September 2011 Doc ID 14996 Rev 2 1/9
9
SMA6F
High junction temperature Transil™
Features
■ECOPACK®2 compliant product
■Peak pulse power:
– 600 W (10/1000 µs)
– 4 kW (8/20 µs)
■Stand off voltage: 5, 12 or 13 V
■Unidirectional type
■Low clamping voltage versus standard series
■Low leakage current, 0.2 µA at 25 °C
■Operating Tj max: 175 °C
■JEDEC registered package outline
Complies with the following standards
■IEC 61000-4-2 level 4:
– 15 kV (air discharge)
– 8 kV (contact discharge)
■MIL STD 883G-Method 3015-7: class3B
– 25 kV (human body model)
Description
The SMA6F Transil series has been designed to
protect sensitive equipment against electro-static
discharges according to IEC 61000-4-2, MIL STD
883 Method 3015, and electrical over stress such
as IEC 61000-4-4 and 5. They are generally for
surges below 600 W 10/1000 µs.
This planar technology makes it compatible with
high-end equipment and SMPS where low
leakage current and high junction temperature are
required to provide reliability and stability over
time. Their low clamping voltages provides a
better safety margin to protect sensitive circuits
with extended life time expectancy.
Packaged in SMAflat non exposed pad, this
minimizes PCB space consumption (footprint in
accordance with IPC 7531 standard).
TM: Transil is a trademark of STMicroelectronics
K
A
Unidirectional
SMAflat
www.st.com
Tamb
(Tamra
I;
van Breakdown voiiage
VOL Clamping voliage
VuVuVm
IRM Leakage curreni @ VFW.
b 4m
IPP Peak pulse curreni I.
0T Voliage Iemperaiure COeHiCieM
VF Forward voliage drop "'
RD Dynamic resistance
2/9 Doc ID 14996 Flev 2
Characteristics SMA6F
2/9 Doc ID 14996 Rev 2
1 Characteristics
Table 1. Absolute ratings (Tamb = 25 °C)
Symbol Parameter Value Unit
PPP Peak pulse power dissipation (1) Tj initial = Tamb 600 W
P Power dissipation on infinite heatsink Tlead = 55 °C 6 W
IFSM
Non repetitive surge peak forward current for
unidirectional types
tp = 10 ms
Tj initial = Tamb
60 A
Tstg Storage temperature range -65 to +175 °C
TjOperating junction temperature range -55 to +175 °C
TLMaximum lead temperature for soldering during 10 s 260 °C
1. For a surge greater than the maximum values, the diode will fail in short-circuit.
Table 2. Thermal resistance
Symbol Parameter Value Unit
Rth (j-l) Junction to leads 20 °C/W
Table 3. Electrical characteristics - definitions (Tamb = 25 °C)
Symbol Parameter
VRM Stand-off voltage
VBR Breakdown voltage
VCL Clamping voltage
IRM Leakage current @ VRM
IPP Peak pulse current
αT Voltage temperature coefficient
VFForward voltage drop
RDDynamic resistance
V
CL
V
BR
V
RM
I
RM
I
R
I
PP
V
I
I
F
V
F
V
CL
V
BR
V
RM
I
RM
I
R
I
PP
V
I
I
F
V
F
Tamb
Inn
SMA6F Characteristics
Doc ID 14996 Rev 2 3/9
Figure 1. Definition of Ipp pulse
Table 4. Electrical characteristics - values (Tamb = 25 °C)
Type
IRM max@VRM V
BR @IR(1) VCL @IPP
10/1000 µs
RD(2)
10/1000 µs
VCL @IPP
8/20 µs
RD(2)
8/20 µs αT(3)
25 °C 85 °C min typ max max max max
µA (Max) V V mA V A ΩVA Ω10-4/°C
SMA6F5.0A 10 50 5.0 6.40 6.74 7.07 10 9.2 68 0.029 13.4 298 0.021 5.7
SMA6F12AVCL 0.2 1 12 13.2 13.7 14.3 1 18.5 31 0.135 22.9 157 0.055 7.8
SMA6F13A 0.2 1 13 14.4 15.2 15.9 1 20.4 29 0.154 23.9 147 0.054 8.3
1. Pulse test: tp <50ms.
2. To calculate maximum clamping voltage at other surge currents, use the following formula
VCLmax = RD x IPP + VBRmax
3. To calculate VBR versus junction temperature, use the following formula:
VBR @ Tj = VBR @ 25 °C x (1 + αT x (Tj - 25))
100
50
%IPP
trtp
0t
Repetitive peak pulse current
tr = rise time (µs)
tp = pulse duration time (µs)
Figure 2. Relative peak power dissipation
versus initial junction temperature
Figure 3. Peak pulse power versus
exponential pulse duration
(Tj initial = 25 °C)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
0 25 50 75 100 125 150 175 200
P
PP
[T
j
initial] / P
PP
[T
j
initial=25°C]
initial (°C)Tj
P (kW)
PP
0.1
1.0
10.0
100.0
1.0E-03 1.0E-02 1.0E-01 1.0E+00 1.0E+01
Tjinitial = 25 °C
t (ms)
p
SMA6F5 0A
15
20
T‘ inma‘:25 “c
25
e versus reverse applied Valiage (typical values)
Characteristics SMA6F
4/9 Doc ID 14996 Rev 2
Figure 4. Clamping voltage versus peak pulse current
(exponential waveform, maximum values)
Figure 5. Junction capacitance versus reverse applied voltage (typical values)
IPP(A)
0.1
1.0
10.0
100.0
1000.0
5 10152025
T
j
initial=25 °C
SMA6F5.0A
tp = 8/20 µs
tp = 10/1000 µs
SMA6F12AVCL
SMA6F13A
VCL(V)
C(pF)
100
1000
10000
1 10 100
F=1 MHz
V
OSC
=30 mV
RMS
T
j
=25 °C
SMA6F5.0A
SMA6F12AVCL
SMA6F13A
V (V)
R
um .uau u: u .n.nu .u u .u u .nm:
SMA6F Characteristics
Doc ID 14996 Rev 2 5/9
Figure 6. Peak forward voltage drop versus
peak forward current (typical
values)
Figure 7. Relative variation of thermal
impedance junction to ambient
versus pulse duration
Figure 8. Thermal resistance junction to
ambient versus copper surface
under each lead
Figure 9. Leakage current versus junction
temperature (typical values)
I (A)
FM
1.0E-02
1.0E-01
1.0E+00
1.0E+01
1.0E+02
0.0 0.5 1.0 1.5 2.0
Tj=25 °C
Tj=125 °C
V (V)
FM
Z
th(j-a)
/R
th(j-a)
0.00
0.01
0.10
1.00
1.
0
E-
03
1.
0
E-
0
21.
0
E-
0
11.
0
E+
00
1.
0
E+
0
11.
0
E+
0
21.
0
E+
03
On recommended pad layout.
Printed circuit board, FR4
copper thickness = 35 µm
copper surface = 1 cm²
t (S)
p
Rth(j-a)(°C/W)
0
20
40
60
80
100
120
140
160
180
200
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0
S (cm )
CU 2
Printed circuit board, FR4
copper thickness = 35 µm
I (nA)
R
1.E+00
1.E+01
1.E+02
1.E+03
1.E+04
25 50 75 100 125 150 175
V
R
=V
RM
V
BR
=11.7V
V
BR
>11.7V
T (°C)
j
Ordering information scheme SMA6F
6/9 Doc ID 14996 Rev 2
2 Ordering information scheme
Figure 10. Ordering information scheme
SM A 6F xx A - TR
Surface mount
Package
Surge rating
A = SMAflat package
6F = 600 W
Stand off voltage
example: 5.0 = 5.0 V
Type
A = Unidirectional
Delivery mode
TR = Tape and reel
EM
w
312
(0123)
1 20
(o 047)
millimelevs
(inches)
(0 use)
Doc ID 14996 Flev 2
SMA6F Package information
Doc ID 14996 Rev 2 7/9
3 Package information
●Case: JEDEC DO-221AC molded plastic over Planar junction
●Terminals: Solder plated, solderable per MIL-STD-750, Method 2026
●Polarity: Band indicates cathode
●Flammability: Epoxy rated UL94V-0
●RoHS package
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Table 5. SMAflat (non exposed pad) dimensions
Ref.
Dimensions
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A 0.90 1.10 0.035 0.043
b 1.25 1.65 0.049 0.065
c 0.15 0.40 0.006 0.016
D 2.25 2.95 0.088 0.116
E 4.80 5.60 0.189 0.220
E1 3.95 4.60 0.156 0.181
L 0.75 1.50 0.030 0.059
L1 0.50 0.019
L2 0.50 0.019
Figure 11. SMAflat footprint dimensions Figure 12. Marking information
D
A
L 2x
L
L2 2x
L1 2x
EE1
b
c
1.20
(0.047)
1.20
(0.047)
3.12
(0.123)
5.52
(0.217)
1.52
(0.060)
millimeters
(inches)
y w wz
x x x
ECOPACK status
XXX: Marking
Z: Manufacturing location
Y: Year
WW: week
Cathode bar (unidirectional devices only )
Ordering information SMA6F
8/9 Doc ID 14996 Rev 2
4 Ordering information
For the latest information on available order codes see the product pages on www.st.com.
5 Revision history
Rev 2
Table 6. Ordering information
Order code Marking Package Weight Base qty Delivery mode
SMA6F5.0A-TR SUA
SMAflat 0.035 g 10000 Tape and reelSMA6F12AVCL SUJ
SMA6F13A-TR SUG
Table 7. Document revision history
Date Revision Changes
04-Sep-2008 1First issue.
01-Sep-2011 2Updated order code in Ta b l e 6 .
SMA6F
Doc ID 14996 Rev 2 9/9
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