BLM15G Series Spec Datasheet by Murata Electronics

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Reference Sgec.No.JENF243A70029G701 BLMT SGGZZT SNT D BLMT 5GG471 SNT D BLM‘ 5GA7SOSN‘ D
Reference Spec.No.JENF243A-0029G-01 P1/8
MURATA MFG.CO.,LTD.
Reference Only
High-GHz Noise Suppression Chip Ferrite Bead
BLM15G□□□□SN1Reference Specification
1.Scope
This reference specification applies to Chip Ferrite Bead BLM15G_SN series.
2.Part Numbering
(ex.) BL M 15 GG 221 S N 1 D
(1) (2) (3) (4) (5) (6) (7) (8) (9)
(1)Product ID (2)Type (3)Dimension(L×) (4)Characteristics (5)Typical Impedance at 100MHz
(6)Performance (7)Category (8)Numbers of Circuit (9)Packaging(D:Taping / B:Bulk)
3.Rating
Customer
Part Number MURATA
Part Number
Impedance ()
(Under Standard
Testing Condition) Rated
Current
(mA)
DC Resistance
( max.)
Initial
Values
Values
After
Testing
at 100MHz at 1GHz
BLM15GG221SN1D
220±25% 600±40% 300
0.7 max 0.8 max
BLM15GG221SN1B
BLM15GG471SN1D
470±25% 1200±40% 200
1.3 max 1.4 max
BLM15GG471SN1B
BLM15GA750SN1D
75±25% 1000±40% 200
1.3 max 1.4 max
BLM15GA750SN1B
Operating Temperature : -55°C to +125°C Storage Temperature : -55°C to +125°C
4.Style and Dimensions
Equivalent Circuit
Unit Mass (Typical value)
0.001g
5.Marking
No marking.
6.Standard Testing Conditions
Unless otherwise specified In case of doubt
Temperature : Ordinary Temp. (15 °C to 35 °C ) Temperature : 20°C±2 °C
Humidity : Ordinary Humidity (25%(RH) to 85%(RH)) Humidity : 60%(RH) to 70%(RH)
Atmospheric pressure : 86kPa to 106kPa
7.Specifications
7-1.Electrical Performance
No. Item Specification Test Method
7-1-1 Impedance Meet item 3.
Measuring Frequency : 100MHz±1MHz , 1GHz±1MHz
Measuring Equipment : KEYSIGHT4291A or the equivalent
Test Fixture : KEYSIGHT16192A or the equivalent
7-1-2 DC Resistance Meet item 3. Measuring Equipment : Digital multi meter
*Except resistance of the Substrate and Wire
:Electrode
1.0±0.05 0.5±0.05
0.25±0.1
0.5±0.05
(in mm)
Resistance element becomes
dominant at high frequencies.
()
Reference Sgec.No.JENF245A70029G701 Table i Impedance r Change Within econ/s (al 100MHz) R“ 0 DC Meet ltem 3. Resistance R 77273 Bending It shall be soldered on the substrate. Strength Substrale: Glasssepoxy 100mmx40mmx0. Dellection : 2.0mm Speed ol Applying Force : 0.5mm/s Keeping Time : 30s Pressure rig 77274 Vibration It shall be soldered on the substrate. Oscillation Frequency : 1on to 200on to to Total Amplitude i.5mm or Acceleration 19 whiche Testing Time :A period cl 2 hours in each perpendicular direction 77275 Reslstance PlerHeallrlg : 150°Ci10°Q605~905 to Soldering Solder : Snr3.0Agro.SCu Heat Solder Temperature : 270 mm: lmmersion Time : 105:0.55 lmmersion and emersion rates :25mm/s Then measured alter exposure in the room for 48h:4h. 77276 Drop Products shall be no iailure It shall be dropped on concrete or steel be after tested. Method : free fall Height : 75cm Attitude from which the product is dropped The number oi times : 3 times tor each dire ( 77277 Solderability The electrodes shall be at Flux : Ethanol solution of rosin,25(wt)"/c least 95% coveled with new PrerHeallrlg I150°C;10°C,605~905 solder coating. Solder : Snr3.0Agro.SCu Solder Temperature : 240 mm: lmmersion Time : 35:1 s lmmersion and emersion rates :25mm/s MURATA MFG.CO..LTD.
Reference Spec.No.JENF243A-0029G-01 P2/8
MURATA MFG.CO.,LTD.
Reference Only
7-2.Mechanical Performance
No. Item Specification Test Method
7-2-1 Appearance and
Dimensions Meet item 4. Visual Inspection and measured with Slide Calipers.
7-2-2 Bonding
Strength Meet Table 1.
Table 1
It shall be soldered on the substrate.
Applying Force(F) : 5N
Applying Time : 5s±1s
Applying Direction: Parallel to the substrate.
7-2-3 Bending
Strength It shall be soldered on the substrate.
Substrate: Glass-epoxy 100mm40mm0.8mm
Deflection : 2.0mm
Speed of Applying Force : 0.5mm/s
Keeping Time : 30s
7-2-4 Vibration It shall be soldered on the substrate.
Oscillation Frequency : 10Hz to 2000Hz to 10Hz
for 20 min
Total Amplitude 1.5mm or Acceleration 196m/s2
whichever is smaller
Testing Time : A period of 2 hours in each of 3 mutually
perpendicular directions. (Total 6 h)
7-2-5 Resistance
to Soldering
Heat
Pre-Heating : 150°C±10°C, 60s90s
Solder : Sn-3.0Ag-0.5Cu
Solder Temperature : 270°C±5°C
Immersion Time : 10s±0.5s
Immersion and emersion rates : 25mm/s
Then measured after exposure in the room condition
for 48h±4h.
7-2-6 Drop Products shall be no failure
after tested. It shall be dropped on concrete or steel board.
Method : free fall
Height : 75cm
Attitude from which the product is dropped: 3 direction
The number of times : 3 times for each direction
(Total 9 times)
72-7 Solderability The electrodes shall be at
least 95% covered with new
solder coating.
Flux : Ethanol solution of rosin,25(wt)%
Pre-Heating : 150°C±10°C, 60s90s
Solder : Sn-3.0Ag-0.5Cu
Solder Temperature : 240°C±5°C
Immersion Time : 3s±1s
Immersion and emersion rates : 25mm/s
Appearance No damage
Impedance
Change
(at 100MHz) Within ±30%
DC
Resistance Meet item 3.
45mm
R340
F
Deflection
45mm Product
Pressure jig
R0.5
Substrate
Side view
Reference Spec.N0.JENF243A70029G701 Re fe I' e n C e O n Top tape
Reference Spec.No.JENF243A-0029G-01 P3/8
MURATA MFG.CO.,LTD.
Reference Only
7-3.Environmental Performance
It shall be soldered on the substrate.
No. Item Specification Test Method
7-3-1 Temperature
Cycle Meet Table 1. 1 cycle:
1 step:-55 °C(+0 °C,-3 °C) / 30min±3min
2 step:Ordinary temp. / 3min max.
3 step:+125 °C(+3 °C,-0 °C) / 30min±3min
4 step: Ordinary temp. / 3min max.
Total of 100 cycles
Then measured after exposure in the room condition for 48h±4h.
7-3-2 Humidity Temperature : 70°C±2°C
Humidity : 90%RH to 95%RH
Time : 1000h(+48h,-0h)
Then measured after exposure in the room condition for 48h±4h.
7-3-3 Heat Life Temperature : 125°C±3°C
Applying Current : Rated Current (at Test temperature)
Time : 1000h(+48h,-0h)
Then measured after exposure in the room condition for 48h±4h.
7-3-4 Cold
Resistance Temperature : -55±2°C
Time : 1000h(+48h,-0h)
Then measured after exposure in the room condition for 48h±4h.
8. Specification of Packaging
8-1.Appearance and Dimensions (8mm-wide paper tape)
(1) Taping
Products shall be packaged in the cavity of the base tape of 8mm-wide, 2mm-pitch continuously and sealed
by top tape and bottom tape.
(2) Sprocket hole:Sprocket hole shall be located on the left hand side toward the direction of feed.
(3) Spliced point:The base tape and top tape have no spliced point
(4) Cavity:There shall not be burr in the cavity.
(5) Missing components number
Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater, and are not
continuous. The specified quantity per reel is kept.
8-2.Tape Strength
(1)Pull Strength
Top tape 5N min.
Bottom tape
(2)Peeling off force of Cover tape
0.1N to 0.6N (Minimum value is typical.)
*Speed of Peeling off:300mm/min
F
165 to 180 degree Top tape
Bottom tape Base tape
0.8max.
0.65(Typ.)
1.15(Typ.)
(in mm)
2.0±0.05
2.0±0.05 4.0±0.1
1.5
+0.1
-0
1.75±0.1
3.5±0.05
8.0±0.3
Direction of Feed
Reference Sgec.No.JENF243A70029G701 Case
Reference Spec.No.JENF243A-0029G-01 P4/8
MURATA MFG.CO.,LTD.
Reference Only
8-3.Taping Condition
(1)Standard quantity per reel
Quantity per 180mm reel 10000 pcs. / reel
(2)There shall be leader-tape(top tape and empty tape) and trailer- tape(empty tape) as follows.
(3)On paper tape, the top tape and the base tape shall not be adhered at the tip of the empty leader tape
for more than 5 pitch.
(4)Marking for reel
The following items shall be marked on a label and the label is stuck on the reel.
(Customer part number, MURATA part number, Inspection number(1), RoHS marking(2), Quantity, etc)
1) « Expression of Inspection No. » □□ OOOO 
(1) (2) (3)
(1) Factory Code
(2) Date First digit : Year / Last digit of year
Second digit : Month / Jan. to Sep. 1 to 9, Oct. to Dec. O,N,D
Third, Fourth digit : Day
(3) Serial No.
2) « Expression of RoHS marking » ROHS – Y ()
(1) (2)
(1) RoHS regulation conformity parts.
(2) MURATA classification number
(5) Outside package
These reels shall be packed in the corrugated cardboard package and the following items shall be marked on
a label and the label is stuck on the box.
(Customer name, Purchasing Order Number, Customer Part Number, MURATA part number,
RoHS marking(2) , Quantity , etc)
(6)Dimensions of reel and taping(leader-tape, trailer-tape)
(in mm)
8-4. Specification of Outer Case
Outer Case Dimensions
(mm) Standard Reel Quantity in Outer Case
(Reel)
W D H
186 186 93 5
Above Outer Case size is typical. It depends on a quantity of an order.
9. Caution
9-1. Surge current
Excessive surge current ( pulse current or rush current) than specified rated current applied to the product may cause
a critical failure, such as an open circuit, burnout caused by excessive temperature rise.
Please contact us in advance in case of applying the surge current.
Empty tape
190 min.
Leader
Trailer
Top tape
2.0±0.5
13.0±0.2
21.0±0.8
180±
60±
13±1.4
1
0
0
3
Direction of feed
210 min.
160 min.
1
0
Label
W
D
Label
H
Reference Spec.N0.JENF243A70029G701 Re fe I' e n c e O n I
Reference Spec.No.JENF243A-0029G-01 P5/8
MURATA MFG.CO.,LTD.
Reference Only
9-2.Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high
reliability for the prevention of defects which might directly cause damage to the third party's life, body or property.
(1)Aircraft equipment (2)Aerospace equipment (3)Undersea equipment (4)Power plant control equipment
(5)Medical equipment (6)Transportation equipment(automobiles,trains,ships,etc.) (7)Traffic signal equipment
(8)Disaster prevention / crime prevention equipment (9)Data-processing equipment
(10)Applications of similar complexity or with reliability requirements comparable to the applications listed in the above
10. Notice
Products can only be soldered with reflow.
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
10-1.Land pattern designing
Standard land dimensions (Reflow soldering)
(in mm)
10-2.Soldering Conditions
(1) Flux,Solder
Flux Use rosin-based flux, but not highly acidic flux (with chlorine content exceeding 0.2(wt)%. )
Do not use water-soluble flux.
Solder Use Sn-3.0Ag-0.5Cu solder
Standard thickness of solder paste : 100 µm to 200 m
(2) Soldering conditions
Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited
to 150 max. Also cooling into solvent after soldering should be in such a way that the temperature difference
is limited to 100 max.
Insufficient pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality.
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting
in the deterioration of product quality.
Standard Profile Limit Profile
Pre-heating 150180°C 90s±30s
Heating above 220°C30s60s above 230°C60s max.
Peak temperature 245±3°C 260°C,10s
Cycle of reflow 2 times 2 times
10-3. Reworking with soldering iron
Soldering a b c
Reflow 0.4 1.2 0.5
Limit Profile
Standard Profile
90s±30s
230
260
245℃±3
220
30s~60s
60s max.
180
150
Temp.
(s)
(℃)
Time.
Chip Ferrite Bead
Solder Resist
Pattern
c
b
a
Reference Sgec.N0.JENF243A70029G701 Re fe I' e n C e O n E—fi Fflf WE“? l 30000 ( ) 000m SHED m '1 A > D \s vahd whe IfaCumng Dec ‘5
Reference Spec.No.JENF243A-0029G-01 P6/8
MURATA MFG.CO.,LTD.
Reference Only
Pre-heating : 150°C, 1 min
Tip temperature : 350°C max.
Soldering time : 3(+1,-0) seconds.
Soldering iron output : 80W max.
Tip diameter :φ3mm max.
 Times : 2times max.
Note : Do not directly touch the products with the tip of the soldering iron in order to prevent the crack
on the ferrite material due to the thermal shock.
10-4.Solder Volume
Solder shall be used not to be exceed as shown below.
1/3TtT
(T:Chip thickness)
Accordingly increasing the solder volume, the mechanical stress to product is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
10-5.Attention regarding P.C.B. bending
The following shall be considered when designing and laying out P.C.B.'s.
(1) P.C.B. shall be designed so that products are not subjected to the mechanical stress for board warpage.
<Products direction>
Products shall be located in the sideways
direction (Length:ab) to the mechanical
stress.
(2) Components location on P.C.B. separation.
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as possible
to reduce stress.
Contents of Measures Stress Level
(1) Turn the mounting direction of the component parallel to the board separation surface. A > D *1
(2) Add slits in the board separation part. A > B
(3) Keep the mounting position of the component away from the board separation surface. A > C
*1 A > D is valid when stress is added vertically to the perforation as with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.
Recommendable
Upper Limit
t
Poor example
Good example
b
a
Perforation
Slit
A
B
C
D
Reference Sgec.No.JENF245A70029G701 [CH-MEI] Screw Hole Recommended 1076.Mounting density Add special attention to radiating heal ot products whe The excesslve heat by other products may cause dete 1077.Cleaning Conditions Products shaii be cleaned on the foildwing conditlons. (1 )Cieanlng temperature shall be limited to 60°C max. (40 (2)Ultrasonic cleaning shall comply with the tolloiiving cond at the mounted plcducts and P.C.B. Powelz20W/tmax. Flequency:28kHz|cAOkHz Ti (3)Cleaner l.Alternative cleaner . lsopropyl alcohol (IPA) 2.Aqueous agent . PINE ALPHA ST-loos (4)Tnere shall be no residual tlux and residual cleaner att in the case ot using aqueous agent, products shall be in order to remove the cleaner. (5) Rinslng by Ultrasonic cleaning Uslng water tor ultrasonic cleaning may attect the resi set cleaning conditions, please make sure the reliabilit (6)0ther cleaning Please contact us. 1078. Operating Environment Do not use this product under the tollowing environme the Ferrlle materlai and/or corrosion of Inner Electrode (1) in the ccrrodible atmosphere such as acidic gases, a organic gases and etc. (the sea breeze, Ciz, H28, N (2) in the atmosphere where liquid such as organic solve (a) in the atmosphere where the temperature / humidity c 1079. Resin coating The impedance value may change and/or it may arlec to be used tor coating / molding products. So please p please make the reliability evaluation with the product 1010. Handling of a substrate Alter mounting products on a substrate do not apply substrate when cropping the substrate, inserting and r the Substrate. Excessive mechanical stress may cause cracking in th Bending Tw MURATA MF
Reference Spec.No.JENF243A-0029G-01 P7/8
MURATA MFG.CO.,LTD.
Reference Only
(3) Mounting Components Near Screw Holes
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during
the tightening of the screw. Mount the component in a position as far away from the screw holes as possible.
10-6.Mounting density
Add special attention to radiating heat of products when mounting the inductor near the products with heating.
The excessive heat by other products may cause deterioration at joint of this product with substrate.
10-7.Cleaning Conditions
Products shall be cleaned on the following conditions.
(1) Cleaning temperature shall be limited to 60°C max. (40°C max. for IPA.)
(2)Ultrasonic cleaning shall comply with the following conditions, avoiding the resonance phenomenon
at the mounted products and P.C.B.
Power:20W/ max. Frequency:28kHz to 40kHz Time:5 min max.
(3)Cleaner
1.Alternative cleaner
Isopropyl alcohol (IPA)
2.Aqueous agent
PINE ALPHA ST-100S
(4)There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water
in order to remove the cleaner.
(5) Rinsing by Ultrasonic cleaning
Using water for ultrasonic cleaning may affect the resin quality used for the product by water element . In case of
set cleaning conditions, please make sure the reliability according to the cleaning conditions.
(6)Other cleaning
Please contact us.
10-8. Operating Environment
Do not use this product under the following environmental conditions, on deterioration of the Insulation Resistance of
the Ferrite material and/or corrosion of Inner Electrode may result from the use.
(1) in the corrodible atmosphere such as acidic gases, alkaline gases, chlorine, sulfur gases,
organic gases and etc. (the sea breeze, Cl2, H2S, NH3, SO2, NO2,etc)
(2) in the atmosphere where liquid such as organic solvent, may splash on the products.
(3) in the atmosphere where the temperature / humidity changes rapidly and it is easy to dew.
10-9. Resin coating
The impedance value may change and/or it may affect on the product's performance due to high cure-stress of resin
to be used for coating / molding products. So please pay your careful attention when you select resin. In prior to use,
please make the reliability evaluation with the product mounted in your application set.
10-10. Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the
substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to
the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending Twisting
Screw Hole Recommended
Reference Sgec.N0.JENF243A70029G701 Re fe I' e n c e O n I
Reference Spec.No.JENF243A-0029G-01 P8/8
MURATA MFG.CO.,LTD.
Reference Only
10-11.Storage Conditions
(1)Storage period
Use the products within 12 months after delivered.
Solderability should be checked if this period is exceeded.
(2)Storage conditions
Products should be stored in the warehouse on the following conditions.
Temperature : -10°C to 40°C
Humidity : 15% to 85% relative humidity
No rapid change on temperature and humidity
Don't keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization
of electrode, resulting in poor solderability.
Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
Products should be stored under the airtight packaged condition.
(3)Delivery
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
11. ! Note
(1)Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2) You are requested not to use our product deviating from the reference specifications.
(3) The contents of this reference specification are subject to change without advance notice.
Please approve our product specifications or transact the approval sheet for product specifications
before ordering.

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