T-WING® Heat Spreaders Datasheet by Parker Chomerics

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Phone +1 781-935-4850 www.parker.com/chomerics

T-WING® HEAT SPREADERS

Thin Heat Spreaders

Parker Chomerics’ family of thin heat spreaders provides a

low-cost, effective means of cooling IC devices in restricted

spaces where conventional heat sinks are inappropriate.

TYPICAL APPLICATIONS

• Microprocessors

• Memory modules

• Laptop PCs and other high

density, handheld portable

electronics

• High speed disk drives

DESIGN DETAILS

• Low profile (0.33 mm/0.013 in)

allows use in limited space

environments

• Easy peel and stick adhesion to all

surfaces, including packages with

residual silicone mold release

• Offers low cost cooling for many

package types

• Low application force

(<5 psi/ 0.03 MPa) minimizes risk of

damage to component

• Available in a range of standard sizes

• Pliable nature allows conformance

to concave or otherwise non-flat

surfaces for optimal thermal and

mechanical performance

• Light weight (0.039 oz/in2)

• Standard parts are scored for easy

forming and alignment

• Easy removal for device

replacement

• Available die-cut on continuous rolls

TESTING SUMMARY

Summaries of test procedures used for

T-WING heat spreaders are described

below. Thermal performance, adhesion

strength and visual inspection were

used as pass/fail criteria.

Apparatus

Anatek® Thermal Analyzer: The ATA

was used to measure Rj-a before and

after environmental stressing. PQFP:

196 lead, plastic PQFPs known to

contain silicone mold release were

evaluated. T-WING Heat Spreader:

1 in x 4 in T-WING parts were applied

to the PQFP packages with a 5 psi

(0.03 MPa) mounting pressure.

FEATURES/BENEFITS

• Component junction

temperature reduction of

10 to 20°C is common

• Easily added to existing

designs to lower component

temperatures and improve

reliability

• Custom shapes available for

complex designs

m Bhumerics

Phone +1 781-935-4850 www.parker.com/chomerics

THERMAL PERFORMANCE

Various sizes of T-WING heat

spreaders were applied to a 196 lead

PQFP using less than 5 psi (0.03 MPa)

bonding pressure. Within 30 minutes

of application, the test boards were

mounted in an Analysis Tech® thermal

analyzer. The devices were heated

to equilibrium (45 to 60 minutes) with

approximately 3 watt load on 3 x 3 in

(7.6 x 7.6 cm) test boards.

Two test environments were used:

restricted convention, achieved with

a 1 x 5 x 6 in (2.5 x 12.7 x 15.2 cm)

plexiglass box; and 100 LFM (30 m/

min) air flow. Results were obtained

using thermocouples for Tc (centered

on case) and Rj-a.

Environmental Stressing

Control: Specimens were maintained

for 1000 hours at standard laboratory

conditions, 23°C, 35-60% RH.

Heat Aging: Test specimens were

placed in a forced convection hot air

oven maintained at 150°C ±5°C for

1000 hours. Test specimens were then

removed and tested.

Elevated Temperature/

High Humidity:

Specimens were placed in a humidity

chamber maintained at 85°C ± 2°C

and 90%-0 +10% RH for 1000 hours.

Temperature Cycling: Specimens

were subjected to 500 cycles

from -50°C to +150°C in a Tenney

Temperature Cycling Oven.

Temperature Shock: Specimens were

subjected to 100 temperature shocks

by immersion into -50° and +150°C

liquids. Temperatures were monitored

with thermocouples.

Evaluation Procedure

Visual: All test specimens were

examined for de-bonding, delamination

or other signs that the tape was failing

after environmental stress.

Thermal Performance: T-WING

was applied to the PQFP with 5 psi

mounting pressure. After a one hour

dwell, the Rj-a of each specimen was

measured at 100 LFM and under

restricted convection conditions.

The Rj-a was again measured after

environmental stressing.

90° Peel Strength: A T-WING heat

spreader was applied to each

PQFP with 5 psi mounting pressure.

The specimens were subjected

to environmental stress and then

tested for 90° peel strength at

room temperature.

Results

Visual: There was no visual evidence

of T-WING adhesion failure to the PQFP

after the environmental stresses.

Thermal Performance: The before

and after thermal resistances are given

in Table 4. The data shows that the

thermal resistances were essentially

unchanged by the exposures.

90° Peel Strength: The results of the

peel strength tests are given above.

The data shows that the average peel

strength actually increases with high

temperature/humidity and temperature

shock, while remaining unchanged

with heat aging and decreasing slightly

with temperature cycling.

APPLICATION INSTRUCTIONS

Materials needed: Clean cotton cloth

or rag, industrial solvent, rubber gloves.

Step 1: For best results, clean the top

surface of the component using a

lint-free cotton cloth.

Step 2: Wipe the bonding surface

of the component with an industrial

solvent, such as MEK, acetone or

isopropyl alcohol. In the case of a

plastic package, select a cleaner

that will not chemically attack the

plastic substrate. Do not touch the

cleaned surface during any part of the

assembly process. If the surface has

been contaminated, repeat Steps 1

and 2.

Step 3: Remove the clear release liner

from the T-WING part, exposing the

pressure-sensitive adhesive (PSA).

Avoid touching exposed adhesive

with fingers.

Step 4: For best bond strength and

contact area, center the exposed

PSA onto the component. Press and

smooth the entire T-WING bonding

area with firm finger pressure of about

5 psi, for 5 seconds.

Note: Bond strength will increase as

a function of time as the adhesive

continues to wet out the bonding

surface. Increasing any of the

application variables (pressure,

temperature and time) can improve

bonding results.

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Phone +1 781-935-4850 www.parker.com/chomerics

Typical Thermal Properties

(Performed on surface of 196 lead 3 Watt PQFP package) Standard Part Size in (mm)

Environment* Properties

Without

T-WING

0.5 x 2

(12.7 x 50.8)

0.5 x 3

(12.7 x 76.2)

0.75 x 3

(19.1 x 76.2)

1 x 3

(25.4 x 76.2)

1 x 4

(25.4 x 101.6)

1.5 x 4

(38.1 x

101.6)

Restricted

Convection**

Thermal Resistance

Rj-a, °C/W 26 25 23 23 22 20 19

Case

Temperature, °C 92 82 78 76 72 70 68

100 LFM***

Thermal Resistance

Rj-a, °C/W 18 16 14 14 14 13 12

Case

Temperature, °C 68 57 52 49 46 44 44

* Measured values do not account for heat losses through bottom of case and leads. Ambient temperature range from 21oC to 24oC.

** Restricted convection in a simulated notebook computer environment - a 1 x 5 x 6 in (2.54 x 12.7 x 15.2 cm) plexiglass box.

*** T-WING long axis perpendicular to air flow direction in wind tunnel.

Notes

Rj-a = thermal resistance from junction to ambient

LFM = airflow rate (linear feet per minute)

T-WING® Heat Spreaders

Typical Properties Test Method

Physical

Color Black Visual

Total Thicknesses, in (mm) 0.013 (0.33) ASTM D374

PSA Type Silicone based --

PSA Thickness, in (mm) 0.002 (0.05) Visual

Insulator Type Black polyester --

Insulator Layer Thickness, in (mm) 0.001 (0.025) --

Weight, oz/in20.039 --

Thermal Conductor Copper --

Maximum Operating Temperature, °F (°C) 257 (125) --

Thermal Conductor Thickness, in (mm) 0.007 (0.178) --

Electrical

Dielectric Strength, Vac/mil (kVac/mm) 5,000 (200) for each

dielectric layer ASTM D149

Volume Resistivity, ohm-cm N/A ASTM D149

Dielectric Constant @ 1,000 MHz N/A ASTM D150

Dissipation Factor @ 1,000 kHz N/A Chomerics

Regulatory

Flammability Rating (See UL File E140244) V-0 UL 94

RoHS Compliant Yes Chomerics

Certification

Shelf Life, months from date of manufacture 12 Chomerics

Typical Properties

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Environment 90° Peel Strength

oz/in gm/cm

Control 36 393

Heat Aging 36 393

High Temperature/Humidity 46 514

Temperature Shock 38 424

Temperature Cycling 30 335

Environment Before After

Heat Aging

Rj-a, °C/W Restricted Convection 20.3 20.6

Rj-a, °C/W 100 LFM 12.7 13.1

High Temperature/Humidity

Rj-a, °C/W Restricted Convection 21.4 21.4

Rj-a, °C/W 100 LFM 14.1 14

Temperature Cycling

Rj-a, °C/W Restricted Convection 21.4 21.7

Rj-a, °C/W 100 LFM 14.1 13.9

Test Procedure Result Test Method

Lap Shear - Room Temperature apply/60 min. R.T. dwell/R.T. pull 960 oz/in2 (414 kPa) ASTM D1000

Lap Shear - Elevated Temperature apply/60 min. R.T. dwell/100°C pull 53 oz/in2 (23 kPa) ASTM D1000

90° Peel - Room Temperature apply/1 min. R.T. dwell/R.T. pull 40 oz/in (441 g/cm) ASTM B571/D2861

90° Peel - Elevated Temperature apply/60 min. R.T. dwell/100°C pull 20 oz/in (220 g/cm) ASTM B571/D2861

Creep Adhesion, days 275°F (135°C), 7 oz/in2 (3 kPa), on aluminum >80 days, no failure P.S.T.C. No. 7

Note: Tested with a 1” x 4” (25.4 x 101.6 mm) T-WING.

Note: Average of three samples tested per ASTM B571/D2861.

Typical Adhesion Performance

Environmental Stress Thermal Performance Environmental Stress Adhesive Performance

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Part Numbers

Size (inches/mm)

A: Length, inches (mm) B: Width, inches (mm) C: Adhesive Width, inches (mm)

60-12-20264-TW10 2.0 (50.8) 0.50 (12.7) 0.50 (12.7)

60-12-20265-TW10 3.0 (76.2) 0.50 (12.7) 0.50 (12.7)

60-12-20266-TW10 3.0 (76.2) 0.75 (19.1) 0.75 (19.1)

60-12-20267-TW10 3.0 (76.2) 1.00 (25.4) 1.00 (25.4)

60-12-20268-TW10 4.0 (101.6) 1.00 (25.4) 1.00 (25.4)

60-12-20269-TW10 4.0 (101.6) 1.50 (38.1) 1.50 (38.1)

Ordering Information

T-WING® Heat Spreaders

Standard Parts: Refer to table below for part numbers and sizes. T-WING

heat spreaders are available in standard packages of 100 parts/pkg.

Custom Parts: Custom configured T-WING parts are also available. Contact

Parker Chomerics’ Applications Engineering Department for details.

Available in standard sizes 1,000 parts per plastic tray. Also available die-cut

on continuous rolls.

Folding Scores

0.0015 in. Black PET

0.007 in. RA Copper

0.0015 in. Black PET

Release Liner

0.002 in. Thermattach PSA

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