Thermal Management Catalog Datasheet by Parker Chomerics

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ENGINEERING YOUR SUCCESS.
Thermal Interface Materials
For Electronics Cooling
Products & Custom Solutions Catalog
These products can expose you to chemicals including carbon black (airborne and extracts), antimony trioxide, titanium dioxide, silica (crystalline), di(2-ethylhexyl)phthalate, ethylene
thiourea, acrylonitrile, 1,3-butadiene, epichlorohydrin, toluenediisocyanate, tetrafluoroethylene, ethylbenzene, formaldehyde, furfuryl alcohol, glass fibers, methyl isobutyl ketone,
nickel (metallic and compounds), lead and lead compounds which are known to the State of California to cause cancer; and 1,3-butadiene, epichlorohydrin, di(2-ethylhexyl)phthalate,
di-isodecyl phthalate, ethylene thiourea, methyl isobutyl ketone, methanol, toluene, lead and lead compounds which are known to the State of Califormia to cause birth defects and
other reproductive harm. For more information go to www.P65Warnings.ca.gov.
WARNING:
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NOTES
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Heat Transfer Fundamentals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6
Thermal Gels . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
Gap Filler Pads . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17
Phase Change Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25
Thermal Tapes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28
Potting and Underfill Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32
Dielectric Pads . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36
Heat Spreaders . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .44
Thermal Greases . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .49
Glossary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .52
Thermal Management
Products & Custom Solutions
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Introduction
Parker Chomerics is a global provider of
EMI shielding and thermal interface
materials as well as electrically conductive
thermoplastics and optical products.
Parker provides products and services to
OEM and CEM electronics companies in the
telecommunications, information technology,
consumer, power conversion, medical device,
defense and transportation markets.
TIMs for Military and Aerospace
Applications
Introduction
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About Parker Hannifin
Corporation
Parker Hannifin (NYSE:PH) is
the world’s leading diversified
manufacturer of motion and control
technologies and systems, providing
precision-engineered solutions for a
wide variety of mobile, industrial and
aerospace markets. The company’s
products are vital to virtually
everything that moves or requires
control, including the manufacture
and processing of raw materials,
durable goods, infrastructure
development and all forms of
transport. Parker is strategically
diversified, value-driven and well
positioned for global growth as the
industry consolidator and supplier
of choice.
Dispensed Gels in
Automotive Electronic Control Unit
(ECU) Applications
TIMs for Light Emitting
Diode (LED) and
Industrial Applications
Gap Filler Pad
and Dispensed Gels for
Telecommunications
As each new electronic product generation requires higher power in
smaller packages, the challenges associated with thermal management
become more intense. Parker is committed to developing new,
high-performance products to meet the thermal and design challenges
of tomorrow’s systems. Thermal material drivers include:
Lower thermal impedance
Higher thermal conductivity
Greater compliance and conformability
High reliability
Greater adhesion
Ease of handling, application and use
Long service life
Parker Chomerics’ drive to support our customers is also based on
our continuing commitment to:
Thermal materials expertise
Comprehensive applications engineering
Optimized supply chain and logistics
Worldwide fabrication and service
The objective of thermal manage in electronic packaging is the effici at from the semiconductor junction to the am nt. ‘>> lllll BASI C TH E0 RV The rate at which heat is co nd surface warp through a material is proportional to ctual Contact 000 the area normal to the heat llow and oints, leavlng air» to the temperature gradient along the A alleys align. Air v heat llow path. For a one dlmensional, steady state heat flow the rate is expressed by Fourier's equation: A heat and force Where: k : themial conductivity W/mrK o : rate of heat llow‘ w A : Contact area, m2 lstance of heat flow‘ m T : temperature dliference, c Thermal oonductlvity, k, ls an intrinsic property of a homoge mlcmmerics
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BASIC THEORY
The rate at which heat is conducted
through a material is proportional to
the area normal to the heat flow and
to the temperature gradient along the
heat flow path. For a one dimensional,
steady state heat flow the rate is
expressed by Fourier’s equation:
Where:
k = thermal conductivity, W/m-K
Q = rate of heat flow, W
A = contact area, m2
d = distance of heat flow, m
T = temperature difference, C
Thermal conductivity, k, is an intrinsic
property of a homogeneous material
which describes the material’s ability
to conduct heat. This property is
independent of material size, shape
or orientation. For non-homogeneous
materials, those having glass mesh
or polymer film reinforcement, the
term “relative thermal conductivity”
is appropriate because the thermal
conductivity of these materials
depends on the relative thickness of
the layers and their orientation with
respect to heat flow.
Another inherent thermal property of
a material is its thermal resistance, R,
as defined in Equation 2.
This property is a measure of how a
material of a specific thickness resists
the flow of heat. The relationship
between k and R is shown by
substituting Equation (2) into (1) and
rearranging to form (3)
Equation 3 shows that for
homogeneous materials, thermal
resistance is directly proportional to
thickness. For non-homogeneous
materials, the resistance generally
increases with thickness but the
relationship may not be exactly linear.
Thermal conductivity and thermal
resistance describe heat transfer within
a material once heat has entered the
material. Because real surfaces are
never truly flat or smooth, the contact
plane between a surface and a material
can also produce a resistance to
the flow of heat. Figure 1a depicts
surface irregularities on a micro scale
and surface warp on a macro scale.
Actual contact occurs at the high
points, leaving air-filled voids where the
valleys align. Air voids resist the flow
of heat and force more of the heat to
flow through the contact points. This
constriction resistance is referred to
as surface contact resistance (Rcontact)
and can be a factor at all contacting
surfaces.
The thermal impedance [
θ
] of a
material is defined as the sum of its
thermal resistance (Rmaterial) and any
contact resistance (Rcontact) between it
and the contacting surfaces as defined
in Equation 4.
Surface flatness, surface roughness,
clamping pressure, material thickness,
the presence of pressure sensitive
adhesive (PSA) and compressive
modulus have a major impact on
contact resistance. Because these
surface conditions can vary from
application to application, thermal
impedance of a material will also be
application dependent.
The objective of thermal management programs in
electronic packaging is the efficient removal of heat from the
semiconductor junction to the ambient environment.
This process can be separated into three major phases:
1. heat transfer within the semiconductor component package;
2. heat transfer from the package to a heat dissipater
(the initial heat sink);
3. heat transfer from the heat dissipater to the ambient
environment (the ultimate heat sink)
The first phase is generally beyond the control of the system
level thermal engineer because the package type defines the
internal heat transfer processes. In the second and third phases,
the packaging engineer’s goal is to design an efficient thermal
connection from the package surface to the initial heat spreader
and on to the ambient environment. Achieving this goal requires
a thorough understanding of heat transfer fundamentals as well
as knowledge of available interface materials and how their key
physical properties affect the heat transfer process.
Heat Transfer Fundamentals
Figure 1a. Schematic representation of two surfaces in contact and
heat flow across the interface without (left) and with thermal interface
material applied.
Air
Thermal Interface MaterialThermal Interface MaterialAir
Thermal Interface MaterialThermal Interface Material
Equation 1
Q
=
k A
T
d
Equation 2
R
= A T
Q
Equation 3
k
= d
R
Equation 4
θ
=
R
material +
R
contact
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Heat generated by a semiconductor
must be removed to the ambient
environment to maintain the junction
temperature of the component within
safe operating limits. Often this heat
removal process involves conduction
from a package surface to a heat
spreader that can more efficiently
transfer the heat to the ambient
environment. The spreader has to
be carefully joined to the package to
minimize the thermal resistance of
this newly formed thermal joint.
Attaching a heat spreader to a
semiconductor package surface
requires that two commercial grade
surfaces be brought into intimate
contact. These surfaces are usually
characterized by a microscopic
surface roughness superimposed
on a macroscopic non-planarity that
can give the surfaces a concave,
convex or twisted shape. When two
such surfaces are joined, contact
occurs only at the high points. The
low points form air-filled voids.
Typical contact area can consist
of more than 90 percent air voids,
which represents a significant
resistance to heat flow.
THERMAL INTERFACE MATERIALS (TIMs)
THERMAL PROPERTIES
The key properties of interface
materials are thermal impedance
and thermal conductivity.
THERMAL IMPEDANCE
This is the measure of the total
resistance to the flow of heat from
a hot surface through an interface
material into a cold surface. Thermal
impedance is measured according
to the ASTM D5470 test method.
Although the current version of this
method is specific to high durometer
insulating pad materials tested at
high clamping forces, the method
has been successfully adapted for
use with low durometer materials
as well as fluid compounds.
Thermal impedance can be
measured using ASTM D5470 at
several clamping forces to generate a
pressure versus thermal impedance
plot as shown in Figure 2. This type
of data can be used to generate
information about the ability of a
material to conform to surfaces to
minimize contact resistance. Care must
be taken with this type of data because
contact resistance is also highly
influenced by surface characteristics.
To minimize the impact of test
equipment variations, this type of work
is best performed with the same test
surfaces for all materials being tested.
THERMAL CONDUCTIVITY
Thermal impedance data measured
according to ASTM D5470 can be used
to calculate the thermal conductivity
of an interface material. Rearranging
Equation (3) to give Equation (5)
and substituting into Equation (4) yields
Equation (6).
Equation (6) shows that for a homo-
geneous material, a plot of thermal
impedance [Θ] versus thickness (d) is
a straight line whose slope is equal to
the inverse of the thermal conductivity
and the intercept at zero thickness
is the contact resistance shown in
Figure 2. Thickness can be varied by
either stacking up different layers of the
material or by preparing the material
at different thicknesses.
COEFFICIENT OF THERMAL
EXPANSION
CTE is the tendency of a material
to change in volume in response to
changes in temperature.
HEAT CAPACITY
Heat capacity or thermal mass
represents the ability of a material
to store heat.
Figure 2. Thermal Impedance vs. Thickness
Slope = 1/k
Θ
R
contact
d
®
KEY PROPERTIES OF THERMAL INTERFACE MATERIALS
Thermally conductive materials are
used to eliminate these interstitial
air gaps from the interface by
conforming to the rough and
uneven mating surfaces. Because
the TIM has a greater thermal
conductivity than the air it replaces,
the resistance across the joint
decreases, and the component
junction temperature will be
reduced. A variety of material types
have been developed in response to
the changing needs of the electronic
packaging market.
d
k
Equation 5
R
material =
Equation 6
θ
= +
R
contact
d
k
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Thermal Conductivity Conversion Guide
ELECTRICAL PROPERTIES
VOLTAGE BREAKDOWN
This is a measure of how much
voltage differential a material can
withstand under a specific set of test
conditions. This property is usually
measured using ASTM D149 where a
test specimen is subjected to ramped
alternating current voltage such that
dielectric failure is reached within 20
seconds after the start of the test. Five
specimens are tested and the average
voltage breakdown is calculated and
reported. The value is an average, not
a minimum. Voltage Breakdown can
be converted to Dielectric Strength by
dividing the voltage breakdown value
by the specimen thickness where
the dielectric failure occurred. This
test is an indication of the ability of a
material to withstand high voltages,
but does not guarantee how a
material will behave over time in a real
application. The value is influenced by
several factors. Humidity and elevated
temperature will reduce the voltage
breakdown because absorbed water
will degrade the electrical properties of
the material.
The size of the test electrode will affect
the observed breakdown voltage.
A larger test electrode will typically
yield a lower breakdown voltage. The
presence of partial discharge, as well
as mechanical stresses imposed on
the interface material, also reduce
voltage breakdown.
VOLUME RESISTIVITY
Volume resistivity is a measure of the
bulk electrical resistance of a unit
cube of a material. When determined
per ASTM D257, volume resistivity
can give an indication of how well an
interface material can limit leakage
current between an active component
and its grounded metal heat sink.
As with voltage breakdown, volume
resistivity can be significantly lowered
by humidity and elevated temperature.
ELASTOMERIC PROPERTIES
Interface materials exhibit properties
typical of highly filled elastomers,
namely compression deflection,
compression set and stress relaxation.
COMPRESSION DEFLECTION
Compression deflection refers to
resultant forces a material exerts while
being deflected. As a compressive
load is applied, the elastomer material
is deformed but the volume of the
material remains constant. The
compression deflection characteristics
can vary, depending on part geometry
(i.e., thickness and surface area), rate
of deflection, size of probe, etc.
STRESS RELAXATION
When a compressive load is applied to
an interface material, there is an initial
deflection followed by a slow relaxation
process whereby some of the load is
relieved. This process continues until
the compressive load is balanced by
the cohesive strength of the material.
COMPRESSION SET
Compression set is the result of stress
relaxation. After a material has been
subjected to a compressive load for an
extended time, part of the deflection
becomes permanent and will not be
recoverable after the load is reduced.
From Cal
sec-cm-˚C
BTU-in
hr-ft2-˚F
W
m-k
Multiplier 4.2 x 1022.9 x 1030.14 3.4 x 10-4 6.94 2.4 x 10-3
To W
m-k
BTU-in
hr-ft2-˚F
W
m-k
Cal
sec-cm-˚C
BTU-in
hr-ft2-˚F
Cal
sec-cm-˚C
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Gap Fillers come in two different types, gels and pads. Gels are low-closure-force,
electrically isolating, fully cured materials that are dispensed into place. Gap filler pads are low-
closure-force thermal pads designed to accommodate a wide gap range and electrical isolation.
Phase Change Materials are thin pads that are placed between a heatsink and
the IC chip that then change phase into a liquid at higher temperatures to achieve a thin bond line
for better thermal performance. Poly solder hybrid (PSH) materials consist of both binder and
fillers which both change phase.
Thermal Tapes have adhesive on both sides to hold a heat sink in contact with
an IC component.
Potting and Underfill Materials are one- or two-component materials that are
dispensed and then cured in place afterwards (unlike thermal gap filler gels, which are already
cured when dispensed).
Dielectric Pads are higher-closure-force pads specifically designed to be electrically
isolating, also known as a dielectric, as well as being thermally conductive. Dielectric pads are
typically used on power transistors that have an electrically energized base that will short out if
made to directly contact a metal heat sink.
Heat Spreaders utilize two different vehicles of thermal transfer: conduction to pull heat
off an integrated circuit, and convection to use air flow over the product to remove that heat from
the assembly.
Thermal Greases are silicone-based pastes with a thermally conductive filler material
meant to draw heat away from a heat-generating component on a circuit board while filling very
thin bond lines.
Parker Chomerics
Thermal Interface Material Offerings
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Thermal Management Materials Selector
Gap Fillers Phase Change
Materials
Thermal
Tapes
Thermal Interface
Materials
Potting and
Underfill
Materials
Dielectric
Pads
Heat
Spreaders
Thermal
Greases
Standard
Phase Change
Materials (PSM)
Page 25
THERMFLOW
PC07DM-7
THERMFLOW
T710
THERMFLOW
T725
THERMFLOW
T766/T766-06
THERMATTACH
T418
THERMATTACH
T412
THERMATTACH
T404/T414
THERMATTACH
T405/T405-R
THERMFLOW
T557
THERMFLOW
T558
THERMFLOW
T777
CHO-THERM
T444
CHO-THERM
1674
CHO-THERM
T441
CHO-THERM
T609
CHO-THERM
1678
CHO-THERM
T500
T-WING
TW 10 T650
T660
T670
CHO-THERM
1671
THERM-A-FORM
CIP 35
THERM-A-FORM
1641
THERM-A-FORM
1642
THERM-A-FORM
T642
THERM-A-FORM
T644
THERM-A-FORM
T646
THERM-A-FORM
T647
THERM-A-GAP
T630
THERM-A-GAP
T635
THERM-A-GAP
T636
THERM-A-GAP
GEL 25NS
THERM-A-GAP
GEL 8010
THERM-A-GAP
GEL 30
THERM-A-GAP
GEL 37
THERM-A-GAP
GEL 45
THERM-A-GAP
TC50
Pads
Page 17
THERM-A-GAP
HCS10
THERM-A-GAP
569
THERM-A-GAP
570
THERM-A-GAP
579
THERM-A-GAP
580
THERM-A-GAP
G974
THERM-A-GAP
974
THERM-A-GAP
976
Poly Solder
Hybrid
Materials (PSH)
Page 25
Double-sided
Thermal
Interface Tapes
Page 28
Cure-in-Place
Materials
Page 32
Underfill
Materials
Page 32
Thermal
Insulator Pads
Page 36
Silicone
Grease
Page 49
Low Profile
Page 44
Gels
Page 12
THERMATTACH
T411
Thermal Performance
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THERM-A-GAP Gels
Dispensable, Very Low Compression Force, Thermal Gap Fillers
THERM-A-GAP Gels are highly conformable, pre-cured,
single-component compounds. The cross-linked gel
structure provides superior long term thermal stability
and reliable performance.
TYPICAL APPLICATIONS
Automotive electronic control
units (ECUs)
- Engine control
- Transmission control
- Braking/traction control
Power conversion equipment
Power supplies and uninterruptible
power supplies
Power semiconductors
MOSFET arrays with common
heat sinks
Televisions and consumer
electronics
FEATURES / BENEFITS
Dispensable
Fully cured
Highly conformable at low
pressures
No refrigeration, mixing or filler
settling issues in storage
Single dispensable TIM can
eliminate multiple pad part
sizes/numbers
Reworkable
Consult Applications Engineering for automated
dispensing equipment recommendations.
PERFORMANCE GUIDE
Flow Rate (grams/min)
Thermal Conductivity (W/m-K)
6.0
5.0
4.0
3.0
2.0
1.0
10 20 30 40 50 60
Gel 45
Gel 8010
Gel 37
TC 50
Gel 30
T636
T635
T630
Gel 25NS
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THERM-A-GAP Thermally Conductive Gels
Typical PropertiesT630 T635 T636 Test Method
Physical
Color White White Yellow Visual
Binder Silicone Silicone Silicone --
Flow Rate, grams/min - 30 cc taper tip,
0.130" orifice, 90 psi (621 kPa) 10 8 8 Chomerics
Specific Gravity 2.0 1.5 1.2 ASTM D792
Typical Minimum Bondline Thickness, in (mm) 0.004 (0.10) 0.015 (0.38) 0.015 (0.38) --
Thermal
Thermal Conductivity, W/m-K 0.7 1.7 2.4 ASTM D5470
Heat Capacity, J/g-K 1.1 0.9 0.9 ASTM E1269
Coefficient of Thermal Expansion, ppm/K 350 400 400 ASTM E831
Operating Temperature Range, °F (°C) -67 to 392
(-55 to 200) -67 to 392
(-55 to 200) -67 to 392
(-55 to 200) --
Electrical
Dielectric Strength, Vac/mil (kVac/mm) 200 (8) 200 (8) 200 (8) ASTM D149
Volume Resistivity, ohm-cm 1014 1014 1014 ASTM D257
Dielectric Constant @ 1,000 kHz 5.5 4.0 4.0 ASTM D150
Dissipation Factor @ 1,000 kHz 0.010 0.003 0.003 Chomerics
Regulatory
Flammability Rating
(See UL File E140244 for details) V-0 Not Tested V-0 UL 94
RoHS Compliant Yes Yes Yes Chomerics
Certification
Outgassing, % TML (% CVCM) 0.55 (0.14) Not Tested 0.49 (0.18) ASTM E595
Shelf Life, months from date of manufacture 18 18 18 Chomerics
Storage Conditions, °F (°C) @ 50% Relative Humidity 50 to 90
(10 to 32) 50 to 90
(10 to 32) 50 to 90
(10 to 32) Chomerics
Test method:
• ASTM C165 Modified
• Dispensed material and brought 0.50” diameter probe down to 0.100” height
• Strain rate 0.025 in/min
DEFLECTION – T630
7
6
5
4
3
2
1
0
Strain (%)
0 10 20 30 40 50 60 70 80
Force (psi)
Typical properties: these are not to be construed as specifications .
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THERM-A-GAP Thermally Conductive Gels
Typical PropertiesGEL 25NS GEL 8010 GEL 30 GEL 37 Test Method
Physical
Color Yellow White Pink Blue Visual
Binder Urethane Silicone Silicone Silicone --
Flow Rate, grams/min - 30 cc syringe with no
tip attachment, 0.100” orifice, 90 psi (621 kPa) 15 60 20 30 Chomerics
Specific Gravity 2.6 2.7 3.1 3.1 ASTM D792
Typical Minimum Bondline Thickness, in (mm) 0.004 (0.11) 0.002 (0.05) 0.004 (0.10) 0.004 (0.10) Chomerics
Thermal
Thermal Conductivity, W/m-K 2.5 3.0 3.5 3.7 ASTM D5470
Heat Capacity, J/g-K 0.96 1 1 1 ASTM E1269
Coefficient of Thermal Expansion, ppm/K < 300 150 150 150 ASTM E831
Operating Temperature Range, °F (°C) -58 to 257
(-50 to 125) -67 to 392
(-55 to 200) -67 to 392
(-55 to 200) -67 to 392
(-55 to 200) Chomerics
Electrical
Dielectric Strength, Vac/mil (kVac/mm) 200 (8) 200 (8) 200 (8) 180 (7.0) ASTM D149
Volume Resistivity, ohm-cm 1014 1014 1014 1014 ASTM D257
Dielectric Constant @ 1000 kHz 6.7 6.3 7.0 5.9 ASTM D150
Dissipation Factor @ 1000 kHz 0.018 0.002 0.002 0.012 Chomerics
Regulatory
Flammability Rating V-0 V-0 V-0 V-0 UL 94
RoHS Compliant Yes Yes Yes Yes Chomerics
Certification
Outgassing, % TML (% CVCM) 0.23 (0.04) 1.33 (0.34) 0.15 (0.05) 0.18 (0.07) ASTM E595
Shelf Life, months from date of manufacture 12 18 18 18 Chomerics
Storage Conditions, °F (°C) @ 50%
Relative Humidity 50 to 90
(10 to 32) 50 to 90
(10 to 32) 50 to 90
(10 to 32) 50 to 90
(10 to 32) Chomerics
Typical properties: these are not to be construed as specifications .
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THERM-A-GAP Thermally Conductive Gels
Typical PropertiesGEL 45 TC50 Test Method
Physical
Color Black Gray Visual
Binder Silicone Silicone --
Flow Rate, grams/min - 30 cc syringe with no
tip attachment, 0.100” orifice, 90 psi (621 kPa) 55 10 Chomerics
Specific Gravity 3.1 3.25 ASTM D792
Typical Minimum Bondline Thickness, in (mm) 0.0035 (0.0889) 0.006 (0.15) Chomerics
Thermal
Thermal Conductivity, W/m-K 4.5 5.0 ASTM D5470
Heat Capacity, J/g-K 1 1 ASTM E1269
Coefficient of Thermal Expansion, ppm/K 150 150 ASTM E831
Operating Temperature Range, °F (°C) -67 to 392
(-55 to 200) -67 to 392
(-55 to 200) Chomerics
Electrical
Dielectric Strength, Vac/mil (kVac/mm) 200 (8) 200 (8) ASTM D149
Volume Resistivity, ohm-cm 1014 1014 ASTM D257
Dielectric Constant @ 1000 kHz 7.0 6.8 ASTM D150
Dissipation Factor @ 1000 kHz 0.002 0.022 Chomerics
Regulatory
Flammability Rating V-0 V-0 UL 94
RoHS Compliant Yes Yes Chomerics
Certification
Outgassing, % TML (% CVCM) 0.15 (0.05) 0.07 (0.01) ASTM E595
Shelf Life, months from date of manufacture 18 18 Chomerics
Storage Conditions, °F (°C) @ 50%
Relative Humidity 50 to 90
(10 to 32) 50 to 90
(10 to 32) Chomerics
Typical properties: these are not to be construed as specifications .
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Ordering Information
THERM-A-GAP Thermally Conductive Gels
Cartridge Type
00
02
1P
5P
Material Type
T630
T635
T636
GEL 25NS
GEL 8010
GEL 30
GEL 37
GEL 45
TC50
GEL 75
Vessel Size
0010 = 10 cc Manual Dispense Syringe
0030 = 30 cc Taper Tip Tube
0300 = 300 cc Aluminum Cartridge (Caulking Style)
0030 = 30 cc EFD Plastic Cartridge
0180 = 180 cc EFD Plastic Cartridge
2500 = 1 US gal Pail
7500 = 5 US gal Pail
65 XX YYYYY ZZZZ
PART NUMBER:
These materials are available in the following formats.
Ordering Information: Custom Configurations
Larger custom cartridges and pails available . Please contact Parker Chomerics
for a pre-assigned part number for custom part sizes .
SEMCO is a registered trademark of PPG Aerospace
Dispensing Equipment Options Optional Supplier Description
Hand-Gun Pneumatic Dispensing 300 cc cartridges Bergdahl Associates SEMCO® Model 550
Hand-Gun Pneumatic Dispensing 180 cc (6 oz) cartridges Bergdahl Associates Model 250A-6 oz Sealant Gun
www.bergdahl.com
Pneumatic Shot Size Controllers
30 cc, 180 cc and 300 cc shot size dispensing equipment
EFD
Ultra 2400 Series
Ultra 1400 Series
Ultra 870 Series
30 cc/55 cc Adapter Assembly EFD 10000D5152
Dispensing Sleeve to support 6 oz (180 cc) SEMCO® tubes EFD 5192-6
www.efd-inc.com
mlcmmerics
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Phone +1 781-935-4850 www.parker.com/chomerics
THERM-A-GAP Pads
Thermally Conductive Gap Filler Pads
THERM-A-GAP gap-filler sheets and pads offer
excellent thermal properties and highest conformability
at low clamping forces.
FEATURES/BENEFITS
Ultra low deflection force
High thermal conductivity
High tack surface reduces
contact resistance
974 and G974 supplied with
PSA for ease of use
976 is softer compared to similar
high conductivity materials
“A” version offers high strength
acrylic PSA for permanent
attachment
All products are available on aluminum
foil “A” or on “clean break” glass “G”
fiber carrier. As with all previous Parker
Chomerics gap-fillers, the “A” versions
have a high strength acrylic pressure
sensitive adhesive (PSA) for permanent
attachment to the cold surfaces.
TYPICAL APPLICATIONS
Telecommunications equipment
Consumer electronics
Automotive electronics (ECUs)
LEDs, lighting
Power conversion
Power semiconductors
Desktop computers, laptops,
servers
Handheld devices
Memory modules
Vibration dampening
PERFORMANCE GUIDE
7.0
6.0
5.0
4.0
3.0
2.0
1.0
Hardness (Shore 00)
10 20 30 40 50 60 70
Thermal Conductivity (W/m-K)
569
580
570
579
HCS10
Hardness (Shore A)
10 20 30 40
974
976
G974
mlcmmerics
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Phone +1 781-935-4850 www.parker.com/chomerics
THERM-A-GAP Gap Filler Pads
Typical PropertiesHCS10 569 570 579 580 Test Method
Physical
Color Orange /
Gray Carrier Gray Blue Pink Yellow Visual
Binder Silicone Silicone Silicone Silicone Silicone --
Carrier Options
Supported (standard):
G = Woven glass carrier - no PSA
A = Aluminum foil carrier - with acrylic PSA
Supported (custom):
PN = PEN film carrier
KT = Thermally enhanced polyimide carrier
Unsupported (no carrier):
579 and 580 only - no letter notation needed
HCS10A or
HCS10G A569, G569 or
569PN A570 or G570 A579, G579,
579PN, 579KT,
or 579
A580, G580,
or 580 --
Standard Thicknesses*, in (mm)
Unsupported (no carrier): 0.120-0.200 (3.0-5.0) 0.010 - 0.200
(0.25 - 5.0) 0.010 - 0.200
(0.25 - 5.0) 0.020 - 0.200
(0.5 - 5.0) 0.010 - 0.200
(0.25 - 5.0) 0.020 - 0.200
(0.5 - 5.0) ASTM D374
Specific Gravity 2.0 2.2 2.2 2.9 2.9 ASTM D792
Hardness, Shore 00 4 10 25 30 75 ASTM D2240
Percent Deflection @ various pressures**
(0.125 in thick sample)
@ 5 psi (34 kPa)
@ 10 psi (69 kPa)
@ 25 psi (172 kPa)
@ 50 psi (345 kPa)
% Deflected
26
36
59
73
% Deflected
20
30
50
65
% Deflected
10
15
25
35
% Deflected
22
33
55
68
% Deflected
7
10
20
30
ASTM C165
MOD (0.125 in
“G” Type, 0.50
in dia probe,
0.025 in/min rate)
Operating Temperature Range, °F (°C) -67 to 392
(-55 to 200) -67 to 392
(-55 to 200) -67 to 392
(-55 to 200) -67 to 392
(-55 to 200) -67 to 392
(-55 to 200) --
Thermal
Thermal Conductivity, W/m-K 1 1.5 1.5 3 3 ASTM D5470
Thermal Impedance, °C-in2/W (°C-cm2/W)
@ 10 psi, @ 0.04 in (1 mm) thick, “G” version only 1.5
(9.7) 1.4
(9.1) 1.4
(9.1) 0.7
(4.5) 0.7
(4.5) ASTM D5470
Heat Capacity, J/g-K 1 1 1 1 1 ASTM E1269
Coefficient of Thermal Expansion, ppm/K N/A 250 250 150 150 Chomerics
Electrical
Dielectric Strength, Vac/mil (kVac/mm) 200 (8) 200 (8) 200 (8) 200 (8) 200 (8) ASTM D149
Volume Resistivity, ohm-cm 1014 1014 1014 1014 1014 ASTM D257
Dielectric Constant @ 1,000 kHz 5.3 6.5 6.5 8.0 8.0 ASTM D150
Dissipation Factor @ 1,000 kHz 0.013 0.013 0.013 0.010 0.010 Chomerics Test
Regulatory
Flammability Rating
(See UL File E140244 for details) V-0 V-0 V-0 V-0 V-0 UL 94
RoHS Compliant Yes Yes Yes Yes Yes Chomerics
Certification
Outgassing, % TML (% CVCM) 0.44 (0.13) 0.42 (0.08) 0.35 (0.09) 0.19 (0.06) 0.18 (0.05) ASTM E595
Shelf Life, months from date of shipment 36 36 36 36 36 Chomerics
Shelf Life, months from date of shipment -
A” aluminum foil carrier version only 18 18 18 18 18 Chomerics
Storage Conditions, °F (°C) @ 50%
Relative Humidity 50 to 90
(10 to 32) 50 to 90
(10 to 32) 50 to 90
(10 to 32) 50 to 90
(10 to 32) 50 to 90
(10 to 32) Chomerics
Typical properties: these are not to be construed as specifications .
* Thickness tolerance, in (mm) ±10% nominal thickness @ 0 .1 in (2 .5 mm) or less; ± 0 .01 in (0 .25 mm) @ nominal thickness greater than 0 .1 in (2 .5 mm) .
Custom thicknesses may be available upon request .
** The typical deflection range is approximately 5-40% .
*** Laminated polyester film provides low abrasion on one side as well as improved dielectric isolation .
mlcmmerics
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Phone +1 781-935-4850 www.parker.com/chomerics
THERM-A-GAP Gap FIller Pads
Typical PropertiesG974 974 976 Test Method
Physical
Color Blue Blue Gold Visual
Binder Silicone Silicone Silicone --
Carrier Fiberglass
with PSA PSA None* --
Standard Thicknesses*, in (mm) 0.010 - 0.100
(0.25 - 2.54) 0.020 - 0.060
(0.51 - 1.52) 0.040 - 0.200
(1.00 - 5.08) ASTM D374
Specific Gravity 1.4 1.4 1.3 ASTM D792
Hardness, Shore A 40 40 10 ASTM D2240
Penetrometer, mm 25 25 60 Chomerics
Percent Deflection @ Various Pressures**
(0.060 in thick sample)
@ 5 psi (34 kPa)
@ 10 psi (69 kPa)
@ 25 psi (172 kPa)
@ 50 psi (345 kPa)
% Deflection
7
11
12
13
% Deflection
7
11
12
13
% Deflection
6
10
11
45
ASTM C165 MOD
(0.060 in thick,
0.50 in diameter,
0.025 in/min rate)
Thermal
Thermal Conductivity, W/m-K 5.0 6.0 6.5 ASTM D5470
Thermal Impedance, °C-in2/W (°C-cm2/W)
@ 50 psi (345 kPa), 0.040 in (1 mm) 0.51
(3.3) 0.45
(2.9) 0.30
(1.9) ASTM D5470
Heat Capacity, J/g-K 0.9 0.9 0.9 ASTM E1269
Coefficient of Thermal Expansion, ppm/°C 100 100 100 Chomerics
Operating Temperature Range, °F (°C) -67 to 392
(-55 to 200) -67 to 392
(-55 to 200) -67 to 392
(-55 to 200) --
Electrical
Dielectric Strength, Vac/mil (kVac/mm) 200 (5.1) 200 (5.1) 200 (5.1) ASTM D149
Volume Resistivity, ohm-cm 1014 1014 1014 ASTM D257
Dielectric Constant @ 1,000 kHz 3.2 3.2 3.2 ASTM D150
Dissipation Factor @ 1,000 kHz < 0.001 < 0.001 < 0.001 Chomerics
Regulatory
Flammability Rating
(See UL File E140244 for details) V-0 Not Tested V-0 UL 94
RoHS Compliant Yes Yes Yes Chomerics
Certification
Outgassing, % TML (% CVCM) 0.59 (0.18) 0.59 (0.18) 0.64 (0.21) ASTM E595
Shelf Life, months from date of shipment 12 12 24 Chomerics
Storage Conditions, °F (°C) @ 50% Relative Humidity 50 to 90
(10 to 32) 50 to 90
(10 to 32) 50 to 90
(10 to 32) Chomerics
Typical properties: these are not to be construed as specifications .
* THERM-A-GAP 976 is only offered without a carrier, PSA not available .
** The typical deflection range for G974 and 974 is approximately 5-20%; 976 is 5-30% .
v» ‘y‘ \ 579 579K unsupponad( (m camer) with m pse‘able uner no lm mlcmmerics
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Phone +1 781-935-4850 www.parker.com/chomerics
THERM-A-GAP Gap Filler Pads
HCS10G
with gray fiberglass carrier,
peelable liner
G569
with gray fiberglass carrier,
peelable liner
A579
with aluminum PSA carrier,
peelable liner
579
unsupported (no carrier),
peelable liner
579KT
with thermally enhanced polyimide carrier,
no liner
579PN
with PEN film carrier,
no liner
Blue base liner on all pads
remove prior to installation
Product examples showing carrier options and liners.
G579
with fiberglass carrier,
peelable liner
DO NOT REMOVE
PEEL LINER ONLY
DO NOT REMOVE
PEEL LINER ONLY
DO NOT REMOVE
PEEL LINER ONLY
DO NOT REMOVE
PEEL LINER ONLY
PEEL LINER ONLY
DO NOT REMOVE
PEEL LINER ONLY
DO NOT REMOVE
Available Carriers
G – woven fiberglass (no PSA) – this carrier option provides
reinforcement and a clean break / low-tack interface surface,
allowing for re-use of the pad if necessary or for prototyping.
A – aluminum foil (with PSA) – this carrier’s primary function is
to allow a pressure sensitive adhesive on the gap pad.
PN – PEN film (polyethylenenapthalate) – this carrier permits
the gap pad to see a shearing motion and offers a clear,
cost-effective dielectric film with fair thermal performance.
KT – thermally enhanced polyimide – this carrier permits
the gap pad to see a shearing motion and offers an excellent
dielectric film with enhanced thermal performance.
No carrier (no letter distinction) – the no carrier or
“un-reinforced” option allows the gap pad to have high-tack
surfaces on both sides, allowing for the pad to be highly
conformable, but it does make cutting and handling of the
product more difficult.
mlchomerics
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Phone +1 781-935-4850 www.parker.com/chomerics
Sheet Thickness (in)*
Available in 0.010” increments
from 0.010” - 0.200”
(0.254 mm - 5.0 mm)
0.010 = 01
0.020 = 02†
0.030 = 03
0.040 = 04
0.050 = 05
0.060 = 06
0.070 = 07
0.080 = 08
0.090 = 09
0.100 = 10
Sheet Size
0909 = 9” x 9” sheet
(228.6 mm x 228.6 mm)
Material Type
HCS10G
G569
569PN
G570
G579
579PN
579KT
579
G580
580
Ordering Information
61 XX 0909 ZZZZ
THERM-A-GAP HCS10, 569, 570, 579 and 580 Thermally Conductive Pads
PART NUMBER:
0.110 = 11
0.120 = 12††
0.130 = 13
0.140 = 14
0.150 = 15
0.160 = 16
0.170 = 17
0.180 = 18
0.190 = 19
0.200 = 20
Ordering Information: Custom Configurations
Please contact Parker Chomerics for a pre-assigned part number, for custom widths,
lengths and part sizes, etc .
Available options include:
• Custom die-cut parts on sheets, or as individual parts
• “A” version offered die-cut (up to 0 .040”) on continuous rolls (higher volumes)
• Custom thicknesses available upon request (up to 1” thick)
• Custom molded designs and ribbed sheets
* See typical properties table for thicknesses
† Minimum thickness for A570, G570, G579 and A580, G580
†† Minimum thickness for 579 and 580
9" x 9" Sheets - No Pressure Sensitive Adhesive (PSA)
“G”, “PN”, “KT” carrier
and unsupported
Sheet Thickness (in)*
Available in 0.010" increments
from 0.010" - 0.200"
(0.254 mm - 5.0 mm)
0.010 = 01
0.020 = 02†
0.030 = 03
0.040 = 04
0.050 = 05
0.060 = 06
0.070 = 07
0.080 = 08
0.090 = 09
0.100 = 10
Sheet Size
0909 = 9” x 9” sheet
(228.6 mm x 228.6 mm)
Material Type
HCS10A
A569
A570
A579
A580
62 XX 0909 ZZZZ
PART NUMBER:
0.110 = 11
0.120 = 12
0.130 = 13
0.140 = 14
0.150 = 15
0.160 = 16
0.170 = 17
0.180 = 18
0.190 = 19
0.200 = 20
9" x 9" Sheets - Pressure Sensitive Adhesive (PSA) 1 Side
A” carrier only
mlchomerics
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Phone +1 781-935-4850 www.parker.com/chomerics
Sheet Thickness (in)*
Available in 0.010”, 0.015”,
and in 0.010” increments from
0.020” - 0.200” (2.54 mm - 5.0 mm)
0.010 = 28539
0.015 = 28540**
0.020 = 20698†
0.030 = 20913
0.040 = 20684
0.050 = 27395
0.060 = 20991
0.070 = 20685
0.080 = 21259
Material Type
HCS10G
G569
569PN
G570
G579
579PN
579KT
579
G580
580
69 11 YYYYY ZZZZ
PART NUMBER:
0.100 = 20672
0.120 = 27102††
0.130 = 20675
0.140 = 27100
0.150 = 27101
0.160 = 20686
0.180 = 27103
0.200 = 20687
THERM-A-GAP HCS10, 569, 570, 579 and 580 Thermally Conductive Pads
18" x 18" Sheets - No Pressure Sensitive Adhesive (PSA)
“G”, “PN”, “KT” carrier
and unsupported
Sheet Thickness (in)*
Available in 0.010”, 0.015”,
and in 0.010” increments from
0.020” - 0.200” (2.54 mm - 5.0 mm)
0.010 = 28539
0.015 = 28540
0.020 = 20698†
0.030 = 20913
0.040 = 20684
0.050 = 27395
0.060 = 20991
0.070 = 20685
0.080 = 21259
Material Type
HCS10A
A569
A570
A579
A580
69 12 YYYYY ZZZZ
PART NUMBER:
0.100 = 20672
0.120 = 27102
0.130 = 20675
0.140 = 27100
0.150 = 27101
0.160 = 20686
0.180 = 27103
0.200 = 20687
18" x 18" Sheets - Pressure Sensitive Adhesive (PSA) 1 Side
A” carrier only
Ordering Information: Custom Configurations
Please contact Parker Chomerics for a pre-assigned part number, for custom widths,
lengths and part sizes, etc .
Available options include:
• Custom die-cut parts on sheets, or as individual parts
• “A” version offered die-cut (up to 0 .040”) on continuous rolls (higher volumes)
• Custom thicknesses available upon request (up to 1” thick)
• Custom molded designs and ribbed sheets
* See typical properties table for thicknesses
** Minimum thickness for G579
† Minimum thickness for A570, G570, and A580, G580
†† Minimum thickness for 579 and 580
Ordering Information
mlchomerics
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HANDLING INFORMATION
These products are defined by Parker Chomerics
as “articles” according to the following generally
recognized regulatory definition for articles:
An article is a manufactured item “formed to a
specific shape or design during manufacturing,”
which has “end use functions” dependent upon
its size and shape during end use and which has
generally “no change of chemical composition
during its end use.”
In addition:
There is no known or anticipated exposure to
hazardous materials/substances during routine
and anticipated use of the product.
The product’s shape, surface and design is
more relevant than its chemical composition.
These materials are not deemed by Parker
Chomerics to require an MSDS. For further
questions, please contact Parker Chomerics at
781-935-4850.
* See typical properties table for thicknesses
Ordering Information: Custom Configurations
Please contact Parker Chomerics for a pre-assigned part number, for custom widths,
lengths and part sizes, etc .
Available options include:
• Custom die-cut parts on sheets, or as individual parts
• “A” version offered die-cut (up to 0 .040”) on continuous rolls (higher volumes)
• Custom molded designs and ribbed sheets
Ordering Information
THERM-A-GAP 976 Thermally Conductive Pads
Thickness (in)*
Available in 0.010” increments from
0.040” - 0.200” (1.00 mm - 5.0 mm)
0.040 = 04
0.050 = 05
0.060 = 06
0.070 = 07
0.080 = 08
0.090 = 09
0.100 = 10
0.110 = 11
0.120 = 12
Sheet Size
0912 = 9” x 12” sheet
(228.6 mm x 304.8 mm)
2025 = 20” x 25” sheet
(508 mm x 635 mm)
61 XX YYYY 976
PART NUMBER:
0.130 = 13
0.140 = 14
0.150 = 15
0.160 = 16
0.170 = 17
0.180 = 18
0.190 = 19
0.200 = 20
9" x 12" and 20" x 25" Sheets - No Pressure Sensitive Adhesive (PSA)
976 only
mlchomerics
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Phone +1 781-935-4850 www.parker.com/chomerics
Ordering Information
THERM-A-GAP 974 and G974 Thermally Conductive Pads
Thickness (in)*
Available in 0.010” increments
0.010 = 01
0.020 = 02**
0.030 = 03
0.040 = 04
0.050 = 05
Sheet Size
0912 = 9” x 12” sheets
(228.6 mm x 304.8 mm)
2025 = 20” x 25” sheets
(508 mm x 635 mm)
Material Type
974
G974
62 XX YYYY ZZZZ
PART NUMBER:
0.060 = 06†
0.070 = 07
0.080 = 08
0.090 = 09
0.100 = 10
9" x 12" and 20" x 25" Sheets - Pressure Sensitive Adhesive (PSA) 1 Side
974 and G974 only
HANDLING INFORMATION
These products are defined by Parker Chomerics
as “articles” according to the following generally
recognized regulatory definition for articles:
An article is a manufactured item “formed to a
specific shape or design during manufacturing,”
which has “end use functions” dependent upon
its size and shape during end use and which has
generally “no change of chemical composition
during its end use.”
In addition:
There is no known or anticipated exposure to
hazardous materials/substances during routine
and anticipated use of the product.
The product’s shape, surface and design is
more relevant than its chemical composition.
These materials are not deemed by Parker
Chomerics to require an MSDS. For further
questions, please contact Parker Chomerics at
781-935-4850.
* See typical properties table for thicknesses
** Minimum thickness 974
Maximum thickness 974
Ordering Information: Custom Configurations
Please contact Parker Chomerics for a pre-assigned part number, for custom widths,
lengths and part sizes, etc .
Available options include:
• Custom die-cut parts on sheets, or as individual parts
• “A” version offered die-cut (up to 0 .040”) on continuous rolls (higher volumes)
• Custom molded designs and ribbed sheets
mlchomerics
25
Phone +1 781-935-4850 www.parker.com/chomerics
THERMFLOW®
Non-Silicone, Phase-Change Thermal Interface Pads
THERMFLOW® phase-change Thermal Interface Materials
(TIMs) completely fill interfacial air gaps and voids.
THERMFLOW phase-change materials
are designed to displace entrapped air
between power dissipating electronic
components. Phase-change materials
maximize heat sink performance
and improve component reliability.
THERMFLOW pads soften as
they reach component operating
temperatures.
Upon reaching operating temperature,
THERMFLOW materials will fully
change phase and attain minimum
bond-line thickness (MBLT) to
maximize surface wetting. This results
in practically no thermal contact
resistance due to a very small thermal
resistance path.
At room temperature, THERMFLOW
materials are solid and easy to handle.
This allows them to be consistently
and cleanly applied as dry pads to a
heat sink or component surface. With
light clamping pressure, they will readily
conform to both mating surfaces.
Standard THERMFLOW products are
electrically non-conductive, however
metal-to-metal contact is possible after
the material undergoes phase-change,
decreasing their electrical isolation
properties. PC07DM-7 is the only
THERMFLOW material recommended
for use as a dielectric insulator.
Parker Chomerics offers two types of
phase change materials—traditional
thermal interface pads (PCM) and
dual phase change polymer solder
hybrids (PSH).
DUAL PHASE CHANGE POLYMER
SOLDER HYBRID MATERIALS
(PSH)
THERMFLOW brand products are
also available as dual phase change
polymer solder hybrid (PSH) thermal
interface materials, in which case, both
binder and filler change phases, to
exhibit the lowest thermal impedance
of the THERMFLOW family.
These thermal interface materials
provide superior long term reliability
performance. For optimum
performance, THERMFLOW must be
exposed to temperatures above 64°C
during operation or by a burn-in cycle
to achieve lowest thermal impedance
and highest thermal performance.
TYPICAL APPLICATIONS
Microprocessors
Graphics processors
Chipsets
Memory modules
Power modules
Power semiconductors
APPLICATION
Material may flow when oriented
vertically, especially at higher
temperatures. This does not affect
thermal performance, but should be
considered if appearance is important.
CLEAN UP
THERMFLOW material can be
removed with solvents such as
toluene, MEK or isopropyl alcohol.
FEATURES/BENEFITS
Low thermal impedance
Proven solution – years of
production use in personal
computer OEM applications
Demonstrated reliability through
thermal cycling and accelerated
age testing
Can be pre-applied to heat sinks
Protective release liner prevents
contamination of material prior to
final component assembly
Tabs available for easy removal of
release liner (T710, T725*, T557,
T777, PC07DM)
* T725 is only offered with a tab
Available in custom die-cut shapes,
kiss-cut on rolls
mlcmmerics
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Phone +1 781-935-4850 www.parker.com/chomerics
THERMFLOW® Non-Silicone, Phase-Change Thermal Interface Pads
Typical PropertiesPC07DM-7 T710 with PSA T725 T766/T766-06 T557 T558 T777 Test Method
Physical
Color Pink Light Gray/
Off-White Pink Purple/Gray Foil Gray Gray/Gray Foil Gray Visual
Carrier 1 mil
Polyester 2 mil
Fiberglass None -
Free Film 1 mil
Metal Foil None -
Free Film 1 mil
Metal Foil None -
Free Film --
Standard Thicknesses*,
in (mm) 0.007 (0.178) 0.0055 (0.138) 0.005 (0.125) 0.0035 (0.088)
0.006 (0.152) 0.005 (0.125) 0.0045 (0.115) 0.0045 (0.115) ASTM D374
Specific Gravity 1.1 1.15 1.1 2.6 2.4 3.65 1.95 ASTM D792
Phase Transition
Temperature, °C 55 45 55 55 45/62*** 45/62*** 45/62*** ASTM D3418
Weight Loss,
125°C for 48 Hours <0.5% <0.5% <0.5% <0.5% <0.5% <0.5% <0.5% --
Thermal
Thermal Impedance @ 70°C,
°C-in2/W (°C-cm2/W)
@ 10 psi (69 kPa)
@ 25 psi (172 kPa)
@ 50 psi (345 kPa)
Minimum
Bond-line
Thickness
0.35 (2.2)
0.30 (1.93)
0.28 (1.81)
Minimum Bond-
line Thickness
@ 50°C
0.23 (1.48)
0.16 (1.03)
0.12 (0.77)
2.9 mil
0.11 (0.71)
0.06 (0.39)
0.04 (0.26)
Minimum
Bond-line
Thickness
0.15 (0.97)
0.09 (0.58)
0.06 (0.39)
Minimum
Bond-line
Thickness
0.02 (0.13)
0.015 (0.097)
0.008 (0.052)
Minimum
Bond-line
Thickness
0.03 (0.19)
0.013 (0.084)
0.0097 (0.06)
Minimum
Bond-line
Thickness
0.02 (0.13)
0.015 (0.097)
0.0055 (0.035)
ASTM D5470
Operating Temperature
Range, °F (°C) -67 to 257
(-55 to 125) -67 to 257
(-55 to 125) -67 to 257
(-55 to 125) -67 to 257
(-55 to 125) -67 to 257
(-55 to 125) -67 to 257
(-55 to 125) -67 to 257
(-55 to 125) --
Electrical
Volume Resistivity,
ohm-cm 1014 1014 1014 1014
Metal Foil* Non
conductive**
Non
conductive**/
Metal Foil*
Non
conductive** ASTM D257
Voltage Breakdown,
kVac 5 N/A N/A N/A N/A N/A N/A ASTM D149
Regulatory
Flammability Rating Not Tested Not Tested V-0 Not Tested Not Tested Not Tested V-0 UL 94
RoHS Compliant Yes Yes Yes Yes Yes Yes Yes Chomerics
Certification
Shelf Life, months from
date of shipment 12 12 12 12 12 12 12 Chomerics
Storage Conditions, °F (°C) @
50% Relative Humidity 50 to 90
(10 to 32) 50 to 90
(10 to 32) 50 to 90
(10 to 32) 50 to 90
(10 to 32) 50 to 90
(10 to 32) 50 to 90
(10 to 32) 50 to 90
(10 to 32) Chomerics
Typical properties: these are not to be construed as specifications .
* Phase-change material exhibits 1014 ohm-cm volume resistivity . Metal foil is electrically conductive .
** The phase-change material is electrically non-conductive . However, as it contains dispersed solder for enhanced thermal properties,
it can exhibit through-conductivity at thinner bond line thickness (approximately <2 mils) . It should not be used as an electrical insulator .
*** The lower phase-transition temperature is for the polymer . The higher value is for the low melting alloy filler .
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Ordering Information
THERMFLOW® Non-Silicone, Phase-Change Thermal Interface Pads
Length
10 = 100 ft
40 = 400 ft
Width
Examples:
0100 = 1”
0750 = 7.5”
2400 = 24”
Material
PC07DM-7
T710
T725
T766
T766-06
T557
T558
T777
64 XX YYYY ZZZZ
PART NUMBER:
THERMFLOW materials are supplied
in several standard formats (see part
number guide below).
Custom die-cut shapes can also be
provided on kiss-cut rolls by Parker
Chomerics’ extensive network of distributor/
fabricators. To ease release liner
removal, an optional tab can be added.
Standard tolerances for slitting widths
and individually cut pieces are ±0.020 in
(±0.51 mm).
Ordering Information: Custom Configurations
Please contact Parker Chomerics for a pre-assigned part number, for custom widths,
lengths and part sizes, etc .
Available options include:
• Custom kiss cut parts on sheets, or as individual parts
• Offered die-cut on continuous rolls (higher volumes)
HANDLING INFORMATION
These products are defined by Parker Chomerics
as “articles” according to the following generally
recognized regulatory definition for articles:
An article is a manufactured item “formed to a
specific shape or design during manufacturing,”
which has “end use functions” dependent upon
its size and shape during end use and which has
generally “no change of chemical composition
during its end use.”
In addition:
There is no known or anticipated exposure to
hazardous materials/substances during routine
and anticipated use of the product.
The product’s shape, surface, and design is
more relevant than its chemical composition.
These materials are not deemed by Parker
Chomerics to require an MSDS. For further
questions, please contact Parker Chomerics at
781-935-4850.
Length
10 = 100 ft
40 = 400 ft
Width
Examples:
0100 = 1”
0750 = 7.5”
2400 = 24”
66 XX YYYY T710
PART NUMBER:
Roll Stock - No Pressure Sensitive Adhesive (PSA)
Roll Stock - With Pressure Sensitive Adhesive (PSA)
T710 only
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THERMATTACH® Double-Sided Thermal Tapes
Thermally Conductive Attachment Tapes
THERMATTACH® double-sided thermal interface tapes
provide exceptional bonding properties between electronic
components and heat sinks, eliminating the need for
mechanical fasteners.
TYPICAL APPLICATIONS
Mount heat sinks to components
dissipating < ~25 W
Attach heat sinks to PC (esp.
graphics) processors
Heat sink attachment to motor
control processors
Telecommunication infrastructure
components
FEATURES / BENEFITS
Offered in various forms to provide
thermal, dielectric, and flame
retardant properties
Offered in custom die-cut
configurations to suit a variety of
applications
Eliminates the need for
mechanical attachment (i.e. screws,
clips, rivets, fasteners)
Proven reliability under various
mechanical, thermal and
environmental stresses
Embossed version available
UL recognized V-0 flammability
No curing required, unlike epoxy or
acrylic preforms or liquid systems
Easily reworkable
PERFORMANCE GUIDE
Least suited
Application
T412
T418
Ceramic
Attachment
Metal
Attachment
Plastic
Attachment
Dielectric
Performance
Thermal
Performance T404/T414
T411
T418
T411
T411
T412 T418
T412
T405/T405-R
T405/T405-R
T404/T414
T405/T405-R
T404/T414 T418
T404/T414
T411
Best suited
T418
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THERMATTACH® Thermally Conductive Attachment Tapes
Typical PropertiesT404/T414 T405/T405-R T411 T418 T412 Test Method
Physical
Color Beige White Clear/Metallic Light Yellow Gray Visual
Recommended for Plastic
Component Attachment No No Yes No No --
Embossed Standard Standard No Optional Standard --
Reinforcement Carrier Filled
Polyimide Aluminum Aluminum
Mesh Fiberglass Aluminum
Mesh Visual
Thickness, in (mm) 0.005 (0.127) 0.006 (0.15) 0.010 (0.25) 0.010 (0.25) 0.009 (0.23) ASTM D374
Thickness Tolerance, in (mm) ± 0.001
(0.025) ± 0.001
(0.025) ± 0.001
(0.025) ± 0.001
(0.025) ± 0.001
(0.025) --
Adhesive CTE, ppm/ºF 300 300 400 300 300 ASTM D3386
Glass Transition Temperature Range, ºF (ºC) -22 (-30) -22 (-30) -58 (-50) -4 (-20) -22 (-30) ASTM D1356
Operating Temperature Range, ºF (ºC) -22 to 257
(-30 to 125) -22 to 257
(-30 to 125) -58 to 302
(-50 to 150) -22 to 257
(-30 to 125) -22 to 257
(-30 to 125) --
Thermal
Thermal Impedance
°C-in2 / W (°C-cm2/W) @ 300psi 0.6 (3.7) 0.5 (3.4) 1.0 (6.5) 1.2 (7.7) 0.30 (2.0) ASTM D5470
Thermal Conductivity, W/m-K 0.4 0.5 0.5 0.5 1.4 ASTM D5470
Electrical
Voltage Breakdown, kVac 5 N/A N/A 5 N/A ASTM D149
Volume Resistivity, ohm-cm 3.0 X 1014 N/A N/A 1.0 X 1013 1.0 X 102ASTM D257
Mechanical/Adhesion
Lap Shear Al-Al @ 25°C, psi (kPa) 100 (689) 100 (689) 40 (270) 150 (1,034) 70 (480) ASTM D1002
90° Peel Adhesion to 0.002”
aluminum foil, lbf /in (N/cm) 1.5 (2.6) 1.5 (2.6) 2.0 (3.5) 4.0 (6.9) 1.0 (1.76) ASTM D1000
Die Shear Adhesion after
400 psi attachment, psi (kPa)
– 2 hour sample dwell time 77ºF (25ºC) 130 (897) 125 (862) 110 (759) 150 (1,034) 135 (931) Chomerics #54
Creep Adhesion, days
77ºF (15ºC)
302ºF (125ºC)
>50
>10
>50
>10
>50
>10 >50
>10
>50
>10 PSTC-7
Regulatory
Flammability Rating
(See UL File E140244 for details) V-0 V-0 V-0 V-0 Not Tested UL 94
RoHS Compliant Yes Yes Yes Yes Yes Chomerics
Certification
Shelf Life, months from shipment 12 12 12 12 12 Chomerics
Outgassing, % TML (% CVCM) 0.56 (0.02) 0.25 (0.01) Not Tested Not Tested 0.14 (0.00) ASTM E595
Storage Conditions, °F (°C) @ 50%
Relative Humidity 50 to 90
(10 to 32) 50 to 90
(10 to 32) 50 to 90
(10 to 32) 50 to 90
(10 to 32) 50 to 90
(10 to 32) Chomerics
Typical properties: these are not to be construed as specifications .
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Ordering Information
THERMATTACH® Thermally Conductive Attachment Tapes
Length
10 = 100 ft
40 = 400 ft
Width
0750 = 7.5"
1150 = 11.5"
2400 = 24"
Material Type
T405
T405-R
T411
T412
T418
67 XX YYYY ZZZZ
PART NUMBER:
These attachment tapes are available on continuous rolls.
Ordering Information: Custom Configurations
Please contact Parker Chomerics for a pre-assigned part number, for custom widths, lengths and part sizes, etc .
Available options include:
• Custom kiss cut parts on sheets, or as individual parts
HANDLING INFORMATION
These products are defined by Parker Chomerics
as “articles” according to the following generally
recognized regulatory definition for articles:
An article is a manufactured item “formed to a
specific shape or design during manufacturing,”
which has “end use functions” dependent upon
its size and shape during end use and which has
generally “no change of chemical composition
during its end use.”
In addition:
There is no known or anticipated exposure to
hazardous materials/substances during routine
and anticipated use of the product.
The product’s shape, surface and design is
more relevant than its chemical composition.
These materials are not deemed by Parker Chomerics
to require an MSDS. For further questions, please
contact Parker Chomerics at 781-935-4850.
Length
10 = 100 ft
40 = 400 ft
Width
0600 = 6"
0900 = 9"
1900 = 19"
Material Type
T404
T414
67 XX YYYY ZZZZ
PART NUMBER:
mlcmmerics
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Minimum: 10 psi at room temperature for 15 seconds
PREFERRED: 30 psi at room temperature for 5 seconds
THERMATTACH® Thermally Conductive Attachment Tapes
Tape Application Instructions: T404, T405, T405-R, T411, T412, T413, T414, T418
MATERIALS NEEDED
Clean lint-free cloth rag
Industrial solvent
Rubber gloves
For optimal performance, Parker
Chomerics recommends interface
flatness of 0.001 in/in (0.025 mm/25
mm) to 0.002 in/in (0.050 mm/25 mm)
maximum.
Step 1: Ensure that bonding
surfaces are free from oil, dust or any
contamination that may affect bonding.
Using rubber gloves, wipe surfaces
with a cloth dampened with industrial
solvents such as MEK, toluene,
acetone or isopropyl alcohol.
Step 2: Cut tape to size* and remove
a liner or remove pre-cut tape from roll.
*Note: Due to variations in heat sink
surfaces, Parker Chomerics’ data
indicates that it sometimes is beneficial
to be cut slightly smaller than the area
of the heat sink. See illustration.
Step 3: Apply to center of heat sink
bonding area and smooth over entire
surface using moderate hand pressure
/ rubbing motion. A roller may be
useful to help smooth the part to the
surface by rolling from the center out
to beyond the edges of the part. This
ensures optimal contact between
tape and heat sink.
Step 4: Center heat sink onto
component and apply using any one
of the recommended temperature/
pressure options:
More pressure equals better wetting
out of the adhesive to the contact
surfaces. A twisting motion during
assembly of the substrates will
typically improve wetting.
Note that typically 70% of the
ultimate adhesive bond strength
is achieved with initial application,
and 80-90% is reached within 15
minutes. Ultimate adhesive strength is
achieved within 36 hours; however the
next manufacturing step can typically
occur immediately following the initial
application.
REMOVAL INSTRUCTIONS
Materials needed: Single-edged
razor blade or a small, thin-bladed
pocketknife; soft, thin metal spatula.
Use safety precautions when handling
sharp instruments and organic solvents.
Step 1: Carefully insert the blade edge
into the bond line at a corner between
the heat sink and the component. The
penetration need not be very deep.
Step 2: Remove the blade and insert
the spatula into the wedge. Slowly
twist the spatula blade so that it exerts
a slight upward pressure.
Step 3: As the two surfaces start to
separate, move the spatula blade
deeper into the bond line and continue
the twisting motion and upward force.
Step 4: After the two components are
separated, the tape can be removed
and discarded. If adhesive remains
on the component surfaces, it must
be removed. Wipe with a clean rag
(lint-free) dabbed with MEK, toluene, or
isopropyl alcohol. Use sufficient solvent
to remove all adhesive.
Step 5: Solvent cleaned components
must be verified 100% free of cleaning
solvent prior to reattachment of
adhesive.
* Not Recommended
Typical Properties T418 T412 T404/T414 T405/T405-R T411
Performance
Ceramic Attachment
Metal Attachment
Plastic Attachment
Dielectric Performance
Thermal Performance
Thermally Conductive Attachment Tapes
* * * *
* * *
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THERM-A-FORM
Cure-in-Place Potting and Underfill Materials
THERM-A-FORM thermally conductive silicone elastomer
products are dispensable form-in-place compounds
designed for heat transfer without excessive compressive
force in electronics cooling applications.
FEATURES / BENEFITS
Cures in place once dispensed
Dispensable form-in-place
gap filling, potting, sealing
and encapsulating
Excellent blend of high thermal
conductivity, flexibility and ease
of use
Conformable to irregular shapes
without excessive force on
components
Ready-to-use cartridge system
eliminates weighing, mixing and
de-gassing steps
Variety of kit sizes and
configurations available to suit
any application (handheld twin-
barrel cartridges, Semco® tubes
and pneumatic applicators)
Vibration damping
PERFORMANCE GUIDE
4.0
3.0
2.0
1.0
Viscosity (Poise)
1000 2000 3000 4000 5000 6000
Thermal Conductivity (W/m-K)
T642
1642
T644
1641
TYPICAL APPLICATIONS
Automotive electronic control
units (ECUs)
- Engine control
- Transmission control
- Braking/traction control
Power conversion equipment
Power supplies and uninterruptible
power supplies
Power semiconductors
MOSFET arrays with common
heat sinks
Televisions and consumer
electronics
T646
T647
CIP 35
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THERM-A-FORM Cure-in-Place and Underfill Materials
Typical PropertiesT646 T642 T644 T647 CIP 35 Test Method
Physical
Color Yellow Blue Pink Gray Green Visual
Binder Silicone Silicone Silicone Silicone Silicone --
Filler Aluminum
Oxide Boron Nitride Boron Nitride Aluminum
Oxide Aluminum Oxide /
Boron Nitride --
Number of Components 2-part 2-part 2-part 2-part 2-part --
Mix Ratio (by weight) 1 : 1 10 : 1 1 : 1 1 : 1 1 : 1
Specific Gravity 2.45 1.50 1.45 2.8 2.87 ASTM D792
Hardness, Shore A 50 70 15 25 55 ASTM D2240
Viscosity, poise > 5000 2500 3000 > 5000 5000 ASTM D2196
Pot Life, minutes 300 60 360 300 100 Time to 2X Starting
Viscosity at 23°C
Cure Cycles 3 min @ 150°C
60 min @ 60°C
48 hrs @ 23°C
3 min @ 150°C
30 min @ 70°C
48 hrs @ 23°C
3 min @ 150°C
60 min @ 60°C
72 hrs @ 23°C
3 min @ 150°C
60 min @ 60°C
48 hrs @ 23°C
30 min @ 150ºC
180 min @ 100ºC
48 hrs @ 23ºC Chomerics
Thermal
Thermal Conductivity, W/m-K 0.90 1.20 1.20 3.0 3.5 ASTM D5470
Heat Capacity, J/g-K 1 1 1 0.9 1 ASTM E1269
Coefficient of Thermal Expansion,
ppm/K 250 300 300 150 150 ASTM E831
Operating Temperature Range,
°F (°C) -58 to 302
(-50 to 150) -58 to 302
(-50 to 150) -58 to 302
(-50 to 150) -58 to 302
(-50 to 150) -67 to 392
(-55 to 200) --
Electrical
Dielectric Strength,
kVac/mm (Vac/mil) 10 (250) 20 (500) 20 (500) 10 (250) 10 (250) ASTM D149
Volume Resistivity, ohm-cm 1.0 x 1014 1.0 x 1013 1.0 x 1013 1.0 x 1014 1.0 x 1014 ASTM D257
Dielectric Constant @ 1,000 kHz 6.5 4.0 4.0 8 8 ASTM D150
Dissipation Factor @ 1,000 kHz 0.013 0.001 0.001 0.010 0.010 Chomerics
Regulatory
Flammability Rating
(See UL File E140244 for details) V-0 Not Tested Not Tested V-0 V-0 UL 94
RoHS Compliant Yes Yes Yes Yes Yes Chomerics
Certification
Outgassing, % TML (% CVCM) 0.17 (0.10) 0.32 (0.21) 0.39 (0.29) Not Tested 0.22 (0.06) ASTM E595
Shelf Life, months from
date of manufacture 3 3 3 3 12 Chomerics
Storage Conditions, °F (°C) @ 50%
Relative Humidity 50 to 90
(10 to 32) 50 to 90
(10 to 32) 50 to 90
(10 to 32) 50 to 90
(10 to 32) 50 to 90
(10 to 32) Chomerics
Typical properties: these are not to be construed as specifications .
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THERM-A-FORM Cure-in-Place and Underfill Materials
Typical Properties1641 1642 Test Method
Physical
Color White Blue Visual
Binder Silicone Silicone --
Filler Aluminum
Oxide Aluminum
Oxide --
Number of Components 1-part 2-part --
Mix Ratio (by weight) N/A 100 : 3
Specific Gravity 2.1 2.3 ASTM D792
Hardness, Shore A 56 76 ASTM D2240
Viscosity, poise 3000 2500 ASTM D2196
Pot Life, minutes 30 60 Time to 2X Starting
Viscosity at 23°C
Cure Cycles 48 hrs @ 23°C
@ 50% RH
60 min @ 100°C
4 hrs @ 65°C
1 week @ 23°C Chomerics
Thermal
Thermal Conductivity, W/m-K 0.90 0.95 ASTM D5470
Heat Capacity, J/g-K 1 1 ASTM E1269
Coefficient of Thermal Expansion,
ppm/K 150 200 ASTM E831
Operating Temperature Range,
°F (°C) -94 to 392
(-70 to 200) -94 to 392
(-70 to 200) --
Electrical
Dielectric Strength,
kVac/mm (Vac/mil) 20 (500) 20 (500) ASTM D149
Volume Resistivity, ohm-cm 1.0 x 1013 1.0 x 1013 ASTM D257
Dielectric Constant @ 1,000 kHz 3.9 3.9 ASTM D150
Dissipation Factor @ 1,000 kHz 0.010 0.010 Chomerics
Regulatory
Flammability Rating
(See UL File E140244 for details) Not Tested Not Tested UL 94
RoHS Compliant Yes Yes Chomerics
Certification
Outgassing, % TML (% CVCM) Not Tested 0.40 (0.18) ASTM E595
Shelf Life, months from
date of manufacture 6 12 Chomerics
Storage Conditions, °F (°C) @ 50%
Relative Humidity 50 to 90
(10 to 32) 50 to 90
(10 to 32) Chomerics
Typical properties: these are not to be construed as specifications .
mlcmmerics
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Typical Properties1641 1642 Test Method
Physical
Color White Blue Visual
Binder Silicone Silicone --
Filler Aluminum
Oxide Aluminum
Oxide --
Number of Components 1-part 2-part --
Mix Ratio (by weight) N/A 100 : 3
Specific Gravity 2.1 2.3 ASTM D792
Hardness, Shore A 56 76 ASTM D2240
Viscosity, poise 3000 2500 ASTM D2196
Pot Life, minutes 30 60 Time to 2X Starting
Viscosity at 23°C
Cure Cycles 48 hrs @ 23°C
@ 50% RH
60 min @ 100°C
4 hrs @ 65°C
1 week @ 23°C Chomerics
Thermal
Thermal Conductivity, W/m-K 0.90 0.95 ASTM D5470
Heat Capacity, J/g-K 1 1 ASTM E1269
Coefficient of Thermal Expansion,
ppm/K 150 200 ASTM E831
Operating Temperature Range,
°F (°C) -94 to 392
(-70 to 200) -94 to 392
(-70 to 200) --
Electrical
Dielectric Strength,
kVac/mm (Vac/mil) 20 (500) 20 (500) ASTM D149
Volume Resistivity, ohm-cm 1.0 x 1013 1.0 x 1013 ASTM D257
Dielectric Constant @ 1,000 kHz 3.9 3.9 ASTM D150
Dissipation Factor @ 1,000 kHz 0.010 0.010 Chomerics
Regulatory
Flammability Rating
(See UL File E140244 for details) Not Tested Not Tested UL 94
RoHS Compliant Yes Yes Chomerics
Certification
Outgassing, % TML (% CVCM) Not Tested 0.40 (0.18) ASTM E595
Shelf Life, months from
date of manufacture 6 12 Chomerics
Storage Conditions, °F (°C) @ 50%
Relative Humidity 50 to 90
(10 to 32) 50 to 90
(10 to 32) Chomerics
Product Part Number Volume (mass) Description
1641
65-00-1641-0000 2.5 fluid ounces
(70 grams) 1-Component foil squeeze tube
65-01-1641-0000 12 fluid ounces
(340 grams)
1-Component
SEMCO® cartridge
1642 65-00-1642-0000 277 grams
(approx 120 cc) 1-Pint plastic jar A / vial of B
T642
65-00-T642-0035 35 cc
(53 grams)
10:1 Dual element cartridge
65-00-T642-0250 250 cc
(372 grams)
T644
65-00-T644-0045 45 cc
(68 grams)
1:1 Dual element cartridge
65-00-T644-0200 200 cc
(300 grams)
T646
65-00-T646-0045 45 cc
(115 grams)
65-00-T646-0200 200 cc
(507 grams)
T647
65-00-T647-0045 45 cc
(125 grams)
65-00-T647-0200 200 cc
(560 grams)
CIP 35
65-00-CIP35-0045 45 cc
(128 grams)
65-00-CIP35-0200 200 cc
(570 grams)
65-00-CIP35-0400 400 cc
(1140 grams)
65-00-CIP35-1200 1200 cc
(3440 grams) (2) 600 cc SEMCO® cartridges
65-1P-CIP35-5600 5600 cc
(16 kg)
(2) 1-Gallon pails,
each pail has 8 kg
65-5P-CIP35-10452 10,452 cc
(30 kg)
(2) 5-Gallon pails,
each pail has 15 kg
Ordering Information
THERM-A-FORM T64x and 164x Series
Mixpac Dispensing Systems are available from multiple
sources. When contacting Mixpac equipment suppliers,
reference cartridge volume (cc) and dual element cartridge
A:B mix ratio. Refer to table for volume and mix ratio
information.
MIXPAC is a trademark of Sylzer.
SEMCO is a registered trademark of PPG Aerospace. Figure 1: Typical Applicator
APPLICATION INSTRUCTIONS
35 cc and 45 cc Kits (See Figure 1)
Push safety latch (A) upward. Insert
the pushrod (B) into the applicator
with the pushrod gear teeth facing
downward. Insert the cartridge (C) into
the slots on top of the applicator. Push
the retainer clamp (D) down firmly to
lock the cartridge in place. Remove
the cartridge cap (E) with a 1/4 turn
counter-clockwise. Attach the static
mixer (F) to the cartridge. (For the 10:1
cartridge, make certain that the small
notch on the mixer tube face is toward
the large barrel containing Part A.)
Turn the mixer tube 1/4 turn clockwise
to lock it in place. Cut the tip of the
mixing nozzle to obtain the desired
bead size, or attach a needle with the
Luer adapter. After use, discard the
static mixer and replace the cap on
any remaining material.
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CHO-THERM®
Thermally Conductive Electrical Insulator Pads
CHO-THERM® Thermal Insulator Pads are designed for
use as alternatives to greased mica insulators between
discrete power devices and heat sinks. These products
are offered as dry pads, or with an optional acrylic
adhesive (PSA) layer for attachment.
TYPICAL APPLICATIONS
Power conversion
equipment
Power supplies & UPS
Power semiconductors
Automotive electronics
Motor and engine
controllers
Televisions and
consumer electronics
FEATURES / BENEFITS
Excellent mechanical strength and
puncture resistance
Available with & without acrylic PSA
UL recognized V-0 flammability rating
COMMERCIAL GRADE
Good thermal properties
Good to excellent dielectric strength
Available on continuous rolls for
easy peel and stick application
HIGH POWER
Excellent thermal properties
High dielectric strength
100% inspected for dielectric
properties on every sheet
Extremely low NASA outgassing
Proven through decades of use
in demanding military and
aerospace applications
PERFORMANCE GUIDE
3.0
2.5
2.0
1.5
1.0
0.5
Voltage Breakdown-Dry (Vac)
Thermal Conductivity (W/m-K)
1678
1674
1671
T500
T609
T444
T441
(0.008)
T441
(0.013)
1000
2000
3000
4000
5000
6000
7000
8000
9000
10,000
11,000
12,000
13,000
14,000
T441
(0.018)
mlcmmerics
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CHO-THERM® Thermal Insulator Pads
Typical PropertiesT444 1674 T441 T609 Test Method
Physical
Color Beige Blue Pink Lt. Green Visual
Material Non-Silicone Silicone Silicone Silicone --
Reinforcement Carrier Filled Polyimide Fiberglass Fiberglass Fiberglass Visual
Thickness, in (mm) 0.003 (0.08) 0.010 (0.25) 0.008 (0.20) 0.013 (0.33) 0.018 (0.46) 0.010 (0.25) ASTM D374
Thickness Tolerance, in (mm) 0.0005
(± 0.013) 0.001
(± 0.025) 0.001
(± 0.025) 0.001
(± 0.025) 0.001
(± 0.025) 0.001
(± 0.025) --
Operating Temperature Range, ºF (ºC) -40 to 392
(-40 to 200) -40 to 392
(-40 to 200) -40 to 392
(-40 to 200) -40 to 392
(-40 to 200) -40 to 392
(-40 to 200) -40 to 392
(-40 to 200) --
Thermal
Thermal Impedance,
°C-in2/W (°C-cm2/W) @ 300 psi* 0.37 (2.4) 0.41 (2.6) 0.41 (2.6) 0.56 (3.6) 0.64 (4.1) 0.33 (2.1) ASTM D5470
Thermal Conductivity, W/m-K 0.4 1.0 1.1 1.1 1.1 1.5 ASTM D5470
Heat Capacity, J/g-°C 1 1 1 1 1 1 ASTM E1296
Coefficient of Thermal
Expansion, ppm/°C 400 300 300 300 300 150 ASTM E831
Electrical
Voltage Breakdown Dry, Vac 5,000 2,500 8,700 11,400 13,800 4,000 ASTM D149
Voltage Breakdown Wet, Vac Not Tested Not Tested 8,100 10,500 12,900 Not Tested ASTM D149
Volume Resistivity Dry, ohm-cm 1014 1014 1014 1014 1014 1014 ASTM D257
Volume Resistivity Wet, ohm-cm Not Tested Not Tested 1014 1014 1014 Not Tested ASTM D257
Mechanical
Tensile Strength, psi (Mpa) 3,000 (20.7) 1,500 (10.3) 2,800 (19.3) 2,500 (17.3) 2,000 (13.8) 3,900 (26.9) ASTM D412
Tear Strength, lb/in (kN/m) 150 (26.3) 100 (17.5) 135 (23.6) 110 (19.3) 70 (12.25) 300 (52.5) ASTM D642
Elongation, % N/A 2 40 40 40 30 ASTM D412
Hardness, Shore A 90 85 80 80 80 70 ASTM D2240
Specific Gravity 1.70 2.45 2.45 2.45 2.45 2.10 ASTM D792
Regulatory
Flammability Rating
(See UL File E140244) V-0 Not Tested V-0 V-0 V-0 V-0 UL 94
RoHS Compliant Yes Yes Yes Yes Yes Yes Chomerics
Certification
Outgassing, % TML (% CVCM) Not Tested 0.45 (0.20) Not Tested Not Tested Not Tested Not Tested ASTM E595
Shelf Life, months from shipment,
dry pad (with PSA) (12) Indefinite (12) Indefinite (12) Indefinite (12) Indefinite (12) Indefinite (6) Chomerics
Storage Conditions, °F (°C) @ 50%
Relative Humidity 50 to 90
(10 to 32) 50 to 90
(10 to 32) 50 to 90
(10 to 32) 50 to 90
(10 to 32) 50 to 90
(10 to 32) 50 to 90
(10 to 32) Chomerics
Typical properties: these are not to be construed as specifications .
* Tested without PSA . PSA typically adds 0 .05 °C-in2/W (0 .30 °C-cm2/W)
mlcmmerics
38
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CHO-THERM® Thermal Insulator Pads
Typical Properties1678 T500 1671 Test Method
Physical
Color Pink Green White Visual
Reinforcement Carrier Fiberglass Fiberglass Fiberglass --
Thickness, in (mm) 0.010 (0.25) 0.010 (0.25) 0.015 (0.38)* ASTM D374
Thickness Tolerance, in (mm) ± 0.002
(0.050) ± 0.002
(0.050) ± 0.002
(0.050) --
Operating Temperature Range, ºF (ºC) -40 to 392
(-40 to 200) -40 to 392
(-40 to 200) -40 to 392
(-40 to 200) --
Thermal
Thermal Impedance, °C-in2/W (°C-cm2/W) @ 300 psi** 0.20 (1.26) 0.19 (1.2) 0.23 (1.48) ASTM D5470
Thermal Conductivity, W/m-K 2.0 2.1 2.6 ASTM D5470
Heat Capacity, J/g-°C 1 1 1 ASTM E1296
Coefficient of Thermal Expansion, ppm/K 250 250 250 ASTM E831
Electrical
Voltage Breakdown Dry, Vac 2,500 4,000 4,000 ASTM D149
Volume Resistivity Dry, ohm-cm 1016 1016 1016 ASTM D149
Dielectric Constant at 1,000 kHz 3.6 3.5 3.6 ASTM D150
Dissipation Factor at 1,000 kHz 0.007 0.003 0.007 Chomerics
Mechanical
Tensile Strength, psi (Mpa) 3,000 (20.7) 3,000 (20.7) 3,000 (20.7) Chomerics
Tear Strength, lb/in (kN/m) 200 (35) 400 (70) 400 (70) Chomerics
Elongation, % 20 20 15 Chomerics
Hardness, Shore A 80 80 80 ASTM D2240
Specific Gravity 1.55 1.60 1.55 ASTM D792
Regulatory
Flammability Rating (See UL File E140244) V-0 V-0 HB UL 94
RoHS Compliant Yes Yes Yes Chomerics
Certification
Outgassing, % TML (% CVCM) 0.55 (0.12) 0.40 (0.10) 0.76 (0.07) ASTM E595
Shelf Life, months from shipment, dry pad (with PSA) Indefinite (18) Indefinite (18) Indefinite (18) Chomerics
Storage Conditions, °F (°C) @ 50% Relative Humidity 50 to 90
(10 to 32) 50 to 90
(10 to 32) 50 to 90
(10 to 32) Chomerics
Typical properties: these are not to be construed as specifications .
* 1671 material is available in custom thicknesses .
** Tested without PSA . PSA typically adds 0 .05 °C-in2/W (0 .30 °C-cm2/W) .
mlchomerics
39
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Ordering Information
CHO-THERM® Thermal Insulator Pads
Adhesive Code
11 = No PSA
12 = PSA one side
Die-Cut Parts
For standard die-cut
parts, please see tables on
pages 41 to 43.
Material Type
1674
T441
T444
T609
60 XX YYYY ZZZZ
PART NUMBER:
Die-cut parts on continuous rolls
Slit rolls starting at 0.5" wide; maximum width is material specific
Ordering Information: Custom Configurations
Please contact Parker Chomerics for a pre-assigned part number, for custom widths,
lengths and part sizes, etc .
Available options include:
• Custom die-cut parts on sheets, or as individual parts
* Minimum width in 1674
** Minumum width in T441
Minimum width in T444
Format
4 = No Pressure Sensitive
Adhesive (PSA)
6 = With Pressure Sensitive
Adhesive (PSA)
Roll Length (ft)
10 = 100 ft
40 = 400 ft
Roll Width (in)
0075 = 0.75 in
0100 = 1.00 in
0150 = 1.50 in
0200 = 2.00 in
0800 = 8.00 in
1100 = 11.00 in
1150 = 11.50 in
1600 = 16.00 in*
2200 = 22.00 in**
2400 = 24.00 in†
Material Type
1674
T441
T444
T609
6W XX YYYY ZZZZ
PART NUMBER:
Standard Die-Cut Parts
Roll Stock
mlchomerics
40
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Ordering Information
CHO-THERM® Thermal Insulator Pads
Adhesive Code
11 = No PSA
12 = PSA 1 side
13 = PSA 2 Sides
Die-Cut Parts
For standard die-cut parts,
please see tables on
pages 41 to 43.
Material Type
T500
1671
1678
60 XX YYYY ZZZZ
PART NUMBER:
* 1671 is available in custom thicknesses
up to 0.060" in increments of .005".
Ordering Information: Custom Configurations
Please contact Parker Chomerics for a pre-assigned part number, for custom widths,
lengths and part sizes, etc .
Available options include:
• Custom die-cut parts on sheets, or as individual parts
HANDLING INFORMATION
These products are defined by Parker Chomerics
as “articles” according to the following generally
recognized regulatory definition for articles:
An article is a manufactured item “formed to a
specific shape or design during manufacturing,”
which has “end use functions” dependent upon
its size and shape during end use and which has
generally “no change of chemical composition
during its end use.”
In addition:
There is no known or anticipated exposure to
hazardous materials/substances during routine
and anticipated use of the product.
The product’s shape, surface, and design is
more relevant than its chemical composition.
These materials are not deemed by Parker Chomerics
to require an MSDS. For further questions, please
contact Parker Chomerics at 781-935-4850.
Format
1 = Sheet with No Pressure
Sensitive Adhesive (PSA)
2 = Sheet with Pressure Sensitive
Adhesive (PSA) 1 Side
3 = Sheet with Pressure Sensitive
Adhesive (PSA) 2 Sides
Material Thickness (in)
10 = 0.010" (T500 & 1678)
15 = 0.015"* (1671)
Sheet Size (in)
0808 = 8” X 8” sheet
0810 = 8” X 10” sheet
Material Type
T500
1671
1678
6W XX YYYY ZZZZ
PART NUMBER:
Standard Die-Cut Parts
8" x 8" or 8" x 10" Sheets
¢ 3‘— c an {2) >84 DDIA(Z) A Down) 7‘“ 1— x55 F a t sz) —. we ~— E A—.5oo n mus) cnmz 1117—. m Ghomerics
41
Phone +1 781-935-4850 www.parker.com/chomerics
Recommended
Screw Torque
Configuration Dimensions (inches) Ordering Number
A B C D E F G
#4-40 5 in-lb
#6-32 6 in-lb
TO-3 1.563
1.563
1.593
1.650
1.650
1.650
1.650
1.650
1.650
1.700
1.730
1.780
1.780
1.780
2.07
1.050
1.050
1.100
1.065
1.140
1.140
1.140
1.140
1.140
1.187
1.250
1.250
1.250
1.250
1.56
0.140
0.140
0.156
0.140
0.122
0.140
0.165
0.140
0.165
0.156
0.156
0.140
0.165
0.140
0.122
0.080
0.140
0.070
0.046
0.062
0.093
0.062
0.046
-
0.062
0.062
0.093
0.094
0.046
0.062
60-XX-D065-ZZZZ
60-XX-4305-ZZZZ
60-XX-4511-ZZZZ
60-XX-D370-ZZZZ
60-XX-D371-ZZZZ
60-XX-6875-ZZZZ
60-XX-D372-ZZZZ
60-XX-D373-ZZZZ
60-XX-D374-ZZZZ
60-XX-4996-ZZZZ
60-XX-5442-ZZZZ
60-XX-D375-ZZZZ
60-XX-D376-ZZZZ
60-XX-D377-ZZZZ
60-XX-D378-ZZZZ
#4-40 5 in-lb
#6-32 6 in-lb
3 LEAD
TO-3
1.65 1.140 0.140 0.093 1.187 0.430 60-XX-D379-ZZZZ
#4-40 5 in-lb
#6-32 6 in-lb
4 LEAD
TO-3
1.560
1.563
1.050
1.050
0.158
0.156
0.080
0.063
1.170
1.187
60-XX-D380-ZZZZ
60-XX-D381-ZZZZ
#4-40 5 in-lb
#6-32 6 in-lb
8 LEAD
TO-3
1.650 1.187 0.156 0.60 60-XX-D382-ZZZZ
#4-40 5 in-lb
#6-32 6 in-lb
10 LEAD
TO-3
1.650 1.140 0.165 0.040 60-XX-D383-ZZZZ
1 in-lb = 1.152 kg-cm
A_. mama) him comm l mo 3 T mum .. r-Im » I 2w (9— + —<> 5 v cnum m_ I ‘izfl “A—. ”WW T— DIM “I; é} um mmz) m Ghomerics :J
42
Phone +1 781-935-4850 www.parker.com/chomerics
Recommended
Screw Torque
Configuration Dimensions (inches) Ordering Number
A B C D E F G
#4-40 3 in-lb
#6-32 4 in-lb
TO-66 1.250
1.312
1.375
1.440
0.700
0.762
0.825
1.000
0.140
0.140
0.140
0.140
0.062
0.062
0.062
0.075
60-XX-4353-ZZZZ
60-XX-5527-ZZZZ
60-XX-4997-ZZZZ
60-XX-D384-ZZZZ
#4-40 3 in-lb
#6-32 4 in-lb
3 LEAD
TO-66
1.275 0.750 0.156 0.100 0.960 60-XX-D385-ZZZZ
#4-40 3 in-lb
#6-32 4 in-lb
4 LEAD
TO-66
1.312 0.762 0.140 0.062 0.960 0.200 0.100 60-XX-D386-ZZZZ
#4-40 3 in-lb
#6-32 4 in-lb
9 LEAD
TO-66
1.440 1.000 0.140 0.055 0.960 0.480 0.325 60-XX-D387-ZZZZ
#4-40 3 in-lb
#6-32 4 in-lb
MULTI LEAD
TO-66
1.35 0.800 0.140 0.400 60-XX-D388-ZZZZ
#4-40 2 in-lb TO-220 0.437
0.437
0.500
0.610
0.687
0.710
0.750
0.750
0.750
0.750
0.750
0.750
0.855
0.855
0.860
1.125
1.410
0.312
0.312
0.385
0.560
0.562
0.500
0.410
0.500
0.500
0.500
0.600
0.600
0.562
0.630
0.740
0.625
0.810
0.140
0.140
0.170
0.245
0.218
0.160
0.225
---
0.187
0.187
0.240
0.240
0.218
0.230
0.200
0.200
0.355
0.093
0.122
0.120
0.125
0.125
0.141
0.156
---
0.147
0.125
0.150
0.115
0.125
0.093
0.160
0.145
0.147
60-XX-D389-ZZZZ
60-XX-D390-ZZZZ
60-XX-D391-ZZZZ
60-XX-D392-ZZZZ
60-XX-5791-ZZZZ
60-XX-8302-ZZZZ
60-XX-D393-ZZZZ
60-XX-8531-ZZZZ
60-XX-6956-ZZZZ
60-XX-D394-ZZZZ
60-XX-D395-ZZZZ
60-XX-D396-ZZZZ
60-XX-D397-ZZZZ
60-XX-D398-ZZZZ
60-XX-D399-ZZZZ
60-XX-D400-ZZZZ
60-XX-D401-ZZZZ
#4-40 2 in-lb
0.910
0.983
0.500
0.750
0.200
0.432
0.125
0.156
0.580
0.665
0.046
0.101
0.265
0.217
60-XX-D402-ZZZZ
60-XX-D403-ZZZZ
E mu m + 7. 4 A 219 mama) can!) 7 kg» 1 L-.J J L.J DDIA. I m Chomerics
43
Phone +1 781-935-4850 www.parker.com/chomerics
Recommended
Screw Torque
Configuration Dimensions (inches) Ordering Number
A B C D E F G
#4-40 2 in-lb TYPE II
TO-220
1.00 0.500 0.200 0.141 0.626 60-XX-4969-ZZZZ
#10-32 2 in-lb
#25-28 7 in-lb
DIODE WASHERS
DO-4
DO-5
0.360
0.510
0.510
0.512
0.625
0.750
0.800
0.800
0.812
0.812
0.875
1.000
1.000
1.180
1.250
1.500
1.500
0.260
0.140
0.200
0.161
0.195
0.125
0.190
0.260
0.115
0.145
0.313
0.140
0.255
0.515
0.380
0.200
0.500
60-XX-D404-ZZZZ
60-XX-D405-ZZZZ
60-XX-D406-ZZZZ
60-XX-D407-ZZZZ
60-XX-4659-ZZZZ
60-XX-D408-ZZZZ
60-XX-D409-ZZZZ
60-XX-D410-ZZZZ
60-XX-D411-ZZZZ
60-XX-D412-ZZZZ
60-XX-D413-ZZZZ
60-XX-D414-ZZZZ
60-XX-4661-ZZZZ
60-XX-D415-ZZZZ
60-XX-D416-ZZZZ
60-XX-D417-ZZZZ
60-XX-D418-ZZZZ
TO-36 1.063 0.690 0.200 60-XX-4306-ZZZZ
TO-5 and TO-18
3 holes
4 holes
0.250
0360
0.390
0.250
0.360
0.390
0.100
0.200
0.200
0.100
0.200
0.200
0.036
0.040
0.040
0.036
0.040
0.040
60-XX-D419-ZZZZ
60-XX-4374-ZZZZ
60-XX-D420-ZZZZ
60-XX-D421-ZZZZ
60-XX-D422-ZZZZ
60-XX-D423-ZZZZ
#4-40 2 in-lb RECTIFIER 1.000
1.125
1.250
1.000
1.125
1.250
0.187
0.140
0.200
60-XX-D424-ZZZZ
60-XX-D425-ZZZZ
60-XX-D426-ZZZZ
#4-40 2 in-lb TIP
PACKAGE
0.865
0.865
0.984
0.984
1.260
0.650
0.650
0.787
0.787
0.787
0.650
0.650
---
0.780
0.984
0.140
0.140
---
0.142
0.142
60-XX-5792-ZZZZ
60-XX-D427-ZZZZ
60-XX-D428-ZZZZ
60-XX-D429-ZZZZ
60-XX-D430-ZZZZ
1 in-lb = 1.152 kg-cm
mlchomerics
44
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T-WING® HEAT SPREADERS
Thin Heat Spreaders
Parker Chomerics’ family of thin heat spreaders provides a
low-cost, effective means of cooling IC devices in restricted
spaces where conventional heat sinks are inappropriate.
TYPICAL APPLICATIONS
Microprocessors
Memory modules
Laptop PCs and other high
density, handheld portable
electronics
High speed disk drives
DESIGN DETAILS
Low profile (0.33 mm/0.013 in)
allows use in limited space
environments
Easy peel and stick adhesion to all
surfaces, including packages with
residual silicone mold release
Offers low cost cooling for many
package types
Low application force
(<5 psi/ 0.03 MPa) minimizes risk of
damage to component
Available in a range of standard sizes
Pliable nature allows conformance
to concave or otherwise non-flat
surfaces for optimal thermal and
mechanical performance
Light weight (0.039 oz/in2)
Standard parts are scored for easy
forming and alignment
Easy removal for device
replacement
Available die-cut on continuous rolls
TESTING SUMMARY
Summaries of test procedures used for
T-WING heat spreaders are described
below. Thermal performance, adhesion
strength and visual inspection were
used as pass/fail criteria.
Apparatus
Anatek® Thermal Analyzer: The ATA
was used to measure Rj-a before and
after environmental stressing. PQFP:
196 lead, plastic PQFPs known to
contain silicone mold release were
evaluated. T-WING Heat Spreader:
1 in x 4 in T-WING parts were applied
to the PQFP packages with a 5 psi
(0.03 MPa) mounting pressure.
FEATURES/BENEFITS
Component junction
temperature reduction of
10 to 20°C is common
Easily added to existing
designs to lower component
temperatures and improve
reliability
Custom shapes available for
complex designs
mlchomerics
45
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THERMAL PERFORMANCE
Various sizes of T-WING heat
spreaders were applied to a 196 lead
PQFP using less than 5 psi (0.03 MPa)
bonding pressure. Within 30 minutes
of application, the test boards were
mounted in an Analysis Tech® thermal
analyzer. The devices were heated
to equilibrium (45 to 60 minutes) with
approximately 3 watt load on 3 x 3 in
(7.6 x 7.6 cm) test boards.
Two test environments were used:
restricted convention, achieved with
a 1 x 5 x 6 in (2.5 x 12.7 x 15.2 cm)
plexiglass box; and 100 LFM (30 m/
min) air flow. Results were obtained
using thermocouples for Tc (centered
on case) and Rj-a.
Environmental Stressing
Control: Specimens were maintained
for 1000 hours at standard laboratory
conditions, 23°C, 35-60% RH.
Heat Aging: Test specimens were
placed in a forced convection hot air
oven maintained at 150°C ±5°C for
1000 hours. Test specimens were then
removed and tested.
Elevated Temperature/
High Humidity:
Specimens were placed in a humidity
chamber maintained at 85°C ± 2°C
and 90%-0 +10% RH for 1000 hours.
Temperature Cycling: Specimens
were subjected to 500 cycles
from -50°C to +150°C in a Tenney
Temperature Cycling Oven.
Temperature Shock: Specimens were
subjected to 100 temperature shocks
by immersion into -50° and +150°C
liquids. Temperatures were monitored
with thermocouples.
Evaluation Procedure
Visual: All test specimens were
examined for de-bonding, delamination
or other signs that the tape was failing
after environmental stress.
Thermal Performance: T-WING
was applied to the PQFP with 5 psi
mounting pressure. After a one hour
dwell, the Rj-a of each specimen was
measured at 100 LFM and under
restricted convection conditions.
The Rj-a was again measured after
environmental stressing.
90° Peel Strength: A T-WING heat
spreader was applied to each
PQFP with 5 psi mounting pressure.
The specimens were subjected
to environmental stress and then
tested for 90° peel strength at
room temperature.
Results
Visual: There was no visual evidence
of T-WING adhesion failure to the PQFP
after the environmental stresses.
Thermal Performance: The before
and after thermal resistances are given
in Table 4. The data shows that the
thermal resistances were essentially
unchanged by the exposures.
90° Peel Strength: The results of the
peel strength tests are given above.
The data shows that the average peel
strength actually increases with high
temperature/humidity and temperature
shock, while remaining unchanged
with heat aging and decreasing slightly
with temperature cycling.
APPLICATION INSTRUCTIONS
Materials needed: Clean cotton cloth
or rag, industrial solvent, rubber gloves.
Step 1: For best results, clean the top
surface of the component using a
lint-free cotton cloth.
Step 2: Wipe the bonding surface
of the component with an industrial
solvent, such as MEK, acetone or
isopropyl alcohol. In the case of a
plastic package, select a cleaner
that will not chemically attack the
plastic substrate. Do not touch the
cleaned surface during any part of the
assembly process. If the surface has
been contaminated, repeat Steps 1
and 2.
Step 3: Remove the clear release liner
from the T-WING part, exposing the
pressure-sensitive adhesive (PSA).
Avoid touching exposed adhesive
with fingers.
Step 4: For best bond strength and
contact area, center the exposed
PSA onto the component. Press and
smooth the entire T-WING bonding
area with firm finger pressure of about
5 psi, for 5 seconds.
Note: Bond strength will increase as
a function of time as the adhesive
continues to wet out the bonding
surface. Increasing any of the
application variables (pressure,
temperature and time) can improve
bonding results.
mlcmmerics
46
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Typical Thermal Properties
(Performed on surface of 196 lead 3 Watt PQFP package) Standard Part Size in (mm)
Environment* Properties
Without
T-WING
0.5 x 2
(12.7 x 50.8)
0.5 x 3
(12.7 x 76.2)
0.75 x 3
(19.1 x 76.2)
1 x 3
(25.4 x 76.2)
1 x 4
(25.4 x 101.6)
1.5 x 4
(38.1 x
101.6)
Restricted
Convection**
Thermal Resistance
Rj-a, °C/W 26 25 23 23 22 20 19
Case
Temperature, °C 92 82 78 76 72 70 68
100 LFM***
Thermal Resistance
Rj-a, °C/W 18 16 14 14 14 13 12
Case
Temperature, °C 68 57 52 49 46 44 44
Typical properties: these are not to be construed as specifications.
* Measured values do not account for heat losses through bottom of case and leads. Ambient temperature range from 21oC to 24oC.
** Restricted convection in a simulated notebook computer environment - a 1 x 5 x 6 in (2.54 x 12.7 x 15.2 cm) plexiglass box.
*** T-WING long axis perpendicular to air flow direction in wind tunnel.
Notes
Rj-a = thermal resistance from junction to ambient
LFM = airflow rate (linear feet per minute)
T-WING® Heat Spreaders
Typical PropertiesT-WING Test Method
Physical
Color Black Visual
Total Thicknesses, in (mm) 0.013 (0.33) ASTM D374
PSA Type Silicone based --
PSA Thickness, in (mm) 0.002 (0.05) Visual
Insulator Type Black polyester --
Insulator Layer Thickness, in (mm) 0.001 (0.025) --
Weight, oz/in20.039 --
Thermal Conductor Copper --
Maximum Operating Temperature, °F (°C) 257 (125) --
Thermal Conductor Thickness, in (mm) 0.007 (0.178) --
Electrical
Dielectric Strength, Vac/mil (kVac/mm) 5,000 (200) for each
dielectric layer ASTM D149
Volume Resistivity, ohm-cm N/A ASTM D149
Dielectric Constant @ 1,000 MHz N/A ASTM D150
Dissipation Factor @ 1,000 kHz N/A Chomerics
Regulatory
Flammability Rating (See UL File E140244) V-0 UL 94
RoHS Compliant Yes Chomerics
Certification
Shelf Life, months from date of manufacture 12 Chomerics
Storage Conditions, °F (°C) @ 50% Relative Humidity 50 to 90
(10 to 32) Chomerics
Typical Properties
Typical properties: these are not to be construed as specifications .
47
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Environment 90° Peel Strength
oz/in gm/cm
Control 36 393
Heat Aging 36 393
High Temperature/Humidity 46 514
Temperature Shock 38 424
Temperature Cycling 30 335
Environment Before After
Heat Aging
Rj-a, °C/W Restricted Convection 20.3 20.6
Rj-a, °C/W 100 LFM 12.7 13.1
High Temperature/Humidity
Rj-a, °C/W Restricted Convection 21.4 21.4
Rj-a, °C/W 100 LFM 14.1 14
Temperature Cycling
Rj-a, °C/W Restricted Convection 21.4 21.7
Rj-a, °C/W 100 LFM 14.1 13.9
Test Procedure Result Test Method
Lap Shear - Room Temperature apply/60 min. R.T. dwell/R.T. pull 960 oz/in2 (414 kPa) ASTM D1000
Lap Shear - Elevated Temperature apply/60 min. R.T. dwell/100°C pull 53 oz/in2 (23 kPa) ASTM D1000
90° Peel - Room Temperature apply/1 min. R.T. dwell/R.T. pull 40 oz/in (441 g/cm) ASTM B571/D2861
90° Peel - Elevated Temperature apply/60 min. R.T. dwell/100°C pull 20 oz/in (220 g/cm) ASTM B571/D2861
Creep Adhesion, days 275°F (135°C), 7 oz/in2 (3 kPa), on aluminum >80 days, no failure P.S.T.C. No. 7
Note: Tested with a 1” x 4” (25.4 x 101.6 mm) T-WING.
Note: Average of three samples tested per ASTM B571/D2861.
Typical Adhesion Performance
Environmental Stress Thermal Performance Environmental Stress Adhesive Performance
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Part Numbers
Size (inches/mm)
A: Length, inches (mm) B: Width, inches (mm) C: Adhesive Width, inches (mm)
60-12-20264-TW10 2.0 (50.8) 0.50 (12.7) 0.50 (12.7)
60-12-20265-TW10 3.0 (76.2) 0.50 (12.7) 0.50 (12.7)
60-12-20266-TW10 3.0 (76.2) 0.75 (19.1) 0.75 (19.1)
60-12-20267-TW10 3.0 (76.2) 1.00 (25.4) 1.00 (25.4)
60-12-20268-TW10 4.0 (101.6) 1.00 (25.4) 1.00 (25.4)
60-12-20269-TW10 4.0 (101.6) 1.50 (38.1) 1.50 (38.1)
Ordering Information
T-WING® Heat Spreaders
Standard Parts: Refer to table below for part numbers and sizes. T-WING
heat spreaders are available in standard packages of 100 parts/pkg.
Custom Parts: Custom configured T-WING parts are also available. Contact
Parker Chomerics’ Applications Engineering Department for details.
Available in standard sizes 1,000 parts per plastic tray. Also available die-cut
on continuous rolls.
C
A
B
Folding Scores
0.0015 in. Black PET
0.007 in. RA Copper
0.0015 in. Black PET
Release Liner
0.002 in. Thermattach PSA
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THERMAL GREASES
Parker Chomerics thermal greases offer a range of
performance covering the simplest to the most demanding
thermal requirements. These materials are screened,
stenciled or dispensed and require virtually no compressive
force to conform under typical assembly pressures.
TYPICAL APPLICATIONS
Mobile, desktop, server CPUs
Engine and transmission
control modules
Memory modules
Power conversion equipment
Power supplies and UPS
Power semiconductors
FEATURES/BENEFITS
Silicone based materials conduct
heat between a hot component
and a heat sink or enclosure
Fills interface variable tolerances
in electronics assemblies and heat
sink applications
Dispensable, highly conformable
materials require no cure cycle,
mixing or refrigeration
Thermally stable and require
virtually no compressive force to
deform under typical assembly
pressures
Supports high power applications
requiring material with minimum
bond line thickness and high
conductivity
Ideal for rework and field repair
situations
PERFORMANCE GUIDE
3.0
2.0
1.0
Viscosity (cps)
100,000 200,000 300,000 400,000
Thermal Conductivity (W/m-K)
T660
T650
T670
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MATERIAL APPLICATION
T650
Material is supplied in various syringe
or bulk packaging (see ordering
information) for dispensing onto
components or heat sinks. Excess
material can be wiped with a clean
cloth and suitable solvent.
T660
Packaging the same as T650.
For optimum performance, the
processor should be allowed to
reach temperatures greater than
65ºC (149°F). This causes the solder
fillers to melt and conform to the
mating surfaces, obtaining a minimum
bondline thickness at the interface.
This process only needs to occur
one time to achieve optimum thermal
performance of the grease.
T670
T670 high performance thermal grease
is supplied in easy access metal
cans or pails. Mix with a spatula and
remove the desired amount onto the
component or stencil screen. Stencil
desired pad part size onto heat sink for
immediate assembly or shipping.
Typical properties: these are not to be construed as specifications .
* Not recommended for dielectric applications .
** Material may settle during storage, remixing may be required .
Thermal Greases
Typical PropertiesT650 T660 T670 Test Method
Physical
Color Pale Blue Light Gray White Visual
Specific Gravity 2.3 2.4 2.6 ASTM D792
Viscosity, cps 190,000 170,000 350,000 --
Operating Temperature Range, ºF (ºC) -58 to 392
(-50 to 200) -58 to 392
(-50 to 200) -58 to 392
(-50 to 200) --
Phase Transition Temperature, ºF (ºC) N/A 144 (62) N/A ASTM D3418
Weight Loss % @ 150°C, 48 Hours 0.21 0.17 <0.2 TGA
Thermal
Thermal Conductivity, W/m-K 0.8 0.9 3.0 ASTM D5470
Thermal Impedance,°C-in2/W (°C-cm2/W) @ 100 psi 0.02 (0.13) @ 50°C
0.02 (0.13) @ 65°C 0.02 (0.13) @ 50°C
0.009 (0.06) @ 65°C 0.01 (0.07) @ 50°C
0.01 (0.07) @ 65°C ASTM D5470
Heat Capacity, J/g-K 111 ASTM E1269
Coefficient of Thermal Expansion, ppm/K 300 300 150 ASTM E831
Electrical
Volume Resistivity, ohm-cm 1014 N/A 1014 ASTM D257
Voltage Breakdown, Vac/mil 150* N/A* 150* ASTM D149
Regulatory
Flammability Rating Not Tested Not Tested Not Tested UL 94
RoHS Compliant Yes Yes Yes Chomerics
Certification
Outgassing, % TML 0.21 0.17 <0.2 ASTM E595
Shelf Life, months from date of manufacture** 24 24 24 Chomerics
Storage Conditions, °F (°C) @ 50% Relative Humidity 50 to 90
(10 to 32) 50 to 90
(10 to 32) 50 to 90
(10 to 32) Chomerics
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Ordering Information
Thermal Greases
Material Type
T670
T660
T650
Vessel Size
Volume in cc
0080 = 80 cc in 8 ounce container
0160 = 160 cc in 8 ounce container
3790 = 1 gallon pail
65 00 YYYY
PART NUMBER:
Part Number Examples
65-00-T650-0160 = T650 Material (160 cc) in an 8 ounce container
65-00-T670-3790 = T670 Material in a 3790 cc (gallon) pail
ZZZZ
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Alumina (Al2O3): A relatively inexpensive
ceramic in powder or sintered sheet
form. Its thermal conductivity of 30
W/m-K and excellent dielectric properties
make it useful in low to moderate power
commercial applications.
Ambient Temperature: The temperature
of the air surrounding a heat source.
Apparent Thermal Conductivity:
This value differs from bulk thermal
conductivity as apparent thermal
conductivity also includes contact
resistance when measured, as described
in the Heat Transfer Fundamentals
section of this guide. Also see Thermal
Conductivity.
Arcing: An electrical discharge between
the edges of metal semiconductor
package and the metal heat sink on
which it is mounted.
Binder: A polymer (i.e. silicone,
urethanes, acrylic, epoxy etc.) used in
thermal interface materials to provide
desired mechanical, thermal and
electrical properties and hold in a stable
form the fillers whose primary purpose
is the transfer of heat. Binders are also
good electrical insulators.
Bondline Thickness: Average thickness
between heat spreading device and
components.
Boron Nitride (BN): A non-abrasive
ceramic material that has higher thermal
conductivity than alumina. Because it is
an expensive raw material, it is usually
used in high performance interface
materials.
Breakdown Voltage: The amount of
voltage required to cause a dielectric
failure through an insulator when tested
under a set of specific conditions. This
value does not imply that the insulator
can be operated at those voltages.
Burr: A thin ragged fin left on the edge
of a piece of metal (semiconductor
package or heat sink) by a cutting or
punching tool.
Calorie: A unit of energy equal to the
quantity of heat required to raise the
temperature of 1 gram of water by
one degree Celsius.
Ceramic: A name given to oxides of
metals. Ceramics are usually hard, heat
and corrosion resistant and high dielectric
strength powders that can be formed
into shapes by fusion or sintering.
Chamfer: A bevel cut into the edge of
heat sink mounting holes.
Coefficient of Thermal Expansion
(CTE) : A measure of a material’s
change in volume in response to a
change in temperature.
Compression Set: The permanent
deformation of an elastomeric material
caused by a compressive force.
Conduction: The transfer of heat
energy through matter.
Convection: The transfer of heat that
results from motion of a fluid (gas
or liquid).
Corona: An electrical discharge within
or on an insulator accompanied by
ionization of the air within or contacting
the surface of the insulator. Also called
partial discharge. It is the main mode of
insulation failure exposed to long term
AC voltages.
Creep Distance: The distance that an
insulator has to extend beyond the
edge of a semiconductor package to
prevent arcing.
Cure-In-Place: Any material that is
dispensed as a liquid and cures in
the application.
Cut-Through: A phenomenon that
occurs when sharp edges or burrs on
the metal semiconductor package or
heat sink cut through the thermal pads
and reduce or eliminate their insulating
strength.
Compression / Deflection: The
change in thickness of an elastomeric
interface material in response to a
compressive load. Because these
materials are incompressible, deflection
is accompanied by a proportional
increase in area.
Degreaser or Degreasing Solvent:
The solvent used to clean flux and other
organic residues off printed circuit boards
after they are manufactured. Interface
materials must be able to tolerate
exposure to degreasing solvents without
degrading performance.
Dielectric: A material that acts as
an insulator.
Dielectric Constant: See Permittivity.
Dielectric Strength: The voltage
gradient, expressed as kV/mm, that
will cause a dielectric failure in an
insulating material under very specific
test conditions. Dielectric strength
does not imply that the insulator can
withstand those potential gradients for
an extended period of time.
Durometer: An instrument for
measuring the hardness of rubber.
Measures the resistance to the
penetration of an indentor point into
the surface of the rubber.
Electronic Control Unit or Electronic
Control module (ECU/ECM): Various
electronic controllers, typically used in
automotive applications. (i.e. steering
and braking)
Electrical Insulator: A material having
high electrical resistivity and high
dielectric strength and therefore suitable
for separating components at different
potentials to prevent electrical contact
between them.
THERMAL MANAGEMENT GLOSSARY
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Filler: A fine, dispersible ceramic or
metallic powder (i.e. boron nitride,
alumina, graphite, silver flake, etc.) whose
thermal conductivity is at least twenty
times greater than that of the binder.
Flow Rate: The volume, mass or weight
of a fluid passing through a device of
any type, per unit of time, expressed in
gallons- or liters-per-hour.
Flux: An organic compound used to
enhance the wetting and adhesion of
metal solder to the copper surfaces on
printed circuit boards.
Footprint: The area of the base of an
electronic device which comes in contact
with a thermal interface material.
Hard Tooling: A die cutting tool
manufactured from a machined metal
block. The cost is high, therefore it
is normally used when long runs are
anticipated.
Hardness: A measure of the ability of a
material to withstand penetration by a
hard pointed object. Regarding thermal
interface materials, this property is usually
inversely proportional to the ability of a
material to conform to uneven surfaces.
Hardness Shore A (Shore D, Shore 00):
An instrument reading on a scale of
0 to 100 measuring the hardness of a
material. There are three scales: Shore 00,
A and D. Shore 00 is used for soft rubbers
like gels, Shore A is used for hard rubbers
and Shore D for inelastic plastics.
Heat (Q): A form of energy generated by
the motion of atoms or molecules. Heat
energy is expressed in units of joules.
Heat Capacity: The measure of a
material’s ability to store heat.
Heat Flow: The rate at which heat is
flowing per unit time expressed as Watts.
Heat Flux (Q/A): The rate of heat flow
per unit surface area expressed as
Watts/cm2.
Heat Transfer: The movement of heat
from one body to another (solid, liquid,
gas, or a combination) by means of
conduction, convection, or radiation.
Interface: A boundary that exists
between any two contacting surfaces.
There are five types of interfaces that
can exist between the different forms of
matter: gas-liquid, liquid-liquid, gas-solid,
liquid-solid, and solid-solid.
Junction: The junction is the active
part of a semiconductor, usually silicon,
where the current flow causes heat to
be generated.
MBLT: Minimum bond line thickness.
When two opposing substrates obtain
closest possible distance under pressure.
Micro-inch: This unit of measure, a
millionth of an inch, is used to describe
the roughness of a surface and is the
average distance between the peaks
and valleys on the surface.
Mil: A unit of length equal to one-
thousandth of an inch.
PCM: Abbreviation of phase change
material.
Permeability: A measure of a material’s
ability to align its magnetic domains in
response to an applied magnetic field.
Permittivity: A measure of a dielectric
material’s ability to polarize in response to
an applied electric field, and transmit the
electric field through the material.
Polyimide: An organic polymer with
exceptional electrical insulation and high
temperature capabilities. In film form, it
is used on everything from printed circuit
boards to space suits.
Power Supply: A self contained unit
which converts AC current to DC for
use in electronic devices.
Pressure Sensitive Adhesive (PSA):
An adhesive that is tacky at normal
temperatures and requires only slight
pressure to form a permanent bond. A
PSA requires no further cure to maintain
the bond.
PSH: Class of polymer solder
hybrid. A synergistic blend of eutectic
solder and specialty polymers. They
provide a highly reliable thermal interface
material with a resin carrier and filler
content that both melt to obtain minimum
bond line thickness.
Radiation: A heat transfer process
whereby heat is given off through
electromagnetic radiation, usually
infrared rays.
Reinforcement: A woven glass mesh or
polymer film that is used as a support in
thermal interface materials.
Permanent Set: Permanent Set is
defined as the amount of residual
displacement in a rubber part after the
distorting load has been removed.
Relaxation: Stress Relaxation is a
gradual increase in deformation of an
elastomer under constant load over
time, accompanied by a corresponding
reduction in stress level.
Rheology: The science of the
deformation and flow of materials.
Semiconductor: An electronic material
that can be an insulator under one
condition and switch to a conductor
under a different condition
Shear-Thinning: A characteristic of
a fluid whereby the fluid’s viscosity
decreases with increased shear stress.
Materials the exhibit shear-thinning
are also described as pseudoplastic.
Filled polymer resins commonly exhibit
this behavior. (Example: toothpaste is
shear-thinning. It does not flow when
left alone, but when squeezed with
increased force, it flows more readily.)
Thermal Management Glossary
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Silicon: A non-metallic element
occurring extensively in the earth’s
crust in silica and silicates. Silicon is
the basis for the junction found in most
semiconductor devices.
Solder: A mixture of metals that is used
to connect electronic devices to the
copper patterns on a printed circuit
board.
Solvent Resistance: The ability of
thermal management products to resist
swelling when exposed to organic
solvents such as degreasing solvents,
hydraulic fluids, coolants and jet fuel.
Specific Gravity: The ratio of the
density of a substance to the density
of water. The specific gravity of water
is 1 at standard condition temperature
and pressure.
Specific Heat: The amount of heat
per unit mass required to raise the
temperature by one degree Celsius.
(See Heat Capacity.)
Steel Mill Die: A die cutting tool of
moderate cost, cast from steel. It is
used for high speed cutting.
Steel Rule Die: A low cost die cutting
tool manufactured by shaping sharpened
steel foil to the desired shape and fixing
in a plywood and steel rule metal. It is
used for short runs.
Surface Finish: A measure of the
roughness of a surfaces, usually
expressed in units of micro-inches.
Swelling: A phenomenon that results
when an elastomer is exposed to a
degreasing solvent and the elastomer
absorbs the solvent. The volume of the
elastomer increases and its physical
strength is greatly reduced. In this
swollen state, the elastomer can be
easily damaged and should not be
subjected to any mechanical stress
until the elastomer has been dried.
Tear Strength: A measure of the ability
of a material to withstand tearing/ ripping
stresses. It is usually measured in pounds
force per inch of thickness.
Temperature: A measure of the average
kinetic energy of a material. The standard
unit of temperature is a Kelvin (K).
Temperature determines the direction
of heat flow between any two systems
in thermal contact. Heat will always flow
from the area of higher temperature
(T source) to one of lower temperature
(T sink).
Temperature Gradient (∆T): The
difference in temperatures in the direction
of the heat flow between two points in
a system.
Tensile Strength: A measure of the
ability of a material to withstand a
tension (pulling apart) force. It is usually
measured in MPa or psi of material
cross section.
Thermal Conductivity (K): A quantitative
measure of the ability of a material to
conduct heat expressed in units of
W/m-K.
Thermal Contact Resistance (Ri): The
resistance to the flow of heat caused by
interstitial air trapped in the irregularities
of between contacting solid surfaces.
Units are K-cm2/W.
Thermogravimetric Analysis: Chemical
analysis by the measurement of weight
changes of a system or compound as a
function of increasing temperature.
Thermal Impedance (θ): Thermal
impedance is the sum of the thermal
resistance of an interface material and
the thermal resistances at the interfaces
in contact with the material. K-in2 /Watt.
Thermal Interface Materials (TIMs):
Materials that are inserted between
two contacting solid surfaces and aid
heat flow by eliminating gaps between
the irregular surfaces. Interstitial air is
replaced by material that is significantly
more conductive than air.
Thermal Resistivity: The quantitative
measure of a material’s resistance to the
conduction of heat. (It is the inverse of
thermal conductivity.)
Thermocouple: A thermoelectric device
consisting of two dissimilar metallic wires
fused into a bead which generates a
voltage proportional to the temperature
of the bead.
Thixotropy: A characteristic of a fluid
whereby the fluid’s viscosity decreases
as a function of time at a fixed shear rate.
Viscosity tends to re-build with time as
the shear stress is reduced. (Example:
gels and colloids are often thixotropic.
The longer they are shaken in a can, the
more readily they flow)
Tolerance: The permissible variations in
the dimensions or other characteristic of
a part or substance.
Torque: A turning or twisting that is equal
to the value of the force (f) multiplied by
the rotational distance over which it is
applied (usually measured in ft-lbs.).
Viscoelastic material: A material whose
response to a deforming load combines
both viscous (does not recover its original
shape/ size when load removed) and
elastic (will recover size/shape when load
removed) qualities. The common name
for such a material is “plastic.”
Volume Resistivity: A measure of a
material’s inherent electrical resistance
expressed as ohm-cm.
Watt: An SI unit of power equal to one
joule per second.
Thermal Management Glossary
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Fabric Over Foam Gaskets
SOFT-SHIELD® EMI gasketing products bring new flexibility to
shielding decisions. They offer material choices, performance
levels, configurations and attachment methods.
Typical Applications: Telematics, ITE, medical, commercial
Laminates and Grounding Products
Mechanical, electrical and processing properties plus economy for
commercial applications.
Typical Applications: EMI shields, ground planes, ground straps, ESD shields
Wire and Expanded Metal Gasketing
Metal-based gaskets solutions for Electromagnetic Interference
(EMI) and Electromagnetic Pulse (EMP) shielding as well as
lightning strike protection.
Typical Applications: Connectors, cabinets, military
Beryllium Copper and Stainless Steel Gaskets
Beryllium-copper (BeCu) and stainless steel EMI gaskets
(SPRING-LINE®) combine high levels of shielding effectiveness
with a broad deflection range and low closure force properties.
Typical Applications: Cabinets, enclosures, commercial, military
EMI SHIELDING & GROUNDING
Thermally Conductive Gels
Highly conformable, high performance fully cured single-
component dispensable gap filler ideal for high volume
automated dispense processes.
Typical Applications: Telematics, ECU’s, EPAS, batteries
Thermal Gap Fillers
Low modulus thermally conductive gap pads offer ease of use,
excellent thermal properties and highest conformability for low to
moderate clamping force applications.
Typical Applications: A/V systems, ACC, braking, battery ECU’s
Thermal Insulators
Available in several forms, these materials are designed for use
where the highest possible thermal, dielectric and mechanical
properties are required.
Typical Applications: Power train, lighting, braking, sensors, ECU’s
Phase Change Materials
Designed to minimize the thermal resistance between power
dissipating electronic components and heat sinks, provide
superior long term reliability performance.
Typical Applications: ABS, braking, wipers, transmissions, batteries
THERMAL MANAGEMENT
CHO-TOUCH Touchscreen LCDs
Parker Chomerics has designed these
touchscreen LCDs for harsh environments
such as military, medical, avionics, and
general industrial.
Typical Applications: Military, medical, aerospace
EMI Shielded Touchscreens and Windows
EMI Shielded touchscreens for rugged
performance meeting critical EMC needs.
Glass and polycarbonate windows for EMI
Shielding and mechanical protection.
Typical Applications: Military, medical, aerospace
INTEGRATED DISPLAY SOLUTIONS
Conductive Plastics
Blend of thermoplastic and conductive
fillers that provides world class shielding
effectiveness and requires no machining,
plating, painting or other added
processing steps.
Typical Applications: ACC, sensors, batteries
CONDUCTIVE PLASTICS
CONDUCTIVE COMPOUNDS
Specialty Materials
Offering a wide variety of adhesives, caulks,
sealants and coatings.
Typical Applications: EMI/RFI shielding, component
and module caulking and sealing, ITE, medical
PARKER CHOMERICS CAPABILITIES
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I
Offer of Sale
PARKER-HANNIFIN CORPORATION
OFFER OF SALE
1. Definitions. As used herein, the following terms have the meanings indicated.
Buyer: means any customer receiving a Quote for Products from Seller.
Goods: means any tangible part, system or component to be supplied by the Seller.
Products: means the Goods, Services and/or Software as described in a Quote provided by the Seller.
Quote: means the offer or proposal made by Seller to Buyer for the supply of Products.
Seller: means Parker-Hannifin Corporation, including all divisions and businesses thereof.
Services: means any services to be supplied by the Seller.
Software: means any software related to the Products, whether embedded or separately downloaded.
Terms: means the terms and conditions of this Offer of Sale or any newer version of the same as
published by Seller electronically at www.parker.com/saleterms.
2. Terms. All sales of Products by Seller are contingent upon, and will be governed by, these Terms
and, these Terms are incorporated into any Quote provided by Seller to any Buyer. Buyer’s order for
any Products whether communicated to Seller verbally, in writing, by electronic date interface or other
electronic commerce, shall constitute acceptance of these Terms. Seller objects to any contrary or additional
terms or conditions of Buyer. Reference in Seller's order acknowledgement to Buyer's purchase order
or purchase order number shall in no way constitute an acceptance of any of Buyer's terms of purchase.
No modification to these Terms will be binding on Seller unless agreed to in writing and signed by an
authorized representative of Seller.
3. Price; Payment. The Products set forth in Seller's Quote are offered for sale at the prices indicated in
Seller’s Quote. Unless otherwise specifically stated in Seller’s Quote, prices are valid for thirty (30) days
and do not include any sales, use, or other taxes or duties. Seller reserves the right to modify prices at
any time to adjust for any raw material price fluctuations. Unless otherwise specified by Seller, all prices
are F.C.A. Seller's facility (INCOTERMS 2010). All sales are contingent upon credit approval and payment
for all purchases is due thirty (30) days from the date of invoice (or such date as may be specified in the
Quote). Unpaid invoices beyond the specified payment date incur interest at the rate of 1.5% per month
or the maximum allowable rate under applicable law.
4. Shipment; Delivery; Title and Risk of Loss. All delivery dates are approximate. Seller is not responsible
for damages resulting from any delay. Regardless of the manner of shipment, delivery occurs and title
and risk of loss or damage pass to Buyer, upon placement of the Products with the shipment carrier at
Seller's facility. Unless otherwise agreed, Seller may exercise its judgment in choosing the carrier and
means of delivery. No deferment of shipment at Buyers' request beyond the respective indicated shipping
date will be made except on terms that will indemnify, defend and hold Seller harmless against all loss
and additional expense. Buyer shall be responsible for any additional shipping charges incurred by Seller
due to Buyer’s acts or omissions.
5. Warranty. The warranty related to the Products is as follows: (i) Goods are warranted against defects
in material or workmanship for a period of twelve (12) months from the date of delivery or 2,000 hours of
use, whichever occurs first; (ii) Services shall be performed in accordance with generally accepted practices
and using the degree of care and skill that is ordinarily exercised and customary in the field to which the
Services pertain and are warranted for a period of six (6) months from the completion of the Services by
Seller; and (iii) Software is only warranted to perform in accordance with applicable specifications provided
by Seller to Buyer for ninety (90) days from the date of delivery or, when downloaded by a Buyer or end-
user, from the date of the initial download. All prices are based upon the exclusive limited warranty stated
above, and upon the following disclaimer:
DISCLAIMER OF WARRANTY: THIS WARRANTY IS THE SOLE AND ENTIRE WARRANTY PERTAINING
TO PRODUCTS. SELLER DISCLAIMS ALL OTHER WARRANTIES, EXPRESS AND IMPLIED, INCLUDING
DESIGN, NONINFRINGEMENT, MERCHANTABILITY, AND FITNESS FOR A PARTICULAR PURPOSE.
SELLER DOES NOT WARRANT THAT THE SOFTWARE IS ERROR-FREE OR FAULT-TOLERANT, OR THAT
BUYER’S USE THEREOF WILL BE SECURE OR UNINTERRUPTED. BUYER AGREES AND ACKNOWLEDGES
THAT UNLESS OTHERWISE AUTHORIZED IN WRITING BY SELLER THE SOFTWARE SHALL NOT BE
USED IN CONNECTION WITH HAZARDOUS OR HIGH RISK ACTIVITIES OR ENVIRONMENTS. EXCEPT
AS EXPRESSLY STATED HEREIN, ALL PRODUCTS ARE PROVIDED “AS IS”.
6. Claims; Commencement of Actions. Buyer shall promptly inspect all Products upon receipt. No claims
for shortages will be allowed unless reported to the Seller within ten (10) days of delivery. Buyer shall notify
Seller of any alleged breach of warranty within thirty (30) days after the date the non-conformance is or
should have been discovered by Buyer. Any claim or action against Seller based upon breach of contract
or any other theory, including tort, negligence, or otherwise must be commenced within twelve (12)
months from the date of the alleged breach or other alleged event, without regard to the date of discovery.
7. LIMITATION OF LIABILITY. IN THE EVENT OF A BREACH OF WARRANTY, SELLER WILL, AT ITS
OPTION, REPAIR OR REPLACE THE NON-CONFORMING PRODUCT, RE-PERFORM THE SERVICES, OR
REFUND THE PURCHASE PRICE PAID WITHIN A REASONABLE PERIOD OF TIME. IN NO EVENT IS SELLER
LIABLE FOR ANY SPECIAL, INDIRECT, INCIDENTAL OR CONSEQUENTIAL DAMAGES ARISING OUT OF,
OR AS THE RESULT OF, THE SALE, DELIVERY, NON-DELIVERY, SERVICING, NON-COMPLETION OF
SERVICES, USE, LOSS OF USE OF, OR INABILITY TO USE THE PRODUCTS OR ANY PART THEREOF,
LOSS OF DATA, IDENTITY, PRIVACY, OR CONFIDENTIALITY, OR FOR ANY CHARGES OR EXPENSES OF
ANY NATURE INCURRED WITHOUT SELLER'S WRITTEN CONSENT, WHETHER BASED IN CONTRACT,
TORT OR OTHER LEGAL THEORY. IN NO EVENT SHALL SELLER'S LIABILITY UNDER ANY CLAIM MADE
BY BUYER EXCEED THE PURCHASE PRICE PAID FOR THE PRODUCTS.
8. Loss to Buyer's Property. Any designs, tools, patterns, materials, drawings, confidential information or
equipment furnished by Buyer or any other items which are or become Buyer's property, will be considered
obsolete and may be destroyed by Seller after two (2) consecutive years have elapsed without Buyer ordering
the Products manufactured using such property. Seller shall not be responsible for any loss or damage to
such property while it is in Seller's possession or control.
9. Special Tooling. Special Tooling includes but is not limited to tooling, jigs, fixtures and associated
manufacturing equipment acquired or necessary to manufacture Products. A tooling charge may be imposed
for any Special Tooling. Such Special Tooling shall be and remain Seller's property notwithstanding payment
of any charges by Buyer. In no event will Buyer acquire any interest in Special Tooling belonging to Seller
that is utilized in the manufacture of the Products, even if such Special Tooling has been specially converted
or adapted for such manufacture and notwithstanding any charges paid by Buyer. Unless otherwise agreed,
Seller has the right to alter, discard or otherwise dispose of any Special Tooling or other property in its
sole discretion at any time.
10. Security Interest. To secure payment of all sums due, Seller retains a security interest in all Products
delivered to Buyer and, Buyer’s acceptance of these Terms is deemed to be a Security Agreement under
the Uniform Commercial Code. Buyer authorizes Seller as its attorney to execute and file on Buyer's behalf
all documents Seller deems necessary to perfect its security interest.
11. User Responsibility. The Buyer through its own analysis and testing, is solely responsible for making
the final selection of the Products and assuring that all performance, endurance, maintenance, safety and
warning requirements of the application of the Products are met. The Buyer must analyze all aspects of
the application and follow applicable industry standards, specifications, and other technical information
provided with the Product. If Seller provides Product options based upon data or specifications provided
by the Buyer, the Buyer is responsible for determining that such data and specifications are suitable and
sufficient for all applications and reasonably foreseeable uses of the Products. In the event the Buyer is
not the end-user, Buyer will ensure such end-user complies with this paragraph.
12. Use of Products, Indemnity by Buyer. Buyer shall comply with all instructions, guides and specifications
provided by Seller with the Products. Unauthorized Uses. If Buyer uses or resells the Products for any uses
prohibited in Seller’s instructions, guides or specifications, or Buyer otherwise fails to comply with Seller’s
instructions, guides and specifications, Buyer acknowledges that any such use, resale, or non-compliance
is at Buyer's sole risk. Buyer shall indemnify, defend, and hold Seller harmless from any losses, claims,
liabilities, damages, lawsuits, judgments and costs (including attorney fees and defense costs), whether
for personal injury, property damage, intellectual property infringement or any other claim, brought by
or incurred by Buyer, Buyer’s employees, or any other person, arising out of: (a) improper selection,
application, design, specification or other misuse of Products provided by Seller; (b) any act or omission,
negligent or otherwise, of Buyer; (c) Seller’s use of patterns, tooling, equipment, plans, drawings, designs
or specifications or other information or things furnished by Buyer; (d) damage to the Products from an
external cause, repair or attempted repair by anyone other than Seller, failure to follow instructions, guides
and specifications provided by Seller, use with goods not provided by Seller, or opening, modifying,
deconstructing or tampering with the Products for any reason; or (e) Buyer’s failure to comply with these
Terms. Seller shall not indemnify Buyer under any circumstance except as otherwise provided in these Terms.
13. Cancellations and Changes. Buyer may not cancel or modify any order for any reason, except with
Seller's written consent and upon terms that will indemnify, defend and hold Seller harmless against all
direct, incidental and consequential loss or damage. Seller, at any time, may change Product features,
specifications, designs and availability.
14. Limitation on Assignment. Buyer may not assign its rights or obligations without the prior written
consent of Seller.
15. Force Majeure. Seller does not assume the risk and is not liable for delay or failure to perform any of
Seller’s obligations by reason of events or circumstances beyond its reasonable control (“Events of Force
Majeure”). Events of Force Majeure shall include without limitation: accidents, strikes or labor disputes,
acts of any government or government agency, acts of nature, delays or failures in delivery from carriers
or suppliers, shortages of materials, or any other cause beyond Seller’s reasonable control.
16. Waiver and Severability. Failure to enforce any provision of these Terms will not invalidate that
provision; nor will any such failure prejudice Seller’s right to enforce that provision in the future. Invalidation
of any provision of these Terms by legislation or other rule of law shall not invalidate any other provision
herein and, the remaining provisions will remain in full force and effect.
17. Termination. Seller may terminate any agreement governed by or arising from these Terms for any
reason and at any time by giving Buyer thirty (30) days prior written notice. Seller may immediately terminate,
in writing, if Buyer: (a) breaches any provision of these Terms (b) appoints a trustee, receiver or custodian
for all or any part of Buyer’s property (c) files a petition for relief in bankruptcy on its own behalf, or one if
filed by a third party (d) makes an assignment for the benefit of creditors; or (e) dissolves its business or
liquidates all or a majority of its assets.
18. Ownership of Software. Seller retains ownership of all Software supplied to Buyer hereunder. In no
event shall Buyer obtain any greater right in and to the Software than a right in the nature of a license limited
to the use thereof and subject to compliance with any other terms provided with the Software.
19. Indemnity for Infringement of Intellectual Property Rights. Seller is not liable for infringement of any
patents, trademarks, copyrights, trade dress, trade secrets or similar rights (“Intellectual Property Rights”)
except as provided in this Section. Seller will defend at its expense and will pay the cost of any settlement or
damages awarded in an action brought against Buyer based on a third party claim that one or more of the
Products sold hereunder infringes the Intellectual Property Rights of a third party in the country of delivery
of the Products by the Seller to the Buyer. Seller's obligation to defend and indemnify Buyer is contingent
on Buyer notifying Seller within ten (10) days after Buyer becomes aware of any such claim, and Seller
having sole control over the defense of the claim including all negotiations for settlement or compromise.
If one or more Products sold hereunder is subject to such a claim, Seller may, at its sole expense and
option, procure for Buyer the right to continue using the Products, replace or modify the Products so as to
render them non-infringing, or offer to accept return of the Products and refund the purchase price less a
reasonable allowance for depreciation. Seller has no obligation or liability for any claim of infringement: (i)
arising from information provided by Buyer; or (ii) directed to any Products provided hereunder for which
the designs are specified in whole or part by Buyer; or (iii) resulting from the modification, combination or
use in a system of any Products provided hereunder. The foregoing provisions of this Section constitute
Seller's sole and exclusive liability and Buyer's sole and exclusive remedy for such claims of infringement
of Intellectual Property Rights.
20. Governing Law. These Terms and the sale and delivery of all Products are deemed to have taken place
in, and shall be governed and construed in accordance with, the laws of the State of Ohio, as applicable
to contracts executed and wholly performed therein and without regard to conflicts of laws principles.
Buyer irrevocably agrees and consents to the exclusive jurisdiction and venue of the courts of Cuyahoga
County, Ohio with respect to any dispute, controversy or claim arising out of or relating to the sale and
delivery of the Products.
21. Entire Agreement. These Terms, along with the terms set forth in the main body of any Quote, forms the
entire agreement between the Buyer and Seller and constitutes the final, complete and exclusive expression
of the terms of sale. In the event of a conflict between any term set forth in the main body of a Quote and
these Terms, the terms set forth in the main body of the Quote shall prevail. All prior or contemporaneous
written or oral agreements or negotiations with respect to the subject matter shall have no effect. These
Terms may not be modified unless in writing and signed by an authorized representative of Seller.
22. Compliance with Laws. Buyer agrees to comply with all applicable laws, regulations, and industry
and professional standards, including those of the United States of America, and the country or countries
in which Buyer may operate, including without limitation the U.S. Foreign Corrupt Practices Act (“FCPA”),
the U.S. Anti-Kickback Act (“Anti-Kickback Act”), U.S. and E.U. export control and sanctions laws (“Export
Laws”), the U.S. Food Drug and Cosmetic Act (“FDCA”), and the rules and regulations promulgated by the
U.S. Food and Drug Administration (“FDA”), each as currently amended. Buyer agrees to indemnify, defend,
and hold harmless Seller from the consequences of any violation of such laws, regulations and standards
by Buyer, its employees or agents. Buyer acknowledges that it is familiar with all applicable provisions of
the FCPA, the Anti-Kickback Act, Export Laws, the FDCA and the FDA and certifies that Buyer will adhere to
the requirements thereof and not take any action that would make Seller violate such requirements. Buyer
represents and agrees that Buyer will not make any payment or give anything of value, directly or indirectly,
to any governmental official, foreign political party or official thereof, candidate for foreign political office, or
commercial entity or person, for any improper purpose, including the purpose of influencing such person
to purchase Products or otherwise benefit the business of Seller. Buyer further represents and agrees that
it will not receive, use, service, transfer or ship any Product from Seller in a manner or for a purpose that
violates Export Laws or would cause Seller to be in violation of Export Laws.
5/2017
mlchomerics
59
Phone +1 781-935-4850 www.parker.com/chomerics
Customer Responsibility
and Offer of Sale Statement
These products can expose you to chemicals including carbon black (airborne and extracts), antimony trioxide, titanium dioxide, silica (crystalline), di(2-ethylhexyl)phthalate, ethylene
thiourea, acrylonitrile, 1,3-butadiene, epichlorohydrin, toluenediisocyanate, tetrafluoroethylene, ethylbenzene, formaldehyde, furfuryl alcohol, glass fibers, methyl isobutyl ketone,
nickel (metallic and compounds), lead and lead compounds which are known to the State of California to cause cancer; and 1,3-butadiene, epichlorohydrin, di(2-ethylhexyl)phthalate,
di-isodecyl phthalate, ethylene thiourea, methyl isobutyl ketone, methanol, toluene, lead and lead compounds which are known to the State of Califormia to cause birth defects and
other reproductive harm. For more information go to www.P65Warnings.ca.gov.
WARNING:
CUSTOMER RESPONSIBILITY
OFFER OF SALE
The items described in this document are hereby offered for sale by Parker Hannifin Corporation, its subsidiaries
or its authorized distributors. This offer and its acceptance are governed by the provisions stated in the detailed
“Offer of Sale” elsewhere in this document or available at www.parker.com.
WARNING – USER RESPONSIBILITY
FAILURE OR IMPROPER SELECTION OR IMPROPER USE OF THE PRODUCTS DESCRIBED
HEREIN OR RELATED ITEMS CAN CAUSE DEATH, PERSONAL INJURY AND PROPERTY DAMAGE.
!
This document and other information
from Parker Hannifin Corporation, its
subsidiaries and authorized distributors
provide product or system options for
further investigation by users having
technical expertise.
The user, through its own analysis and
testing, is solely responsible for making
the final selection of the system and
components and assuring that all
performance, endurance, maintenance,
safety and warning requirements of
the application are met. The user must
analyze all aspects of the application,
follow applicable industry standards,
and follow the information concerning
the product in the current product
catalog and in any other materials
provided from Parker or its subsidiaries
or authorized distributors.
To the extent that Parker or its
subsidiaries or authorized distributors
provide component or system options
based upon data or specifications
provided by the user, the user is
responsible for determining that such
data and specifications are suitable
and sufficient for all applications and
reasonably foreseeable uses of the
components or systems.
minnow
CHOMERICS, CHO-FORM, CHO-THERM, THERMATTACH, THERMFLOW, and T-WING are registered trademarks of
Parker Hannifin Corporation. THERM-A-FORM and THERM-A-GAP are trademarks of Parker Hannifin Corporation.
Other trademarks are the property of their respective owners.
© 2020 Parker Hannifin Corporation. All rights reserved.
www.parker.com/chomerics
PARKER CHOMERICS WORLDWIDE
Corporate Facilities
To place an order please contact a customer service representative at the following locations:
North America
Global Division Headquarters
77 Dragon Court
Woburn, MA
Phone +1 781-935-4850
Fax +781-933-4318
chomailbox@parker.com
Product Disclosure
(ROHS/REACH, Material
Declarations, SDS)
choproductdisclosure@parker.com
Europe
Parker Hannifin Ltd
Chomerics Division Europe
Unit 6, Century Point
Halifax Road
High Wycombe
Bucks HP12 3SL
UK
Phone +44 1494 455400
Fax +44 14944 55466
chomerics_europe@parker.com
Asia Pacific
Parker Hannifin
Chomerics Shanghai
280 Yunqiao Road, Jin Qiao Export
Processing Zone, Shanghai 201206,
China
Phone +86 21 2899 5000
Fax +86 21 2899 5146
chomerics_ap@parker.com
Parker Hannifin
Chomerics Shenzhen
No.5 Bldg Jinrongda Technological Park
Gangtou Village, Bantian Longgang
District Shenzhen, 518122
China
Phone +86 755 8974 8558
Fax +86 755 8974 8560
chomerics_ap@parker.com
Parker Hannifin
Chomerics Kuala Lumpur
Lot 15, Jalan Gudang 16/9
Section 16, Shah Alam
Industrial Estate, 40200 Shah Alam
Selangor, Malaysia
Phone +603 5510 9188
Fax +603 5512 6988
chomerics_ap@parker.com
Penang, Malaysia
No.3, Puncak Perusahaan 1, 13600
Prai, Penang, Malaysia
Phone +604 398329
Fax +604 3983299
chomerics_ap@parker.com
Parker Hannifin India
Private Limited
Chomerics Division
Plot No. 41/2, 8th Avenue DTA,
Anjur Village, Mahindra World City,
Chengalpattu, Tamilnadu - 603 004,
India
Phone +91 44 67132333
Phone +91 44 67132045
chomerics_ap@parker.com
Manufacturing Facilities
Woburn, MA; Hudson, NH; Cranford, NJ; Fairport, NY; Monterrey, Mexico; Grantham, UK; High Wycombe, UK; Saint Ouen L’Aumone, France;
Sadska, Czech Republic; Shanghai, PRC; Shenzhen, PRC; Penang, Malaysia; Kuala Lumpur, Malaysia; Chennai, India.
THERM CAT 1002 EN July 2020

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