Specifications and Test Methods 3p Datasheet by Murata Electronics

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Continued on the following page.
Step Temperature (°C)
25±2
Min. Operating Temp.±3
25±2
Max. Operating Temp.±2
25±2
1
2
3
4
5
* "Room condition" Temperature: 15 to 35°C, Relative humidity: 45 to 75%, Atmospheric pressure: 86 to 106kPa
Solder the capacitor to the test jig (glass epoxy board).
The capacitor should be subjected to a simple harmonic motion
having a total amplitude of 1.5mm, the frequency being varied
uniformly between the approximate limits of 10 and 55Hz. The
frequency range, from 10 to 55Hz and return to 10Hz, should be
traversed in approximately 1 min. This motion should be applied
for a period of 2 hrs. in each of 3 mutually perpendicular
directions (total of 6 hrs.).
10
Vibration
Resistance
Appearance
No defects or abnormalities
Capacitance
Within the specified tolerance
D.F. 0.025 max.
Solder the capacitor to the testing jig (glass epoxy board) shown
in Fig. 1.
Then apply 10N force in the direction of the arrow.
The soldering should be done using the reflow method and
should be conducted with care so that the soldering is uniform
and free of defects such as heat shock.
Fig. 1
9Adhesive Strength
of Termination No removal of the terminations or other defect should occur.
The capacitance measurement should be made at each step
specified in the Table.
U*ÀiÌÀi>ÌiÌ
Perform a heat treatment at 150
+0
–10
°C for 60±5 min. and then
let sit for 24±2 hrs. at room condition.*
8
Capacitance
Temperature
Characteristics
Cap. Change
Within ±15%
(Temp. Range: –55 to +125°C)
7Dissipation
Factor (D.F.) 0.025 max.
The capacitance/D.F. should be measured at a frequency of
1±0.2kHz and a voltage of AC1±0.2V(r.m.s.).
6 Capacitance Within the specified tolerance
The insulation resistance should be measured with rated
voltage (DC500±50V in case of rated voltage: DC630V,
DC1kV) and within 60±5 sec. of charging.
5
Insulation Resistance
(I.R.)
CU0.01μF: More than 100MΩs&
CF0.01μF: More than 10,000MΩ
No failure should be observed when 150% of the rated voltage
(200% of the rated voltage in case of rated voltage: DC200V,
DC250V, 120% of the rated voltage in case of rated voltage:
DC1kV) is applied between the terminations for 1 to 5 sec.,
provided the charge/discharge current is less than 50mA.
4 Dielectric Strength No defects or abnormalities
Using calipers and micrometers
3 Dimensions Within the specified dimensions
Visual inspection
2 Appearance No defects or abnormalities
1
Operating
Temperature Range
–55 to +125°C
No. Test MethodSpecificationsItem
Solder resist
Cu
Glass Epoxy Board
10N (5N : Size 1.6g0.8mm only), 10±1s
Glass Epoxy Board
Medium Voltage High Capacitance for General Use Specifications and Test Methods
Continued from the preceding page.
Continued on the following page.
* "Room condition" Temperature: 15 to 35°C, Relative humidity: 45 to 75%, Atmospheric pressure: 86 to 106kPa
Let the capacitor sit at 40±2°C and relative humidity of 90 to 95%
for 500
+24
–0
hrs.
Remove and let sit for 24±2 hrs. at room condition,* then
measure.
U*ÀiÌÀi>ÌiÌ
Perform a heat treatment at 150
+0
–10
°C for 60±5 min. and then
let sit for 24±2 hrs. at room condition.*
15
Õ`ÌÞÊ
-Ìi>`ÞÊ
-Ì>Ìi®
««i>À>Vi
No marking defects
>«>VÌ>ViÊ
>}i
Within ±15%
D.F. 0.05 max.
I.R. CU0.01μF: More than 10MΩs&
CF0.01μF: More than 1,000MΩ
iiVÌÀVÊ
-ÌÀi}Ì
In accordance with item No.4
Fix the capacitor to the supporting jig (glass epoxy board) shown
in Fig. 4.
Perform the 5 cycles according to the 4 heat treatments listed in
the following table.
Let sit for 24±2 hrs. at room condition,* then measure.
U*ÀiÌÀi>ÌiÌ
Perform a heat treatment at 150
+0
–10
°C for 60±5 min. and then
let sit for 24±2 hrs. at room condition.*
Fig. 4
14
/i«iÀ>ÌÕÀiÊ
ÞVi
««i>À>Vi
No marking defects
>«>VÌ>ViÊ
>}i
Within ±7.5%
D.F. 0.025 max.
I.R. CU0.01μF: More than 100MΩs&
CF0.01μF: More than 10,000MΩ
iiVÌÀVÊ
-ÌÀi}Ì
In accordance with item No.4
Preheat the capacitor at 120 to 150°C* for 1 min.
Immerse the capacitor in solder solution at 260±5°C for 10±1
sec. Let sit at room condition* for 24±2 hrs., then measure.
UiÀÃ}Êëii`\Ê25±2.5mm/s
U*ÀiÌÀi>ÌiÌ
Perform a heat treatment at 150
+0
–10
°C for 60±5 min. and then
let sit for 24±2 hrs. at room condition.*
*Preheating for more than 3.2Z2.5mm
13
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ÌÊ-`iÀ}Ê
i>Ì
««i>À>Vi
No marking defects
>«>VÌ>ViÊ
>}i
Within ±10%
D.F. 0.025 max.
I.R. CU0.01μF: More than 100MΩs&
CF0.01μF: More than 10,000MΩ
iiVÌÀVÊ
-ÌÀi}Ì
In accordance with item No.4
Immerse the capacitor in a solution of ethanol (JIS-K-8101) and
rosin (JIS-K-5902) (25% rosin in weight proportion).
Immerse in solder solution for 2±0.5 sec.
Immersing speed: 25±2.5mm/s
Temp. of solder: 245±5°C Lead Free Solder (Sn-3.0Ag-0.5Cu)
235±5°C H60A or H63A Eutectic Solder
12 -`iÀ>LÌÞÊvÊ
/iÀ>Ì 75% of the terminations are to be soldered evenly and continuously.
Solder the capacitor to the testing jig (glass epoxy board) shown
in Fig. 2.
Then apply a force in the direction shown in Fig. 3.
The soldering should be done using the reflow method and
should be conducted with care so that the soldering is uniform
and free of defects such as heat shock.
(in mm)
Fig. 3
11 iviVÌ
No marking defects
Fig. 2
° /iÃÌÊiÌ`-«iVvV>ÌÃÌi
b
a
c
100
40
ø4.5
t : 1.6
d
Capacitance meter
Flexure=1
20 50
R230
45 45
Pressurizing
speed: 1.0mm/s
Pressurize
LZW
®
iÃÊ®
>
1.0
1.2
2.2
2.2
3.5
4.5
L
3.0
4.0
5.0
5.0
7.0
8.0
V
1.2
1.65
2.0
2.9
3.7
5.6
`
1.0
1.6Z0.8
2.0Z1.25
3.2Z1.6
3.2Z2.5
4.5Z3.2
5.7Z5.0
-Ìi« /i«iÀ>ÌÕÀi
100 to 120°C
170 to 200°C
/i
1 min.
1 min.
1
2
-Ìi« /i«iÀ>ÌÕÀiÊc®
Min. Operating Temp.±3
Room Temp.
Max. Operating Temp.±2
Room Temp.
/iÊ°®
30±3
2 to 3
30±3
2 to 3
1
2
3
4
Solder resist
Cu
Glass Epoxy Board
Medium Voltage High Capacitance for General Use Specifications and Test Methods
Humidiiy
Continued from the preceding page.
* "Room condition" Temperature: 15 to 35°C, Relative humidity: 45 to 75%, Atmospheric pressure: 86 to 106kPa
Apply the rated voltage at 40±2°C and relative humidity of 90 to
95% for 500
+24
–0
hrs.
Remove and let sit for 24±2 hrs. at room condition,* then
measure.
U*ÀiÌÀi>ÌiÌ
Apply test voltage for 60±5 min. at test temperature.
Remove and let sit for 24±2 hrs. at room condition.*
17 Õ`ÌÞÊ
>`}
««i>À>Vi
No marking defects
>«>VÌ>ViÊ
>}i
Within ±15%
D.F. 0.05 max.
I.R. CU0.01μF: More than 10MΩs&
CF0.01μF: More than 1,000MΩ
iiVÌÀVÊ
-ÌÀi}Ì
In accordance with item No.4
Apply 120% of the rated voltage (150% of the rated voltage in
case of rated voltage: DC200V, DC250V, 110% of the rated
voltage in case of rated voltage: DC1kV) for 1,000
+48
–0
hrs. at
maximum operating temperature ±3°C. Remove and let sit for
24±2hrs. at room condition,* then measure.
The charge/discharge current is less than 50mA.
U*ÀiÌÀi>ÌiÌ
Apply test voltage for 60±5 min. at test temperature.
Remove and let sit for 24±2 hrs. at room condition.*
16 vi
««i>À>Vi
No marking defects
>«>VÌ>ViÊ
>}i
Within ±15% (rated voltage: DC200V, DC250V, DC500V,
DC630V)
Within ±20% (rated voltage: DC1kV)
D.F. 0.05 max.
I.R. CU0.01μF: More than 10MΩs&
CF0.01μF: More than 1,000MΩ
iiVÌÀVÊ
-ÌÀi}Ì
In accordance with item No.4
No. /iÃÌÊiÌ`-«iVvV>ÌÃÌi
Medium Voltage High Capacitance for General Use Specifications and Test Methods

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