OUT
V
BATT
V
CC
WATCHDOG
INPUT (WDI)
POWER FAIL
INPUT (PFI)
1
VOLTAGE DETECTOR = 4.65V (ADM691, ADM695)
4.40V (ADM693)
POWER FAIL
OUTPUT (PFO)
RESET
WATCHDOG
TIMER
RESET &
WATCHDOG
TIMEBASE
RESET
GENERATOR
BATT ON
OSC IN
OSC SEL
WATCHDOG
OUTPUT (WDO)
RESET
LOW LINE
CE
OUT
CE
IN
4.65V1RESET
GENERATOR2
WATCHDOG
TRANSITION DETECTOR
(1.6s)
1.3V
ADM690
ADM692
ADM694
VOUT
VBATT
VCC
WATCHDOG
INPUT (WDI)
POWER FAIL
INPUT (PFI)
1VOLTAGE DETECTOR = 4.65V (ADM690, ADM694)
4.40V (ADM692)
2RESET PULSE WIDTH = 50ms (ADM690, ADM692)
200ms (ADM694)
POWER FAIL
OUTPUT (PFO)
RESET
© Analog Devices, Inc., 1996
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 617/329-4700 Fax: 617/326-8703
ADM690–ADM695–SPECIFICATIONS
Parameter Min Typ Max Units Test Conditions/Comments
BATTERY BACKUP SWITCHING
V
CC
Operating Voltage Range
ADM690, ADM691, ADM694, ADM695 4.75 5.5 V
ADM692, ADM693 4.5 5.5 V
V
BATT
Operating Voltage Range
ADM690, ADM691, ADM694, ADM695 2.0 4.25 V
ADM692, ADM693 2.0 4.0 V
V
OUT
Output Voltage V
CC
– 0.05 V
CC
– 0.025 V I
OUT
= 1 mA
V
CC
– 0.5 V
CC
– 0.25 V I
OUT
100 mA
V
OUT
in Battery Backup Mode V
BATT
– 0.05 V
BATT
– 0.02 V I
OUT
= 250 µA, V
CC
< V
BATT
– 0.2 V
Supply Current (Excludes I
OUT
) 1 1.95 mA I
OUT
= 100 mA
Supply Current in Battery Backup Mode 0.6 1 µAV
CC
= 0 V, V
BATT
= 2.8 V
Battery Standby Current 5.5 V > V
CC
> V
BATT
+ 0.2 V
(+ = Discharge, – = Charge) –0.1 +0.02 µAT
A
= +25°C
–1.0 +0.02 µA
Battery Switchover Threshold 70 mV Power Up
V
CC
– V
BATT
50 mV Power Down
Battery Switchover Hysteresis 20 mV
BATT ON Output Voltage 0.3 V I
SINK
= 3.2 mA
BATT ON Output Short Circuit Current 35 mA BATT ON = V
OUT
= 4.5 V Sink Current
0.5 1 25 µA BATT ON = 0 V Source Current
RESET AND WATCHDOG TIMER
Reset Voltage Threshold
ADM690, ADM691, ADM694, ADM695 4.5 4.65 4.73 V
ADM692, ADM693 4.25 4.4 4.48 V
Reset Threshold Hysteresis 40 mV
Reset Timeout Delay
ADM690, ADM691, ADM692, ADM693 35 50 70 ms OSC SEL = HIGH, V
CC
= 5 V, T
A
= +25°C
ADM694, ADM695 140 200 280 ms OSC SEL = HIGH, V
CC
= 5 V, T
A
= +25°C
Watchdog Timeout Period, Internal Oscillator 1.0 1.6 2.25 s Long Period, V
CC
= 5 V, T
A
= +25°C
70 100 140 ms Short Period, V
CC
= 5 V, T
A
= +25°C
Watchdog Timeout Period, External Clock 3840 4097 Cycles Long Period
768 1025 Cycles Short Period
Minimum WDI Input Pulse Width 50 ns V
IL
= 0.4, V
IH
= 3.5 V
RESET Output Voltage @ V
CC
= +1 V 4 200 mV I
SINK
= 10 µA, V
CC
= 1 V
RESET, LOW LINE Output Voltage 0.4 V I
SINK
= 1.6 mA, V
CC
= 4.25 V
3.5 V I
SOURCE
= 1 µA, V
CC
= 5 V
RESET, WDO Output Voltage 0.4 V I
SINK
= 1.6 mA, V
CC
= 5 V
3.5 V I
SOURCE
= 1 µA, V
CC
= 4.25 V
Output Short Circuit Source Current 1 3 25 µA
Output Short Circuit Sink Current 25 mA
WDI Input Threshold V
CC
= 5 V
1
Logic Low 0.8 V
Logic High 3.5 V
WDI Input Current 20 50 µA WDI = V
OUT
, T
A
= +25°C
–50 –15 µA WDI = 0 V, T
A
= +25°C
POWER FAIL DETECTOR
PFI Input Threshold 1.25 1.3 1.35 V V
CC
= +5 V
PFI Input Current –25 ±0.01 +25 nA
PFO Output Voltage 0.4 V I
SINK
= 3.2 mA
3.5 V I
SOURCE
= 1 µA
PFO Short Circuit Source Current 1 3 25 µA PFI = Low, PFO = 0 V
PFO Short Circuit Sink Current 25 mA PFI = High, PFO = V
OUT
CHIP ENABLE GATING
CE
IN
Threshold 0.8 V V
IL
3.0 V V
IH
CE
IN
Pull-Up Current 3 µA
CE
OUT
Output Voltage 0.4 V I
SINK
= 3.2 mA
V
OUT
– 1.5 V I
SOURCE
= 3.0 mA
V
OUT
– 0.05 V I
SOURCE
= 1 µA, V
CC
= 0 V
CE Propagation Delay 5 9 ns
REV. A
(VCC = Full Operating Range, VBATT = +2.8 V, TA = TMIN to
TMAX unless otherwise noted)
–2–
Parameter Min Typ Max Units Test Conditions/Comments
OSCILLATOR
OSC IN Input Current ±2µA
OSC SEL Input Pull-Up Current 5 µA
OSC IN Frequency Range 0 250 kHz OSC SEL = 0 V
OSC IN Frequency with External Capacitor 4 kHz OSC SEL = 0 V, C
OSC
= 47 pF
NOTE
1
WDI is a three level input which is internally biased to 38% of V
CC
and has an input impedance of approximately 125 k.
Specifications subject to change without notice.
ADM690–ADM695
REV. A –3–
ABSOLUTE MAXIMUM RATINGS*
(T
A
= +25°C unless otherwise noted)
V
CC
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +6 V
V
BATT
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +6 V
All Other Inputs . . . . . . . . . . . . . . . . . . –0.3 V to V
OUT
+ 0.5 V
Input Current
V
CC
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 200 mA
V
BATT
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA
GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA
Digital Output Current . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA
Power Dissipation, N-8 DIP . . . . . . . . . . . . . . . . . . . . 400 mW
θ
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 120°C/W
Power Dissipation, Q-8 DIP . . . . . . . . . . . . . . . . . . . . 500 mW
θ
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 125°C/W
Power Dissipation, N-16 DIP . . . . . . . . . . . . . . . . . . . 600 mW
θ
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 135°C/W
Power Dissipation, Q-16 DIP . . . . . . . . . . . . . . . . . . . 600 mW
θ
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 100°C/W
Power Dissipation, R-16 SOIC . . . . . . . . . . . . . . . . . . 600 mW
θ
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 110°C/W
Operating Temperature Range
Industrial (A Version) . . . . . . . . . . . . . . . . . –40°C to +85°C
Extended (S Version) . . . . . . . . . . . . . . . . . –55°C to +125°C
Lead Temperature (Soldering, 10 secs) . . . . . . . . . . . . +300°C
Vapor Phase (60 secs) . . . . . . . . . . . . . . . . . . . . . . . +215°C
Infrared (15 secs) . . . . . . . . . . . . . . . . . . . . . . . . . . . +220°C
Storage Temperature Range . . . . . . . . . . . . . –65°C to +150°C
*Stresses above those listed under “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress rating only and functional
operation of the device at these or any other conditions above those listed in the
operational sections of this specification is not implied. Exposure to absolute
maximum ratings for extended periods of time may affect device reliability.
ORDERING GUIDE
Model Temperature Range Package Option
ADM690AN –40°C to +85°C N-8
ADM690AQ –40°C to +85°C Q-8
ADM690SQ –55°C to +125°C Q-8
ADM691AN –40°C to +85°C N-16
ADM691AR –40°C to +85°C R-16
ADM691AQ –40°C to +85°C Q-16
ADM691SQ –55°C to +125°C Q-16
ADM692AN –40°C to +85°C N-8
ADM692AQ –40°C to +85°C Q-8
ADM692SQ –55°C to +125°C Q-8
ADM693AN –40°C to +85°C N-16
ADM693AR –40°C to +85°C R-16
ADM693AQ –40°C to +85°C Q-16
ADM693SQ –55°C to +125°C Q-16
ADM694AN –40°C to +85°C N-8
ADM694AQ –40°C to +85°C Q-8
ADM694SQ –55°C to +125°C Q-8
ADM695AN –40°C to +85°C N-16
ADM695AR –40°C to +85°C R-16
ADM695AQ –40°C to +85°C Q-16
ADM695SQ –55°C to +125°C Q-16
WARNING!
ESD SENSITIVE DEVICE
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the ADM690–ADM695 features proprietary ESD protection circuitry, permanent
damage may occur on devices subjected to high energy electrostatic discharges. Therefore,
proper ESD precautions are recommended to avoid performance degradation or loss of
functionality.
ADM690–ADM695
REV. A
–4–
PIN FUNCTION DESCRIPTION
Mnemonic Function
V
CC
Power Supply Input: +5 V Nominal.
V
BATT
Backup Battery Input. Connect to Ground if a backup battery is not used.
V
OUT
Output Voltage, V
CC
or V
BATT
is internally switched to V
OUT
depending on which is at the highest potential. V
OUT
can supply up to 100 mA to power CMOS RAM. Connect V
OUT
to V
CC
if V
OUT
and V
BATT
are not used.
GND 0 V. Ground reference for all signals.
RESET Logic Output. RESET goes low if
1. V
CC
falls below the Reset Threshold
2. V
CC
falls below V
BATT
3. The watchdog timer is not serviced within its timeout period.
The reset threshold is typically 4.65 V for the ADM690/ADM691/ADM694/ADM695 and 4.4 V for the ADM692 and
ADM693. RESET remains low for 50 ms (ADM690/ADM691/ADM692/ADM693) or 200 ms (ADM694/ADM695)
after V
CC
returns above the threshold. RESET also goes low for 50 (200) ms if the watchdog timer is enabled but not
serviced within its timeout period. The RESET pulse width can be adjusted on the ADM691/ADM693/ADM695 as
shown in Table I. The RESET output has an internal 3 µA pull up, and can either connect to an open collector
Reset bus or directly drive a CMOS gate without an external pull-up resistor.
WDI Watchdog Input. WDI is a three level input. If WDI remains either high or low for longer than the watchdog timeout
period, RESET pulses low and WDO goes low. The timer resets with each transition on the WDI line. The watchdog
timer may be disabled if WDI is left floating or is driven to midsupply.
PFI Power Fail Input. PFI is the noninverting input to the Power Fail Comparator when PFI is less than 1.3 V, PFO
goes low. Connect PFI to GND or V
OUT
when not used.
PFO Power Fail Output. PFO is the output of the Power Fail Comparator. It goes low when PFI is less than 1.3 V. The
comparator is turned off and PFO goes low when V
CC
is below V
BATT
.
CE
IN
Logic Input. The input to the CE gating circuit. Connect to GND or V
OUT
if not used.
CE
OUT
Logic Output. CE
OUT
is a gated version of the CE
IN
signal. CE
OUT
tracks CE
IN
when V
CC
is above the reset
threshold. If V
CC
is below the reset threshold, CE
OUT
is forced high. See Figures 5 and 6.
BATT ON Logic Output. BATT ON goes high when V
OUT
is internally switched to the V
BATT
input. It goes low when V
OUT
is internally switched to V
CC
. The output typically sinks 35 mA and can directly drive the base of an external
PNP transistor to increase the output current above the 100 mA rating of V
OUT
.
LOW LINE Logic Output. LOW LINE goes low when V
CC
falls below the reset threshold. It returns high as soon as V
CC
rises
above the reset threshold.
RESET Logic Output. RESET is an active high output. It is the inverse of RESET.
OSC SEL Logic Oscillator Select Input. When OSC SEL is unconnected (floating) or driven high, the internal oscillator sets
the reset active time and watchdog timeout period. When OSC SEL is low, the external oscillator input, OSC IN,
is enabled. OSC SEL has a 3 µA internal pull up, (see Table I).
OSC IN Oscillator Logic Input. With OSC SEL low, OSC IN can be driven by an external clock signal or an external
capacitor can be connected between OSC IN and GND. This sets both the reset active pulse timing and the watch-
dog timeout period (see Table I and Figure 4). With OSC SEL high or floating, the internal oscillator is enabled
and the reset active time is fixed at 50 ms typ. (ADM691/ADM693) or 200 ms typ (ADM695). In this mode the
OSC IN pin selects between fast (100 ms) and slow (1.6 s) watchdog timeout periods. In both modes, the timeout
period immediately after a reset is 1.6 s typical.
WDO Logic Output. The Watchdog Output, WDO, goes low if WDI remains either high or low for longer than the
watchdog timeout period. WDO is set high by the next transition at WDI. If WDI is unconnected or at midsupply,
the watchdog timer is disabled and WDO remains high. WDO also goes high when LOW LINE goes low.
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ADM690–ADM695
REV. A –5–
PIN CONFIGURATIONS
PRODUCT SELECTION GUIDE
Part Nominal Reset Nominal V
CC
Nominal Watchdog Battery Backup Base Drive Chip Enable
Number Time Reset Threshold Timeout Period Switching Ext PNP Signals
ADM690 50 ms 4.65 V 1.6 s Yes No No
ADM691 50 ms or ADJ 4.65 V 100 ms, 1.6 s, ADJ Yes Yes Yes
ADM692 50 ms 4.4 V 1.6 s Yes No No
ADM693 50 ms or ADJ 4.4 V 100 ms, 1.6 s, ADJ Yes Yes Yes
ADM694 200 ms 4.65 V 1.6 s Yes No No
ADM695 200 ms or ADJ 4.65 V 100 ms, 1.6 s, ADJ Yes Yes Yes
CIRCUIT INFORMATION
Battery Switchover Section
The battery switchover circuit compares V
CC
to the V
BATT
input, and connects V
OUT
to whichever is higher. Switchover
occurs when V
CC
is 50 mV higher than V
BATT
as V
CC
falls, and
when V
CC
is 70 mV greater than V
BATT
as V
CC
rises. This
20 mV of hysteresis prevents repeated rapid switching if V
CC
falls very slowly or remains nearly equal to the battery voltage.
Figure 1. Battery Switchover Schematic
During normal operation with V
CC
higher than V
BATT
, V
CC
is in-
ternally switched to V
OUT
via an internal PMOS transistor
switch. This switch has a typical on-resistance of 1.5 and can
supply up to 100 mA at the V
OUT
terminal. V
OUT
is normally
used to drive a RAM memory bank which may require instanta-
neous currents of greater than 100 mA. If this is the case then a
bypass capacitor should be connected to V
OUT
. The capacitor
will provide the peak current transients to the RAM. A capaci-
tance value of 0.1 µF or greater may be used.
If the continuous output current requirement at V
OUT
exceeds
100 mA or if a lower V
CC
–V
OUT
voltage differential is desired,
an external PNP pass transistor may be connected in parallel
with the internal transistor. The BATT ON output (ADM691/
ADM693/ADM695) can directly drive the base of the external
transistor.
A 20 MOSFET switch connects the V
BATT
input to V
OUT
during battery backup. This MOSFET has very low input-to-
output differential (dropout voltage) at the low current levels
required for battery back up of CMOS RAM or other low
power CMOS circuitry. The supply current in battery back up
is typically 0.6 µA.
The ADM690/ADM691/ADM694/ADM695 operates with
battery voltages from 2.0 V to 4.25 V and the ADM692/ADM693
operates with battery voltages from 2.0 V to 4.0 V. High value
capacitors, either standard electrolytic or the farad size double
layer capacitors, can also be used for short-term memory back
up. A small charging current of typically 10 nA (0.1 µA max)
flows out of the V
BATT
terminal. This current is useful for
maintaining rechargeable batteries in a fully charged condition.
This extends the life of the back up battery by compensating
for its self discharge current. Also note that this current poses
no problem when lithium batteries are used for back up since
the maximum charging current (0.1 µA) is safe for even the
smallest lithium cells.
If the battery-switchover section is not used, V
BATT
should be
connected to GND and V
OUT
should be connected to V
CC
.
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
TOP VIEW
(Not to Scale)
ADM691
ADM693
ADM695
GND
V
BATT
V
OUT
PFI
PFO
WDO
V
CC
RESET
BATT ON
LOW LINE
OSC IN
OSC SEL
RESET
CE
IN
CE
OUT
WDI
GND
V
BATT
V
OUT
PFI PFO
WDI
RESET
V
CC
1
2
3
4
8
7
6
5
TOP VIEW
(Not to Scale)
ADM690
ADM692
ADM694
ADM690–ADM695
REV. A
–6–
POWER FAIL RESET OUTPUT
RESET is an active low output which provides a RESET signal
to the Microprocessor whenever V
CC
is at an invalid level. When
V
CC
falls below the reset threshold, the RESET output is forced
low. The nominal reset voltage threshold is 4.65 V (ADM690/
ADM691/ADM694/ADM695) or 4.4 V (ADM692/ADM693).
t
1
t
1
= RESET TIME.
V1 = RESET VOLTAGE THRESHOLD LOW
V2 = RESET VOLTAGE THRESHOLD HIGH
HYSTERESIS = V2–V1
V2 V2
V1 V1
t
1
V
CC
LOW LINE
RESET
Figure 2. Power Fail Reset Timing
On power-up RESET will remain low for 50 ms (200 ms for
ADM694 and ADM695) after V
CC
rises above the appropriate
reset threshold. This allows time for the power supply and mi-
croprocessor to stabilize. On power-down, the RESET output
remains low with V
CC
as low as 1 V. This ensures that the
microprocessor is held in a stable shutdown condition.
This RESET active time is adjustable on the ADM691/ADM693/
ADM695 by using an external oscillator or by connecting an
external capacitor to the OSC IN pin. Refer to Table I and
Figure 4.
The guaranteed minimum and maximum thresholds of the
ADM690/ADM691/ADM694/ADM695 are 4.5 V and 4.73 V,
while the guaranteed thresholds of the ADM692/ADM693 are
4.25 V and 4.48 V. The ADM690/ADM691/ADM694/ADM695
is, therefore, compatible with 5 V supplies with a +10%, –5%
tolerance while the ADM692/ADM693 is compatible with 5 V
± 10% supplies. The reset threshold comparator has approxi-
mately 50 mV of hysteresis. The response time of the reset volt-
age comparator is less than 1 µs. If glitches are present on the
V
CC
line which could cause spurious reset pulses, then V
CC
should be decoupled close to the device.
In addition to RESET the ADM691/ADM693/ADM695 con-
tain an active high RESET output. This is the complement of
RESET and is intended for processors requiring an active high
RESET signal.
Watchdog Timer RESET
The watchdog timer circuit monitors the activity of the micro-
processor in order to check that it is not stalled in an indefinite
loop. An output line on the processor is used to toggle the
Watchdog Input (WDI) line. If this line is not toggled within the
selected timeout period, a RESET pulse is generated. The
nominal watchdog timeout period is preset at 1.6 seconds on the
ADM690/ADM692/ADM694. The ADM691/ADM693/ADM695
may be configured for either a fixed “short” 100 ms or a “long”
1.6 second timeout period or for an adjustable timeout period.
If the “short” period is selected, some systems may be unable to
service the watchdog timer immediately after a reset, so the
ADM691/ADM693/ADM695 automatically selects the “long”
timeout period directly after a reset is issued. The watchdog
timer is restarted at the end of reset, whether the reset was
caused by lack of activity on WDI or by V
CC
falling below the
reset threshold.
The normal (short) timeout period becomes effective following
the first transition of WDI after RESET has gone inactive. The
watchdog timeout period restarts with each transition on the
WDI pin. To ensure that the watchdog timer does not time out,
either a high-to-low or low-to-high transition on the WDI pin
must occur at or less than the minimum timeout period. If WDI
remains permanently either high or low, reset pulses will be
issued after each “long” timeout period (1.6 s). The watchdog
monitor can be deactivated by floating the Watchdog Input
(WDI) or by connecting it to midsupply.
t
2
RESET
WDO
WDI
t
1
= RESET TIME.
t
2
= NORMAL (SHORT) WATCHDOG TIMEOUT PERIOD.
t
3
= WATCHDOG TIMEOUT PERIOD IMMEDIATELY FOLLOWING A RESET.
t
1
t
1
t
1
t
3
Figure 3. Watchdog Timeout Period and Reset Active
Time
ADM690–ADM695
REV. A –7–
Table I. ADM691, ADM693, ADM695 Reset Pulse Width and Watchdog Timeout Selections
Watchdog Timeout Period Reset Active Period
Immediately
OSC SEL OSC IN Normal After Reset ADM691/ADM693 ADM695
Low External Clock Input 1024 CLKS 4096 CLKS 512 CLKS 2048 CLKS
Low External Capacitor 260 ms × C/47 pF 1.04 s × C/47 pF 130 ms × C/47 pF 520 ms × C/47 pF
Floating or High Low 100 ms 1.6 s 50 ms 200 ms
Floating or High Floating or High 1.6 s 1.6 s 50 ms 200 ms
NOTE
With the OSC SEL pin low, OSC IN can be driven by an external clock signal, or an external capacitor can be connected between OSC IN and GND. The nominal
internal oscillator frequency is 10.24 kHz. The nominal oscillator frequency with external capacitor is: F
OSC
(Hz) = 184,000/C (pF).
The watchdog timeout period is fixed at 1.6 seconds, and the
reset pulse width is fixed at 50 ms on the ADM690/ADM692.
On the ADM694 the watchdog timeout period is also 1.6 sec-
onds but the reset pulse width is fixed at 200 ms. The ADM691/
ADM693/ADM695 allow these times to be adjusted as shown
in Table I. Figure 4 shows the various oscillator configurations
which can be used to adjust the reset pulse width and watchdog
timeout period.
The internal oscillator is enabled when OSC SEL is high or
floating. In this mode, OSC IN selects between the 1.6 second
and 100 ms watchdog timeout periods. With OSC IN connected
high or floating, the 1.6 second timeout period is selected; while
with it connected low, the 100 ms timeout period is selected. In
either case, immediately after a reset, the timeout period is 1.6
seconds. This gives the microprocessor time to reinitialize the
system. If OSC IN is low, then the 100 ms watchdog period be-
comes effective after the first transition of WDI. The software
should be written such that the I/O port driving WDI is left in
its power-up reset state until the initialization routines are com-
pleted and the microprocessor is able to toggle WDI at the mini-
mum watchdog timeout period of 70 ms.
Watchdog Output (WDO)
The Watchdog Output WDO (ADM691/ADM693/ADM695)
provides a status output which goes low if the watchdog timer
“times out” and remains low until set high by the next transition
on the Watchdog Input. WDO is also set high when V
CC
goes
below the reset threshold.
OSC IN
OSC SEL
ADM691
ADM693
ADM695
CLOCK
0 TO 250kHz
8
7
Figure 4a. External Clock Source
OSC IN
OSC SEL
ADM691
ADM693
ADM695
8
7
COSC
Figure 4b. External Capacitor
OSC IN
OSC SEL
ADM691
ADM693
ADM695
8
7
NC
NC
Figure 4c. Internal Oscillator (1.6 Second Watchdog)
OSC IN
OSC SEL
ADM691
ADM693
ADM695
8
7
NC
Figure 4d. Internal Oscillator (100 ms Watchdog)
ADM690–ADM695
REV. A
–8–
CE Gating and RAM Write Protection (ADM691/ADM693/
ADM695)
The ADM691/ADM693/ADM695 products include memory
protection circuitry which ensures the integrity of data in mem-
ory by preventing write operations when V
CC
is at an invalid
level. There are two additional pins, CE
IN
and CE
OUT
, which
may be used to control the Chip Enable or Write inputs of
CMOS RAM. When V
CC
is present, CE
OUT
is a buffered replica
of CE
IN
, with a 5 ns propagation delay. When V
CC
falls below
the reset voltage threshold or V
BATT
, an internal gate forces
CE
OUT
high, independent of CE
IN
.
CE
OUT
typically drives the CE, CS, or write input of battery
backed up CMOS RAM. This ensures the integrity of the data
in memory by preventing write operations when V
CC
is at an in-
valid level. Similar protection of EEPROMs can be achieved by
using the CE
OUT
to drive the store or write inputs.
If the 5 ns typical propagation delay of CE
OUT
is excessive, con-
nect CE
IN
to GND and use the resulting CE
OUT
to control a
high speed external logic gate.
ADM69x
CE
OUT
CE
IN
V
CC
LOW = 0
V
CC
OK = 1
Figure 5. Chip Enable Gating
Power Fail Warning Comparator
An additional comparator is provided for early warning of failure
in the microprocessor’s power supply. The Power Fail Input
(PFI) is compared to an internal +1.3 V reference. The Power
Fail Output (PFO) goes low when the voltage at PFI is less than
1.3 V. Typically PFI is driven by an external voltage divider
which senses either the unregulated dc input to the system’s 5 V
regulator or the regulated 5 V output. The voltage divider ratio
can be chosen such that the voltage at PFI falls below 1.3 V sev-
eral milliseconds before the +5 V power supply falls below the
reset threshold. PFO is normally used to interrupt the micropro-
cessor so that data can be stored in RAM and the shut down
procedure executed before power is lost
ADM69x
POWER
FAIL
INPUT
R
2
INPUT
POWER
1.3V PFO POWER
FAIL
OUTPUT
R
1
Figure 7. Power Fail Comparator
Table II. Input and Output Status In Battery Backup Mode
Signal Status
V
OUT
V
OUT
is connected to V
BATT
via an internal
PMOS switch.
RESET Logic low.
RESET Logic high. The open circuit output voltage is
equal to V
OUT
.
LOW LINE Logic low.
BATT ON Logic high. The open circuit voltage is equal to
V
OUT.
WDI WDI is ignored. It is internally disconnected
from the internal pull-up resistor and does not
source or sink current as long as its input voltage
is between GND and V
OUT
. The input voltage
does not affect supply current.
WDO Logic high. The open circuit voltage is equal
to V
OUT
.
PFI The Power Fail Comparator is turned off and
has no effect on the Power Fail Output.
PFO Logic low.
CE
IN
CE
IN
is ignored. It is internally disconnected
from its internal pull-up and does not source or
sink current as long as its input voltage is
between GND and V
OUT
. The input voltage
does not affect supply current.
CE
OUT
Logic high. The open circuit voltage is equal to
V
OUT
.
OSC IN OSC IN is ignored.
OSC SEL OSC SEL is ignored.
t
1
t
1
= RESET TIME.
V1 = RESET VOLTAGE THRESHOLD LOW
V2 = RESET VOLTAGE THRESHOLD HIGH
HYSTERESIS = V2–V1
V2 V2
V1 V1
t
1
V
CC
LOW LINE
RESET
CE
IN
CE
OUT
Figure 6. Chip Enable Timing
SLOPE = 1,552
Typical Performance Curves–ADM690–ADM695
5.00
4.80 0 100
4.95
4.85
20
4.90
806040
V
CC
= 5V
T
A
= +25°C
SLOPE = 1.5
V
OUT
– V
I
OUT
– mA
Figure 8. V
OUT
vs. I
OUT
Normal
Operation
1.303
1.29920 120
1.302
1.300
40
1.301
1008060
PFI INPUT THRESHOLD – V
TEMPERATURE –
°
C
Figure 11. PFI Input Threshold vs.
Temperature
6
1.25
0
2
0
1
3
4
5
0.80.5 0.60.3 0.4 0.70.20.1
V
PFI
1.3V 30pF
PFO
V
CC
= 5V
T
A
= +25
°
C
1.35
TIME – µs
Figure 14. Power Fail Comparator
Response Time
2.80
2.76 0 1000
2.79
2.77
200
2.78
800600400
I
OUT
µA
V
OUT
– V
SLOPE = 20
V
CC
= 0V
V
BATT
= +2.8V
T
A
= +25°C
Figure 9. V
OUT
vs. I
OUT
Battery
Backup
53
4920 120
52
50
40
51
1008060
VCC = +5V
TEMPERATURE –
°
C
RESET ACTIVE TIME – ms
ADM690
ADM691
ADM692
ADM693
Figure 12. Reset Active Time vs.
Temperature
6
90
1.25
0
1.35
2
0
1
3
4
5
8050 6030 40 702010
VPFI
1.3V 30pF
PFO
VCC = 5V
TA = +25
°
C
TIME – µs
Figure 15. Power Fail Comparator
Response Time
10
90
100
0%
3.36 V
500ms
A4
1V1V
Figure 10. Reset Output Voltage vs.
Supply Voltage
4.70
4.6220 120
4.68
4.64
40
4.66
1008060
TEMPERATURE – °C
RESET VOLTAGE THRESHOLD – V
VCC = +5V
POWER-UP
POWER-DOWN
ADM690
ADM691
ADM694
ADM695
Figure 13. Reset Voltage Threshold
vs. Temperature
6
01.8
1.25
0
1.35
2
0
1
3
4
5
1.61.0 1.20.6 0.8 1.40.40.2
V
CC
= 5V
T
A
= +25
°
C
V
PFI
1.3V 30pF
PFO
+5V
10k
+5V
TIME – µs
Figure 16. Power Fail Comparator
Response Time with Pull-Up Resistor
REV. A –9–
ADM690–ADM695
REV. A
–10–
+APPLICATION INFORMATION
Increasing the Drive Current
If the continuous output current requirements at V
OUT
exceed
100 mA or if a lower V
CC
–V
OUT
voltage differential is desired,
an external PNP pass transistor may be connected in parallel
with the internal transistor. The BATT ON output (ADM691/
ADM693/ADM695) can directly drive the base of the external
transistor.
V
OUT
V
CC
BATTERY
+5V
INPUT
POWER 0.1µF0.1µF
BATT
ON
V
BATT
PNP TRANSISTOR
ADM691
ADM693
ADM695
Figure 17. Increasing the Drive Current
Using a Rechargeable Battery for Back Up
If a capacitor or a rechargeable battery is used for back up then
the charging resistor should be connected to V
OUT
since this
eliminates the discharge path that would exist during power
down if the resistor is connected to V
CC
.
V
OUT
V
CC
RECHARGEABLE
BATTERY
+5V
INPUT
POWER 0.1µF
0.1µF
V
BATT
ADM69x
R
I =
V
OUT
– V
BATT
R
Figure 18. Rechargeable Battery
Adding Hysteresis to the Power Fail Comparator
For increased noise immunity, hysteresis may be added to the
power fail comparator. Since the comparator circuit is nonin-
verting, hysteresis can be added simply by connecting a resistor be-
tween the PFO output and the PFI input as shown in Figure 19.
When PFO is low, resistor R
3
sinks current from the summing
junction at the PFI pin. When PFO is high, the series combina-
tion of R
3
and R
4
source current into the PFI summing junc-
tion. This results in differing trip levels for the comparator.
ADM69x
R
2
1.3V PFO
R
1
7805
R
4
R
3
+7V TO +15V
INPUT
POWER
+5V
PFI
V
CC
TO
µP NMI
5V
0V
0V V
L
V
H
V
IN
PFO
V
H
= 1.3V
(
1+ ––– + –––
)
V
L
= 1.3V
(
1+ ––– – –––––––––––––
)
ASSUMING R
4 < <
R
3
THEN
HYSTERESIS V
H
– V
L
= 5V
(
–––
)
R
1
R
2
R
1
R
3
R
1
R
2
R
1
R
2
R
1
(5V – 1.3V)
1.3V (R
3 +
R
4
)
Figure 19. Adding Hysteresis to the Power Fail Comparator
Monitoring the Status of the Battery
The power fail comparator can be used to monitor the status of
the backup battery instead of the power supply if desired. This
is shown in Figure 20. The PFI input samples the battery volt-
age and generates an active low PFO signal when the battery
voltage drops below a chosen threshold. It may be necessary to
apply a test load in order to determine the loaded battery volt-
age. This can be done under processor control using CE
OUT.
Since CE
OUT
is forced high during the battery backup mode, the
test load will not be applied to the battery while it is in use, even
if the microprocessor is not powered.
ADM690–ADM695
REV. A –11–
ADM69x
CE
IN
PFO
PFI
V
CC
FROM µP I/O PIN
APPLIES TEST LOAD
TO BATTERY
LOW BATTERY
SIGNAL TO
µP I/O PIN
+5V INPUT
POWER
V
BATT
CE
OUT
BATTERY
20k
OPTIONAL
TEST LOAD
10M
10M
Figure 20. Monitoring the Battery Status
Alternate Watchdog Input Drive Circuits
The watchdog feature can be enabled and disabled under pro-
gram control by driving WDI with a 3-state buffer (Figure 21a).
When three-stated, the WDI input will float thereby disabling
the watchdog timer.
WDI
ADM69x
WATCHDOG
STROBE
CONTROL
INPUT
Figure 21a. Programming the Watchdog Input
This circuit is not entirely foolproof, and it is possible that a
software fault could erroneously 3-state the buffer. This would
then prevent the ADM69x from detecting that the microproces-
sor is no longer operating correctly. In most cases a better
method is to extend the watchdog period rather than disabling
the watchdog. This may be done under program control using
the circuit shown in Figure 21b. When the control input is high,
the OSC SEL pin is low and the watchdog timeout is set by the
external capacitor. A 0.01 µF capacitor sets a watchdog timeout
delay of 100 seconds. When the control input is low, the OSC
SEL pin is driven high, selecting the internal oscillator. The
100 ms or the 1.6 s period is chosen, depending on which diode
in Figure 21b is used. With D1 inserted the internal timeout is
set at 100 ms, while with D2 inserted the timeout is set at 1.6 s.
OSC IN
OSC SEL
ADM69x
CONTROL
INPUT*
D1 D2
*LOW = INTERNAL TIMEOUT
HIGH = EXTERNAL TIMEOUT
Figure 21b. Programming the Watchdog Input
Replacing the Backup Battery
When changing the backup battery with system power on, spuri-
ous resets can occur when the battery is removed. This occurs
because the leakage current flowing out of the V
BATT
pin will
charge up the stray capacitance. If the voltage on V
BATT
reaches
within 50 mV of V
CC
, a reset pulse is generated.
If spurious resets during battery replacement are acceptable,
then no action is required. If not, then one of the following
solutions should be considered:
1. A capacitor from V
BATT
to GND. This gives time while the
capacitor is charging up to replace the battery. The leakage
current will charge up the external capacitor towards the V
CC
level. The time taken is related to the charging current, the
size of external capacitor and the voltage differential between
the capacitor and the charging voltage supply.
t = C
EXT
× V
DIFF
/I
The maximum leakage (charging) current is 1 µA over tem-
perature and V
DIFF
= V
CC
–V
BATT
. Therefore, the capacitor
size should be chosen such that sufficient time is available to
make the battery replacement.
C
EXT
= T
REQD
(1 µA/(V
CC
V
BATT
))
If a replacement time of 5 seconds is allowed and assuming a
V
CC
of 4.5 V and a V
BATT
of 3 V
C
EXT
= 3.33 µF
ADM69x
V
BATT
BATTERY C
EXT
Figure 22a. Preventing Spurious RESETS During
Battery Replacement
2. A resistor from V
BATT
to GND. This will prevent the voltage
on V
BATT
from rising to within 50 mV of V
CC
during battery
replacement.
‘ PAP} wan—I | T | | u”— Vam
ADM690–ADM695
REV. A
–12–
ADM690
ADM692
ADM694
R
2
R
1
PFO
+5V
V
CC
CMOS RAM
POWER
I/O LINE
µP NMI
µP RESET
µP SYSTEM
µP POWER
V
OUT
RESET
WDI
GND
PFI
V
BATT
BATTERY
+
0.1µF
Figure 23a. ADM690/ADM692/ADM694 Typical Application
Circuit A
Figure 23b shows a similar application but in this case the PFI
input monitors the unregulated input to the 7805 voltage regu-
lator. This gives an earlier warning of an impending power fail-
ure. It is useful with processors operating at low speeds or
where there are a significant number of housekeeping tasks to be
completed before the power is lost.
ADM690
ADM692
ADM694
R2
R1
PFO
7805
INPUT
POWER
V > 8V
+5V
VCC
CMOS RAM
POWER
I/O LINE
µP NMI
µP RESET
µP SYSTEM
µP POWER
VOUT
RESET
WDI
GND
PFI
VBATT
0.1µF
BATTERY
0.1µF
Figure 23b. ADM690/ADM692/ADM694 Typical Application
Circuit B
ADM691, ADM693, ADM695
A typical connection for the ADM691/ADM693/ADM695 is
shown in Figure 24. CMOS RAM is powered from V
OUT
. When
5 V power is present this is routed to V
OUT
. If V
CC
fails then
V
BATT
is routed to V
OUT
. V
OUT
can supply up to 100 mA from
V
CC
, but if more current is required, an external PNP transistor
can be added. When V
CC
is higher than V
BATT
, the BATT ON
output goes low, providing up to 25 mA of base drive for the
external transistor. A 0.1 µF capacitor is connected to V
OUT
to
supply the transient currents for CMOS RAM. When V
CC
is
lower than V
BATT
, an internal 20 MOSFET connects the
backup battery to V
OUT
.
R =(V
CC
– 50 mV)/1 µA
Note that the resistor will discharge the battery slightly. With a
V
CC
supply of 4.5 V, a suitable resistor is 4.3 M. With a 3 V
battery this will draw around 700 nA. This will be negligible in
most cases.
ADM69x
V
BATT
BATTERY R
Figure 22b. Preventing Spurious RESETS During Battery
Replacement
TYPICAL APPLICATIONS
ADM690, ADM692 AND ADM694
Figure 23 shows the ADM690/ADM692/ADM694 in a typical
power monitoring, battery backup application. V
OUT
powers the
CMOS RAM. Under normal operating conditions with V
CC
present, V
OUT
is internally connected to V
CC
. If a power failure
occurs, V
CC
will decay and V
OUT
will be switched to V
BATT
thereby maintaining power for the CMOS RAM. A RESET
pulse is also generated when V
CC
falls below 4.65 V for the
ADM690/ADM694 or 4.4 V for the ADM692. RESET will
remain low for 50 ms (200 ms for ADM694) after V
CC
returns
to 5 V.
The watchdog timer input (WDI) monitors an I/O line from the
µP system. This line must be toggled once every 1.6 seconds to
verify correct software execution. Failure to toggle the line indi-
cates that the µP system is not correctly executing its program
and may be tied up in an endless loop. If this happens, a reset
pulse is generated to initialize the processor.
If the watchdog timer is not needed, the WDI input should be
left floating.
The Power Fail Input, PFI, monitors the input power supply via
a resistive divider network. The voltage on the PFI input is com-
pared with a precision 1.3 V internal reference. If the input volt-
age drops below 1.3 V, a power fail output (PFO) signal is
generated. This warns of an impending power failure and may
be used to interrupt the processor so that the system may be
shut down in an orderly fashion. The resistors in the sensing
network are ratioed to give the desired power fail threshold
voltage V
T
.
V
T
= (1.3 R
1
/R
2
) + 1.3 V
R
1
/R
2
= (V
T
/1.3) – 1
ADM690–ADM695
REV. A –13–
ADM691
ADM693
ADM695
R
2
R
1
PFO
INPUT POWER
+5V
V
CC
V
OUT
WDI
GND
PFI
V
BATT
0.1µF
3V
BATTERY
RESET
0.1µF
OSC IN
OSC SEL
LOW LINE WDO
SYSTEM STATUS
INDICATORS
CMOS
RAM
ADDRESS
DECODE
I/O LINE
NMI
RESET
A0–A15
µP
0.1µF
RESET
CE
OUT
CE
IN
BATT
ON
NC
Figure 24. ADM691/ADM693/ADM695 Typical Application
Reset Output
The internal voltage detector monitors V
CC
and generates a
RESET output to hold the microprocessor’s Reset line low
when V
CC
is below 4.65 V (4.4 V for ADM693). An internal
timer holds RESET low for 50 ms (200 ms for the ADM695)
after V
CC
rises above 4.65 V (4.4 V for ADM693). This prevents
repeated toggling of RESET even if the 5 V power drops out
and recovers with each power line cycle.
The crystal oscillator normally used to generate the clock for mi-
croprocessors can take several milliseconds to stabilize. Since
most microprocessors need several clock cycles to reset, RESET
must be held low until the microprocessor clock oscillator has
started. The power-up RESET pulse lasts 50 ms (200 ms for the
ADM695) to allow for this oscillator start-up time. If a different
reset pulse width is required, then a capacitor should be con-
nected to OSC IN or an external clock may be used. Please refer
to Table I and Figure 4. The manual reset switch and the 0.1 µF
capacitor connected to the reset line can be omitted if a manual
reset is not needed. An inverted, active high, RESET output is
also available.
Power Fail Detector
The +5 V V
CC
power line is monitored via a resistive potential
divider connected to the Power Fail Input (PFI). When the
voltage at PFI falls below 1.3 V, the Power Fail Output (PFO)
drives the processor’s NMI input low. If for example a Power
Fail threshold of 4.8 V is set with resistors R
1
and R
2
, the micro-
processor will have the time when V
CC
falls from 4.8 V to 4.65 V
to save data into RAM. An earlier power fail warning can be
generated if the unregulated dc input to the 5 V regulator is
available for monitoring. This will allow more time for micro-
processor housekeeping tasks to be completed before power is
lost.
RAM Write Protection
The ADM691/ADM693/ADM695 CE
OUT
line drives the Chip
Select inputs of the CMOS RAM. CE
OUT
follows CE
IN
as long
as V
CC
is above the 4.65 V (4.4 V for ADM693) reset threshold.
If V
CC
falls below the reset threshold, CE
OUT
goes high, inde-
pendent of the logic level at CE
IN
. This prevents the micropro-
cessor from writing erroneous data into RAM during power-up,
power-down, brownouts and momentary power interruptions.
Watchdog Timer
The microprocessor drives the Watchdog Input (WDI) with an
I/O line. When OSC IN and OSC SEL are unconnected, the
microprocessor must toggle the WDI pin once every 1.6 sec-
onds to verify proper software execution. If a hardware or soft-
ware failure occurs such that WDI not toggled, the ADM691/
ADM693 will issue a 50 ms (200 ms for ADM695) RESET
pulse after 1.6 seconds. This typically restarts the micro-
processor’s power-up routine. A new RESET pulse is issued
every 1.6 seconds until WDI is again strobed. If a different
watchdog timeout period is required, then a capacitor should be
connected to OSC IN or an external clock may be used. Please
refer to Table I and Figure 4.
The WATCHDOG OUTPUT (WDO) goes low if the watch-
dog timer is not serviced within its timeout period. Once WDO
goes low, it remains low until a transition occurs at WDI. The
watchdog timer feature can be disabled by leaving WDI
unconnected.
The RESET output has an internal 3 µA pull-up, and can either
connect to an open collector reset bus or directly drive a CMOS
gate without an external pull-up resistor.
ADM690–ADM695
REV. A
–14–
OUTLINE DIMENSIONS
Dimensions shown in inches and (mm).
8-Pin Plastic DIP (N-8)
PIN 1 0.280 (7.11)
0.240 (6.10)
4
58
1
SEATING
PLANE
0.060 (1.52)
0.015 (0.38)
0.150
(3.81)
MIN
0.210
(5.33)
MAX
0.160 (4.06)
0.115 (2.93)
0.430 (10.92)
0.348 (8.84)
0.022 (0.558)
0.014 (0.356)
0.070 (1.77)
0.045 (1.15)
0.100
(2.54)
BSC
0.325 (8.25)
0.300 (7.62)
0.015 (0.381)
0.008 (0.204)
0.195 (4.95)
0.115 (2.93)
16-Lead Plastic DIP (N-16)
0.840 (21.33)
0.745 (18.93)
0.325 (8.25)
0.300 (7.62)
0.015 (0.381)
0.008 (0.204)
0.195 (4.95)
0.115 (2.93)
PIN 1 0.280 (7.11)
0.240 (6.10)
9
16
18
0.210
(5.33)
0.200 (5.05)
0.125 (3.18)
0.022 (0.558)
0.014 (0.356) 0.100
(2.54)
BSC
SEATING
PLANE
0.060 (1.52)
0.015 (0.38)
0.150
(3.81)
0.070 (1.77)
0.045 (1.15)
8-Pin Cerdip (Q-8)
PIN 1
0.420 (10.67)
MAX 0.060 (1.52)
0.015 (0.38)
0.015 (0.381)
0.008 (0.204)
0.150
(3.81)
MIN
0.310 (7.87)
0.220 (5.59)
0.320 (8.13)
0.290 (7.37)
0.200
(5.08)
MAX
PLANE
SEATING
0.070 (1.78)
0.30 (0.76)
0.100 (2.54)
BSC
0.022 (0.558)
0.014 (0.356)
14
5
8
Hfl I HHHHHHHHT HHHHHHHH P7 4»{ LW 1% ffiwuwj? Hm
ADM690–ADM695
REV. A –15–
16-Lead Cerdip (Q-16)
PIN 1
0.840 (21.34) MAX 0.060 (1.52)
0.015 (0.38)
0.015 (0.381)
0.008 (0.204)
0.150
(3.81)
MIN
0.200
(5.08)
MAX
0.022 (0.558)
0.014 (0.356)
0.100 (2.54)
BSC 0.070 (1.78)
0.30 (0.76)
PLANE
SEATING
0.310 (7.87)
0.220 (5.59)
0.320 (8.13)
0.290 (7.37)
18
9
16
16-Lead SOIC (R-16)
0.019 (0.49)
0.05 (1.27)
REF
0.104
(2.65)
0.012
(0.3)
0.413 (10.50)
0.419
(10.65)
0.042
(1.07)
0.013
(0.32)
0.030
(0.75)
0.299
(7.60)
18
916
C1782a–2–6/96
PRINTED IN U.S.A.
–16–

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