SP3003 Series Datasheet by Littelfuse Inc.

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© 2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 05/12/17
TVS Diode Arrays (SPA® Diodes)
Low Capacitance ESD Protection - SP3003 Series
Description
Features
Applications
The SP3003 has ultra low capacitance rail-to-rail diodes with
an additional zener diode fabricated in a proprietary silicon
avalanche technology to protect each I/O pin providing a
high level of protection for electronic equipment that may
experience destructive electrostatic discharges (ESD). These
robust diodes can safely absorb repetitive ESD strikes at the
maximum level specified in the IEC 61000-4-2 international
standard (Level 4, ±8kV contact discharge) without
performance degradation. Their very low loading capacitance
also makes them ideal for protecting high speed signal pins
such as HDMI, DVI, USB2.0, and IEEE 1394.
ESD protection of ±8kV
contact discharge,
±15kV air discharge, (IEC
61000-4-2)
EFT protection,
IEC 61000-4-4, 40A
(5/50ns)
Lightning Protection, IEC
61000-4-5, 2nd edition
2.5A (8/20µs)
• Low capacitance of
0.65pF (TYP) per I/O
Low leakage current of
0.5μA (MAX) at 5V
Complete line of small
packaging helps save
board space (SC70,
SOT553, SOT563,
MSOP10, µDFN-6L)
AEC-Q101 qualified
(µDFN package)
RoHS compliant and lead-
free
LCD/ PDP TVs
• DVD Players
• Desktops
• MP3/ PMP
• Digital Cameras
• Set Top Boxes
• Mobile Phones
• Notebooks
Computer Peripherals
Pinout
NC
V
CC
I/O 1
GND
I/O 2
I/O 4
V
CC
I/O 3
I/O 1
GND
I/O 2
SP3003-04X/J
SP3003-02X/J
Functional Block Diagram
SP3003-04J/XTG SP3003-04ATG
SP3003-02J/XTG SP3003-08ATG
123
654
12345
10 9876
12312345
10 9876
54
I/O 1
I/O 2
V
NC
GND
CC
NC
NC
NC
I/O 3
I/O 4
SP3003-04A
I/O 1
I/O 2
NC
I/O 3
I/O 4
SP3003-08A
GND
I/O 8
I/O 7
I/O 6
I/O 5
Life Support Note:
Not Intended for Use in Life Support or Life Saving Applications
The products shown herein are not designed for use in life sustaining or life saving
applications unless otherwise expressly indicated.
RoHS
Pb
GREEN
Application Example
IC
*Package is shown as transparentDVI/ HDMI Port
Vcc/NC
Vcc/NC
Signal GND
GND
GND
D2+
GND
GND
GND
GND
D2-
D1+
D1-
D0+
D0-
CLK+
CLK-
A single, 4 channel SP3003-04 device can be used to
protect four (4) of the data lines in a HDMI/DVI interface
so two (2) SP3003-04 devices provide protection for all
eight (8) TMDS lines.
SP3003-02UTG
(AEC-Q101 qualified)
SP3003-02UTG
SP3003 Series 0.65pF Diode Array
Additional Information
Samples
Resources
% Littelfuse’ Wampum \ Answusmllumd
© 2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 05/12/17
TVS Diode Arrays (SPA® Diodes)
Low Capacitance ESD Protection - SP3003 Series
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress only rating and operation of the device
at these or any other conditions above those indicated in the operational sections of this
specification is not implied.
Absolute Maximum Ratings
Symbol Parameter Value Units
IPP Peak Current (tp=8/20μs) 2.5 A
TOP Operating Temperature –40 to 125 °C
TSTOR Storage Temperature –55 to 150 °C
Thermal Information
Parameter Rating Units
Storage Temperature Range –55 to 150 °C
Maximum Junction Temperature 150 °C
Maximum Lead Temperature
(Soldering 20-40s)
260 °C
Electrical Characteristics (TOP=25ºC)
Parameter Symbol Test Conditions Min Typ Max Units
Reverse Standoff Voltage VRWM IR ≤ 1µA 6 V
Reverse Leakage Current ILEAK VR=5V 0.5 µA
Clamp Voltage1VC
IPP=1A, tp=8/20µs, Fwd 10.0 12.0 V
IPP=2A, tp=8/20µs, Fwd 11. 8 15.0 V
ESD Withstand Voltage1VESD
IEC61000-4-2 (Contact) ±8 kV
IEC61000-4-2 (Air) ±15 kV
Diode Capacitance1CI/O-GND
Reverse Bias=0V 0.7 0.8 0.95 pF
Reverse Bias=1.65V 0.55 0.65 0.8 pF
Diode Capacitance1CI/O-I/O Reverse Bias=0V 0.35 pF
Note: 1. Parameter is guaranteed by design and/or device characterization.
Capacitance vs. Bias VoltageInsertion Loss (S21) I/O to GND
-10
-9
-8
-7
-6
-5
-4
-3
-2
-1
0
1
1.E+06 1.E+07 1.E+08 1.E+09 1.E+10
Frequency [Hz]
Insertion Loss [dB]
1.00
0.95
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
0.90
0.85
0.80
0.75
0.70
0.65
0.60
0.55
0.50
I/O Capacitance (pF)
I/O DC Bias (V)
VCC = 3.3V
VCC = Float
VCC = 5V
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© 2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 05/12/17
TVS Diode Arrays (SPA® Diodes)
Low Capacitance ESD Protection - SP3003 Series
Capacitance vs. Frequency
0
2E-13
4E-13
6E-13
8E-13
1E-12
1.2E-12
1.4E-12
1.E+06
1.E+07 1.E+08 1.E+09
Frequency [Hz]
Capacitance [F]
Product Characteristics
Lead Plating Matte Tin (SC70-x, MSOP-10) Pre-Plated
Frame (SOT5x3, µDFN-6)
Lead Material Copper Alloy
Lead Coplanarity 0.0004 inches (0.102mm)
Substitute
Material Silicon
Body Material Molded Epoxy
Flammability UL 94 V-0
Notes :
1. All dimensions are in millimeters
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
5. Package surface matte finish VDI 11-13.
Reflow Condition Pb – Free assembly
Pre Heat
- Temperature Min (Ts(min))150°C
- Temperature Max (Ts(max))200°C
- Time (min to max) (ts)60 – 180 secs
Average ramp up rate (Liquidus) Temp
(TL) to peak 3°C/second max
TS(max) to TL - Ramp-up Rate 3°C/second max
Reflow - Temperature (TL) (Liquidus) 217°C
- Temperature (tL)60 – 150 seconds
Peak Temperature (TP)260+0/-5 °C
Time within 5°C of actual peak
Temperature (tp)20 – 40 seconds
Ramp-down Rate 6°C/second max
Time 25°C to peak Temperature (TP)8 minutes Max.
Do not exceed 260°C
Soldering Parameters
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© 2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 05/12/17
TVS Diode Arrays (SPA® Diodes)
Low Capacitance ESD Protection - SP3003 Series
Package Dimensions — SC70-6
D
A2 A
A1
C
L
EHE
2
13
654
ee
B
Package SC70-6
Pins 6
JEDEC MO-203
Millimeters Inches
Min Max Min Max
A0.80 1. 10 0.031 0.043
A1 0.00 0.10 0.000 0.004
A2 0.70 1. 0 0 0.028 0.039
B0.15 0.30 0.006 0.012
c0.08 0.25 0.003 0.010
D1.85 2.25 0.073 0.089
E1. 15 1.35 0.045 0.053
e0.65 BSC 0.026 BSC
HE 2.00 2.40 0.079 0.094
L0.26 0.46 0.010 0.018
Recommended Solder Pad Layout
Package Dimensions — SC70-5
D
A2 A
A1
C
L
EHE
2
13
65
not used 4
ee
B
Package SC70-5
Pins 5
JEDEC MO-203
Millimeters Inches
Min Max Min Max
A0.80 1. 10 0.031 0.043
A1 0.00 0.10 0.000 0.004
A2 0.70 1. 0 0 0.028 0.039
B0.15 0.30 0.006 0.012
c0.08 0.25 0.003 0.010
D1.85 2.25 0.073 0.089
E1. 15 1.35 0.045 0.053
e0.65 BSC 0.026 BSC
HE 2.00 2.40 0.079 0.094
L0.26 0.46 0.010 0.018
Recommended Solder Pad Layout
Package Dimensions — SOT553
Package SOT 553
Pins 5
Millimeters Inches
Min Max Min Max
A0.50 0.60 0.020 0.024
B0.17 0.27 0.007 0.011
c0.08 0.18 0.003 0.007
D1.50 1.70 0.059 0.067
E1. 10 1.30 0.043 0.051
e0.50 BSC 0.020 BSC
L0.10 0.30 0.004 0.012
HE 1.50 1.70 0.059 0.067
c
HE
L
A
D
64
23
E
e
B
5
(not used)
Recommended
Solder Pad Layout
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© 2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 05/12/17
TVS Diode Arrays (SPA® Diodes)
Low Capacitance ESD Protection - SP3003 Series
Package Dimensions — SOT563
Package SOT 563
Pins 6
Millimeters Inches
Min Max Min Max
A0.50 0.60 0.020 0.024
B0.17 0.27 0.007 0.011
c0.08 0.18 0.003 0.007
D1.50 1.70 0.059 0.067
E1. 10 1.30 0.043 0.051
e0.50 BSC 0.020 BSC
L0.10 0.30 0.004 0.012
HE 1.50 1.70 0.059 0.067
c
HE
L
A
D
64
23
E
e
B
5Recommended
Solder Pad Layout
Package Dimensions — MSOP10
Recommanded Solder Pad Layout
Package Dimensions —µDFN-6L
Package µDFN-6L
JEDEC MO-229
Pins 6
Millimeters Inches
Min Max Min Max
A0.45 0.55 0.018 0.022
A1 0.00 0.05 0.000 0.002
A3 0.125REF 0.005REF
b0.35 0.45 0.014 0.018
b1 0.15 0.25 0.006 0.010
D1.55 1.65 0.062 0.065
D2 ----
E0.95 1.05 0.038 0.042
E2 ----
e0.50REF 0.020REF
L0.33 0.43 0.013 0.017
Recommended
Solder Pad Layout
Recommended Solder Pad
Layout
Package MSOP10
JEDEC MO-187
Pins 10
Millimeters Inches
Min Max Min Max
A-1. 10 - 0.043
A1 0.00 0.15 0.000 0.006
B0.17 0.27 0.007 0.011
c0.08 0.23 0.003 0.009
D2.90 3.10 0.114 0.122
E4.67 5.10 0.184 0.200
E1 2.90 3.10 0.114 0.122
e0.50 BSC 0.020 BSC
HE 0.40 0.80 0.016 0.031
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© 2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 05/12/17
TVS Diode Arrays (SPA® Diodes)
Low Capacitance ESD Protection - SP3003 Series
Embossed Carrier Tape & Reel Specification MSOP-10
Millimetres Inches
Min Max Min Max
E1.65 1.85 0.065 0.073
F5.40 5.60 0.213 0.220
D1.50 1.60 0.059 0.063
D1 1.50 Min 0.059 Min
P0 3.90 4.10 0.154 0.161
10P0 40.0± 0.20 1.574±0.008
W11.90 12.10 0.469 0.476
P7.90 8.10 0.311 0.319
A0 5.20 5.40 0.205 0.213
B0 3.20 3.40 0.126 0.134
K0 1.20 1.40 0.047 0.055
t0.30 ± 0.05 0.012± 0.002
User Feeding Direction
Pin 1 Location
Embossed Carrier Tape & Reel Specifications — SOT553 and SOT563
Millimetres Inches
Min Max Min Max
E1.65 1.85 0.064 0.073
F3.45 3.55 0.135 0.139
P2 1.95 2.05 0.076 0.081
D1.40 1.60 0.055 0.063
D1 0.45 0.55 0.017 0.021
P0 3.90 4.10 0.154 0.161
10P0 40.0± 0.20 1.574±0.008
W7.70 8.10 0.303 0.318
P3.90 4.10 0.153 0.161
A0 1.73 1.83 0.068 0.072
B0 1.73 1.83 0.068 0.072
K0 0.64 0.74 0.025 0.029
t0.22 max 0.009 max
User Feeding Direction
Pin 1 Location
Embossed Carrier Tape & Reel Specifications — SC70-5 and SC70-6
Millimetres Inches
Min Max Min Max
E1.65 1.85 0.064 0.073
F3.45 3.55 0.135 0.139
P2 1.95 2.05 0.077 0.081
D1.40 1.60 0.055 0.063
D1 1. 0 0 1.25 0.039 0.049
P0 3.90 4.10 0.154 0.161
10P0 40.0± 0.20 1.574±0.008
W7.70 8.10 0.303 0.318
P3.90 4.10 0.153 0.161
A0 2.14 2.34 0.084 0.092
B0 2.24 2.44 0.088 0.960
K0 1. 12 1.32 0.044 0.052
t0.27 max 0.010 max
User Feeding Direction
Pin 1 Location
SPQQ-Ox x TG T +le
© 2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 05/12/17
TVS Diode Arrays (SPA® Diodes)
Low Capacitance ESD Protection - SP3003 Series
Part Numbering System
SP3003-0x xTG
Series
Number of Channels
-02 = 2 channel
(SC70-5, SOT553, µDFN-6L packages)
-04 = 4 channel
(SC70-6, SOT563, MSOP-10 packages)
-08 = 8 channel
(MSOP-10 packages)
Package
A = MSOP-10, 4000 quantity
J = SC70-5 or SC70-6, 3000 quantity
X = SOT553 or SOT563, 5000 quantity
U= µDFN-6L, 3000 quantity
T= Tape & Reel
G= Green
TVS Diode Arrays
(SPA® Diodes)
Part Marking System
F * *
F**
Product Series
F=SP3003 series
Assembly Site
(varies)
Number of Channels
(varies)
Ordering Information
Part Number Package Marking Min. Order Qty.
SP3003-02JTG SC70-5 F*23000
SP3003-02UTG µDFN-6L FH2 3000
SP3003-02XTG SOT553 F*23000
SP3003-04ATG MSOP-10 F*44000
SP3003-04JTG SC70-6 F*43000
SP3003-04XTG SOT563 F*43000
SP3003-08ATG MSOP-10 F*84000
Embossed Carrier Tape & Reel Specification — µDFN-6L
Millimetres Inches
Min Max Min Max
E1.65 1.85 0.064 0.073
F3.45 3.55 0.135 0.139
P2 1.95 2.05 0.076 0.081
D1.40 1.60 0.055 0.063
D1 0.45 0.55 0.017 0.021
P0 3.90 4.10 0.154 0.161
10P0 40.0±0.20 1.574±0.008
W7.90 8.30 0.311 0.319
P0 3.90 4.10 0.154 0.161
A0 1. 15 1.25 0.045 0.049
B0 1.75 1.85 0.069 0.073
K0 0.65 0.75 0.026 0.03
t0.22 max 0.009 max
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test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications.
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