SN54/74AHCT08 Datasheet by Texas Instruments

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SN54AHCT08
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SN74AHCT08
SCLS237N –OCTOBER 1995REVISED SEPTEMBER 2015
SNx4AHCT08 Quadruple 2-Input Positive-AND Gates
1 Features 3 Description
The SNx4AHCT08 devices are quadruple 2-input
1 Inputs are TTL-Voltage Compatible positive-AND gates. These devices perform the
Latch-Up Performance Exceeds 250 mA Per Boolean function in positive logic.
JESD 17
ESD Protection Exceeds JESD 22 Device Information(1)
2000-V Human-Body Model (A114-A) PART NUMBER PACKAGE BODY SIZE (NOM)
200-V Machine Model (A115-A) SOIC (14) 8.65 mm × 3.91 mm
SSOP (14) 6.20 mm × 5.30 mm
1000-V Charged-Device Model (C101)
SNx4AHCT08 SOP (14) 12.60 mm × 5.30 mm
On Products Compliant to MIL-PRF-38535, TSSOP (14) 5.00 mm × 4.40 mm
All Parameters Are Tested Unless Otherwise
Noted. On All Other Products, Production VQFN (14) 3.50 mm × 3.50 mm
Processing Does Not Necessarily Include Testing (1) For all available packages, see the orderable addendum at
of All Parameters. the end of the data sheet.
2 Applications
• Servers
Network Switches
PCs and Notebooks
Electronic Points of Sale
4 Simplified Schematic
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
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Table of Contents
9.1 Overview ................................................................... 8
1 Features.................................................................. 19.2 Functional Block Diagram......................................... 8
2 Applications ........................................................... 19.3 Feature Description................................................... 8
3 Description ............................................................. 19.4 Device Functional Modes.......................................... 8
4 Simplified Schematic............................................. 110 Application and Implementation.......................... 9
5 Revision History..................................................... 210.1 Application Information............................................ 9
6 Pin Configuration and Functions......................... 310.2 Typical Application ................................................. 9
7 Specifications......................................................... 411 Power Supply Recommendations ..................... 10
7.1 Absolute Maximum Ratings ...................................... 412 Layout................................................................... 10
7.2 ESD Ratings.............................................................. 412.1 Layout Guidelines ................................................. 10
7.3 Recommended Operating Conditions....................... 412.2 Layout Example .................................................... 10
7.4 Thermal Information.................................................. 513 Device and Documentation Support ................. 11
7.5 Electrical Characteristics........................................... 513.1 Related Links ........................................................ 11
7.6 Switching Characteristics, VCC = 5 V ± 0.5 V ........... 513.2 Community Resources.......................................... 11
7.7 Noise Characteristics ................................................ 613.3 Trademarks........................................................... 11
7.8 Operating Characteristics.......................................... 613.4 Electrostatic Discharge Caution............................ 11
7.9 Typical Characteristics.............................................. 613.5 Glossary................................................................ 11
8 Parameter Measurement Information .................. 714 Mechanical, Packaging, and Orderable
9 Detailed Description.............................................. 8Information ........................................................... 11
5 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision M (July 2014) to Revision N Page
Added TJ, Junction temperature ............................................................................................................................................ 4
Updated VIH and VIL MIN and MAX values............................................................................................................................. 4
Changes from Revision L (October 1995) to Revision M Page
Added ESD Ratings table, Feature Description section, Device Functional Modes,Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section.................................................................................................. 1
Deleted Ordering Information table. ....................................................................................................................................... 1
Added Military Disclaimer to Features list. ............................................................................................................................. 1
Added Applications. ............................................................................................................................................................... 1
Added Pin Functions table...................................................................................................................................................... 3
Added ESD Ratings table. ..................................................................................................................................................... 4
Changed MAX operating temperature to 125°C in Recommended Operating Conditions table. ......................................... 4
Added Thermal Information table. .......................................................................................................................................... 5
Added Typical Characteristics section.................................................................................................................................... 6
Added Detailed Description section........................................................................................................................................ 8
Added Application and Implementation section...................................................................................................................... 9
Added Power Supply Recommendations and Layout sections............................................................................................ 10
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l TEXAS INSTRUMENTS SN74AHCTOE . . .RGV Package U ] g 1 __fi E J 1 (— : N E C 1 2 | I E a 2 | | N I: c 2 L————1 I: (I) NC 7 No mtema‘ connection
3 2 1 20 19
9 10 11 12 13
4
5
6
7
8
18
17
16
15
14
4A
NC
4Y
NC
3B
1Y
NC
2A
NC
2B
1B
1A
NC
3Y
3A
V
4B
2Y
GND
NC
CC
NC No internal connection
SN54HACT08 . . . FK Package
20–Pin LCCC
Top View
1 14
7 8
2
3
4
5
6
13
12
11
10
9
4B
4A
4Y
3B
3A
1B
1Y
2A
2B
2Y
1A
3Y V
GND
CC
SN74AHCT08 . . .RGY Package
14–Pin VQFN
Top View
SN54AHCT08
,
SN74AHCT08
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SCLS237N –OCTOBER 1995REVISED SEPTEMBER 2015
6 Pin Configuration and Functions
Pin Functions
PIN
SN74AHCT08 SN54AHCT08 I/O DESCRIPTION
NAME D, DB, DGV, RGY J, W FK
N, NS, PW
1A 1 1 1 2 I 1A Input
1B 2 2 2 3 I 1B Input
1Y 3 3 3 4 O 1Y Output
2A 4 4 4 6 I 2A Input
2B 5 5 5 8 I 2B Input
2Y 6 6 6 9 O 2Y Output
3Y 8 8 8 12 O 3Y Output
3A 9 9 9 13 I 3A Input
3B 10 10 10 14 I 3B Input
4Y 11 11 11 16 O 4Y Output
4A 12 12 12 18 I 4A Input
4B 13 13 13 19 I 4B Input
GND 7 7 7 10 Ground Pin
1
5
7
NC No Connection
11
15
17
VCC 14 14 14 20 Power Pin
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7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VCC Supply voltage range –0.5 7 V
VIInput voltage range(2) –0.5 7 V
VOOutput voltage range(2) –0.5 VCC + 0.5 V
IIK Input clamp current VI< 0 –20 mA
IOK Output clamp current VO< 0 or VO> VCC ±20 mA
IOContinuous output current VO= 0 to VCC ±25 mA
Continuous current through VCC or GND ±50 mA
Tstg Storage temperature range –65 150 °C
TJJunction temperature 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
7.2 ESD Ratings
VALUE UNIT
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000
V(ESD) Electrostatic discharge V
Charged-device model (CDM), per JEDEC specification JESD22- ±1000
C101(2)
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with
less than 500-V HBM is possible with the necessary precautions.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with
less than 250-V CDM is possible with the necessary precautions.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)(1)
SN54AHCT08 SN74AHCT08 UNIT
MIN MAX MIN MAX
VCC Supply voltage 4.5 5.5 4.5 5.5 V
VIH High-level input voltage 2 2 V
VIL Low-level input voltage 0.8 0.8 V
VIInput voltage 0 5.5 0 5.5 V
VOOutput voltage 0 VCC 0 VCC V
IOH High-level output current –8 –8 mA
IOL Low-level output current 8 8 mA
Δt/Δv Input transition rise or fall rate 20 20 ns/V
TAOperating free-air temperature –55 125 –40 125 °C
(1) All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI Application Report,
Implications of Slow or Floating CMOS Inputs, (SCBA004).
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7.4 Thermal Information
SN74AHCT08
D (SOIC) DB (SSOP) DGV N (PDIP)
THERMAL METRIC(1) UNIT
(TVSOP)
14 PINS 14 PINS 14 PINS 14 PINS
RθJA Junction-to-ambient thermal resistance 97.5 109.5 133.3 59.7 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 58.7 62.1 55.6 47.3 °C/W
RθJB Junction-to-board thermal resistance 51.8 56.9 66.3 39.5 °C/W
ψJT Junction-to-top characterization parameter 22.6 22.6 7.8 32.4 °C/W
ψJB Junction-to-board characterization parameter 51.6 56.3 56.6 39.4 °C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, (SPRA953).
7.5 Electrical Characteristics
over recommended operating free-air temperature range (unless otherwise noted)
TA= 25°C SN54AHCT08 SN74AHCT08
PARAMETER TEST CONDITIONS VCC UNIT
MIN TYP MAX MIN MAX MIN MAX
IOH = –50 µA 4.4 4.5 4.4 4.4
VOH 4.5 V V
IOH = –8 mA 3.94 3.8 3.8
IOL = 50 µA 0.1 0.1 0.1
VOL 4.5 V V
IOL = 8 mA 0.36 0.44 0.44
0 V to
IIVI= 5.5 V or GND ±0.1 ±1(1) ±1 µA
5.5 V
ICC VI= VCC or GND, IO= 0 5.5 V 2 20 20 µA
One input at 3.4 V,
ΔICC(2) 5.5 V 1.35 1.5 1.5 mA
Other inputs at VCC or GND
CiVI= VCC or GND 5 V 4 10 10 pF
(1) On products compliant to MIL-PRF-38535, this parameter is not production tested at VCC = 0 V.
(2) This is the increase in supply current for each input at one of the specified TTL voltage levels, rather than 0 V or VCC.
7.6 Switching Characteristics, VCC = 5 V ± 0.5 V
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 2)
FROM TO TA= 25°C SN54AHCT08 SN74AHCT08
LOAD
PARAMETER UNIT
(INPUT) (OUTPUT) CAPACITANCE MIN TYP MAX MIN MAX MIN MAX
tPLH 5(1) 6.9(1) 1(1) 8(1) 1 8
A or B Y CL= 15 pF ns
tPHL 5(1) 6.9(1) 1(1) 8(1) 1 8
tPLH 5.5 7.9 1 9 1 9
A or B Y CL= 50 pF ns
tPHL 5.5 7.9 1 9 1 9
(1) On products compliant to MIL-PRF-38535, this parameter is not production tested.
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Temperature (qC)
TPD (ns)
-100 -50 0 50 100 150
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
D001
TPD in ns
SN54AHCT08
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SN74AHCT08
SCLS237N –OCTOBER 1995REVISED SEPTEMBER 2015
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7.7 Noise Characteristics
VCC = 5 V, CL= 50 pF, TA= 25°C(1)
SN74AHCT08
PARAMETER UNIT
MIN TYP MAX
VOL(P) Quiet output, maximum dynamic VOL 0.4 0.8 V
VOL(V) Quiet output, minimum dynamic VOL –0.4 –0.8 V
VOH(V) Quiet output, minimum dynamic VOH 4.4 V
VIH(D) High-level dynamic input voltage 2 V
VIL(D) Low-level dynamic input voltage 0.8 V
(1) Characteristics are for surface-mount packages only.
7.8 Operating Characteristics
VCC = 5 V, TA= 25°C
PARAMETER TEST CONDITIONS TYP UNIT
Cpd Power dissipation capacitance No load, f = 1 MHz 18 pF
7.9 Typical Characteristics
Figure 1. TPD vs Temperature
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l TEXAS INSTRUMENTS % 81/ o \ \ \ «H H H v 1 r \ 5 ‘ ‘5 \ ‘ C ‘ \ \ £1°L,fl \ \ \ $—q H—w M w +¢ ‘f E. An paramemrs and waveforms are rm appncame m an devmes.
50% VCC
3 V
3 V
0 V
0 V
th
tsu
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
Data Input
tPLH
tPHL
tPHL
tPLH
VOH
VOH
VOL
VOL
3 V
0 V
50% VCC
50% VCC
Input
Out-of-Phase
Output
In-Phase
Output
Timing Input
50% VCC
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
Output
Control
Output
Waveform 1
S1 at VCC
(see Note B)
Output
Waveform 2
S1 at GND
(see Note B)
VOL
VOH
tPZL
tPZH
tPLZ
tPHZ
VCC
0 V
50% VCC VOL + 0.3 V
50% VCC
0 V
3 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open Drain
Open
VCC
GND
VCC
TEST S1
3 V
0 V
tw
VOLTAGE WAVEFORMS
PULSE DURATION
Input
NOTES: A. CLincludes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR 1 MHz, ZO= 50 , tr3 ns, tf3 ns.
D. The outputs are measured one at a time with one input transition per measurement.
E. All parameters and waveforms are not applicable to all devices.
From Output
Under Test
CL
(see Note A)
LOAD CIRCUIT FOR
3-STATE AND OPEN-DRAIN OUTPUTS
S1
VCC
RL= 1 k
GND
From Output
Under Test
CL
(see Note A)
Test
Point
LOAD CIRCUIT FOR
TOTEM-POLE OUTPUTS
Open
VOH − 0.3 V
1.5 V 1.5 V
1.5 V
1.5 V 1.5 V
1.5 V 1.5 V1.5 V 1.5 V
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8 Parameter Measurement Information
Figure 2. Load Circuit and Voltage Waveforms
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A
B
Y
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SCLS237N –OCTOBER 1995REVISED SEPTEMBER 2015
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9 Detailed Description
9.1 Overview
The SNx4AHCT08 devices are quadruple 2-input positive-AND gates with low drive that will produce slow rise
and fall times. This slow transition reduces ringing on the output signal. The device has TTL inputs that allow up
translation from 3.3 V to 5 V. The inputs are high impedance when VCC = 0 V.
9.2 Functional Block Diagram
9.3 Feature Description
Slow rise and fall time on outputs allow for low-noise outputs
TTL inputs allow up translation from 3.3 V to 5 V
9.4 Device Functional Modes
Table 1 is the function table for the SNx4AHCT08.
Table 1. Function Table
(Each Gate)
INPUTS OUTPUT
Y
A B
H H H
L X L
X L L
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l TEXAS INSTRUMENTS 55v sav 45v Auv 15v Jnv 25v 1w 15v «av nsv nav rusv .15v
VCC
0.1 Fµ
5 V Regulated
5-V Accessory
3.3-V Bus Driver
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SCLS237N –OCTOBER 1995REVISED SEPTEMBER 2015
10 Application and Implementation
10.1 Application Information
The SNx4AHCT08 devices are low-drive CMOS devices that can be used for a multitude of bus-interface type
applications where output ringing is a concern. The low drive and slow edge rates will minimize overshoot and
undershoot on the outputs. The TTL inputs can except voltages down to 3.3 V and translate up to 5 V.
10.2 Typical Application
Figure 3. Typical Application Diagram
10.2.1 Design Requirements
This device uses CMOS technology and has balanced output drive. Care should be taken to avoid bus
contention because it can drive currents that would exceed maximum limits. The high drive will also create fast
edges into light loads, so routing and load conditions should be considered to prevent ringing.
10.2.2 Detailed Design Procedure
1. Recommended input conditions
Rise time and fall time specs: See (Δt/ΔV) in the Recommended Operating Conditions table.
Specified High and low levels: See (VIH and VIL) in the Recommended Operating Conditions table.
Inputs are overvoltage tolerant allowing them to go as high as 5.5 V at any valid VCC
2. Recommend output conditions
Load currents should not exceed 25 mA per output and 50 mA total for the part
Outputs should not be pulled above VCC
10.2.3 Application Curves
Figure 4. Switching Characteristics Comparison
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Vcc
Unused Input
Input
Output
Input
Unused Input Output
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SCLS237N –OCTOBER 1995REVISED SEPTEMBER 2015
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11 Power Supply Recommendations
The power supply can be any voltage between the MIN and MAX supply voltage rating located in the
Recommended Operating Conditions table.
Each VCC pin should have a good bypass capacitor to prevent power disturbance. For devices with a single
supply, 0.1 μF is recommended. If there are multiple VCC pins, 0.01 μF or 0.022 μF is recommended for each
power pin. It is acceptable to parallel multiple bypass caps to reject different frequencies of noise. A 0.1 μF and 1
μF are commonly used in parallel. The bypass capacitor should be installed as close to the power pin as
possible for best results.
12 Layout
12.1 Layout Guidelines
When using multiple bit logic devices inputs should not ever float.
In many cases, functions or parts of functions of digital logic devices are unused, for example, when only two
inputs of a triple-input AND gate are used or only 3 of the 4 buffer gates are used. Such input pins should not be
left unconnected because the undefined voltages at the outside connections result in undefined operational
states. Specified in Figure 5 are the rules that must be observed under all circumstances. All unused inputs of
digital logic devices must be connected to a high or low bias to prevent them from floating. The logic level that
should be applied to any particular unused input depends on the function of the device. Generally they will be
tied to GND or VCC; whichever makes more sense or is more convenient. It is generally acceptable to float
outputs unless the part is a transceiver. If the transceiver has an output enable pin, it will disable the outputs
section of the part when asserted. This will not disable the input section of the IOs, so they cannot float when
disabled.
12.2 Layout Example
Figure 5. Layout Diagram
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13 Device and Documentation Support
13.1 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 2. Related Links
TECHNICAL TOOLS & SUPPORT &
PARTS PRODUCT FOLDER SAMPLE & BUY DOCUMENTS SOFTWARE COMMUNITY
SN54AHCT08 Click here Click here Click here Click here Click here
SN74AHCT08 Click here Click here Click here Click here Click here
13.2 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
13.3 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
13.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
13.5 Glossary
SLYZ022 TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
14 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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I TEXAS INSTRUMENTS Samples Samples Samples Samples Samples Samples Samples Samples Sample: Sample: Samples Samples Samples Samples Samples Samples Samples
PACKAGE OPTION ADDENDUM
www.ti.com 9-Mar-2021
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
5962-9682101Q2A ACTIVE LCCC FK 20 1 Non-RoHS
& Green SNPB N / A for Pkg Type -55 to 125 5962-
9682101Q2A
SNJ54AHCT
08FK
5962-9682101QCA ACTIVE CDIP J 14 1 Non-RoHS
& Green SNPB N / A for Pkg Type -55 to 125 5962-9682101QC
A
SNJ54AHCT08J
5962-9682101QDA ACTIVE CFP W 14 1 Non-RoHS
& Green SNPB N / A for Pkg Type -55 to 125 5962-9682101QD
A
SNJ54AHCT08W
5962-9682101VDA ACTIVE CFP W 14 1 Non-RoHS
& Green SNPB N / A for Pkg Type -55 to 125 5962-9682101VD
A
SNV54AHCT08W
SN74AHCT08D ACTIVE SOIC D 14 50 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 AHCT08
SN74AHCT08DBR ACTIVE SSOP DB 14 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 HB08
SN74AHCT08DE4 ACTIVE SOIC D 14 50 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 AHCT08
SN74AHCT08DG4 ACTIVE SOIC D 14 50 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 AHCT08
SN74AHCT08DGVR ACTIVE TVSOP DGV 14 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 HB08
SN74AHCT08DR ACTIVE SOIC D 14 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 AHCT08
SN74AHCT08DRG4 ACTIVE SOIC D 14 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 AHCT08
SN74AHCT08N ACTIVE PDIP N 14 25 RoHS & Green NIPDAU N / A for Pkg Type -40 to 125 SN74AHCT08N
SN74AHCT08NSR ACTIVE SO NS 14 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 AHCT08
SN74AHCT08PW ACTIVE TSSOP PW 14 90 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 HB08
SN74AHCT08PWR ACTIVE TSSOP PW 14 2000 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM -40 to 125 HB08
SN74AHCT08PWRG4 ACTIVE TSSOP PW 14 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 HB08
SN74AHCT08RGYR ACTIVE VQFN RGY 14 3000 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 125 HB08
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PACKAGE OPTION ADDENDUM
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Addendum-Page 2
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
SN74AHCT08RGYRG4 ACTIVE VQFN RGY 14 3000 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 125 HB08
SNJ54AHCT08FK ACTIVE LCCC FK 20 1 Non-RoHS
& Green SNPB N / A for Pkg Type -55 to 125 5962-
9682101Q2A
SNJ54AHCT
08FK
SNJ54AHCT08J ACTIVE CDIP J 14 1 Non-RoHS
& Green SNPB N / A for Pkg Type -55 to 125 5962-9682101QC
A
SNJ54AHCT08J
SNJ54AHCT08W ACTIVE CFP W 14 1 Non-RoHS
& Green SNPB N / A for Pkg Type -55 to 125 5962-9682101QD
A
SNJ54AHCT08W
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
I TEXAS INSTRUMENTS
PACKAGE OPTION ADDENDUM
www.ti.com 9-Mar-2021
Addendum-Page 3
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN54AHCT08, SN54AHCT08-SP, SN74AHCT08 :
Catalog: SN74AHCT08, SN54AHCT08
Enhanced Product: SN74AHCT08-EP, SN74AHCT08-EP
Military: SN54AHCT08
Space: SN54AHCT08-SP
NOTE: Qualified Version Definitions:
Catalog - TI's standard catalog product
Enhanced Product - Supports Defense, Aerospace and Medical Applications
Military - QML certified for Military and Defense Applications
Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application
I TEXAS INSTRUMENTS REEL DIMENSIONS TAPE DIMENSIONS ’ I+Ko '«Pt» Reel DlameIer A0 Dimension designed to accommodate the component Width Bo Dimension designed to accommodate the component Iength K0 Dimension designed to accommodate the component thickness 7 w OveraH Wiotn ot the carrier Iape i P1 Pitch between successive cawty centers f T Reel Width (W1) QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE DOODOOOD ,,,,,,,,,,, ‘ User Direcllon 0' Feed SprockeI Hoies Pockel Quadrams
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
SN74AHCT08DGVR TVSOP DGV 14 2000 330.0 12.4 6.8 4.0 1.6 8.0 12.0 Q1
SN74AHCT08DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
SN74AHCT08DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
SN74AHCT08NSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
SN74AHCT08PWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
SN74AHCT08PWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
SN74AHCT08PWRG4 TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
SN74AHCT08RGYR VQFN RGY 14 3000 330.0 12.4 3.75 3.75 1.15 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 30-Dec-2020
Pack Materials-Page 1
I TEXAS INSTRUMENTS TAPE AND REEL BOX DIMENSIONS
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74AHCT08DGVR TVSOP DGV 14 2000 853.0 449.0 35.0
SN74AHCT08DR SOIC D 14 2500 333.2 345.9 28.6
SN74AHCT08DR SOIC D 14 2500 853.0 449.0 35.0
SN74AHCT08NSR SO NS 14 2000 853.0 449.0 35.0
SN74AHCT08PWR TSSOP PW 14 2000 853.0 449.0 35.0
SN74AHCT08PWR TSSOP PW 14 2000 364.0 364.0 27.0
SN74AHCT08PWRG4 TSSOP PW 14 2000 853.0 449.0 35.0
SN74AHCT08RGYR VQFN RGY 14 3000 853.0 449.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 30-Dec-2020
Pack Materials-Page 2
MECHANICAL DATA AME; CHEF“ ELAR‘REE ?< (a="" cm;="" w”)="" ,eamess="" c="" ’7="" flflflflflfl\="" f="" e="" e="" e="" e="" ,="" kwwwg="" qfijrm“="" a="" i:="" i7="" i4="" i:="" i:="" e7="" eiflfiiflfizj="" vvwwttflfl="" 1="" notes="" ah="" ineur="" dimensions="" are="" in="" inches="" (minmeiers).="" this="" cruwg="" i5="" subjeci="" i0="" chcnge="" without="" noiice="" this="" package="" car="" he="" hermeticuiiy="" secied="" mm="" a="" metai="" ic="" i'ciis="" wiihi="" jedec="" n87004="" 50m)="" {mm="" instruments="" w.="" (i.="" cam="">
MECHANICAL DATA ROY :3 ESPN MA) PLASUC QJ/‘D :L/fP/NCK V07 w » 42035397Zfl US/ZUM Home urchun m drawmq ‘5 sumo o N (am He (puck No Lcuujp 0 change We AH \mecr mmensws are m m hmeters mmensnmnq and tu‘erc'mmg per Aw: mswwgga Tre pucmge Mermm pc: must be smcerec m the Board for them: and memumcm perfurmunce See 'he uddihonu‘ rm 8 m the Pmdnct Data Sheet rm detm‘s reguvdmg (he expused 012va pud {saunas and dimenswuns [3 Package Carma: m JF‘IFC M07941 vermin RA A B C D E & P'w 1 \derh‘we's are \ocuted ur bo:h top and bckkorr of :he package 0er wkhv‘ the zone 'nmcutec We Pm 1 'demmers are ewiher u ma‘ded, marked‘ or msid feature, ‘5’ hams INSI'RUMENT‘S www.1i.com
THERMAL PAD MECHANICAL DATA RGY (87PVQFN7N14) PLASTlC QUAD FLATPACK NOiLEAD THERMAL lNFORMATlON This package incorporates an exposed thermal pad that is designed to be attached directly to an external heatsink. The thermal pad must be soldered directly to the printed circuit board (PCB). After soldering, the PCB can be used as a heatsink. In addition, through the use of thermal vias, the thermal pad can be attached directly to the appropriate copper plane shown in the electrical Schematic for the device, or alternatively, can be attached to a special heatsink structure designed into the PCB, This design optimizes the heat transfer from the integrated circuit (IC). For iniormatlon on the Quad Flatpack No—Lead (QFN) package and its advantages. reier to Application Report. OFN/SON PCB Attachment. Texas instruments Literature No. SLUA271. This document is available at wwwti‘cam, The exposed thermal pad dimensions for this package are shown in the following illustration. —Exposed Thermal Pad UUU s U T 13 ‘t/C7 2,05i0,i0 -l- l i4 U Q i3 9 2,05i0,i0 Bottom View Exposed Thermal Pad Dimensions 4206353—2/P 03/14 NOTE: All linear dimensions are in millimeters ”I. "-216 ‘5 INSTRUMENTS www.li.com
LAND PATTERN DATA PLASTIC QUAD FLATPACK NO—LEAD RGY (s—PVQFN—Ni 4) Example Stencil Design 0‘125mm stencil ihichness Example Eaard Lawut (Note E) <—4,3o—» us="" h="" u="" u="" u="" note="" d="" h="" u="" u="" u="" l="" —d="" (:l="" 7:2,.="" «f="" t:l="" £50="" ledf="" 2.05’="" "25="" 7551—="" 82="" t="" 1,50="" 7="" 7="" use="" _="" _="" 1:)="" z'i="" ~;l="" l:)="" -°—l="" 7="" ‘-="" 0.50="" x="" h="" pl="" non="" solder="" mask="" .e="" du="" 4="" e="" 54%="" solder="" coverage="" by="" printed="" area="" on="" center="" thermal="" pad="" example="" ma="" layout="" design="" may="" vary="" depending="" on="" constraints="" defined="" pad="" ..’="" .....="" example="" \="" (note="" a.="" f)="" l="" ‘\="" solder="" mask="" opening="" w,="" (note="" f)="" o="" l="" ,="" +="" 4397="" l‘="" '="" “="" o="" l="" \l\="" example="" 6x¢0,3="" ‘.\="" 7="" pad="" geometry="" .‘="" 0'07="" (note="" c)="" all="" around="" \\="" ‘\="" \_\="">. Customers should Laser cutting apertures with trapezoidal walls and also rounding carriers will orler better paste release. Reler to we 7525 tor stencil design considerations. contact their board ossemoly site tar stencil design recommendations, Customers should contact their board fabrication site for minimum solder mask wea tolerances between signal pods. TEXAS INSTRUMENTS www.ti.com til!
MECHANICAL DATA NS (R-PDSO-G") PLASTIC SMALL—OUTLINE PACKAGE 14-PINS SHOWN HHFHHFH j j t t H H j, A jfi/—\ % lgLLLLLiLLL/fiif A MAX 1060 1060 1290 1530 A MW 990 9,90 1230 14‘70 4040062/0 03/03 VOTES: A. AH Hneur dimenswons are m mHHmetevs a, Tm: druwmg 5 subject to change wmom name. 0 Body dwmenswons do not mamas mom flash 0v pmtmswom not to exceed 0,15 INSTRUMEN'IS www.li.m
MECHANICAL DATA W (R—GDFP—F14) CERAM‘C DUAL FLATPACK Ease and Seating Wane 0.250 (6.60) 00‘5 (W) 0235 (5.97) f 0. 026 (0 as) ‘ ‘ 0.005 0.20 _ 00 2.03) 0.004 (0.10) 0,045 1.14 47 0,280 (7.11) MAX 4» 0.019 0.48 1 H i 0.015 50.35; :3 I: T I: :1 :I I: 0.050 (1.27) (:3 ::I 0.390 (9 91) 7' I: :1 0.335 (0.51) :l I: 1:3 ::1 1:3 ::1 “-005 (0-13) “‘N 4 Manes 1:3 I: i 7 E f 0.560 (9.11) 0.360 (0.14) 0.250 (0.35) 0,250 (6.35) 404013072/r 01/11 NOTES: A. AH Hnear dimensions are in inches (m1111meters). B. This dram’ng 1: 5mm \0 change mm nofice. c, This package can be hermeticany sea1ed mm 0 ceramic lid usmg glass iriL 0, \ndex paint '15 pmw'ded an cap for terminm idenmcutiun omy. E. Faus within M1L STD 1835 GDFPW’FH i TEXAS INSTRUMENTS www.mmm
MPDSODSC 7 FEERUAHV1996 7 HE DGV (R-PDSO-G“) PLASTIC SM 24 PINS SHOWN 0,16 NOM 17 i Gage Plane 0,15 7|,20MAX 0E PINS N 14 1s 20 24 as 43 56 DIM AMAX 3170 3.70 5110 5.10 7190 9,80 11,40 AMIN 350 3,50 490 4,90 7170 9,50 11,20 407325| /E 03/00 *5 TEXAS INSTRUMENTS 9057 omca aox $55303 - DALLAS IEXAS 75285
MECHANICAL DATA
MPDS006C FEBRUARY 1996 – REVISED AUGUST 2000
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE
24 PINS SHOWN
14
3,70
3,50 4,90
5,10
20
DIM
PINS **
4073251/E 08/00
1,20 MAX
Seating Plane
0,05
0,15
0,25
0,50
0,75
0,23
0,13
112
24 13
4,30
4,50
0,16 NOM
Gage Plane
A
7,90
7,70
382416
4,90
5,103,70
3,50
A MAX
A MIN
6,60
6,20
11,20
11,40
56
9,60
9,80
48
0,08
M
0,07
0,40
0°8°
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
D. Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
GENERIC PACKAGE VIEW J 14 CDIP - 5.08 mm max heigm CERAMIC DUAL IN LINE PACKAGE [I l l 'I I.“ Images above are jusl a represenlalion of the package family, aclual package may vary Refel lo the produd dala sheel for package details. 4040053756 I TEXAS INSTRI IMFNTS
www.ti.com
PACKAGE OUTLINE
C
14X .008-.014
[0.2-0.36]
TYP
-15
0
AT GAGE PLANE
-.314.308 -7.977.83[ ]
14X -.026.014 -0.660.36[ ]
14X -.065.045 -1.651.15[ ]
.2 MAX TYP
[5.08] .13 MIN TYP
[3.3]
TYP-.060.015 -1.520.38[ ]
4X .005 MIN
[0.13]
12X .100
[2.54]
.015 GAGE PLANE
[0.38]
A
-.785.754 -19.9419.15[ ]
B -.283.245 -7.196.22[ ]
CDIP - 5.08 mm max heightJ0014A
CERAMIC DUAL IN LINE PACKAGE
4214771/A 05/2017
NOTES:
1. All controlling linear dimensions are in inches. Dimensions in brackets are in millimeters. Any dimension in brackets or parenthesis are for
reference only. Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This package is hermitically sealed with a ceramic lid using glass frit.
4. Index point is provided on cap for terminal identification only and on press ceramic glass frit seal only.
5. Falls within MIL-STD-1835 and GDIP1-T14.
78
14
1
PIN 1 ID
(OPTIONAL)
SCALE 0.900
SEATING PLANE
.010 [0.25] C A B
fi©©©©©©© ““w“‘¢‘w‘w““‘ ,w@@@@@@ A RLr
www.ti.com
EXAMPLE BOARD LAYOUT
ALL AROUND
[0.05] MAX.002
.002 MAX
[0.05]
ALL AROUND
SOLDER MASK
OPENING
METAL
(.063)
[1.6]
(R.002 ) TYP
[0.05]
14X ( .039)
[1]
( .063)
[1.6]
12X (.100 )
[2.54]
(.300 ) TYP
[7.62]
CDIP - 5.08 mm max heightJ0014A
CERAMIC DUAL IN LINE PACKAGE
4214771/A 05/2017
LAND PATTERN EXAMPLE
NON-SOLDER MASK DEFINED
SCALE: 5X
SEE DETAIL A SEE DETAIL B
SYMM
SYMM
1
78
14
DETAIL A
SCALE: 15X
SOLDER MASK
OPENING
METAL
DETAIL B
13X, SCALE: 15X
MECHANICAL DATA D U1 4)} 0 (3'4) DLASHC SMALL 0U ¥N¥ 4040047 5/M 06/1‘ NO'ES, A AH Hnec' dimensmrs c'e m 'mc'ves ['nflhmeter5> B Th5 drawer ‘5 subje», ,0 change mm: Home, A Body \cngth docs rm mac mod Hoar, p'omswons, (xv gmc bms Mom mm warmers, or gm buns sha‘ nm exceed 3005 (015) eam swce @ Body mm does 101 meme 11mm fish. E Rdererce JEDEC MS 012 mam AB, nter‘ec: flash sfu‘ not exceed 0017 (043) each swde {If TEXAS INSTRUMENTS www.1i.com
LAND PATTERN DATA D (R7PDSOmGl4) PLASTlC SMALL OUTLINE Example Board Layout Sterlazlogpeulyngs (Mole c) —— <—14x0,55 -hhheb&&t="" tmedddifi§n%="" 5.40="" 5,40="" @eeeeeej="" rfihfl§eflhj="" —=""> ——l 2x1,27 Example Non Soldermask Delined Pad Example Pad Geometry (See Note c) F Example l / Solder Mask Opening 7 0 07 f (See Note E) All Armlnd ,/ tzllmss/E oa/lz NOTES: A. All linear dimensions are in millimeters. a, Tnis drawan is subject to cnonae wl'lhuul notice. c. Publlcutl’on chs7351 is recommended tor alternate desl’gns. D. Laser ctming apertures w‘lth trapezoidal walls and also roundlng comers wlll otter better paste release. Customers should contact their board assembly site for stencil design recommendations, Reter tc ch—7525 lor otner stencil recommendations. E. Customers snoola contact their ooard looricotion site lor solder musk tolerances between ond oroond signol oods. {I} Tums INSTRUMENTS www.li.com
MECHANICAL DATA "7’7 : 3‘ AST‘C SMAH CJ’ N7 HHHHHHH . . ‘7,4’ 44*, A f;—‘ NO'ES' A AH Hnec' dimensmrs c'e m m'\\me(ers Dwmens'amnq cnd tu‘erc'vcmg per ASME w 5M 1994, Tm drawer ‘5 subje», ,o "hangs wnrau: Home, Budy \evvgih ‘ues m W" Le mom Hush, pyuws‘m Ur guts Ms M exceed 0,15 each m & Rudy wde does NM Wands \Mer end flair \Mefiead 'Wclsh shaH um exceed 0‘75 each S‘de E Fa‘s WM" JEDEC M07153 MUM "\u>h, main: bus, 01 guie buns shuH {if TEXAS INSTRUMENTS www.ci.com
PW (RiPDsoicM) LAND PATTERN DATA PLASTHC SMALL OUTLINE Example Board Layout (Male 0) —>| ‘,——12x0 65 HHHHHHHi 5,60 HHHHHHHHi l“ l l l Example Non So‘dermask Defined Pad 4 x 1,60 / H l <—0,07 y/="" ah="" around="" pad="" seamelry="" (see="" nale="" c)="" solder="" mask="" opening="" (see="" note="" e)="" stencil="" 0="" en'ln="" s="" (notepd)="" ‘3="" 14x0="" 30="" h="" '«,lzxo="" 65="" ~hhhhhh~="" 5,60="" hhhhhhh—="" example="" example="" 421128472/6="" 08/15="" notes:="" ah="" h‘lneor="" dimensions="" one="" in="" rnihll'rneters.="" tn‘ls="" dvowing="" is="" subject="" lp="" change="" wltnoul="" nallee.="" publl'cotlon="" hpcjssh="" is="" recommended="" lar="" allemale="" deslgns.="" laser="" cutllng="" apertures="" wch="" tropexoidm="" walls="" and="" also="" raund‘lna="" comers="" wlll="" we!="" better="" pasle="" release="" customers="" show="" contact="" their="" board="" assembly="" sl’te="" (ov="" stenci‘="" design="" recommendations.="" reler="" to="" ”50—7525="" lur="" other="" stencl‘="" recommendotluns="" customers="" shou‘d="" contact="" their="" board="" hoercot'lon="" shte="" (or="" solder="" musk="" tolerances="" between="" and="" around="" s'lgnol="" pods.="" *1?="" tums="" instruments="" www.ti.com="">
MECHANICAL DATA N (R—PDlP-T“) PLASTIC DUAL—IN—LINE PACKAGE 16 P15 SHOWN PWS " A L . [NM 15 a 20 16 9 0 775 U 777 0 SZU '1 USE 3 , 1H HH HH r% r’H r"—1 r’H H1 1 A VAX “9‘69? (191591 (23,37) (25,92) 0 250 (6,50‘ A MN [1145‘ 0142‘ 0.350 new 3 O 240 (6.10), 15 92/ (1832/ (2 .59) (23,58) MSiUO‘ (A AA AA Ari AA AA AA R1 &. VAR1AT1CN M RR AC AD 1 B 0070( (17s) 0015 (111) A 0045 (1,111 g n > , ‘ -) 3.020 (0,51) MW w o 5 (0 35) 0200( 38) MAX f, ), Gnu E Home 1 1‘ 9 fix—1%)” 1 0125’ 1/111 4% 0010 (v.37 ) NOM 31a) U L»- J 0450 (13,92) MAX L 202‘ (0,53) » e c 015 (0,35) / \ a; 00‘s (0,Zb)® / \ 1 1 \\¥,// 11/18 Pm (My > @ 20 Pm vendor upho'v mom/r 17/7037 NO'FS A AH Mnec' mmensmr‘fi: B 1m: drawmq 1s sume m muss (m1111mevem) 0 change mm): nofice /c\ FuHs wumn JEDEC M57001, except 15 an: 20 p171 'r1111mLm body 1mm (01m A) A The 70 p171 and 15m} shmflder Md” 15 a ve'vdnr 0311071, eher NIH Dr 111 wkflh INSI'RUMENTS www.1i.com
oo A‘ioyi 55 fiHHHHHHHHHHHHfi {'3 TEXAS INSTRUMENTS
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE
4040065 /E 12/01
28 PINS SHOWN
Gage Plane
8,20
7,40
0,55
0,95
0,25
38
12,90
12,30
28
10,50
24
8,50
Seating Plane
9,907,90
30
10,50
9,90
0,38
5,60
5,00
15
0,22
14
A
28
1
2016
6,50
6,50
14
0,05 MIN
5,905,90
DIM
A MAX
A MIN
PINS **
2,00 MAX
6,90
7,50
0,65 M
0,15
0°ā8°
0,10
0,09
0,25
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
IMPORTANT NOTICE AND DISCLAIMER
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IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
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Copyright © 2021, Texas Instruments Incorporated

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