SP1001 Series Datasheet by Littelfuse Inc.

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© 2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 05/12/17
TVS Diode Arrays (SPA® Diodes)
General Purpose ESD Protection - SP1001 Series
Description
Zener diodes fabricated in a proprietary silicon avalanche
technology protect each I/O pin to provide a high level of
protection for electronic equipment that may experience
destructive electrostatic discharges (ESD). These robust
diodes can safely absorb repetitive ESD strikes above
the maximum level specified in the IEC 61000-4-2
international standard (Level 4, ±8kV contact discharge)
without performance degradation. Their very low loading
capacitance also makes them ideal for protecting high-
speed signal pins.
Pinout
Functional Block Diagram
Features
Low capacitance of 8pF
(TYP) per I/O
ESD protection of ±15kV
contact discharge, ±30kV
air discharge, (Level 4,
IEC 61000-4-2)
EFT protection, IEC
61000-4-4, 40A
(5/50ns)
Low leakage current of
0.5 to 0.1μA (MAX) at 5V
Small package saves
board space
Lightning protection, IEC
61000-4-5, 2nd edition 2A
(8/20µs)
AEC-Q101 qualified
(SC70-x packages)
RoHS compliant and lead-
free
Applications
Computer Peripherals
Mobile Phones
Digital Cameras
• Desktops/Notebooks
LCD/PDP TVs
Set Top Boxes
DVD Players
• MP3/PMP
1
34
5
*SP1001-02
(SC70-3) (SC70-5) (SC70-6)
1
3
2
*SP1001-04
1
3
5
4
6
*SP1001-05
2
2
1
34
51
3
5
4
6
2
2
SP1001-02
(SOT 553)
4
5
2
NC
NC
*Note: AEC-Q101 qualified
(SOT 553)
SP1001-05
(SOT 563)
SP1001-04 SP1001-05
(SOT 963)
1
3
5
4
6
2
SP1001-02 SP1001-02
2
3
1
213
4
2
5
2
13
SP1001-05
SP1001-04
4
54
65
Life Support Note:
Not Intended for Use in Life Support or Life Saving Applications
The products shown herein are not designed for use in life sustaining or life saving
applications unless otherwise expressly indicated.
RoHS
Pb
GREEN
Application Example
Shield
Ground
SP 1001-04JTG (SC70-5)
SP 1001-04XTG (SOT553)
Outside World
Input LCD module
Controller
D1
D2
D3
D4
Signal
Ground
SP1001 Series - 8pF 15kV Unidirectional TVS Array
Additional Information
Samples
Resources
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© 2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 05/12/17
TVS Diode Arrays (SPA® Diodes)
General Purpose ESD Protection - SP1001 Series
Absolute Maximum Ratings
Symbol Parameter Value Units
IPP Peak Current (tp=8/20μs) 2 A
TOP Operating Temperature –40 to 125 °C
TSTOR Storage Temperature –55 to 150 °C
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress only rating and operation of the device
at these or any other conditions above those indicated in the operational sections of this
specification is not implied.
Electrical Characteristics (TOP = 25°C)
Parameter Symbol Test Conditions Min Typ Max Units
Forward Voltage Drop VFIF=10mA 0.7 0.9 1. 2 V
Reverse Voltage Drop VRIR=1mA 6.0 8.5 V
Reverse Standoff Voltage VRWM IR≤1µA 5.5 V
Reverse Leakage Current ILEAK VR=5V 0.1 µA
Clamp Voltage1VC
IPP=1A, tp=8/20µs, Fwd 8.0 11. 0 V
IPP=2A, tp=8/20µs, Fwd 9.7 13.0 V
Dynamic Resistance RDYN (VC2 - VC1) / (IPP2 - IPP1)1. 7 Ω
ESD Withstand Voltage1,2 VESD
IEC61000-4-2 (Contact) ±15 kV
IEC61000-4-2 (Air) ±30 kV
Diode Capacitance1CD
Reverse Bias=0V 12 pF
Reverse Bias=2.5V 8 pF
Reverse Bias=5V 7 pF
Notes:
1 Parameter is guaranteed by device characterization
2 A minimum of 1,000 ESD pulses are applied at 1s intervals between the anode and common cathode of each diode
Thermal Information
Parameter Rating Units
Storage Temperature Range –55 to 150 °C
Maximum Junction Temperature 150 °C
Maximum Lead Temperature (Soldering
20s-40s)
260 °C
Capacitance vs. Reverse Bias
0
2
4
6
8
10
12
14
DC Bias (V)
Capacitance (pF)
0 0.5 11.5 2 2.5 3 3.5 4 4.5 5 5.5 6
Design Consideration
Because of the fast rise-time of the ESD transient,
placement of ESD devices is a key design consideration.
To achieve optimal ESD suppression, the devices should be
placed on the circuit board as close to the source of the ESD
transient as possible. Install the ESD suppressors directly
behind the connector so that they are the first board-level
circuit component encountered by the ESD transient. They
are connected from signal/data line to ground.
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© 2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 05/12/17
TVS Diode Arrays (SPA® Diodes)
General Purpose ESD Protection - SP1001 Series
Reflow Condition Pb – Free assembly
Pre Heat
- Temperature Min (Ts(min))150°C
- Temperature Max (Ts(max))200°C
- Time (min to max) (ts)60 – 180 secs
Average ramp up rate (Liquidus) Temp
(TL) to peak 3°C/second max
TS(max) to TL - Ramp-up Rate 3°C/second max
Reflow - Temperature (TL) (Liquidus) 217°C
- Temperature (tL)60 – 150 seconds
Peak Temperature (TP)260+0/-5 °C
Time within 5°C of actual peak
Temperature (tp)20 – 40 seconds
Ramp-down Rate 6°C/second max
Time 25°C to peak Temperature (TP)8 minutes max.
Do not exceed 260°C
Soldering Parameters
Part Numbering System
Ordering Information
Part Number Package Marking Min. Order Qty.
SP1001-02JTG SC70-3 A*23000
SP1001-02XTG SOT553 A*23000
SP1001-04JTG SC70-5 A*43000
SP1001-04XTG SOT553 A*43000
SP1001-05JTG SC70-6 A*53000
SP1001-05VTG SOT963 A*58000
SP1001-05XTG SOT563 A*53000
Part Marking System
SP1001
-0**TG
Series
Number of Channels
02 = 2 Channel
04 = 4 Channel
05 = 5 Channel
Package
J = SC70-3, SC70-5 or SC70-6
X = SOT553 or SOT563
V = SOT963
T= Tape & Reel
G= Green
TVS Diode Arrays
(SPA® Diodes)
Product Characteristics
Lead Plating Matte Tin (SC70-x) Pre-Plated Frame
(SOT5x3, SOT963)
Lead Material Copper Alloy
Lead Coplanarity 0.0004 inches (0.102mm)
Substitute
Material Silicon
Body Material Molded Epoxy
Flammability UL 94 V-0
Notes :
1. All dimensions are in millimeters
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
5. Package surface matte finish VDI 11-13.
A**
A**
Product Series
A = SP1001 series
Assembly Site
(varies)
Number of Channels
(varies)
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© 2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 05/12/17
TVS Diode Arrays (SPA® Diodes)
General Purpose ESD Protection - SP1001 Series
Package Dimensions — SC70
B
3
EHE
2
1
ee
D
A2 A
A1
C
L
Package SC70-3
Pins 3
JEDEC MO-203
Millimeters Inches
Min Max Min Max
A0.80 1. 10 0.031 0.043
A1 0.00 0.10 0.000 0.004
A2 0.70 1. 0 0 0.028 0.039
B0.15 0.30 0.006 0.012
c0.08 0.25 0.003 0.010
D1.85 2.25 0.073 0.089
E1. 15 1.35 0.045 0.053
e0.66 BSC 0.026 BSC
HE 2.00 2.40 0.079 0.094
L0.26 0.46 0.010 0.018
Package SC70-6
Pins 6
JEDEC MO-203
Millimeters Inches
Min Max Min Max
A0.80 1. 10 0.031 0.043
A1 0.00 0.10 0.000 0.004
A2 0.70 1. 0 0 0.028 0.039
B0.15 0.30 0.006 0.012
c0.08 0.25 0.003 0.010
D1.85 2.25 0.073 0.089
E1. 15 1.35 0.045 0.053
e0.65 BSC 0.026 BSC
HE 2.00 2.40 0.079 0.094
L0.26 0.46 0.010 0.018
D
A2 A
A1
C
L
EHE
2
13
654
BB
B
D
A2 A
A1
C
L
EHE
2
13
65
not used 4
ee
B
Package SC70-5
Pins 5
JEDEC MO-203
Millimeters Inches
Min Max Min Max
A0.80 1. 10 0.031 0.043
A1 0.00 0.10 0.000 0.004
A2 0.70 1. 0 0 0.028 0.039
B0.15 0.30 0.006 0.012
c0.08 0.25 0.003 0.010
D1.85 2.25 0.073 0.089
E1. 15 1.35 0.045 0.053
e0.65 BSC 0.026 BSC
HE 2.00 2.40 0.079 0.094
L0.26 0.46 0.010 0.018
SC70-5
Solder Pad Layout
SC70-6
Solder Pad Layout
SC70-3
Solder Pad Layout
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© 2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 05/12/17
TVS Diode Arrays (SPA® Diodes)
General Purpose ESD Protection - SP1001 Series
Package Dimensions SOT553 and SOT563
Package SOT 553
Pins 5
Millimeters Inches
Min Max Min Max
A0.50 0.60 0.020 0.024
B0.17 0.27 0.007 0.011
c0.08 0.18 0.003 0.007
D1.50 1.70 0.059 0.067
E1. 10 1.30 0.043 0.051
e0.50 BSC 0.020 BSC
L0.10 0.30 0.004 0.012
HE 1.50 1.70 0.059 0.067
5
(not used)
c
HE
L
A
D
64
23
E
e
B
Package SOT 563
Pins 6
Millimeters Inches
Min Max Min Max
A0.50 0.60 0.020 0.024
B0.17 0.27 0.007 0.011
c0.08 0.18 0.003 0.007
D1.50 1.70 0.059 0.067
E1. 10 1.30 0.043 0.051
e0.50 BSC 0.020 BSC
L0.10 0.30 0.004 0.012
HE 1.50 1.70 0.059 0.067
c
HE
L
A
D
64
23
E
e
B
5
SOT 553
Solder Pad Layout
SOT 563
Solder Pad Layout
Recommanded Solder Pad Layout
Package Dimensions — SOT963
Package SOT 963
Pins 6
Millimeters Inches
Min Nom Max Min Nom Max
A0.44 0.48 0.50 0.0173 0.0189 0.0197
B0.10 0.15 0.20 0.004 0.006 0.008
c0.05 0.10 0.15 0.002 0.004 0.006
D0.95 1. 0 0 1.05 0.037 0.039 0.041
E0.75 0.80 0.85 0.029 0.031 0.033
E1 0.95 1. 0 0 1.05 0.037 0.039 0.041
e0.35 BSC 0.014 BSC
L0.05 0.10 0.15 0.002 0.004 0.006
L1 0.125 0.15 0.175 0.005 0.006 0.007
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© 2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 05/12/17
TVS Diode Arrays (SPA® Diodes)
General Purpose ESD Protection - SP1001 Series
Embossed Carrier Tape & Reel Specification — SC70-5 and SC70-6
Millimetres Inches
Min Max Min Max
E1.65 1.85 0.065 0.073
F3.45 3.55 0.135 0.139
P2 1.95 2.05 0.077 0.081
D1.40 1.60 0.055 0.063
D1 1. 0 0 1.25 0.039 0.049
P0 3.90 4.10 0.154 0.161
10P0 40.0 ± 0.20 1.574 ± 0.008
W7.70 8.10 0.303 0.318
P3.90 4.10 0.153 0.161
A0 2.14 2.34 0.084 0.092
B0 2.24 2.44 0.088 0.096
K0 1. 12 1.32 0.044 0.052
t0.27 max 0.010 max
Dimensions
Embossed Carrier Tape & Reel Specification — SC70-3
Millimetres Inches
Min Max Min Max
E1.65 1.85 0.065 0.073
F3.45 3.55 0.135 0.139
P2 1.95 2.05 0.077 0.081
D1.40 1.60 0.055 0.063
D1 1. 0 0 1.25 0.039 0.049
P0 3.90 4.10 0.154 0.161
10P0 40.0 ± 0.20 1.574 ± 0.008
W7.70 8.10 0.303 0.318
P3.90 4.10 0.153 0.161
A0 2.30 2.50 0.090 0.098
A1 1.00 Ref 0.039 Ref
B0 2.30 2.50 0.090 0.098
B1 1.90 Ref 0.074
K0 1. 10 1.30 0.043 0.051
K1 0.60 Ref 0.023 Ref
t0.27 max 0.010
Dimensions
© 2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 05/12/17
TVS Diode Arrays (SPA® Diodes)
General Purpose ESD Protection - SP1001 Series
Embossed Carrier Tape & Reel Specification – SOT963
Symbol Millimetres Inches
Min Max Min Max
E1.65 1.85 0.065 0.073
F3.45 3.55 0.136 0.140
D1 0.45 0.55 0.018 0.022
D1.50 min 0.059 min
P0 3.90 4.10 0.154 0.161
10P0 40.0 ± 0.20 1.575 ± 0.008
P1.95 2.05 0.077 0.081
P2 1.95 2.05 0.077 0.081
W7.90 8.20 0.311 0.323
A0 1. 11 1.21 0.044 0.048
B0 1. 11 1.21 0.044 0.048
K0 0.58 0.68 0.023 0.027
t0.22 max 0.009 max
Embossed Carrier Tape & Reel Specification — SOT553 and SOT563
Millimetres Inches
Min Max Min Max
E1.65 1.85 0.065 0.073
F3.45 3.55 0.135 0.139
P2 1.95 2.05 0.077 0.081
D1.40 1.60 0.055 0.063
D1 0.45 0.55 0.017 0.021
P0 3.90 4.1 0.154 0.161
10P0 40.0 ± 0.20 1.574 ± 0.008
W7.70 8.10 0.303 0.318
P3.90 4.10 0.153 0.161
A0 1.73 1.83 0.068 0.072
B0 1.73 1.83 0.068 0.072
K0 0.64 0.74 0.025 0.029
t0.22 max .009 max
Dimensions
Dimensions
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test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications.
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