Anaren M191 ’ DESCRIPTION ELECTRICAL SFECIFICATIONS‘ Mechanical Outline ‘ A00: me ,0661 m [10162025] [1.66.034] DNC DNC PIN 1 ORIENTATION MARK DENOTES PIN 1 DENOTES P'“ 2 ARRAY NUMBER Dimensionsare m Inches [Millimelers] muse-020$ Mechamcal Ouuine 200mm [5.084125] DNC 2x 034: mm [o as,“ m] we 2x .02410m [0.5141 10] * 2x .020qu [0.5mm] P IN 1 2X 024- mu [ 51mm] 2X .0341um SQ FIN 2 4—1 <7 [ofifimm]="" tolerances="" are="" nun-cumulauve="" maren'="" whl’ll="" i:="" [link="" if="" lzxfl"="">
Available on Tape
and Reel For Pick and
Place Manufacturing.
USA/Canada:
Toll Free:
Europe:
(315) 432-8909
(800) 544-2414
+44 2392-232392
Model XDL15-2-020S
Rev H
Delay Line
DESCRIPTION
The XDL15-2-020S can be used in amplifier linearization applications from
112 2700Mhz. Small form factor of XDL15-2-020S is ideal for cascading
to obtain longer delay. The Xinger® delay lines are a low cost, high quality
alternative to the traditional coaxial and filter solutions presently available.
Parts have been subjected to rigorous qualification testing and units are
100% tested. Produced with 6 of 6 RoHS compliant tin immersion finish.
ELECTRICAL SPECIFICATIONS*
Features:
Production Friendly
Consistent Delay
Stable Over Temperature
Surface Mountable
Available in Tape & Reel
Non-Lead Solder Paste
Compatible
Lead Free
100% Tested
MSL1
Frequency
(MHz)
Return
Loss
(dB)
(min)
Insertion
Loss
(dB/ns)
(max)
Group
Delay
(nS)
Amplitude
Flatness
(dB max
per 50Mhz )
Operating
Temp.
ºC
Power
Handling
Watts
112 -168 -20 -0.26 1.93 ± 0.08 0.10 -55 to +85
1
300 -2000 -17 -0.90 2.01 ± 0.17 0.10 -55 to +85
1
2000-2700 -14 -1.10
2.20 ± 0.20
0.10 -55 to +85
1
* Specification based on performance of unit properly installed on Anaren Test Board 66111-0001.
* Specifications subject to change without notice. Refer to parameter definitions for details.
Mechanical Outline
Ilal'll I2 Iii-k If IQXIT“ An 0 not co 0 not co TYPICAL PERFORMANCE: 100 MHI to 3000 MHI PIN CONFIGURATION CASCADING XDL15-2-0208
USA/Canada:
Toll Free:
Europe:
(315) 432-8909
(800) 544-2414
+44 2392-232392
Available on Tape and
Reel For Pick and Place
Manufacturing.
Model XDL15-2-020S
Rev H
PIN CONFIGURATION
Pin 1 Pin 2 Pin 3 Pin 4
Input Output DNC- Do not connect,
Do not ground
DNC- Do not connect,
Do not ground
Output Input DNC- Do not connect,
Do not ground
DNC- Do not connect,
Do not ground
TYPICAL PERFORMANCE: 100 MHz to 3000 MHz
100 400 700 1000 1300 1600 1900 2200 2500 2800
-50
-40
-30
-20
-10
0
Frequency (MHz)
Return Loss 2(dB)
Return Loss 2 XDL15-2-020S (OVERTEMP)
-55ºC
25ºC
95ºC
100 400 700 1000 1300 1600 1900 2200 2500 2800
-1.5
-1
-0.5
0
Frequency (MHz)
Insertion loss per ns (dB/ns)
Insertion Loss per ns XDL15-2-020S (OVERTEMP)
-55ºC
25ºC
95ºC
100 400 700 1000 1300 1600 1900 2200 2500 2800
-50
-40
-30
-20
-10
0
Frequency (MHz)
Return Loss 1(dB)
Return Loss 1 XDL15-2-020S (OVERTEMP)
-55ºC
25ºC
95ºC
100 400 700 1000 1300 1600 1900 2200 2500 2800
1
1.5
2
2.5
3
Frequency (MHz)
Group Delay(ns)
Group DealyXDL15-2-020S (OVERTEMP)
-55ºC
25ºC
95ºC
CASCADING XDL15-2-020S
If more than 2ns delay is needed, cascading XDL15-2-020S can provide group delay of 4ns, 6ns and 8ns. Please
refer to the app-note for the recommend mounting footprint for cascading the delay. Gap of 2mm between the
cascaded parts is needed with solder mask in between.
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Available on Tape
and Reel For Pick and
Place Manufacturing.
USA/Canada:
Toll Free:
Europe:
(315) 432-8909
(800) 544-2414
+44 2392-232392
Model XDL15-2-020S
Rev H
PIN 1 PIN 2
NC NC
2X .040
[1.01] 2X 50O
TRANSMISSION
LINE
.116
[2.95]
2X .046
[1.18]
.116
[2.95]
2X .046
[1.18]
2X .034
[0.86]
4X .032
[0.81]
.307
[7.80]
PIN 1
NC
PIN 2
NC
2X .040
[1.01]
2X .046
[1.18]
2X 50O
TRANSMISSION
LINE
CC
2X .046
[1.18]
XDL15-X-0X0S
4X .032
[0.81]
.116
[2.95]
.307
[7.80]
RR
.116
[2.95]
2X .034
[0.86]
Mounting
In order for Xinger surface mount delay lines to work
optimally, there must be 50 transmission lines leading
to and from all of the RF ports. Also, there must be a
very good ground plane under the part with a number of
plated thru holes to ensure proper electrical performance.
If any of these conditions are not satisfied, insertion loss,
average delay and VSWR may not meet published
specifications.
When a surface mount delay line is mounted to a printed
circuit board (PCB), the primary concerns are; insuring
the RF pads of the device are in contact with the circuit
trace of the PCB and the ground plane of neither the
component nor the PCB are in contact with the RF signal.
An example of how the PCB footprint could look is shown
below. In particular designs, the 50 lines need to be
adjusted to the unique dielectric coefficients and
thicknesses as well as varying pick and place equipment
tolerances.
Mounting Footprint
Dimensions are in Inches
[
Millimeters
]
Pin 3 & 4 are internally connected and should not be connected or
grounded
Coupler Mounting Process
The process for assembling this component is a
conventional surface mount process as shown in Figure
1. This process is conducive to both low and high volume
usage.
Figure 1: Surface Mounting Process Steps
Storage of Components: The Xinger products are
available in immersion tin finish. Commonly used storage
procedures used to control oxidation should be followed
for these surface mount components. The storage
temperatures should be held between 15OC and 60OC.
Substrate: Depending upon the particular component,
the circuit material has an x and y coefficient of thermal
expansion of between 17 and 25 ppm/°C. This coefficient
minimizes solder joint stresses due to similar expansion
rates of most commonly used board substrates such as
RF35, RO4003, FR4, polyimide and G-10 materials.
Mounting to “hard” substrates (alumina etc.) is possible
depending upon operational temperature requirements.
The solder surfaces of the coupler are all copper plated
with either an immersion tin or tin-lead exterior finish.
Solder Paste: All conventional solder paste formulations
will work well with Anaren’s Xinger surface mount
components. Solder paste can be applied with stencils or
syringe dispensers. An example of a stenciled solder
paste deposit is shown in Figure 2. As shown in the
figure solder paste is applied to the four RF pads and the
entire ground plane underneath the body of the part.
Reflow: The surface mount coupler is conducive to most
of today’s conventional reflow methods. A low and high
temperature thermal reflow profile are shown in Figures 5
and 6, respectively. Manual soldering of these
components can be done with conventional surface
mount non-contact hot air soldering tools. Board pre-
heating is highly recommended for these selective hot air
soldering methods. Manual soldering with conventional
irons should be avoided.
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USA/Canada:
Toll Free:
Europe:
(315) 432-8909
(800) 544-2414
+44 2392-232392
Available on Tape and
Reel For Pick and Place
Manufacturing.
Model XDL15-2-020S
Rev H
Figure 5 – Low Temperature Solder Reflow Thermal Profile
Figure 6 – High Temperature Solder Reflow Thermal Profile
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Available on Tape
and Reel For Pick and
Place Manufacturing.
USA/Canada:
Toll Free:
Europe:
(315) 432-8909
(800) 544-2414
+44 2392-232392
Model XDL15-2-020S
Rev H
Qualification Flow Chart
Visual Inspection
n=45
Mechanical Inspection
n=40
Solderability Test
n=5
Initial RF Test
n=40
Solder Units to Test Board
n=20
Post Solder Visual Inspection
n
=
20
Initial RF Test Board Mounted
Over Temp
n=20
Visual Inspection
n=40
V-Tek Operation
n=45
Thermal Shock
n=40
Post Shock RF Test
n=40
Moisture Resistance
n=40
Reflow /Resistance to
Solder Heat
n=20 (loose)
Bake Units
n=40
Micro section
n = 2
Visual Inspection
n=40
Life Test
n=3
Final RF Test
n=3
RF Test
n = 20 (loose), n = 20
(mounted over temp)
Voltage Breakdown
n=10
Visual Inspection
n=10
RF Test
n=10
Micro section
n = 1 loose control, n = 1
mounted control, n = 3
board mounted, n = 3
loose
Visual Inspection
n=45
Packaging and ordering lnformatio Carrier Tage Reel \_ Y1 \‘ L‘,[‘ T-BLE ' LVEEL HUD LU H ' LHH' F F ,r H, 1 ‘ . _‘ Anaen' Ilal'll I2 III-k If mm-
USA/Canada:
Toll Free:
Europe:
(315) 432-8909
(800) 544-2414
+44 2392-232392
Available on Tape and
Reel For Pick and Place
Manufacturing.
Model XDL15-2-020S
Rev H
Packaging and ordering Information
Parts are available in a reel and as loose parts in a bag. Packaging follows EIA 481-2 for reels. Parts are oriented in
tape and reel as shown below. Minimum order quantities are 2000 per reel. See Model Numbers below for further
ordering information.
Carrier Tape
Direction of
Part Feed
(Unloading)
.079
[2.00]
.315
[8.00]
.067
[1.70]
.453
[11.50]
.945
[24.00]
Ø.059
[Ø1.50]
.157
[4.00]
.228
[5.80]
.433
[11.00]
A
SECTION A-A
.012
[0.30]
.094
[2.40] A
Dimensions are in Inches [Millimeters]
Reel