1723230003 Appl Spec Datasheet by Molex

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molexa REVISION. ECR/ECN \NFORMATION. TITLE. SHEET No. ECNa DATE. CONNECTOR SYSTEM DOCUMENTNUMBER. CREATED/REVEEDBV. CHECKEDBV. APPROVEDBY 1723230003
APPLICATION SPECIFICATION
REVISION:
ECR/ECN INFORMATION:
TITLE:
APPLICATION SPECIFICATION FOR
ULTRA-FIT WIRE TO BOARD
CONNECTOR SYSTEM
ABCDEFGHIJKLMNOPQRSTUVWX
SHEET No.
B
EC No:
642405
1 of 8
DATE:
7/29/2020
CREATED / REVISED BY:
CHECKED BY:
APPROVED BY:
1723230003
Dixon Li
Jonny. Zheng
Jonny. Zheng
TEMPLATE FILENAME: APPLICATION_SPEC[SIZE_A](V.1).DOC
1.0 SCOPE
This specification covers the requirements for the application of Ultra-Fit Tangless 3.50 mm pitch wire
to board connector systems.
2.0 PRODUCT NAME AND SERIES NUMBERS
Ultra-Fit Tangless Female Crimp Terminal 172253
Ultra-Fit Tangless Receptacle Housing 172256 / 172258
TPA Tangless 172264
Ultra-Fit Vertical Header 172286 / 172287 / 172298 / 172299
Ultra-Fit Right Angle Header 172310 / 172316
3.0 REFERENCE DOCUMENTS
See the appropriate sales drawings for information on specific part numbers and materials.
4.0 GENERAL APPLICATION NOTES
Appearance:
Parts conform to class "B" requirements of cosmetic specification PS-45499-002 except where
noted on the sales drawings.
Connector Application
This connector system is designed to mate gold plating to gold plating OR tin plating to tin plating.
Never cross mate tin plated parts to gold plated parts.
This connector system is not designed for current sharing (i.e. splitting one current load across
multiple circuits)
Connectors are not to be mated or unmated while circuits are live except per the current interrupt
rating listed in product specification: PS-172323-0001
Packaging
The parts should remain in the original Molex packaging until ready for use to prevent damage.
Chemical Exposure
Do not store terminals or header assemblies near any chemicals listed below as they may cause
corrosion in the terminal contacts.
Alkalies Ammonia Citrates Phosphates Citrates Sulfur Compounds
Amines Carbonates Nitrites Sulfur Nitrites Tartrates
molexa DIM T . . M 'f TWIsted Wires 1723230003 Cable Tie REVISION: ECR/ECN INFORMATION: TITLE: SHEET N0. EC No: DATE: CONNECTOR SYSTEM DOCUMENT NUMBER: CREATED / REVISED BY: CHECKED BY: APPROVED BY:
APPLICATION SPECIFICATION
REVISION:
ECR/ECN INFORMATION:
TITLE:
APPLICATION SPECIFICATION FOR
ULTRA-FIT WIRE TO BOARD
CONNECTOR SYSTEM
ABCDEFGHIJKLMNOPQRSTUVWX
SHEET No.
B
EC No:
642405
2 of 8
DATE:
7/29/2020
CREATED / REVISED BY:
CHECKED BY:
APPROVED BY:
1723230003
Dixon Li
Jonny. Zheng
Jonny. Zheng
TEMPLATE FILENAME: APPLICATION_SPEC[SIZE_A](V.1).DOC
Crimped Terminal Extraction
Female terminal extraction tool: See Molex part# 011-03-0016 instructions online on website. Do
not reuse terminals that have been removed with the extraction tool. The receptacle housing can
be reused if it was not damaged.
Minimum wire bend, cable tie or twist location
Circuit Sizes
Dim T Min.
(single row)
Dim T Min.
(dual row)
2
.50” (12.7 mm)
4-6
.75” (19.1 mm)
.75” (19.1 mm)
8
1.00” (25.4 mm)
10-12
1.25” (31.75 mm)
14-16
1.25” (31.75 mm)
The “T” dimension defines a “free” length of wire, or a length of wire that is not subject to
significant bias by external factors such as a wire tie, wire twisting, or other means of
bending or deforming of the wires that repositions them from their natural relaxed state
or location where they enter the housing. This dimension is a general recommendation
and may need to be adjusted for different wire gauges and wire type and insulation
thickness and insulation material.
Wires are to be dressed in such a manner to allow the terminals to float freely in the receptacle
pocket.
Connector Testing
Do not use Ultra-Fit connectors as test parts, they are not intended to be used with repeated
mating. Follow durability cycles as listed in PS-172323-0001
molexa REVISION: ECR/ECN INFORMATION: TITLE: SHEET N0. EC No: DATE: CONNECTOR SYSTEM DOCUMENT NUMBER: CREATED / REVISED BY: CHECKED BY: APPROVED BY: 1723230003
APPLICATION SPECIFICATION
REVISION:
ECR/ECN INFORMATION:
TITLE:
APPLICATION SPECIFICATION FOR
ULTRA-FIT WIRE TO BOARD
CONNECTOR SYSTEM
ABCDEFGHIJKLMNOPQRSTUVWX
SHEET No.
B
EC No:
642405
3 of 8
DATE:
7/29/2020
CREATED / REVISED BY:
CHECKED BY:
APPROVED BY:
1723230003
Dixon Li
Jonny. Zheng
Jonny. Zheng
TEMPLATE FILENAME: APPLICATION_SPEC[SIZE_A](V.1).DOC
Crimped Terminal Insertion
Terminals are inserted in same direction as below picture for both single row and dual row.
DO NOT reuse receptacle housing if a crimped terminal was pushed out without an extraction tool.
Array arrangement
Single Row Receptacle Terminal position into the housing
Dual Row Receptacle Terminal position into the housing
REVISION: ECR/ECN INFORMATION: TITLE: SHEET No. EC No: DATE: CONNECTOR SYSTEM DOCUMENT NUMBER: CREATED / REVISED BY: CHECKED BY: APPROVED BY: 1723230003
APPLICATION SPECIFICATION
REVISION:
ECR/ECN INFORMATION:
TITLE:
APPLICATION SPECIFICATION FOR
ULTRA-FIT WIRE TO BOARD
CONNECTOR SYSTEM
ABCDEFGHIJKLMNOPQRSTUVWX
SHEET No.
B
EC No:
642405
4 of 8
DATE:
7/29/2020
CREATED / REVISED BY:
CHECKED BY:
APPROVED BY:
1723230003
Dixon Li
Jonny. Zheng
Jonny. Zheng
TEMPLATE FILENAME: APPLICATION_SPEC[SIZE_A](V.1).DOC
Ensure terminals are fully seated and locked during terminal insertion to the receptacle housing
TPA Assembly over the wires
Crimp Terminal Appearance
TPA Feature
Locking feature
molexg REVISION: ECR/ECN INFORMATION: TITLE: SHEET No. EC No: DATE: CONNECTOR SYSTEM DOCUMENT NUMBER: CREATED / REVISED BY: CHECKED BY: APPROVED BY: 1723230003
APPLICATION SPECIFICATION
REVISION:
ECR/ECN INFORMATION:
TITLE:
APPLICATION SPECIFICATION FOR
ULTRA-FIT WIRE TO BOARD
CONNECTOR SYSTEM
ABCDEFGHIJKLMNOPQRSTUVWX
SHEET No.
B
EC No:
642405
5 of 8
DATE:
7/29/2020
CREATED / REVISED BY:
CHECKED BY:
APPROVED BY:
1723230003
Dixon Li
Jonny. Zheng
Jonny. Zheng
TEMPLATE FILENAME: APPLICATION_SPEC[SIZE_A](V.1).DOC
Forming marks on female terminal are normal. These are due to stretching of the plating during
the forming process and are superficial cracks on the plating surface.
Crimp Terminal Function
DO NOT use terminals with damaged front face:
Forming Marks
Normal Square
Front Box
Damaged
Front Box
molexa REVISION: ECR/ECN INFORMATION: TITLE: SHEET N0. EC No: DATE: CONNECTOR SYSTEM DOCUMENT NUMBER: CREATED / REVISED BY: CHECKED BY: APPROVED BY: 1723230003
APPLICATION SPECIFICATION
REVISION:
ECR/ECN INFORMATION:
TITLE:
APPLICATION SPECIFICATION FOR
ULTRA-FIT WIRE TO BOARD
CONNECTOR SYSTEM
ABCDEFGHIJKLMNOPQRSTUVWX
SHEET No.
B
EC No:
642405
6 of 8
DATE:
7/29/2020
CREATED / REVISED BY:
CHECKED BY:
APPROVED BY:
1723230003
Dixon Li
Jonny. Zheng
Jonny. Zheng
TEMPLATE FILENAME: APPLICATION_SPEC[SIZE_A](V.1).DOC
Crimp Terminal Handling
Due to exposed terminal interface, keep crimp terminals on prepackaged reel until they are
crimped onto wires. Do not precut and bulk pack terminals due to risk of damaging the contact
interface. Store and handle crimped terminals so the interface does not make contact with other
terminals or foreign objects. If terminal interface is damaged please discard prior to assembly.
Crimping
For acceptable crimp tools and specifications see application tooling section on Molex.com listed
for each terminal part number.
Use with multi strand wire only. Single strand wire should not be used.
This female crimp terminal is designed for single wire crimping only, no double wire crimping is
allowed.
Use only Molex specified crimp tooling, refer to Molex.com for acceptable crimp tooling. Crimped
terminals must also meet Molex crimp specifications. Using crimp tooling/specifications other
than specified voids any product warranties and will negatively impact mechanical and electrical
performance.
Header Appearance
Discoloration in the bandolier carrier area of the pin is inherent to the plating process and is due to
the masking effect of the carrier. This discoloration is in a non-functional area of the pin and will
not affect the performance of the header assembly. Refer to cosmetic specification PS-45499-
002.
Right Angle Header Appearance
Forming marks on header pins are acceptable. Refer to cosmetic specification PS-45499-002.
molexg REVISION: ECR/ECN INFORMATION: TITLE: SHEET No. EC No: 9E: CONNECTORSYSTEM DOCUMENT NUMBER: CREATED / REVISED BV: CHECKED BV: APPROVED BV: 1723230003
APPLICATION SPECIFICATION
REVISION:
ECR/ECN INFORMATION:
TITLE:
APPLICATION SPECIFICATION FOR
ULTRA-FIT WIRE TO BOARD
CONNECTOR SYSTEM
ABCDEFGHIJKLMNOPQRSTUVWX
SHEET No.
B
EC No:
642405
7 of 8
DATE:
7/29/2020
CREATED / REVISED BY:
CHECKED BY:
APPROVED BY:
1723230003
Dixon Li
Jonny. Zheng
Jonny. Zheng
TEMPLATE FILENAME: APPLICATION_SPEC[SIZE_A](V.1).DOC
Header Assembly to Board
Headers are designed with press fit pegs and need to be pushed into the circuit board.
Header should be flush with board after insertion.
See below for solder process information.
Solder Process Temperatures
Wave Solder: 260°C Max
Reflow Solder: 260°C Max
Reflow Soldering Profile
See AS-40000-5013
Plated Thru Hole profile
Keep outer ring at 5 mils max with at least 20 mils distance between adjacent metal
pads
MAX
MIN
molexa Component Side (PCB top View) Preferred wave solder direction REVISION: ECR/ECN INFORMATION: TITLE: SHEET N0. EC No: DATE: CONNECTOR SYSTEM DOCUMENT NUMBER: CREATED / REVISED BY: CHECKED BY: APPROVED BY: 1723230003
APPLICATION SPECIFICATION
REVISION:
ECR/ECN INFORMATION:
TITLE:
APPLICATION SPECIFICATION FOR
ULTRA-FIT WIRE TO BOARD
CONNECTOR SYSTEM
ABCDEFGHIJKLMNOPQRSTUVWX
SHEET No.
B
EC No:
642405
8 of 8
DATE:
7/29/2020
CREATED / REVISED BY:
CHECKED BY:
APPROVED BY:
1723230003
Dixon Li
Jonny. Zheng
Jonny. Zheng
TEMPLATE FILENAME: APPLICATION_SPEC[SIZE_A](V.1).DOC
Wave Solder Direction
Preferred wave solder direction:

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