LLL185R71A104MA01 Ref Sheet Datasheet by Murata Electronics

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mm 5.Package t1! 4! F
LLL185R71A104MA01_ (0306, X7R:EIA, 0.1uF, DC10V)
_: packaging code Reference Sheet
1.Scope
  
2.MURATA Part NO. System
(Ex.)
3. Type & Dimensions
(Unit:mm)
4.Rated value
5.Package
Product specifications in this catalog are as of Jun.9,2017,and are subject to change or obsolescence without notice.
Please consult the approval sheet before ordering.
Please read rating and !Cautions first.
0.1 min.
(1)-1 L
0.8±0.1
(1)-2 W
1.6±0.1
e
LW Reversed Low ESL Chip Multilayer Ceramic Capacitors for General Purpose
mark
(4)
Rated
Voltage
DC 10 V
Temp. coeff
or Cap. Change
This product specification is applied to LW Reversed Low ESL Chip Multilayer Ceramic Capacitors used for General Electronic equipment.
(2) T
0.5±0.1
-15 to 15 %
(6)
Capacitance
Tolerance
0.1 uF
±20 %
(3) Temperature Characteristics
(Public STD Code):X7R(EIA)
g
0.25±0.15
(5) Nominal
Capacitance
L
K
(1)L/W
Dimensions (2)T
Dimensions (3)Temperature
Characteristics (4)Rated
Voltage (5)Nominal
Capacitance (6)Capacitance
Tolerance (8)Packaging Code

Code
LLL 18 5R7 1A 104 M A01 L
LLL185R71A104MA01-01 1
1 Rated Voltage Shown in Rated value. The rated voltage is defined as the maximum voltage
which may be applied continuously to the capacitor.
When AC voltage is superimposed on DC voltage,
VP-P or VO-P, whichever is larger, should be maintained
within the rated voltage range.
2 Appearance No defects or abnormalities. Visual inspection.
3 Dimension Within the specified dimensions. Using Measuring instrument of dimension.
4 Voltage proof No defects or abnormalities. Measurement Point : Between the terminations
Test Voltage : 250% of the rated voltage
Applied Time : 1s to 5 s
Charge/discharge current : 50mA max.
5 Insulation Resistance(I.R.)
CMeasurement Point    : Between the terminations
C Measurement Voltage : DC Rated Voltage
C:Nominal Capacitance Charging Time : 2 min
Charge/discharge current : 50mA max.
Measurement Temperature : Room Temperature
6 Capacitance Shown in Rated value. Measurement Temperature : Room Temperature
7 Dissipation Factor (D.F.) W.V.:25Vdc min. : 0.025max.
W.V.:16/10Vdc  : 0.035max.
W.V.:6.3/4Vdc   : 0.05max.
8
Temperature No bias R7 : Within +/-15% (-55°C to +125°C) The capacitance change should be measured after 5 min
Characteristics C7 : Within +/-22% (-55°C to +125°C) at each specified temp. stage.
of Capacitance Capacitance value as a reference is the value in step 3.
· Initial measurement
Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature,then measure.
9 Adhesive Strength of No removal of the terminations or other defect Solder the capacitor on the test substrate (glass epoxy board).
Termination should occur.
Applied Force       : 5N
Holding Time : 10+/-1s
Applied Direction : In parallel with the test substrate and vertical with
the capacitor side.
      Land Dimensions
Fig.1
10 Vibration Appearance No defects or abnormalities. Solder the capacitor on the test substrate (glass epoxy board).
(Refer to No.9)
Capacitance Within the specified initial value. Kind of Vibration : A simple harmonic motion
10Hz to 55Hz to 10Hz (1min)
D.F. Within the specified initial value. Total amplitude : 1.5mm
This motion should be applied for a period of 2h in each 3 mutually
perpendicular directions(total of 6h).
Specifications and Test Methods
No
Item
Specification
Test Method
(Ref. Standard:JIS C 5101, IEC60384
Step
Temperature(C)
Applying Voltage(Vdc)
1
Reference Temp.+/-2
No bias
2
Min.Operating Temp.+/-3
3
Reference Temp.+/-2
4
Max.Operating Temp.+/-3
5
Reference Temp.+/-2
c
b
a
Solder Resist
Chip Capacitor
Land
Type
Dimension (mm)
a
b
c
LLL15
0.2
0.8
1.0
LLL18
0.3
1.2
2.0
Capacitance
Frequency
Voltage
C
1.0+/-0.1kHz
1.0+/-0.2Vrms
JEMCFS-01244A 2
11 Solderability 75% of the terminations is to be soldered evenly and continuously. Test Method : Solder bath method
Flux : Solution of rosin ethanol 25(mass)%
Preheat :
80 to 120 for 10s to 30s
Solder : Sn-3.0Ag-0.5Cu
Solder Temp. :
245+/-5
Immersion time :
2+/-0.5s
12
Temperature Appearance No defects or abnormalities. Solder the capacitor on the test substrate (glass epoxy board).
Sudden Change (Refer to No.9)
Capacitance Within +/-7.5% Perform the 5 cycles according to the four heat treatments
Change shown in the following table.
D.F. Within the specified initial value.
I.R. Within the specified initial value.
Voltage proof No defects.
Exposure Time : 24+/-2h
· Initial measurement
Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature,then measure.
13
High Appearance No defects or abnormalities. Solder the capacitor on the test substrate (glass epoxy board).
Temperature (Refer to No.9)
High Humidity Capacitance Within +/-12.5%
Test Temperature :
40+/-2
(Steady) Change
Test Humidity :
90%RH to 95%RH
Test Time :
500+/-12h
D.F. W.V.:10Vdc min. : 0.05max. Applied Voltage : DC Rated Voltage
W.V.:6.3/4Vdc   : 0.075max. Charge/discharge current : 50mA max.
Exposure Time :
24+/-2h
I.R. 
14 Durability Appearance No defects or abnormalities. Solder the capacitor on the test substrate (glass epoxy board).
(Refer to No.9)
Capacitance Within +/-12.5% Test Temperature : Max. Operating Temp. +/-3
Change
Test Time :
1000+/-12h
Applied Voltage : 200% of the rated voltage
D.F. W.V.:10Vdc min. : 0.05max. Charge/discharge current : 50mA max.
W.V.:6.3/4Vdc   : 0.075max. Exposure Time : 24+/-2h
I.R. 
Initial measurement
Apply 200% of the rated DC voltage at the max. operating
temp. +/-3°C for 1h.
Remove and set for 24+/-2h at room temperature.
Perform initial measurement.
No
Item
Specification
Test Method
(Ref. Standard:JIS C 5101, IEC60384
Step
Temp.(C)
Time (min)
1
Min.Operating Temp.+0/-3
30+/-3
2
Room Temp.
2 to 3
3
Max.Operating Temp.+3/-0
30+/-3
4
Room Temp
2 to 3
JEMCFS-01244A 3
LLL1 U LLL18/LLR18
1.Tape Carrier Packaging(Packaging Code:E/D/L/F/J/K)
1.1 Minimum Quantity(pcs./reel)
 
Paper Tape Plastic Tape Paper Tape Plastic Tape
Code:E/D Code:L Code:F/J Code:K
2
20000 50000
3
10000 50000
LLL1U
10000 50000
LLL18/LLR18
4000 10000
54000 10000
64000 10000
93000 10000
54000 10000
74000 10000
M3000 10000
Package
LLL/LLR Type
Type
LLL15
LLL21
LLL31
JEMCFP-01893D 4
1.2 Dwmensions of Tape (1)LLL15/LLL1U (2)LLL1B/LLR1B/LLL21/LLL31 flk
1.2 Dimensions of Tape
 (2)GRMMD/GRM03/GRM15(W8P2 CODE:D/E/J/F)
(1)LLL15/LLL1U (in mm)
L W
T
2 0.2 +0.02/-0.04
0.5±0.05
LLL1U 4 0.6±0.05 0.4±0.05 0.75 0.9 max.
*3 Nominal value
 (2)LLL18/LLR18/LLL21/LLL31 (in mm)
L W
T
0.5 +0/-0.15
0.5 +0.05/-0.1
0.5±0.1
1.6±0.2 1.10±0.10 1.95±0.10
LLR18 1.6±0.15 1.05±0.10 1.85±0.10
0.5 +0/-0.15
6 0.6±0.1
9 0.85±0.1
5
0.5 +0/-0.15
7 0.7±0.1
M 1.15±0.1
*3 Nominal value
LLR31
1.6±0.15
3.2±0.15
1.90±0.20
3.50±0.20
1.85±0.10
0.8±0.15
0.5 +0.05/-0.1
LLL21
1.25±0.1
2.0±0.1
1.45±0.20
2.25±0.20
Type
Dimensions(Chip)
A *3
B *3
LLL18
5
0.8±0.1
1.6±0.1
1.05±0.10
LLL15
0.5 +0.07/-0.03
1.0±0.05
0.65
1.15
0.8 max.
3
0.3±0.05
Package
LLL/LLR Type
Type
Dimensions(Chip)
A *3
B *3
t
*1,22.0±0.05
2
4.0±0.1
8.0±0.3
3.5±0.05
0.05以下
1
φ1.5
+0.1
-0
t
*1,22.0±0.05
1.75±0.1
4.0±0.1
*1
φ1.5
+0.1
-0
1.75±0.1
8.0±0.3
3.5±0.05
t
*2
0.05 max.
8.0±0.3
4.0±0.1
3.5±0.05
1.75±0.1
1.7 max.
2.0±0.1
φ1.5
+0.1
-0
4.0±0.1
0.2±0.1
JEMCFP-01893D 5
Package
LLL/LLR Type
1
ップ詰め状態
(
単位:
mm)

10±1.5
16.5 max.
Top Tape : Thickness 0.05
(LLL15/LLL1U/LLL219/LLL31M type:0.06)
Feeding Hole :As specified in 1.2.
Hole for Chip : As specified in 1.2.
Base Tape : As specified in 1.2.
Bottom Tape :Thickness 0.05
(Only a bottom tape existence )
-3.0

 min.

2.0±0.5
Chip
(in mm)
Fig.1 Package Chips
Fig.2 Dimensions of Reel
Fig.3 Taping Diagram
JEMCFP-01893D 6
1.10 Break down Iorce cl top tape : 5N min. 1.11 Reel is made by resin and appeaser and dimension is shown in Fig 2. 18% : Z 1.13 Label that show the customer parts number, our pans number, our company name, inspection
1.3 Tapes for capacitors are wound clockwise shown in Fig.3.
(The sprocket holes are to the right as the tape is pulled toward the user.)
1.4 Part of the leader and part of the vacant section are attached as follows.
(in:mm)
1.5 Accumulate tolerance of sprocket holes pitch = ±0.3mm / 10 pitch
1.6 Chip in the tape is enclosed by top tape and bottom tape as shown in Fig.1.
1.7 The top tape and base tape are not attached at the end of the tape for a minimum of 5 pitches.
1.8 There are no jointing for top tape and bottom tape.
1.9 There are no fuzz in the cavity.
 1.10 Break down force of top tape : 5N min.
Break down force of bottom tape : 5N min. (Only a bottom tape existence )
 1.11 Reel is made by resin and appeaser and dimension is shown in Fig 2.
There are possibly to change the material and dimension due to some impairment.
 1.12 Peeling off force : 0.1N to 0.6N in the direction as shown below.
 1.13 Label that show the customer parts number, our parts number, our company name, inspection
number and quantity, will be put in outside of reel.
Package
LLL/LLR Type
1
ップ詰め状態
(
単位:
mm)
Tail vacant Section
Chip-mounting Unit
Leader vacant Section
Leader Unit
(Top Tape only)
Direction
of Feed
160 min.
190 min.
210 min.
1
ップ詰め状態
(
単位:
mm)
165180°
Top tape
JEMCFP-01893D 7
nmRata Please contact us pelore using our products for the applications listed below which require especially high reliability lor the prevention of delects which might directly cause damage to the third party's lile, body or property. Aircralt equipment Aerospace equipment Undersea equipment Power plant control equipment Medical equipment Transportation equipment(vehicles.trains,ships,etc.) Trailic signal equipment Disaster prevention / crime prevention equipment Data-processing equipment Application of similar complexity and/or reliability requirements to the applications listed in the above. Storage and Operation condition Room Temperature ol +5 to +40 and a Relative Humidity of 20% to 70%. (1) High temperature and humidity conditions may accelerate the deterioration ol solderapility due to oxidation ol the terminal electrodes and deterioration ol taping/packaging performance. (2) Prolonged storage may cause oxidation of the electrodes and deterioration of the packaging materials. (3) Store the capacitors in the original packaging without opening the smallest packing unit. Rating 1.1emperature Dependent Characteristics '75 75:2 25 a 25 an 75 WE
Caution
Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high reliability
  for the prevention of defects which might directly cause damage to the third party's life, body or property.
   ①Aircraft equipment Aerospace equipment Undersea equipment Power plant control equipment
   ⑤Medical equipment Transportation equipment(vehicles,trains,ships,etc.) Traffic signal equipment
   ⑧Disaster prevention / crime prevention equipment Data-processing equipment
   ⑩Application of similar complexity and/or reliability requirements to the applications listed in the above.
Storage and Operation condition
1. The performance of chip multilayer ceramic capacitors may be affected by the storage conditions.
1-1. Store the capacitors in the following conditions:
Room Temperature of +5 to +40 and a Relative Humidity of 20% to 70%.
(1) High temperature and humidity conditions may accelerate the deterioration of solderability due to oxidation
 
of the terminal electrodes and deterioration of taping/packaging performance.
Therefore, maintain the appropriate storage temperature and humidity.
(2) Prolonged storage may cause oxidation of the electrodes and deterioration of the packaging materials.
If more than six months have elapsed since delivery, check the mounting before use.
If more than one year has elapsed since delivery, also check the solderability before use.
Even if the storage period is short, do not exceed the specified atmospheric conditions.
(3) Store the capacitors in the original packaging without opening the smallest packing unit.
Do not exceed the above atmospheric conditions for any length of time.
1-2. Corrosive gas can react with the termination (external) electrodes or lead wires of capacitors, and result
in poor solderability. Do not store the capacitors in an atmosphere consisting of corrosive gas (e.g.,hydrogen
sulfide, sulfur dioxide, chlorine, ammonia gas etc.).
1-3. Due to moisture condensation caused by rapid humidity changes, or the photochemical change caused
by direct sunlight on the terminal electrodes and/or the resin/epoxy coatings, the solderability and
electrical performance may deteriorate. Do not store capacitors under direct sunlight or in high huimidity
conditions
Rating
1.Temperature Dependent Characteristics
1. The electrical characteristics of the capacitor can change with temperature.
1-1. For capacitors having larger temperature dependency, the capacitance may change with temperature
changes. The following actions are recommended in order to ensure suitable capacitance values.
(1) Select a suitable capacitance for the operating temperature range.
(2) The capacitance may change within the rated temperature.
When you use a high dielectric constant type capacitor in a circuit that needs a tight (narrow) capacitance
tolerance (e.g., a time-constant circuit), please carefully consider the temperature characteristics, and
carefully confirm the various characteristics in actual use conditions and the actual system.
[Example of Temperature Caracteristics X7R(R7)] [Example of Temperature Characteristics X5R(R6)]

!
-20
-10
-15
-5
5
0
10
15
20
Temperature (C)
-75 -50 -25 025 50 75 100 125 150
Capacitance Change (%)
-20
-10
-15
-5
5
0
10
15
20
Temperature (C)
-75 -50 -25 025 50 75 100
Capacitance Change (%)
JEMCFC-00639G 8
2.Measurement of Capacitance 3. Eglied Voltage Typlcal Voltage Applled lo the DC capaollor DC Voltage DC Vollage+AC AC Voltage Pulse Voltage T l WW l l (E Maximum possible applled voltage) 41192 at AEEIied Voltage and Self-heating Temgerature ol the capacitor body remalns below 20°C , when measunng at an amblenl temperature ol 25°C.
2.Measurement of Capacitance
1. Measure capacitance with the voltage and frequency specified in the product specifications.
1-1. The output voltage of the measuring equipment may decrease occasionally when capacitance is high.
Please confirm whether a prescribed measured voltage is impressed to the capacitor.
1-2. The capacitance values of high dielectric constant type capacitors change depending on the AC voltage applied.
Please consider the AC voltage characteristics when selecting a capacitor to be used in a AC circuit.
3.Applied Voltage
1. Do not apply a voltage to the capacitor that exceeds the rated voltage as called out in the specifications.
1-1. Applied voltage between the terminals of a capacitor shall be less than or equal to the rated voltage.
(1) When AC voltage is superimposed on DC voltage, the zero-to-peak voltage shall not exceed the rated DC voltage.
When AC voltage or pulse voltage is applied, the peak-to-peak voltage shall not exceed the rated DC voltage.
(2) Abnormal voltages (surge voltage, static electricity, pulse voltage, etc.) shall not exceed the rated DC voltage.
Typical Voltage Applied to the DC capacitor
DC Voltage DC Voltage+AC AC Voltage Pulse Voltage
(EMaximum possible applied voltage.)
1-2. Influence of over voltage
Over voltage that is applied to the capacitor may result in an electrical short circuit caused by the breakdown
of the internal dielectric layers .
The time duration until breakdown depends on the applied voltage and the ambient temperature.
4.Type of Applied Voltage and Self-heating Temperature
1.Confirm the operating conditions to make sure that no large current is flowing into the capacitor due to the
continuous application of an AC voltage or pulse voltage.
When a DC rated voltage product is used in an AC voltage circuit or a pulse voltage circuit, the AC current
or pulse current will flow into the capacitor; therefore check the self-heating condition.
Please confirm the surface temperature of the capacitor so that the temperature remains within the upper limits
of the operating temperature, including the rise in temperature due to self-heating. When the capacitor is
used with a high-frequency voltage or pulse voltage, heat may be generated by dielectric loss.
<Applicable to Rated Voltage of less than 100VDC>
The load should be contained so that the self-heating
 of the capacitor body remains below 20°C ,
 when measuring at an ambient temperature of 25°C.
Caution
!
1
10
100
0 1 2 3
Current (Ar.m.s.)
4 5 6
Temperature Rise (C)
[Example of Temperature Rise (Heat Generation) in Chip
Multilayer Ceramic Capacitors in Contrast to Ripple Current]
Sample: R(R1) characteristics 10 Rated voltage: DC10V
Ripple Current
100kHz
500kHz
1MHz
E
E
E
E
0
0
0
0
JEMCFC-00639G 9
5. DC Voltage and AC Voltage Charact capacitor changes depending on the DC voltage applied. Please consider the DC voltage characteristics when a type capacitor is used in a circuit that requires a constant circuit), please carelully consider the characteristics in the actual operating conditions ol the system. 6.0agac nceAg 9 have an Aging characteristic in which the capacitance 7.Vibration and Shock ol another printed circuit board should not be allowed to hit the capacitor in order to avoid 20 20 40 an an um Example of Change Over Time (Aging characteristics) ]
5. DC Voltage and AC Voltage Characteristic
1. The capacitance value of a high dielectric constant type
capacitor changes depending on the DC voltage applied.
Please consider the DC voltage characteristics when a
capacitor is selected for use in a DC circuit.
1-1. The capacitance of ceramic capacitors may change
sharply depending on the applied voltage. (See figure)
Please confirm the following in order to secure the
capacitance.
(1) Determine whether the capacitance change caused
by the applied voltage is within the allowed range .
(2) In the DC voltage characteristics, the rate of
capacitance change becomes larger as voltage
increases, even if the applied voltage is below
the rated voltage. When a high dielectric constant
type capacitor is used in a circuit that requires a
tight (narrow) capacitance tolerance (e.g., a time
constant circuit), please carefully consider the
voltage characteristics, and confirm the various
characteristics in the actual operating conditions
  of the system.
2. The capacitance values of high dielectric
constant type capacitors changes depending
on the AC voltage applied.
Please consider the AC voltage characteristics
when selecting a capacitor to be used in a
AC circuit.
6. Capacitance Aging
[ Example of Change Over Time (Aging characteristics) ]
1. The high dielectric constant type capacitors
have an Aging characteristic in which the capacitance
value decreases with the passage of time.
When you use a high dielectric constant type
capacitors in a circuit that needs a tight (narrow)
capacitance tolerance (e.g., a time-constant circuit),
please carefully consider the characteristics
of these capacitors, such as their aging, voltage,
and temperature characteristics. In addition,
check capacitors using your actual appliances
at the intended environment and operating conditions.
7.Vibration and Shock
1. Please confirm the kind of vibration and/or shock, its condition, and any generation of resonance.
Please mount the capacitor so as not to generate resonance, and do not allow any impact on the terminals.
2. Mechanical shock due to being dropped may cause damage or
a crack in the dielectric material of the capacitor.
Do not use a dropped capacitor because the quality and reliability
may be deteriorated.
3. When printed circuit boards are piled up or handled, the corner
 of another printed circuit board
should not be allowed to hit the capacitor in order to avoid
a crack or other damage to the capacitor.
Caution
-100
-80
-60
-40
-20
0
20
010 20 30
DC Voltage (V)
40 50
[Example of DC Voltage Characteristics]
Sample: X7R(R7) Characteristics , Rated Voltage 50VDC
Capacitance Change (%)
00.5 1
AC Voltage (Vr.m.s.)
1.5 2
[Example of AC Voltage Characteristics]
Sample: X7R(R7) Characteristics 
Capacitance Change (%)
30
20
10
0
-10
-20
-30
-40
-50
-60
Floor
Crack
Mounting printed circuit board
Crack
!
20
10
0
-10
-20
-30
-40
10
100
1000
10000
Time(h)
Capacitance Change(%)
C0G(5C)
X7R(R7)
X5R(R6)
JEMCFC-00639G 10
Soldering and Mounting 1.Mounling Pas n 1-1.Choose a mounting posuien that minimizes the stress imposed on the chip during flexing or bending oi the board. [Component Direction] Locate chip horizontal lo the ©D:l]->D:l] 2.lnlormalion before Mountin
Soldering and Mounting
1.Mounting Position
1. Confirm the best mounting position and direction that minimizes the stress imposed on the capacitor during flexing
or bending the printed circuit board.
1-1.Choose a mounting position that minimizes the stress imposed on the chip during flexing or bending of the board.
  [Component Direction]
Locate chip horizontal to the
direction in which stress acts.
(Bad Example) (Good Example)
[Chip Mounting Close to Board Separation Point]
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as possible
to reduce stress.
Stress Level
(1) Turn the mounting direction of the component parallel to the board separation surface.
A > D *1
(2) Add slits in the board separation part.
A > B
(3) Keep the mounting position of the component away from the board separation surface.
A > C
*1 A > D is valid when stress is added vertically to the perforation as with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.
[Mounting Capacitors Near Screw Holes]
When a capacitor is mounted near a screw hole, it may be affected by the board deflection that occurs during
the tightening of the screw. Mount the capacitor in a position as far away from the screw holes as possible.
 
2.Information before Mounting
1. Do not re-use capacitors that were removed from the equipment.
2. Confirm capacitance characteristics under actual applied voltage.
3. Confirm the mechanical stress under actual process and equipment use.
4. Confirm the rated capacitance, rated voltage and other electrical characteristics before assembly.
5. Prior to use, confirm the solderability of capacitors that were in long-term storage.
6. Prior to measuring capacitance, carry out a heat treatment for capacitors that were in long-term storage.
7.The use of Sn-Zn based solder will deteriorate the reliability of the MLCC.
Please contact our sales representative or product engineers on the use of Sn-Zn based solder in advance.
Caution
Contents of Measures
Screw Hole Recommended
!
1C
1B
1A
Perforation
Slit
A
B
C
D
1A
JEMCFC-00639G 11
nlenance of (he Mounlin ick and lace Machine [I ncorrect] E/ifluza\ [Correcl] / E\ /'E
3.Maintenance of the Mounting (pick and place) Machine
1. Make sure that the following excessive forces are not applied to the capacitors.
Check the mounting in the actual device under actual use conditions ahead of time.
1-1. In mounting the capacitors on the printed circuit board, any bending force against them shall be kept
to a minimum to prevent them from any damage or cracking. Please take into account the following precautions
and recommendations for use in your process.
(1) Adjust the lowest position of the pickup nozzle so as not to bend the printed circuit board.
  [Incorrect]
  [Correct]
2.Dirt particles and dust accumulated in the suction nozzle and suction mechanism prevent the nozzle from
moving smoothly. This creates excessive force on the capacitor during mounting, causing cracked chips.
causing cracked chips. Also, the locating claw, when worn out, imposes uneven forces on the chip
when positioning, causing cracked chips. The suction nozzle and the locating claw must be maintained,
checked and replaced periodically.
Caution
!
Board Guide
Board
Suction Nozzle
Deflection
Support Pin
JEMCFC-00639G 12
4-1.Rellow Soldering Temperaturel‘bl Table 1 :3 Series g Q E c 5 fi :3 Recommended Conoilions soldering time must be within the range shown above ~Drop m solder wettability ~Soider vowds ~Possible occurrence ol whiskering ~Drop m bonding strenglh ~Drop m self-alignmenl propemes ~Possible occurrence ol lombstones and/or shifting on lhe land patterns ol lhe circuit board This makes lhe chip more susceplible to mechanical and lhermal stress on lhe board and may cause the chips lo crack.
4-1.Reflow Soldering
1. When sudden heat is applied to the components, the [Standard Conditions for Reflow Soldering]
mechanical strength of the components will decrease
because a sudden temperature change causes
deformation inside the components. In order to prevent
mechanical damage to the components, preheating is
required for both the components and the PCB.
Preheating conditions are shown in table 1. It is required to
keep the temperature differential between the solder and

2. When components are immersed in solvent after mounting,

between the component and the solvent within the range
shown in the table 1. [Allowable Reflow Soldering Temperature and Time]
Table 1
Series
LLL
LLR
In the case of repeated soldering, the accumulated
Recommended Conditions
soldering time must be within the range shown above.
Lead Free Solder: Sn-3.0Ag-0.5Cu
3. When a capacitor is mounted at a temperature lower than the peak reflow temperature recommended by the
solder manufacturer, the following quality problems can occur. Consider factors such as the placement of

dropping below the peak temperature specified. Be sure to evaluate the mounting situation beforehand and
verify that none of the following problems occur.
Drop in solder wettability
Solder voids
Possible occurrence of whiskering
Drop in bonding strength
Drop in self-alignment properties
Possible occurrence of tombstones and/or shifting on the land patterns of the circuit board
4. Optimum Solder Amount for Reflow Soldering
4-1. Overly thick application of solder paste results in a excessive solder fillet height.
This makes the chip more susceptible to mechanical and thermal stress on the board and may cause the chips to crack.
4-2. Too little solder paste results in a lack of adhesive strength on the termination, which may result in chips breaking loose
from the PCB.
4-3. Please confirm that solder has been applied smoothly to the termination.
Make sure not to impose any abnormal mechanical shocks to the PCB.
Inverting the PCB
Lead Free Solder
Peak Temperature
240 to 260
Atmosphere
Air or N2
Caution
Chip Dimension(L/W) Code
Temperature Differential
190
15/1U/18/21/31
18
!
Temperature()
Peak Temperature
Soldering
Gradual
Cooling
Preheating
ΔT
60-120 seconds
30-60 seconds
Time
190
170
150
220
Soldering Temperature()
Soldering Time(s)
280
270
260
250
240
230
220
0
30
60
120
90
JEMCFC-00639G 13
4-2.Flow Solde ng [Standard Condlllons for Flow Suldenng] Table 2 Series Preneallng COfldlllOHS are shown in table 2. ll l5 required to Snldenng mpevamveCC Recommended Conditlons 5. Opllmum Solder Amuunl lor Flow Soldering
4-2.Flow Soldering
1. Do not apply flow soldering to chips not listed in Table 2.
     [Standard Conditions for Flow Soldering]
Table 2
Series
LLL
2. When sudden heat is applied to the components, the
mechanical strength of the components will decrease
because a sudden temperature change causes
deformation inside the components. In order to prevent
mechanical damage to the components, preheating is
required for both of the components and the PCB.
Preheating conditions are shown in table 2. It is required to
[Allowable Flow Soldering Temperature and Time]
keep the temperature differential between the solder and

3. Excessively long soldering time or high soldering
temperature can result in leaching of the terminations,
causing poor adhesion or a reduction in capacitance value
due to loss of contact between the inner electrodes and terminations.
4. When components are immersed in solvent after mounting,

between the component and solvent within the range
shown in the table 2. In the case of repeated soldering, the accumulated
soldering time must be within the range shown above.
Recommended Conditions
Lead Free Solder: Sn-3.0Ag-0.5Cu
5. Optimum Solder Amount for Flow Soldering
5-1. The top of the solder fillet should be lower than the
thickness of the components. If the solder amount is
excessive, the risk of cracking is higher during
board bending or any other stressful condition.
Preheating Peak Temperature
100 to 120
Soldering Peak Temperature
250 to 260
Atmosphere
Air or N2
Caution
Chip Dimension(L/W) Code
Temperature Differential
21/31
150
Lead Free Solder
!
Soldering mperature()
Soldering Time(s)
280
270
260
250
240
230
220
0
10
20
40
30
Temperature()
Soldering
Peak
Temperature
Preheating
Peak
Temperature
30-90 seconds
Preheating
5 seconds max.
Time
Gradual
Cooling
Soldering
ΔT
Up to Chip Thickness
Adhesive
in section
JEMCFC-00639G 14
5.Washing 6.Eleclrical Tes! on Primed Circ i: Board 7.Prinled Circuit Board Cro in 2. Check me cropping melhod forthe prmled cxrcuit board m advance
5.Washing
Excessive ultrasonic oscillation during cleaning can cause the PCBs to resonate, resulting in cracked chips
or broken solder joints. Before starting your production process, test your cleaning equipment / process to insure
it does not degrade the capacitors.
6.Electrical Test on Printed Circuit Board
1. Confirm position of the support pin or specific jig, when inspecting the electrical performance of a
capacitor after mounting on the printed circuit board.
1-1. Avoid bending the printed circuit board by the pressure of a test-probe, etc.
The thrusting force of the test probe can flex the PCB, resulting in cracked chips or open solder
joints. Provide support pins on the back side of the PCB to prevent warping or flexing.
Install support pins as close to the test-probe as possible.
1-2. Avoid vibration of the board by shock when a test -probe contacts a printed circuit board.
[Not Recommended] [Recommended]
7.Printed Circuit Board Cropping
1. After mounting a capacitor on a printed circuit board, do not apply any stress to the capacitor that
caused bending or twisting the board.
1-1. In cropping the board, the stress as shown may cause the capacitor to crack.
Cracked capacitors may cause deterioration of the insulation resistance, and result in a short.
Avoid this type of stress to a capacitor.
[Bending] [Twisting]
2. Check the cropping method for the printed circuit board in advance.
2-1. Printed circuit board cropping shall be carried out by using a jig or an apparatus (Disc separator, router
type separator, etc.) to prevent the mechanical stress that can occur to the board.
* When a board separation jig or disc separator is used, if the following precautions are not observed,
a large board deflection stress will occur and the capacitors may crack.
Use router type separator if at all possible.
Notes
Hand and nipper
separation apply a high
level of stress.
Use another method.
· Board handling
· Board bending direction
· Layout of capacitors
· Board handling
· Layout of slits
· Design of V groove
· Arrangement of blades
· Controlling blade life
Board handling
Level of stress on board
High
Medium
Medium
Low
Recommended
×
*
*
Caution
Board Separation Method
Hand Separation
Nipper Separation
(1) Board Separation Jig
Board Separation Apparatus
2) Disc Separator
3) Router Type Separator
!
Peeling
Test-probe
Support Pin
Test-probe
1A
JEMCFC-00639G 15
(Measures) [Hand Separation] rn Pnnted 2mm Dlrection ol ioad Load paint a 3} board Ii ii is difficuii Io introduce a rouier Iype separator, impiement the following measures [Cross-section Diagram] :{2 % [V-groove Design] LJ
(1) Example of a suitable jig
[In the case of Single-side Mounting]
An outline of the board separation jig is shown as follows.
Recommended example: Stress on the component mounting position can be minimized by holding the
portion close to the jig, and bend in the direction towards the side where the capacitors are mounted.
Not recommended example: The risk of cracks occurring in the capacitors increases due to large stress
being applied to the component mounting position, if the portion away from the jig is held and bent in the
direction opposite the side where the capacitors are mounted.
[Outline of jig] [Hand Separation]
[In the case of Double-sided Mounting]
Since components are mounted on both sides of the board, the risk of cracks occurring can not be avoided with the
above method. Therefore, implement the following measures to prevent stress from being applied to the components.
  (Measures)
(1) Consider introducing a router type separator.
   If it is difficult to introduce a router type separator, implement the following measures.
(Refer to item 1. Mounting Position)
(2) Mount the components parallel to the board separation surface.
(3) When mounting components near the board separation point, add slits in the separation position
near the component.
(4) Keep the mounting position of the components away from the board separation point.
(2) Example of a Disc Separator
An outline of a disc separator is shown as follows. As shown in the Principle of Operation, the top
blade and bottom blade are aligned with the V-grooves on the printed circuit board to separate the board.
In the following case, board deflection stress will be applied and cause cracks in the capacitors.
(1) When the adjustment of the top and bottom blades are misaligned, such as deviating in the top-bottom,
left-right or front-rear directions
(2) The angle of the V groove is too low, depth of the V groove is too shallow, or the V groove is misaligned
top-bottom
IF V groove is too deep, it is possible to brake when you handle and carry it. Carefully design depth of the
V groove with consideration about strength of material of the printed circuit board.
[ Outline of Machine ] [ Principle of Operation ] [ Cross-section Diagram ]
[Disc Separator]
Top Blade Top Blade Top Blade Top Blade
Bottom Blade Bottom Blade Bottom Blade Bottom Blade
[V-groove Design]
Depth too Deep
Example of Recommended
V-groove Design
Not Recommended
Left-right Misalignment
Low-Angle
Depth too Shallow
Caution
Recommended
Not recommended
Recommended
Not recommended
Top-bottom Misalignment
Left-right Misalignment
Front-rear Misalignment
Printed Circuit Board
Top Blade
V-groove
Bottom Blade
Top Blade Printed Circuit Board
V-groove
!
Board Cropping Jig
V-groove
Printed Circuit Board
Printed circuit
board
Components
Load point
Direction of
load
Printed circuit
board
Component
s
Load point
Direction of load
JEMCFC-00639G 16
The router type separamr perlorms cutting by a router 8. Assembly capacimrs have been moumed on (he opposne side. fig} or the bending may damage mounted components on the board. 1 Socket %
(3) Example of Router Type Separator
The router type separator performs cutting by a router
rotating at a high speed. Since the board does not
bend in the cutting process, stress on the board can
be suppressed during board separation.
When attaching or removing boards to/from the router type
separator, carefully handle the boards to prevent bending.
8. Assembly
1. Handling
If a board mounted with capacitors is held with one hand, the board may bend.
Firmly hold the edges of the board with both hands when handling.
If a board mounted with capacitors is dropped, cracks may occur in the capacitors.
Do not use dropped boards, as there is a possibility that the quality of the capacitors may be impaired.
2. Attachment of Other Components
2-1. Mounting of Other Components
Pay attention to the following items, when mounting other components on the back side of the board after
capacitors have been mounted on the opposite side.
When the bottom dead point of the suction nozzle is set too low, board deflection stress may be applied
to the capacitors on the back side (bottom side), and cracks may occur in the capacitors.
· After the board is straightened, set the bottom dead point of the nozzle on the upper surface of the board.
· Periodically check and adjust the bottom dead point.
2-2. Inserting Components with Leads into Boards
When inserting components (transformers, IC, etc.) into boards, bending the board may cause cracks in the
capacitors or cracks in the solder. Pay attention to the following.
· Increase the size of the holes to insert the leads, to reduce the stress on the board during insertion.
· Fix the board with support pins or a dedicated jig before insertion.
· Support below the board so that the board does not bend. When using support pins on the board,
periodically confirm that there is no difference in the height of each support pin.
2-3. Attaching/Removing Sockets and/or Connectors
Insertion and removal of sockets and connectors, etc., might cause the board to bend.
Please insure that the board does not warp during insertion and removal of sockets and connectors, etc.,
    or the bending may damage mounted components on the board.
2-4. Tightening Screws
The board may be bent, when tightening screws, etc. during the attachment of the board to a shield or
chassis. Pay attention to the following items before performing the work.
· Plan the work to prevent the board from bending.
· Use a torque screwdriver, to prevent over-tightening of the screws.
· The board may bend after mounting by reflow soldering, etc. Please note, as stress may be applied
to the chips by forcibly flattening the board when tightening the screws.
Caution
!
Suction Nozzle
Component with Leads
Socket
Screwdriver
[ Outline Drawing ] Router
JEMCFC-00639G 17
Others 1. Under Ogemion of Eguigmenl 2. Others
Others
1. Under Operation of Equipment
1-1. Do not touch a capacitor directly with bare hands during operation in order to avoid the danger of an electric shock.
1-2. Do not allow the terminals of a capacitor to come in contact with any conductive objects (short-circuit).
Do not expose a capacitor to a conductive liquid, inducing any acid or alkali solutions.
1-3. Confirm the environment in which the equipment will operate is under the specified conditions.
Do not use the equipment under the following environments.
(1) Being spattered with water or oil.
(2) Being exposed to direct sunlight.
(3) Being exposed to ozone, ultraviolet rays, or radiation.
(4) Being exposed to toxic gas (e.g., hydrogen sulfide, sulfur dioxide, chlorine, ammonia gas etc.)
(5) Any vibrations or mechanical shocks exceeding the specified limits.
(6) Moisture condensing environments.
1-4. Use damp proof countermeasures if using under any conditions that can cause condensation.
2. Others
2-1. In an Emergency
(1) If the equipment should generate smoke, fire, or smell, immediately turn off or unplug the equipment.
If the equipment is not turned off or unplugged, the hazards may be worsened by supplying continuous power.
(2) In this type of situation, do not allow face and hands to come in contact with the capacitor or burns may be caused
by the capacitor's high temperature.
2-2. Disposal of waste
When capacitors are disposed of, they must be burned or buried by an industrial waste vendor with the appropriate
licenses.
2-3. Circuit Design
(1) Addition of Fail Safe Function
Capacitors that are cracked by dropping or bending of the board may cause deterioration of the
insulation resistance, and result in a short. If the circuit being used may cause an electrical shock,
smoke or fire when a capacitor is shorted, be sure to install fail-safe functions, such as a fuse,
to prevent secondary accidents.
(2) This series are not safety standard certified products.
2-4. Remarks
Failure to follow the cautions may result, worst case, in a short circuit and smoking when the product is used.
The above notices are for standard applications and conditions. Contact us when the products are used in special
mounting conditions.
Select optimum conditions for operation as they determine the reliability of the product after assembly.
The data herein are given in typical values, not guaranteed ratings.
Caution
!
JEMCFC-00639G 18
Rating 1.09am ng Temgeralure 2.Atmosghere Surround gs gaseous and liguidl electrodes may result in breakdown when the capacitor is exposed lo corrosive or volatile gases or solvents 3.Piezo-eleclric Phenomenon
Rating
1.Operating Temperature
1. The operating temperature limit depends on the capacitor.
1-1. Do not apply temperatures exceeding the maximum operating temperature.
It is necessary to select a capacitor with a suitable rated temperature that will cover the operating temperature range.
It is also necessary to consider the temperature distribution in equipment and the seasonal temperature variable
factor.
1-2. Consider the self-heating factor of the capacitor
The surface temperature of the capacitor shall not exceed the maximum operating temperature including self-heating.
2.Atmosphere Surroundings (gaseous and liquid)
1. Restriction on the operating environment of capacitors.
1-1. Capacitors, when used in the above, unsuitable, operating environments may deteriorate due to the corrosion
of the terminations and the penetration of moisture into the capacitor.
1-2. The same phenomenon as the above may occur when the electrodes or terminals of the capacitor are subject
to moisture condensation.
1-3. The deterioration of characteristics and insulation resistance due to the oxidization or corrosion of terminal
  electrodes may result in breakdown when the capacitor is exposed to corrosive or volatile gases or solvents
for long periods of time.
3.Piezo-electric Phenomenon
1. When using high dielectric constant type capacitors in AC or pulse circuits, the capacitor itself vibrates
at specific frequencies and noise may be generated.
Moreover, when the mechanical vibration or shock is added to capacitor, noise may occur.
Notice
JEMCFC-00639G 19
Soldering and Mounting 1.PCB Design Pattern Forms Cf % in section in section in section in section \% in section in section
Soldering and Mounting
1.PCB Design
1. Notice for Pattern Forms
1-1. Unlike leaded components, chip components are susceptible to flexing stresses since they are mounted
directly on the substrate.
They are also more sensitive to mechanical and thermal stresses than leaded components.
Excess solder fillet height can multiply these stresses and cause chip cracking.
When designing substrates, take land patterns and dimensions into consideration to eliminate the possibility
of excess solder fillet height.
1-2. There is a possibility of chip cracking caused by PCB expansion/contraction with heat, because stress
on a chip is different depending on PCB material and structure.When the thermal expansion coefficient
greatly differs between the board used for mounting and the chip,it will cause cracking of the chip due to
the thermal expansion and contraction. When capacitors are mounted on a fluorine resin printed circuit
board or on a single-layered glass epoxy board, it may also cause cracking of the chip for the same reason.
Pattern Forms
in section in section
in section in section
in section in section
Placing of Leaded
Components
after Chip Component
Lateral Mounting
Notice
Prohibited
Correct
Placing Close to Chassis
Placing of Chip
Components
and Leaded
Components
Chassis
Solder (ground)
Electrode Pattern
Solder Resist
Lead Wire
Solder Resist
Lead Wire
Soldering Iron
Solder Resist
ソ
Solder Resist
JEMCFC-00639G 20
Please confirm the suilaole land dimension by Table 1 Flow Soldering Method Flow soldering can only be used for proouols wilh a chip size of 1.25x2.0mm lo 1.6x32mm. Table 2 Rellow Soldering Method
2. Land Dimensions
 Please confirm the suitable land dimension by
evaluating of the actual SET / PCB.
Table 1 Flow Soldering Method
Flow soldering can only be used for products with a chip size of 1.25×2.0mm to 1.6×3.2mm.
(in mm)
Table 2 Reflow Soldering Method
(in mm)
3.Amount of solder
3-1.Because the LLL152 series is a super thin article,Overly thick application of solder paste results in a excessive solder
   fillet height. This makes the chip more susceptible to thermal stress by the temperature sudden change and
may cause the chips to crack. We recommend that it limits amount of solder as follows.
60 to 90
a (mm) 0.18 to 0.22
b (mm) 0.20 to 0.25
c (mm) 1.00
*1 aperture ratio of metal mask stencil
= Thickness of metal mask stencil / Land area
Land Pattern
Dimensions
Guideline
Thickness of metal mask stencil(µm)
aperture ratio of metal mask stencil
60% to 100%
(*See diagram below)
LLL
31
1.6×3.2
0.6 to 0.8
0.6 to 0.7
2.6 to 2.8
LLL
21
1.25×2.0
0.4 to 0.5
0.4 to 0.5
1.4 to 1.8
LLL/LLR
18
0.8×1.6
0.2 to 0.3
0.3 to 0.4
1.4 to 1.6
LLL
1U
0.6×1.0
0.20 to 0.25
0.25 to 0.35
0.7 to 1.0
LLL
153
0.5×1.0
0.15 to 0.20
0.20 to 0.25
0.7 to 1.0
Series
Chip Dimension
(L/W/(T)) Code
Chip(L×W)
a
b
c
LLL
31
1.6×3.2
0.6 to 1.0
0.8 to 0.9
2.6 to 2.8
LLL
21
1.25×2.0
0.4 to 0.7
0.5 to 0.7
1.4 to 1.8
Notice
Series
Chip Dimension
(L/W) Code
Chip(L×W)
a
b
c
50%
55%
60%
65%
70%
75%
80%
85%
90%
95%
100%
50 60 70 80 90 100 110 120
開口1)
厚(μm
Range of
Guidelin
aperture ratio of metal
mask stencil(*1)
Thickness of metal mask stencil(µm)
c
b
a
Solder Resist
Chip Capacitor
Land
c
b
a
Solder Resist
Chip Capacitor
Land
JEMCFC-00639G 21
2.ltem to be con med for Flow sorder g If you want to temporarily attach the capacitor to the board using an adhesive agent belore soldering the capacitor, lirst be sure that the conditions are appropriate lor affixing the capacitor. If the dimensions of the land, the type of adhesive,the amount of coating, the contact surface area, the curing temperature. or other conditions are inappropriate. the characteristics of the capacitor may deteriorate. (1) Selection of Adhesive Epoxy resins are a typical class of adhesive. To select the proper adhesive, consider the folloWing points. 1) There must be enough adhesive strength to prevent the component lrorn loosening or slipping during the mounting process. 2) The adhesive strength must not decrease when exposed to moisture during soldering. 3) The adhesive must have good coatability and shape retention properties. 4) The adhesive must have a long pot life. 5) The curing time must be short. 6) The adhesive must not be corrosive to the exterior of the capacitor or the board. 7) The adhesive must have good insulation properties. 8) The adhesive must not emit toxic gases or otherwise be harmful to health. 9) The adhesive must be tree of halogenated compounds. (2) Use the lollowing illustration as a guide to the amount of adhesive to apply. Chip Dimension (L/W) Code:21/3i \
3. Board Design
When designing the board, keep in mind that the amount of strain which occurs will increase depending on the size
and material of the board.
2.Item to be confirmed for Flow sordering
  If you want to temporarily attach the capacitor
  to the board using an adhesive agent before
  soldering the capacitor, first be sure that the
  conditions are appropriate for affixing the
  capacitor. If the dimensions of the land, the type of adhesive,the amount of coating, the contact surface area,
  the curing temperature, or other conditions are inappropriate, the characteristics of the capacitor may deteriorate.
1. Selection of Adhesive
1-1. Depending on the type of adhesive, there may be a decrease in insulation resistance. In addition, there is a chance
that the capacitor might crack from contractile stress due to the difference in the contraction rate of the capacitor
and the adhesive.
1-2. If there is not enough adhesive, the contact surface area is too small, or the curing temperature or curing time
are inadequate, the adhesive strength will be insufficient and the capacitor may loosen or become disconnected
during transportation or soldering. If there is too much adhesive, for example if it overflows onto the land, the result
could be soldering defects, loss of electrical connection, insufficient curing, or slippage after the capacitor is mounted.
Furthermore, if the curing temperature is too high or the curing time is too long, not only will the adhesive strength
be reduced, but solderability may also suffer due to the effects of oxidation on the terminations (outer electrodes)
of the capacitor and the land surface on the board.
 (1) Selection of Adhesive
 Epoxy resins are a typical class of adhesive. To select the proper adhesive, consider the following points.
 1) There must be enough adhesive strength to prevent the component from loosening or slipping during the
    mounting process.
 2) The adhesive strength must not decrease when exposed to moisture during soldering.
  3) The adhesive must have good coatability and shape retention properties.
  4) The adhesive must have a long pot life.
 5) The curing time must be short.
  6) The adhesive must not be corrosive to the exterior of the capacitor or the board.
  7) The adhesive must have good insulation properties.
  8) The adhesive must not emit toxic gases or otherwise be harmful to health.
  9) The adhesive must be free of halogenated compounds.
 (2) Use the following illustration as a guide to the amount of adhesive to apply.
  Chip Dimension (L/W) Code:21/31
Notice
Relationship with amount of strain to the board thickness, length, width, etc.]
3PL
2Ewh2
Relationship between load and strain
When the load is constant, the following relationship can be established.
· As the distance between the supporting points (L) increases,the amount of strain also increases.

· As the elastic modulus (E) decreases, the amount of strain increases.

· As the board width (w) decreases, the amount of strain increases.

· As the board thickness (h) decreases, the amount of strain increases.

Since the board thickness is squared, the effect on the amount of strain becomes even greater.
Strain on center of board (st)
LDistance between supporting points (mm)
w Board width (mm)
h Board thickness (mm)
E Elastic modulus of board (N/m2=Pa)
Y Deflection (mm)
P Load (N)
Y
P
h
w
L
Land
Resist
Adhesive
Cross Sectional View
Resist
Side View
JEMCFC-00639G 22
so apply llux thihly and evenly throughout. (A foaming system is generally used for flow solderrihg.) sullicient oleahing. Use flux With a halide content at 0.1% max. ("Water-soluble llux can be defined as hon-rosin type flux including wash-type llux and non-wash-type flux.) Set temperature and time to ensure that leaching of the mounted on substrate. 3.Rellow soldering by this kind of solder paste. 4.Wash g 5.Coating @v __,—.‘ 3 The halogen system substance and organic acid are included in coating material, and a Chip corrodes by the kind of Coating material. Do not use strong acid type.
2.Flux
2-1. An excessive amount of flux generates a large quantity of flux gas, which can cause a deterioration of solderability,
  so apply flux thinly and evenly throughout. (A foaming system is generally used for flow solderring.)
2-2. Flux containing too high a percentage of halide may cause corrosion of the terminations unless there is
  sufficient cleaning. Use flux with a halide content of 0.1% max.
2-3. Do not use strong acidic flux.
2-4. Do not use water-soluble flux.*
  (*Water-soluble flux can be defined as non-rosin type flux including wash-type flux and non-wash-type flux.)
3.Leaching of the terminations
Set temperature and time to ensure that leaching of the
terminations does not exceed 25% of the chip end
area as a single chip (full length of the edge A-B-C-D
shown at right) and 25% of the length A-B shown as
mounted on substrate.
3.Reflow soldering
The halogen system substance and organic acid are included in solder paste, and a chip corrodes
  by this kind of solder paste.
Do not use strong acid flux.
Do not use water-soluble flux.*
(*Water-soluble flux can be defined as non-rosin type flux including wash-type flux and non-wash-type flux.)
4.Washing
1. Please evaluate the capacitor using actual cleaning equipment and conditions to confirm the quality,
and select the solvent for cleaning.
2. Unsuitable cleaning solvent may leave residual flux or other foreign substances, causing deterioration of
electrical characteristics and the reliability of the capacitors.
3. Select the proper cleaning conditions.
3-1. Improper cleaning conditions (excessive or insufficient) may result in the deterioration of the performance
of the capacitors.
5.Coating
1. A crack may be caused in the capacitor due to the stress of the thermal contraction of the resin during curing process.
The stress is affected by the amount of resin and curing contraction. Select a resin with low curing contraction.
The difference in the thermal expansion coefficient between a coating resin or a molding resin and the capacitor
may cause the destruction and deterioration of the capacitor such as a crack or peeling, and lead to the deterioration
of insulation resistance or dielectric breakdown.
Select a resin for which the thermal expansion coefficient is as close to that of the capacitor as possible.
A silicone resin can be used as an under-coating to buffer against the stress.
2. Select a resin that is less hygroscopic.
Using hygroscopic resins under high humidity conditions may cause the deterioration of the insulation resistance
of a capacitor. An epoxy resin can be used as a less hygroscopic resin.
3The halogen system substance and organic acid are included in coating material, and a chip corrodes
  by the kind of Coating material. Do not use strong acid type.
Notice
A
B
D
C
Termination
As a Single Chip
As Mounted on Substrate
A
B
JEMCFC-00639G 23
Others 1.1ransgorla on low air temperature : -40 change at temperature air/air : -25 /+25 low air pressure :30 kPa change at air pressure :6 kPa/mint capacitors, the capacitance may change depending on the operating conditions in the actual system. which wiii aiiect the capacitance value of the capacitcrt
Others
1.Transportation
1. The performance of a capacitor may be affected by the conditions during transportation.
1-1. The capacitors shall be protected against excessive temperature, humidity and mechanical force during transportation.
(1) Climatic condition
 ・ low air temperature : -40
change of temperature air/air : -25/+25
low air pressure : 30 kPa
change of air pressure : 6 kPa/min.
(2) Mechanical condition
Transportation shall be done in such a way that the boxes are not deformed and forces are not directly passed
on to the inner packaging.
1-2. Do not apply excessive vibration, shock, or pressure to the capacitor.
(1) When excessive mechanical shock or pressure is applied to a capacitor, chipping or cracking may occur
in the ceramic body of the capacitor.
(2) When the sharp edge of an air driver, a soldering iron, tweezers, a chassis, etc. impacts strongly on the surface
of the capacitor, the capacitor may crack and short-circuit.
1-3. Do not use a capacitor to which excessive shock was applied by dropping etc.
A capacitor dropped accidentally during processing may be damaged.
2.Characteristics Evaluation in the Actual System
1. Evaluate the capacitor in the actual system,to confirm that there is no problem with the performance and specification
values in a finished product before using.
2. Since a voltage dependency and temperature dependency exists in the capacitance of high dielectric type ceramic
capacitors, the capacitance may change depending on the operating conditions in the actual system.
Therefore,be sure to evaluate the various characteristics, such as the leakage current and noise absorptivity,
which will affect the capacitance value of the capacitor.
3. In addition,voltages exceeding the predetermined surge may be applied to the capacitor by the inductance in
the actual system. Evaluate the surge resistance in the actual system as required.
Notice
JEMCFC-00639G 24
NOTE
1.Please make sure that your product has been evaluated in view of your specifications with our
product being mounted to your product.
2.Your are requested not to use our product deviating from this product specification.
3.We consider it not appropriate to include any terms and conditions with regard to the business
transaction in the product specifications, drawings or other technical documents. Therefore,
if your technical documents as above include such terms and conditions such as warranty clause,
product liability clause, or intellectual property infringement liability clause, they will be deemed to
be invalid.
!
JEMCFC-00639G 25

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