KPS Series, X7R Automotive Datasheet by KEMET

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E‘ectromc Components KEII/IEI' CHARGED? Rated (VDC)
1© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1021_X7R_KPS_AUTO_SMD • 4/16/2019
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
One world. One KEMET
Overview
KEMET Power Solutions (KPS) Automotive Series stacked
capacitors utilize a proprietary lead-frame technology
to vertically stack one or two multilayer ceramic chip
capacitors into a single compact surface mount package.
The attached lead-frame mechanically isolates the
capacitor/s from the printed circuit board, therefore offering
advanced mechanical and thermal stress performance.
Isolation also addresses concerns for audible, microphonic
noise that may occur when a bias voltage is applied. A
two chip stack offers up to double the capacitance in
the same or smaller design footprint when compared to
traditional surface mount MLCC devices. Providing up to
10 mm of board flex capability, KPS Series capacitors are
environmentally friendly and in compliance with RoHS
legislation. Available in X7R dielectric, these devices are
capable of Pb-Free reflow profiles and provide lower ESR, ESL
and higher ripple current capability when compared to other
dielectric solutions.
Combined with the stability of an X7R dielectric, KEMET’s
KPS Series devices exhibit a predictable change in
capacitance with respect to time and voltage and boast a
minimal change in capacitance with reference to ambient
temperature. Capacitance change is limited to ±15% from
−55°C to +125°C.
KPS Series automotive grade capacitors meet the demanding
Automotive Electronics Council's AEC–Q200 qualification
requirements.
Ordering Information
C2220 C106 M 5 R 2 C AUTO
Ceramic Case Size
(L" x W")
Specification/
Series
Capacitance
Code (pF)
Capacitance
Tolerance1
Rated
Voltage
(VDC)
Dielectric Failure Rate/Design Leadframe Finish2
Packaging/Grade
(C-Spec)
1210
1812
2220
C = Standard Two
significant
digits and
number of
zeros
K = ±10%
M = ±20%
8 = 10
4 = 16
3 = 25
5 = 50
1 = 100
A = 250
R = X7R 1 = KPS Single
Chip Stack
2 = KPS Double
Chip Stack
C = 100% Matte Sn See
“Packaging
C-Spec
Ordering
Options Table”
1 Double chip stacks ("2" in the 13th character position of the ordering code) are only available in M (±20%) capacitance tolerance. Single chip stacks
("1" in the 13th character position of the ordering code) are available in K (±10%) or M (±20%) tolerances.
2 Additional leadframe finish options may be available. Contact KEMET for details.
Benefits
AEC–Q200 automotive qualified
−55°C to +125°C operating temperature range
Reliable and robust termination system
EIA 1210, 1812, and 2220 Case sizes
DC voltage ratings of 10 V, 16 V, 25 V, 50 V, 100 V,
and 250 V
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KPS, X7R Dielectric, 10 – 250 VDC (Automotive Grade)
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2© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1021_X7R_KPS_AUTO_SMD • 4/16/2019
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
2
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KPS, X7R Dielectric, 10 – 250 VDC (Automotive Grade)
Packaging C-Spec Ordering Options Table
Packaging Type1Packaging/Grade
Ordering Code (C-Spec)2
7" Reel (Embossed Plastic Tape)/Unmarked AUTO
13" Reel (Embossed Plastic Tape)/Unmarked AUTO 7289
1 The terms "Marked" and "Unmarked" pertain to laser marking option of capacitors. All packaging options labeled as "Unmarked" will contain capacitors
that have not been laser marked. The option to laser mark is not available on these devices. For more information see "Capacitor Marking".
2 For additional information regarding "AUTO" C-Spec options, see "Automotive C-Spec Information".
Benefits cont'd
Capacitance offerings ranging from 0.1μF up to 47 μF
• Available capacitance tolerances of ±10% and ±20%
Higher capacitance in the same footprint
Potential board space savings
Advanced protection against thermal and
mechanical stress
Provides up to 10 mm of board flex capability
Reduces audible, microphonic noise
Extremely low ESR and ESL
Lead (Pb)-free, RoHS and REACH compliant
Capable of Pb-free reflow profiles
• Non-polar device, minimizing installation concerns
Tantalum and electrolytic alternative
Applications
Typical applications include smoothing circuits, DC/DC converters, power supplies (input/output filters), noise reduction
(piezoelectric/mechanical), circuits with a direct battery or power source connection, critical and safety relevant circuits
without (integrated) current limitation and any application that is subject to high levels of board flexure or temperature
cycling.
Qualification/Certification
Automotive Grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details
regarding test methods and conditions are referenced in document AEC–Q200, Stress Test Qualification for Passive
Components. For additional information regarding the Automotive Electronics Council and AEC–Q200, please visit their
website at www.aecouncil.com.
Environmental Compliance
Lead (Pb)-free, RoHS, and REACH compliant without exemptions.
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3© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1021_X7R_KPS_AUTO_SMD • 4/16/2019
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
3
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KPS, X7R Dielectric, 10 – 250 VDC (Automotive Grade)
Automotive C-Spec Information
KEMET automotive grade products meet or exceed the requirements outlined by the Automotive Electronics Council.
Details regarding test methods and conditions are referenced in document AEC–Q200, Stress Test Qualifi cation for Passive
Components. These products are supported by a Product Change Notifi cation (PCN) and Production Part Approval Process
warrant (PPAP).
Automotive products offered through our distribution channel have been assigned an inclusive ordering code C-Spec, “AUTO.
This C-Spec was developed in order to better serve small and medium-sized companies that prefer an automotive grade
component without the requirement to submit a customer Source Controlled Drawing (SCD) or specifi cation for review by a
KEMET engineering specialist. This C-Spec is therefore not intended for use by KEMET OEM automotive customers and are
not granted the same “privileges” as other automotive C-Specs. Customer PCN approval and PPAP request levels are limited
(see details below.)
Product Change Notifi cation (PCN)
The KEMET product change notifi cation system is used to communicate primarily the following types of changes:
• Product/process changes that affect product form, fi t, function, and/or reliability
• Changes in manufacturing site
• Product obsolescence
KEMET Automotive
C-Spec
Customer Notifi cation Due To: Days Prior To
Implementation
Process/Product change Obsolescence*
KEMET assigned1Yes (with approval and sign off) Yes 180 days minimum
AUTO Yes (without approval) Yes 90 days minimum
1 KEMET assigned C-Specs require the submittal of a customer SCD or customer specifi cation for review. For additional information contact KEMET.
Production Part Approval Process (PPAP)
The purpose of the Production Part Approval Process is:
• To ensure that supplier can meet the manufacturability and quality requirements for the purchased parts.
• To provide the evidence that all customer engineering design records and specifi cation requirements are properly
understood and fulfi lled by the manufacturing organization.
• To demonstrate that the established manufacturing process has the potential to produce the part.
KEMET Automotive
C-Spec
PPAP (Product Part Approval Process) Level
12345
KEMET assigned1●●●●●
AUTO ○ ○
1 KEMET assigned C-Specs require the submittal of a customer SCD or customer specifi cation for review. For additional information contact KEMET.
Part number specifi c PPAP available
Product family PPAP only
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4© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1021_X7R_KPS_AUTO_SMD • 4/16/2019
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
4
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KPS, X7R Dielectric, 10 – 250 VDC (Automotive Grade)
Dimensions – Millimeters (Inches)
TOP VIEW PROFILE VIEW
Single or Double Chip Stack Double Chip Stack Single Chip Stack
L
L
H
H
W
LW LW
Number
of Chips
EIA
Size Code
Metric
Size Code L Length W Width H Height LW Lead Width Mounting
Technique
Single
1210 3225
3.50 (0.138)
±0.30 (0.012)
2.60 (0.102)
±0.30 (0.012)
3.35 (0.132)
±0.10 (0.004)
0.80 (0.032)
±0.15 (0.006)
Solder Reflow Only
1812 4532
5.00 (0.197)
±0.50 (0.020)
3.50 (0.138)
±0.50 (0.020)
2.65 (0.104)
±0.35 (0.014)
1.10 (0.043)
±0.30 (0.012)
2220 5650
6.00 (0.236)
±0.50 (0.020)
5.00 (0.197)
±0.50 (0.020)
3.50 (0.138)
±0.30 (0.012)
1.60 (0.063)
±0.30 (0.012)
Double
1210 3225
3.50 (0.138)
±0.30 (0.012)
2.60 (0.102)
±0.30 (0.012)
6.15 (0.242)
±0.15 (0.006)
0.80 (0.031)
±0.15 (0.006)
1812 4532
5.00 (0.197)
±0.50 (0.020)
3.50 (0.138)
±0.50 (0.020)
5.00 (0.197)
±0.50 (0.020)
1.10 (0.043)
±0.30 (0.012)
2220 5650
6.00 (0.236)
±0.50 (0.020)
5.00 (0.197)
±0.50 (0.020)
5.00 (0.197)
±0.50 (0.020)
1.60 (0.063)
±0.30 (0.012)
Electrical Parameters/Characteristics
Item Parameters/Characteristics
Operating Temperature Range −55°C to +125°C
Capacitance Change with Reference to
+25°C and 0 VDC Applied (TCC) ±15%
Aging Rate (Maximum % Capacitance Loss/Decade Hour) 3.0%
Dielectric Withstanding Voltage (DWV)
Dissipation Factor (DF) Maximum Limit at 25ºC 5% (6.3 and 10 V), 3.5% (16 and 25 V) and 2.5% (50 to 250 V)
Insulation Resistance (IR) Limit at 25°C
Regarding aging rate: Capacitance measurements (including tolerance) are indexed to a referee time of 1,000 hours.
To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits.
Capacitance and dissipation factor (DF) measured under the following conditions:
1 kHz ±50 Hz and 1.0 ±0.2 Vrms if capacitance ≤ 10 µF
120 Hz ±10 Hz and 0.5 ±0.1 Vrms if capacitance > 10 µF
Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 and Agilent E4980 have a feature known
as Automatic Level Control (ALC). The ALC feature should be switched to "ON."
ammmc compmm KEIVIEI' crummy: 1,000 Megohm Microlalads or 100 an 500 Megohm Microfarads or 10 an
5© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1021_X7R_KPS_AUTO_SMD • 4/16/2019
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
5
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KPS, X7R Dielectric, 10 – 250 VDC (Automotive Grade)
Post Environmental Limits
High Temperature Life, Biased Humidity, Moisture Resistance
Dielectric Rated DC
Voltage
Capacitance
Value
Dissipation Factor
(Maximum %)
Capacitance
Shift
Insulation
Resistance
X7R
> 25
All
3.0
±20% 10% of Initial
Limit
16/25 5.0
< 16 7.5
Insulation Resistance Limit Table
EIA Case Size
1,000 Megohm
Microfarads or 100 GΩ
500 Megohm
Microfarads or 10 GΩ
1210 < 0.39 µF ≥ 0.39 µF
1812 < 2.2 µF ≥ 2.2 µF
2220 < 10 µF ≥ 10 µF
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6© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1021_X7R_KPS_AUTO_SMD • 4/16/2019
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
6
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KPS, X7R Dielectric, 10 – 250 VDC (Automotive Grade)
ESR – 1210, .22 µF, 50 V X7R Impedance – 1210, .22 µF, 50 V X7R
Impedance – 1812, .10 µF, 50 V X7R
ESR – 1812, .10 µF, 50 V X7R
C1210C475M5R1C Z and ESR
Frequency (Hz)
Magnitude Ohms
10
0
10
2
10
4
10
6
10
8
10
10
10
-3
10
-2
10
-1
10
0
10
1
10
2
10
3
ESR
Z
Z and ESR C1210C475M5R1C Z and ESR C2220C476M3R2C
Frequency (Hz)
Magnitude Ohms
10
0
10
2
10
4
10
6
10
8
10
10
10
-6
10
-4
10
-2
10
0
10
2
10
4
ESR
Z
Electrical Characteristics
0.01
0.1
1
10
1.E+03 1.E+04 1.E+05 1.E+06 1.E+07 1.E+08
ESR (Ohms)
Frequency (Hz)
ESR vs. Frequency
C1210C224K5R2C (2 Chip Stack)
C1210C224K5R1C (1 Chip Stack)
0.01
0.1
1
10
100
1000
1.E+03 1.E+04 1.E+05 1.E+06 1.E+07 1.E+08
Impedance (Ohms)
Frequency (Hz)
Impedance vs. Frequency
C1210C224K5R2C (2 Chip Stack)
C1210C224K5R1C (1 Chip Stack)
0.01
0.1
1
10
100
1000
10000
1.E+03 1.E+04 1.E+05 1.E+06 1.E+07 1.E+08
Impedance (Ohms)
Frequency (Hz)
Impedance vs. Frequency
C1812C104K5R2C (2 Chip Stack)
C1812C104K5R1C (1 Chip Stack)
0.01
0.1
1
10
1.E+03 1.E+04 1.E+05 1.E+06 1.E+07 1.E+08
ESR (Ohms)
Frequency (Hz)
ESR vs. Frequency
C1812C104K5R2C (2 Chip Stack)
C1812C104K5R1C (1 Chip Stack)
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7© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1021_X7R_KPS_AUTO_SMD • 4/16/2019
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
7
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KPS, X7R Dielectric, 10 – 250 VDC (Automotive Grade)
Electrical Characteristics cont'd
Competitive Comparision
Ripple Current (Arms) 2220, 22 µF, 50 V
Microphonics – 2220, 47 µF, 25 V, X7R Microphonics – 1210, 22 µF, 25 V, X7R
Microphonics – 2220, 22 µF, 50 V, X7R
Microphonics – 1210, 4.7 µF, 50 V, X7R
20
30
40
50
60
70
80
90
100
110
120
0 5 10 15 20 25 30
Temperature Rise (C)
Ripple Current (A
rms
)
Competitor
KEMET - KPS
20
25
30
35
40
45
012345
Sound Pressure (dB)
Vp-p
Standard SMD MLCC
KPS - 2 Chip Stack
20
25
30
35
40
45
50
0 2 4 6 8 10 12 14 16
Sound Pressure (dB)
Vp-p
Standard SMD MLCC
KPS - 2 Chip Stack
20
25
30
35
40
45
0 1 2 3 4 5
Sound Pressure (dB)
Vp-p
Standard SMD MLCC
KPS - 2 Chip Stack
20
25
30
35
40
45
50
55
0 2 4 6 8 10 12 14 16
Sound Pressure (dB)
Vp-p
Standard SMD MLCC
KPS - 1 Chip Stack
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8© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1021_X7R_KPS_AUTO_SMD • 4/16/2019
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
8
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KPS, X7R Dielectric, 10 – 250 VDC (Automotive Grade)
Electrical Characteristics cont'd
Board Flexure to 10 mm Board Flexure to 10 mm
Board Flex vs. Termination Type
Board Flex vs. Termination Type
101
90
80
70
60
50
40
30
20
10
Percent
2
Weibull
X7R 1812 47uF 16V
Board Flexure (mm)
10.0
9.0
8.0
7.0
6.0
5.0
4.0
3.0
2.0
1.5
1.0
90
80
70
60
50
40
30
20
10
Percent
2
Weibull
X7R 2220 22uF 25V – (47 uF KPS Stacked)
Board Flexure (mm)
Standard Termination
KPS – 2 Chip Stack
10.0
9.0
8.0
7.0
6.0
5.0
4.0
3.0
2.0
1.5
1.0
90
80
70
60
50
40
30
20
10
Percent
2
Weibull
X7R 1210 4.7 uF 50 V
Board Flexure (mm)
10.0
9.0
8.0
7.0
6.0
5.0
4.0
3.0
2.0
1.5
1.0
90
80
70
60
50
40
30
20
10
Percent
2
Weibull
X7R 1210 10 uF – (22 uF KPS Stacked)
Board Flexure (mm)
Standard Termination
KPS – 2 Chip Stack
Eiccxmmc compmm KEIVIEI' crummy: Product Availabili‘y and Chip Thickness On Q 2 hr Chip Thickness Dimensions See Tahl Lies FV FW GP GR JP JR 1210 1210 1812 1812 2220 2220 3.35 t 0.10 6.151015 2.65 t 0.35 5.00 t 0.50 3501030 500 t 0.50 oooooo season 600 300 500 400 300 200 2,000 1,000 2,000 1,700 1,300 800
9© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1021_X7R_KPS_AUTO_SMD • 4/16/2019
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
9
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KPS, X7R Dielectric, 10 – 250 VDC (Automotive Grade)
Table 1 – Capacitance Range/Selection Waterfall (1210 – 2220 Case Sizes)
Capacitance Cap
Code
Case Size/Series C1210C C1812C C2220C
Voltage Code 8 4 3 5 1 A 4 3 5 1 A 4 3 5 1 A
Rated Voltage (VDC)
10
16
25
50
100
250
16
25
50
100
250
16
25
50
100
250
Capacitance Tolerance
Product Availability and Chip Thickness Codes
See Table 2 for Chip Thickness Dimensions
Single Chip Stack
0.10 µF 104 K M FV FV FV FV FV FV GP GP GP UD UD JP JP JP JP JP
0.22 µF 224 K M FV FV FV FV FV GP GP GP UD UD JP JP JP JP JP
0.47 µF 474 K M FV FV FV FV FV GP GP GP UD UD JP JP JP
1.0 µF 105 K M FV FV FV FV FV GP GP GP UD JP JP JP
2.2 µF 225 K M FV FV FV FV GP GP GP JP JP JP UD
3.3 µF 335 K M FV FV FV FV GP GP GP JP JP JP UD
4.7 µF 475 K M FV FV FV FV GP GP GP JP JP JP
10 µF 106 K M FV FV FV GP GP JP JP JP
15 µF 156 K M JP JP
22 µF 226 K M JP JP
Double Chip Stack
0.10 µF 104 MFW FW FW FW FW FW GR GR GR UD UD JR JR JR JR JR
0.22 µF 224 MFW FW FW FW FW FW GR GR GR UD UD JR JR JR JR JR
0.47 µF 474 MFW FW FW FW FW GR GR GR UD UD JR JR JR JR JR
1.0 µF 105 MFW FW FW FW FW GR GR GR UD UD JR JR JR
2.2 µF 225 MFW FW FW FW FW GR GR GR UD JR JR JR
3.3 µF 335 MFW FW FW FW GR GR GR UD JR JR JR UD
4.7 µF 475 MFW FW FW FW GR GR GR JR JR JR
10 µF 106 MFW FW FW FW GR GR GR JR JR JR
22 µF 226 MFW FW FW GR GR JR JR JR
33 µF 336 MJR JR
47 µF 476 M JR JR
Capacitance Cap
Code
Rated Voltage (VDC)
10
16
25
50
100
250
16
25
50
100
250
16
25
50
100
250
Voltage Code 8 4 3 5 1 A 4 3 5 1 A 4 3 5 1 A
Case Size/Series C1210C C1812C C2220C
UD = Under development
These products are protected under US Patent 8,331,078 other patents pending, and any foreign counterparts.
Table 2 – Chip Thickness/Tape & Reel Packaging Quantities
Thickness
Code
Case
Size
Thickness ±
Range (mm)
Paper Quantity Plastic Quantity
7" Reel 13" Reel 7" Reel 13" Reel
FV
1210
3.35 ± 0.10
0
0
600
2,000
FW
1210
6.15 ± 0.15
0
0
300
1,000
GP
1812
2.65 ± 0.35
0
0
500
2,000
GR
1812
5.00 ± 0.50
0
0
400
1,700
JP
2220
3.50 ± 0.30
0
0
300
1,300
JR
2220
5.00 ± 0.50
0
0
200
800
Thickness
Code
Case
Size
Thickness ±
Range (mm)
7" Reel 13" Reel 7" Reel 13" Reel
Paper Quantity Plastic Quantity
Package quantity based on finished chip thickness specifications.
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10© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1021_X7R_KPS_AUTO_SMD • 4/16/2019
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
10
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KPS, X7R Dielectric, 10 – 250 VDC (Automotive Grade)
Table 3 – KPS Land Pattern Design Recommendations (mm)
EIA SIZE
CODE
METRIC
SIZE
CODE
Median (Nominal) Land
Protrusion
C
Y
X
V1
V2
1210 3225 1.50 1.14 1.75 5.05 3.40
1812 4532 2.20 1.35 2.87 6.70 4.50
2220 5650 2.69 2.08 4.78 7.70 6.00
Image at right based on an EIA 1210 case size.
Soldering Process
KEMET’s KPS Series devices are compatible with IR
reflow techniques. Preheating of these components is
recommended to avoid extreme thermal stress. KEMET's
recommended profile conditions for IR reflow reflect the
profile conditions of the IPC/J–STD–020D standard for
moisture sensitivity testing.
To prevent degradation of temperature cycling capability,
care must be taken to prevent solder from flowing into
the inner side of the lead frames (inner side of "J" lead in
contact with the circuit board).
After soldering, the capacitors should be air cooled to
room temperature before further processing. Forced air
cooling is not recommended.
Hand soldering should be performed with care due to the
difficulty in process control. If performed, care should be
taken to avoid contact of the soldering iron to the capacitor
body. The iron should be used to heat the solder pad,
applying solder between the pad and the lead, until reflow
occurs. Once reflow occurs, the iron should be removed
immediately. (Preheating is required when hand soldering to
avoid thermal shock.)
Profile Feature SnPb Assembly Pb-Free Assembly
Preheat/Soak
Temperature Minimum (T
Smin
)100°C 150°C
Temperature Maximum (T
Smax)
150°C 200°C
Time (t
s
) from T
smin
to T
smax
) 60 – 120 seconds 60 – 120 seconds
Ramp-up Rate (T
L
to T
P
)3°C/seconds maximum 3°C/seconds maximum
Liquidous Temperature (T
L
)183°C 217°C
Time Above Liquidous (t
L
) 60 – 150 seconds 60 – 150 seconds
Peak Temperature (T
P
)235°C 250°C
Time within 5°C of Maximum
Peak Temperature (tP)
20 seconds maximum 10 seconds maximum
Ramp-down Rate (T
P
to T
L
)6°C/seconds maximum 6°C/seconds maximum
Time 25°C to Peak
Temperature
6 minutes maximum 8 minutes maximum
Note: All temperatures refer to the center of the package, measured on the
package body surface that is facing up during assembly reflow.
Time
Temperature
Tsmin
25
Tsmax
TL
TPMaximum Ramp-up Rate = 3°C/second
Maximum Ramp-down Rate = 6°C/second
tP
tL
ts
25°C to Peak
Y
C C
X X V2
Grid Placement Courtyard
Y
V1
ammm Compancnls KEIVIEI' cumin:
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11
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KPS, X7R Dielectric, 10 – 250 VDC (Automotive Grade)
Storage & Handling
Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in
other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres,
and long term storage. In addition, packaging materials will be degraded by high temperature–reels may soften or warp
and tape peel force may increase. KEMET recommends that maximum storage temperature not exceed 40ºC and maximum
storage humidity not exceed 70% relative humidity. Temperature fluctuations should be minimized to avoid condensation on
the parts and atmospheres should be free of chlorine and sulfur bearing compounds. For optimized solderability chip stock
should be used promptly, preferably within 1.5 years of receipt.
.................... CHARGED!
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12
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KPS, X7R Dielectric, 10 – 250 VDC (Automotive Grade)
Construction (Typical)
Dielectric Material
(BaTiO3)
Detailed Cross Section
Barrier Layer
(Ni)
Inner Electrodes
(Ni)
Termination Finish
(Sn)
Barrier Layer
(Ni)
Termination Finish
(Sn)
Inner Electrodes
(Ni)
Dielectric Material
(BaTiO3)
Leadframe Attach
(High Melting Point Solder)
Leadframe
(Phosphor Bronze - Alloy 510)
End Termination/
External Electrode
(Cu)
End Termination/
External Electrode
(Cu)
Product Marking
Laser marking option is not available on:
C0G, Ultra Stable X8R and Y5V dielectric devices
EIA 0402 case size devices
EIA 0603 case size devices with Flexible Termination option.
KPS Commercial and Automotive grade stacked devices.
These capacitors are supplied unmarked only.
E‘ucuomc Compcnonu KEIVIEI' CHARGED! ed Carrier 12 mm (01172”) 0' 15 mm (01:29”) \ 180 mm (7.0”
13© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1021_X7R_KPS_AUTO_SMD • 4/16/2019
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13
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KPS, X7R Dielectric, 10 – 250 VDC (Automotive Grade)
Tape & Reel Packaging Information
KEMET offers multilayer ceramic chip capacitors packaged in 8, 12 and 16 mm tape on 7" and 13" reels in accordance with
EIA Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table 2 for
details on reeling quantities for commercial chips.
Embossed Carrier
Embossment
Top Tape Thickness
0.10 mm (0.004”)
Maximum Thickness
12 mm (0.472”)
or
16 mm (0.629”) 180 mm (7.0”)
or
330 mm (13.0”)
Table 4 – Carrier Tape Confi guration – Embossed Plastic (mm)
EIA Case Size Tape Size (W)* Pitch (P
1
)*
01005 – 0402 8 2
0603 – 1210 8 4
1805 – 1808 12 4
≥ 1812 12 8
KPS 1210 12 8
KPS 1812 & 2220 16 12
Array 0508 & 0612 8 4
*Refer to Figure 1 for W and P1 carrier tape reference locations.
*Refer to Table 5 for tolerance specifi cations.
Eiecxmmc Compancnls KEIVIEI' EHARGED: ‘ ' F ‘ , tawny: nulhnlaeling D, Minimum R Reference 8, Minimum T T, Nme 1 Nme 2 Note 3 Maximum Maximim 1.0 25 0 (0.039) (0.904) BY Maximum T2 W Nme 4 Maximum Maximum 4 35 6 25 3.51005 4.01010 2.5 8 3 (0.171) (0.246) (013810.002) (015710 004) (0.090) (0.327) Slngle (4 mm) & 8.2 10.25 5 510.05 8.01010 4.6 12.3 Daubie (0 mm) (0.323) (0 404) (0.21710 002) (0 31510004) (0.101) (0.404) 12.1 14.25 7. 05 12. 0.10 4.6 16.3 (0.476) (0 561) (013810.002) (015710 004) (0.181) (0.642)
14© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1021_X7R_KPS_AUTO_SMD • 4/16/2019
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14
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KPS, X7R Dielectric, 10 – 250 VDC (Automotive Grade)
Figure 1 – Embossed (Plastic) Carrier Tape Dimensions
P
0
T
F
W
Center Lines of Cavity
A
0
B
0
User Direction of Unreeling
Cover Tape
K
0
B
1
is for tape feeder reference only,
including draft concentric about B
0
.
T
2
ØD
1
ØD
0
B
1
S
1
T
1
E
1
E
2
P
1
P
2
Embossment
For cavity size,
see Note 1 Table 4
(10 pitches cumulative
tolerance on tape ±0.2 mm)
Table 5 – Embossed (Plastic) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size D0
D
1
Minimum
Note 1
E1P0P2
R Reference
Note 2
S
1
Minimum
Note 3
T
Maximum
T
1
Maximim
8 mm
1.5+0.10/0.0−0.0
(0.059+0.004/−0.0)
1.0
(0.039)
1.75±0.10
(0.060.004) 4.0±0.10
(0.157±0.004) 2.0±0.05
(0.070.002)
25.0
(0.984)
0.600
(0.024) 0.600
(0.024) 0.100
(0.004)
12 mm 1.5
(0.059) 30
(1.181)
16 mm
Variable Dimensions — Millimeters (Inches)
Tape Size Pitch
B
1
Maximum
Note 4
E2 Minimum F P1
T
2
Maximum
W
Maximum
A0, B0 & K0
8 mm Single (4 mm)
4.35
(0.171)
6.25
(0.246)
3.5±0.05
(0.138±0.002)
4.0±0.10
(0.157±0.004)
2.5
(0.098)
8.3
(0.327)
Note 512 mm
Single (4 mm) &
Double (8 mm)
8.2
(0.323)
10.25
(0.404)
5.5±0.05
(0.217±0.002)
8.0±0.10
(0.315±0.004)
4.6
(0.181)
12.3
(0.484)
16 mm Triple (12 mm)
12.1
(0.476)
14.25
(0.561)
7.5±0.05
(0.138±0.002)
12.0±0.10
(0.157±0.004)
4.6
(0.181)
16.3
(0.642)
1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment
location and hole location shall be applied independent of each other.
2. The tape with or without components shall pass around R without damage (see Figure 5).
3. If S1 < 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Standard 481 paragraph 4.3 section b).
4. B1 dimension is a reference dimension for tape feeder clearance only.
5. The cavity defi ned by A0, B0 and K0 shall surround the component with suffi cient clearance that:
(a) the component does not protrude above the top surface of the carrier tape.
(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.
(c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 2).
(d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see
Figure 3).
(e) for KPS Series product, A0 and B0 are measured on a plane 0.3 mm above the bottom of the pocket.
(f) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements.
cccccccccccccccccccc Emma): e 7/////////////////////l‘ e O @379
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15
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KPS, X7R Dielectric, 10 – 250 VDC (Automotive Grade)
Packaging Information Performance Notes
1. Cover Tape Break Force: 1.0 Kg minimum.
2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:
Tape Width Peel Strength
8 mm 0.1 to 1.0 newton (10 to 100 gf)
12 and 16 mm 0.1 to 1.3 newton (10 to 130 gf)
The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be
165° to 180° from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of
300 ±10 mm/minute.
3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA
Standards 556 and 624.
Figure 2 – Maximum Component Rotation
Ao
Bo
°
T
°
s
Maximum Component Rotation
Top View
Maximum Component Rotation
Side View
Tape Maximum
Width (mm) Rotation (°
T)
8,12 20
16 – 200 10 Tape Maximum
Width (mm) Rotation ( °
S)
8,12 20
16 – 56 10
72 – 200 5
Typical Pocket Centerline
Typical Component Centerline
Figure 3 – Maximum Lateral Movement
0.5 mm maximum
0.5 mm maximum
8 mm & 12 mm Tape
1.0 mm maximum
1.0 mm maximum
16 mm Tape
Figure 4 – Bending Radius
RR
Bending
Radius
Embossed
Carrier
Punched
Carrier
ammm Compancnls KEIVIEI' Emma): 3.4+1 5/70 0 (a 331+0.059/70.o) 12.4+2 0/70 0 (0.4mm 07340.0) 16 4410/7041 (044640378400) 14.4 (a 567) 15.4 (0.724) 22.4 (o 882)
16© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1021_X7R_KPS_AUTO_SMD • 4/16/2019
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16
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KPS, X7R Dielectric, 10 – 250 VDC (Automotive Grade)
Figure 5 – Reel Dimensions
AD(See Note)
Full Radius,
See Note
B(see Note)
Access Hole at
Slot Location
(Ø 40 mm minimum)
If present,
tape slot in core
for tape start:
2.5 mm minimum width x
10.0 mm minimum depth
W
3
(Includes
flange distortion
at outer edge)
W
2
(Measured at hub)
W
1
(Measured at hub)
C
(Arbor hole
diameter)
Note: Drive spokes optional; if used, dimensions B and D shall apply.
N
Table 6 – Reel Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size A B Minimum CD Minimum
8 mm 178±0.20
(7.000.008)
or
330±0.20
(13.000±0.008)
1.5
(0.059) 13.0+0.5/−0.2
(0.521+0.02/−0.008) 20.2
(0.795)
12 mm
16 mm
Variable Dimensions — Millimeters (Inches)
Tape Size N Minimum W1 W2 Maximum W3
8 mm
50
(1.969)
8.4+1.5/0.0
(0.331+0.059/0.0)
14.4
(0.567)
Shall accommodate tape
width without interference
12 mm
12.4+2.0/0.0
(0.488+0.078/0.0)
18.4
(0.724)
16 mm
16.4+2.0/0.0
(0.646+0.078/0.0)
22.4
(0.882)
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17© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1021_X7R_KPS_AUTO_SMD • 4/16/2019
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17
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KPS, X7R Dielectric, 10 – 250 VDC (Automotive Grade)
Figure 6 – Tape Leader & Trailer Dimensions
Trailer
160 mm minimum
Carrier Tape
END START
Round Sprocket Holes
Elongated Sprocket Holes
(32 mm tape and wider)
Top Cover Tape
Top Cover Tape
Punched Carrier
8 mm & 12 mm only
Embossed Carrier
Components
100 mm
minimum leader
400 mm minimum
Figure 7 – Maximum Camber
Carrier Tape
Round Sprocket Holes
1 mm maximum, either direction
Straight Edge
250 mm
Elongated Sprocket Holes
(32 mm & wider tapes)
ammmc compmm KEIVIEI' cumin:
18© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1021_X7R_KPS_AUTO_SMD • 4/16/2019
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18
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KPS, X7R Dielectric, 10 – 250 VDC (Automotive Grade)
KEMET Electronics Corporation Sales Offi ces
For a complete list of our global sales offi ces, please visit www.kemet.com/sales.
Disclaimer
All product specifi cations, statements, information and data (collectively, the “Information”) in this datasheet are subject to change. The customer is responsible for
checking and verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed. All Information given
herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied.
Statements of suitability for certain applications are based on KEMET Electronics Corporation’s (“KEMET) knowledge of typical operating conditions for such
applications, but are not intended to constitute – and KEMET specifi cally disclaims – any warranty concerning suitability for a specifi c customer application or use.
The Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any
technical advice inferred from this Information or otherwise provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes
no obligation or liability for the advice given or results obtained.
Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component
failures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards
(such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury
or property damage.
Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other
measures may not be required.
KEMET is a registered trademark of KEMET Electronics Corporation.

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