T-WING® Heat Spreaders Datasheet by Parker Chomerics

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T-WING® HEAT SPREADERS
Thin Heat Spreaders
Parker Chomerics’ family of thin heat spreaders provides a
low-cost, effective means of cooling IC devices in restricted
spaces where conventional heat sinks are inappropriate.
TYPICAL APPLICATIONS
Microprocessors
Memory modules
Laptop PCs and other high
density, handheld portable
electronics
High speed disk drives
DESIGN DETAILS
Low profile (0.33 mm/0.013 in)
allows use in limited space
environments
Easy peel and stick adhesion to all
surfaces, including packages with
residual silicone mold release
Offers low cost cooling for many
package types
Low application force
(<5 psi/ 0.03 MPa) minimizes risk of
damage to component
Available in a range of standard sizes
Pliable nature allows conformance
to concave or otherwise non-flat
surfaces for optimal thermal and
mechanical performance
Light weight (0.039 oz/in2)
Standard parts are scored for easy
forming and alignment
Easy removal for device
replacement
Available die-cut on continuous rolls
TESTING SUMMARY
Summaries of test procedures used for
T-WING heat spreaders are described
below. Thermal performance, adhesion
strength and visual inspection were
used as pass/fail criteria.
Apparatus
Anatek® Thermal Analyzer: The ATA
was used to measure Rj-a before and
after environmental stressing. PQFP:
196 lead, plastic PQFPs known to
contain silicone mold release were
evaluated. T-WING Heat Spreader:
1 in x 4 in T-WING parts were applied
to the PQFP packages with a 5 psi
(0.03 MPa) mounting pressure.
FEATURES/BENEFITS
Component junction
temperature reduction of
10 to 20°C is common
Easily added to existing
designs to lower component
temperatures and improve
reliability
Custom shapes available for
complex designs
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THERMAL PERFORMANCE
Various sizes of T-WING heat
spreaders were applied to a 196 lead
PQFP using less than 5 psi (0.03 MPa)
bonding pressure. Within 30 minutes
of application, the test boards were
mounted in an Analysis Tech® thermal
analyzer. The devices were heated
to equilibrium (45 to 60 minutes) with
approximately 3 watt load on 3 x 3 in
(7.6 x 7.6 cm) test boards.
Two test environments were used:
restricted convention, achieved with
a 1 x 5 x 6 in (2.5 x 12.7 x 15.2 cm)
plexiglass box; and 100 LFM (30 m/
min) air flow. Results were obtained
using thermocouples for Tc (centered
on case) and Rj-a.
Environmental Stressing
Control: Specimens were maintained
for 1000 hours at standard laboratory
conditions, 23°C, 35-60% RH.
Heat Aging: Test specimens were
placed in a forced convection hot air
oven maintained at 150°C ±5°C for
1000 hours. Test specimens were then
removed and tested.
Elevated Temperature/
High Humidity:
Specimens were placed in a humidity
chamber maintained at 85°C ± 2°C
and 90%-0 +10% RH for 1000 hours.
Temperature Cycling: Specimens
were subjected to 500 cycles
from -50°C to +150°C in a Tenney
Temperature Cycling Oven.
Temperature Shock: Specimens were
subjected to 100 temperature shocks
by immersion into -50° and +150°C
liquids. Temperatures were monitored
with thermocouples.
Evaluation Procedure
Visual: All test specimens were
examined for de-bonding, delamination
or other signs that the tape was failing
after environmental stress.
Thermal Performance: T-WING
was applied to the PQFP with 5 psi
mounting pressure. After a one hour
dwell, the Rj-a of each specimen was
measured at 100 LFM and under
restricted convection conditions.
The Rj-a was again measured after
environmental stressing.
90° Peel Strength: A T-WING heat
spreader was applied to each
PQFP with 5 psi mounting pressure.
The specimens were subjected
to environmental stress and then
tested for 90° peel strength at
room temperature.
Results
Visual: There was no visual evidence
of T-WING adhesion failure to the PQFP
after the environmental stresses.
Thermal Performance: The before
and after thermal resistances are given
in Table 4. The data shows that the
thermal resistances were essentially
unchanged by the exposures.
90° Peel Strength: The results of the
peel strength tests are given above.
The data shows that the average peel
strength actually increases with high
temperature/humidity and temperature
shock, while remaining unchanged
with heat aging and decreasing slightly
with temperature cycling.
APPLICATION INSTRUCTIONS
Materials needed: Clean cotton cloth
or rag, industrial solvent, rubber gloves.
Step 1: For best results, clean the top
surface of the component using a
lint-free cotton cloth.
Step 2: Wipe the bonding surface
of the component with an industrial
solvent, such as MEK, acetone or
isopropyl alcohol. In the case of a
plastic package, select a cleaner
that will not chemically attack the
plastic substrate. Do not touch the
cleaned surface during any part of the
assembly process. If the surface has
been contaminated, repeat Steps 1
and 2.
Step 3: Remove the clear release liner
from the T-WING part, exposing the
pressure-sensitive adhesive (PSA).
Avoid touching exposed adhesive
with fingers.
Step 4: For best bond strength and
contact area, center the exposed
PSA onto the component. Press and
smooth the entire T-WING bonding
area with firm finger pressure of about
5 psi, for 5 seconds.
Note: Bond strength will increase as
a function of time as the adhesive
continues to wet out the bonding
surface. Increasing any of the
application variables (pressure,
temperature and time) can improve
bonding results.
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Typical Thermal Properties
(Performed on surface of 196 lead 3 Watt PQFP package) Standard Part Size in (mm)
Environment* Properties
Without
T-WING
0.5 x 2
(12.7 x 50.8)
0.5 x 3
(12.7 x 76.2)
0.75 x 3
(19.1 x 76.2)
1 x 3
(25.4 x 76.2)
1 x 4
(25.4 x 101.6)
1.5 x 4
(38.1 x
101.6)
Restricted
Convection**
Thermal Resistance
Rj-a, °C/W 26 25 23 23 22 20 19
Case
Temperature, °C 92 82 78 76 72 70 68
100 LFM***
Thermal Resistance
Rj-a, °C/W 18 16 14 14 14 13 12
Case
Temperature, °C 68 57 52 49 46 44 44
* Measured values do not account for heat losses through bottom of case and leads. Ambient temperature range from 21oC to 24oC.
** Restricted convection in a simulated notebook computer environment - a 1 x 5 x 6 in (2.54 x 12.7 x 15.2 cm) plexiglass box.
*** T-WING long axis perpendicular to air flow direction in wind tunnel.
Notes
Rj-a = thermal resistance from junction to ambient
LFM = airflow rate (linear feet per minute)
T-WING® Heat Spreaders
Typical Properties Test Method
Physical
Color Black Visual
Total Thicknesses, in (mm) 0.013 (0.33) ASTM D374
PSA Type Silicone based --
PSA Thickness, in (mm) 0.002 (0.05) Visual
Insulator Type Black polyester --
Insulator Layer Thickness, in (mm) 0.001 (0.025) --
Weight, oz/in20.039 --
Thermal Conductor Copper --
Maximum Operating Temperature, °F (°C) 257 (125) --
Thermal Conductor Thickness, in (mm) 0.007 (0.178) --
Electrical
Dielectric Strength, Vac/mil (kVac/mm) 5,000 (200) for each
dielectric layer ASTM D149
Volume Resistivity, ohm-cm N/A ASTM D149
Dielectric Constant @ 1,000 MHz N/A ASTM D150
Dissipation Factor @ 1,000 kHz N/A Chomerics
Regulatory
Flammability Rating (See UL File E140244) V-0 UL 94
RoHS Compliant Yes Chomerics
Certification
Shelf Life, months from date of manufacture 12 Chomerics
Typical Properties
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Environment 90° Peel Strength
oz/in gm/cm
Control 36 393
Heat Aging 36 393
High Temperature/Humidity 46 514
Temperature Shock 38 424
Temperature Cycling 30 335
Environment Before After
Heat Aging
Rj-a, °C/W Restricted Convection 20.3 20.6
Rj-a, °C/W 100 LFM 12.7 13.1
High Temperature/Humidity
Rj-a, °C/W Restricted Convection 21.4 21.4
Rj-a, °C/W 100 LFM 14.1 14
Temperature Cycling
Rj-a, °C/W Restricted Convection 21.4 21.7
Rj-a, °C/W 100 LFM 14.1 13.9
Test Procedure Result Test Method
Lap Shear - Room Temperature apply/60 min. R.T. dwell/R.T. pull 960 oz/in2 (414 kPa) ASTM D1000
Lap Shear - Elevated Temperature apply/60 min. R.T. dwell/100°C pull 53 oz/in2 (23 kPa) ASTM D1000
90° Peel - Room Temperature apply/1 min. R.T. dwell/R.T. pull 40 oz/in (441 g/cm) ASTM B571/D2861
90° Peel - Elevated Temperature apply/60 min. R.T. dwell/100°C pull 20 oz/in (220 g/cm) ASTM B571/D2861
Creep Adhesion, days 275°F (135°C), 7 oz/in2 (3 kPa), on aluminum >80 days, no failure P.S.T.C. No. 7
Note: Tested with a 1” x 4” (25.4 x 101.6 mm) T-WING.
Note: Average of three samples tested per ASTM B571/D2861.
Typical Adhesion Performance
Environmental Stress Thermal Performance Environmental Stress Adhesive Performance
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Part Numbers
Size (inches/mm)
A: Length, inches (mm) B: Width, inches (mm) C: Adhesive Width, inches (mm)
60-12-20264-TW10 2.0 (50.8) 0.50 (12.7) 0.50 (12.7)
60-12-20265-TW10 3.0 (76.2) 0.50 (12.7) 0.50 (12.7)
60-12-20266-TW10 3.0 (76.2) 0.75 (19.1) 0.75 (19.1)
60-12-20267-TW10 3.0 (76.2) 1.00 (25.4) 1.00 (25.4)
60-12-20268-TW10 4.0 (101.6) 1.00 (25.4) 1.00 (25.4)
60-12-20269-TW10 4.0 (101.6) 1.50 (38.1) 1.50 (38.1)
Ordering Information
T-WING® Heat Spreaders
Standard Parts: Refer to table below for part numbers and sizes. T-WING
heat spreaders are available in standard packages of 100 parts/pkg.
Custom Parts: Custom configured T-WING parts are also available. Contact
Parker Chomerics’ Applications Engineering Department for details.
Available in standard sizes 1,000 parts per plastic tray. Also available die-cut
on continuous rolls.
C
A
B
Folding Scores
0.0015 in. Black PET
0.007 in. RA Copper
0.0015 in. Black PET
Release Liner
0.002 in. Thermattach PSA

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